Total 562 Senior Executive engineering job vacancies in Australia

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

As a Senior Manufacturing Engineer, you’ll play a critical role in turning breakthrough designs into real-world manufacturing solutions. From concept to customer delivery, you’ll drive new product industrialization by working cross-functionally to optimize for quality, cost, and lead time. You’ll be a strategic partner to both Global Operations and our Business Units, influencing design, improving processes, and supporting the full product lifecycle.

What you will be working on

• Provide first line engineering support in resolving daily operation issues in semiconductor equipment manufacturing, through collaboration with a team of multidisciplined manufacturing engineers, manufacturing supervisors and technicians.
• Achieve daily targets on product delivery to global customers in alignment with manufacturing engineering strategies, production schedules, quality and safety standards.
• Design and develop cost-effective testing methods with innovations for systems and equipment throughout product development and manufacturing in meeting manufacturing efficiency and customer quality.
• Prepare test and diagnostic programs according to product requirements, refine detailed test specifications, develop detailed procedures.
• Provide holistic technical solutions for highly complex problems from the suppliers, contract manufacturing, and internal manufacturing by liaising with cross functional teams in GOPS and Business Units (BU).
• Perform systematic troubleshooting and root cause analysis of manufacturing issues and deviations, provide immediate containment actions, and pursue long term corrective solutions.
• Partner with cross functional teams in Global Operations (Manufacturing, Production Planning, Procurement, and Quality Engineering), organize and lead internal and external review meetings, ensuring alignment and progress with focus on manufacturing processes, cycle time, assembly sequence, and quality.
• Lead the execution of continuous improvement projects on quality, cost, capacity, and efficiency enhancement with cross functional teams in GOPS and BU.

What we are looking for

• Bachelor’s degree in Electrical/Electronic Engineering, Automation engineering or equivalent.
• Minimum 8 years of experience in a manufacturing or engineering environment
• Minimum 5 years of relevant engineering experience in semiconductor capital equipment industry.
• Hands-on experience in electrical testing and troubleshooting.
• Working knowledge of testing methodology, C#, Python, or other scripting languages.
• Proven track record of managing technical projects to completion while accomplishing objectives and influencing cross-functional teams
• Experience with control systems utilized in testing automation, serial communication protocols, TwinCAT PLC, Device Net, Ethercat, RS 485, RS 232, etc.
• Proficient in operational excellence tools such as FMEA, 8D, SPC, DMAIC, GR&R, and Six Sigma

What sets you apart

• Strong cross-functional communication and stakeholder engagement skills
• Experience in project management for multiple NPI programs
• Background in supplier development or contract manufacturing environments
• Exposure to manufacturing digitization or data-driven process improvement

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

About our group:

The team is responsible for Drive Backend Assembly processes, including monitoring, controlling, maintaining, and improving product performance. This role applies engineering principles—such as Six Sigma and Lean—together with strong skills in data analysis, problem‑solving, and solution implementation to achieve performance metrics aligned with company goals.

About the role - you will:

• Perform process setup and buyoff for both Drive Backend Assembly, ensuring that yield, cycle time, and quality outcomes meet defined targets.
• Support product ID label buyoff to ensure compliance with product specifications and standards.
• Monitor production yield to detect any excursions, conduct process mapping, implement immediate containment (stop bleeding), establish hypotheses, design experiments to identify root causes, propose corrective actions, and report findings to engineers. Escalate issues appropriately per PMP requirements.
• Conduct basic data queries and analysis to provide relevant information and insights for engineering teams.
• Ensure process sustainability by monitoring KPIVs/KPOVs and managing Fast Triggering systems to maintain stable and controlled operations.
• Collaborate closely with engineers to achieve aggressive goals while upholding high-quality standards.
• Lead or participate in continuous improvement projects aimed at enhancing production efficiency in a consistent and sustainable manner.
• Perform additional tasks and responsibilities as assigned to support team, department, and company Objectives and Key Results (OKRs).

About you:

• Diploma in Engineering and related disciplines.
• Able to perform effectively under pressure, meet deadlines, and maintain a positive and professional attitude.
• Enjoys taking on challenging assignments and demonstrates strong resilience and adaptability.
• Open‑minded with a consistently positive work attitude.
• Strong data querying and analytical capabilities.
• Proficient in English with strong verbal and written communication skills.

Your experience includes:

• Experience in the manufacturing process is preferable.
• Process setup, buyoff, process mapping, and control.
• Failure analysis experience is preferable.
• Strong verbal and written communication.

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

As a Principal / Senior Engineer, Electrical Engineering at ASM, you will act as a technical lead for electrical systems within advanced semiconductor equipment. You will drive system-level design decisions, ensuring robust architecture, seamless integration, and high-performance delivery. By combining deep technical expertise with strong ownership, you will guide the development of complex systems from concept through production while influencing cross-functional engineering outcomes.

What you will be working on

• Lead the design and development of electrical systems and sub-assemblies, setting technical direction and ensuring alignment with product architecture
• Lead fabrication and test of electrical test structures (ex. MOS capacitors, MIM capacitors, FETs) for semiconductor logic and memory applications
• Own system-level integration, ensuring electrical, mechanical, and control elements work cohesively to meet performance, safety, and reliability targets
• Define and validate digital and analog I/O architectures, enabling flexible, customer-specific configurations
• Drive technical decision-making across new product development, capital projects, and system improvements
• Review and approve engineering changes, ensuring technical integrity, risk mitigation, and adherence to timelines
• Act as a key contributor in design reviews, providing expert guidance and ensuring readiness for production release
• Define and oversee system validation strategies, including hardware testing, instrumentation, and performance verification
• Analyze, understand and interpret electrical test data (ex. CV, IV, Dit) to guide process development and integration of ASM's products such as ALD films
• Evaluate feasibility of new concepts and technologies, solving complex system-level challenges with a structured and innovative approach
• Influence and collaborate with global cross-functional teams, acting as the electrical domain expert
• Mentor and guide junior engineers, elevating technical capability within the team
• Drive high-quality technical documentation, reporting standards, and stakeholder alignment

What we are looking for

• Master’s or PhD in Electrical and Electronics Engineering
• Minimum 5 years of experience in system engineering within semiconductor equipment manufacturing
• Strong expertise in electrical hardware design, system architecture, and integration (e.g., reactors, plasma sources, or similar systems)
• Proven ability to lead technical problem-solving and make system-level design decisions
• Proficiency in AutoCAD and data analysis tools such as JMP
• Hands-on experience in hardware testing, instrumentation, and system validation
• Ability to operate effectively in a fast-paced, global engineering environment
• Strong communication skills in English, with the ability to influence technical discussions

What sets you apart

• Experience acting as a technical lead or subject matter expert on complex engineering projects
• Strong understanding of semiconductor processes and equipment architecture
• Experience defining or improving system validation strategies and test methodologies
• Familiarity with data analysis or scripting tools (e.g., Python)
• Proven track record of driving cost reduction, reliability improvements, or product innovation
• Experience working across regions or with international engineering teams
• Proactive, ownership-driven mindset with the ability to influence without formal authority

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Job Description

• Industry/ Organization Type: Manufacture of Electrical Equipment
• Position Title: Business Development Executive (Electrical / Engineering Solutions)
• Working Location: Nearest MRT – Woodlands North/Admiralty
• Working Hours: 5 Days (Monday – Friday, 8:30 AM – 6:00 PM)
• Salary Package: Basic Salary + VB
• Duration: Permanent Role

Key Responsibilities

• Identify and follow up on new business opportunities in data centre, transportation, commercial, industrial, and infrastructure projects
• Plan and carry out marketing strategies to improve brand awareness and generate leads
• Build and maintain strong relationships with consultants, owners, contractors, and end-users
• Promote electrical switchboards and control panels, explaining their features and benefits
• Monitor upcoming projects and market opportunities in Southeast Asia
• Conduct market research and analyze competitors to support business planning
• Support and take part in industry events, exhibitions, and networking activities
• Perform other related duties as assigned

APPLY NOW!!!

• Diploma in Electrical Engineering, Business, Marketing, or a related field
• At least 3 years of experience in business development and marketing
• Strong analytical, organizational, and problem-solving skills
• Good communication skills with the ability to present ideas clearly
• Self-motivated, resourceful, and able to handle multiple tasks in a fast-paced environment
• Proficient in Microsoft Office applications

Kindly apply through ANY of the following methods:

• Submit your application by clicking the APPLY button;
• Email your resume to Job@anradus.com.sg. Please indicate #84154 on the email subject.

Anradus Application Policy: We value each application and ensure every resume is reviewed. Our process is efficient, typically concluding within 3 working days. If you do not receive communication from us within this timeframe, it's likely that your application has not been shortlisted by our client. In such cases, we recommend continuing your job search to maximize your opportunities.

Anradus Pte Ltd | EA License No. 20C0161 | Angel Lim | EA Reg No.: R1769781

As a PDE Central Yield Enhancement (YE) Engineer within Package Development Engineering (PDE), you will own and execute yield learning and improvement activities across advanced package technologies during HBM and NCG New Product Introduction (NPI). Your scope includes yield monitoring, excursion response, and yield stabilization, with an emphasis on rapid learning, early risk identification, and scalable solutions. 

This role plays a key part in driving robust yield performance from first silicon through NPI ramp and early HVM, partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing and Quality teams. You will act as a hands‑on yield owner for NPI builds, translating data into actionable insights, driving fast learning cycles, early risk detection, and leading disciplined yield recovery. 

Job Responsibilities 

Yield Loss Accounted For 

• Account for HBM NPI builds across PWF, Assembly, and test through defect breakdown and PFA submission to understand fail mode 

• Own and execute assigned Central YE responsibilities for HBM NPI program, work closely with PI to identify defects that is coming from their area to brainstorm for CIP 

• Learn NPI processes, phase gates, and yield best practices 

• Assist in maintaining yield dashboards and trackers. Support PI/PE/RDA in identifying and transforming processing data to account/ breakdown a yield loss 

Yield Deviation Control 

• Analyze and report on yield deviation issue and trigger action from PI, PE or RDA 

• Support block run and partial conversion build yield analysis to early detect any impact on yield 

• Work closely with PCS team to identify SPC or FDC charts to put into YLR dashboard for shift left monitoring 

Yield Improvement Opportunities 

• Brainstorm with staff from other departments for improvement opportunities and propose to PI 

• Design and implement new solutions, including hotspot analytics, to improve the effectiveness of the automated defense line system. 

• Utilize software tool like Auto-diagnostics to find yield improvement opportunities 

Integrating Artificial Intelligence 

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgement and complying with organizational standards and legal requirements 

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work 

Job Requirements 

• Bachelor's or Master's degree in Electrical/ Electronics Engineering/ Computer Engineering / Computer Science with 2 to 5 years of experience in semiconductor industry, specifically involving yield analysis, defect/root cause investigation, or data-driven process optimization in advanced memory (HBM, DRAM, NAND) or high-volume semiconductor packaging. 

• Proficiency in Python (e.g., Pandas, NumPy) and SQL for semiconductor manufacturing data analysis, with hands-on experience developing interactive dashboards and visual reports using tools (including Spotfire and Power BI/Tableau) to translate large manufacturing datasets into actionable yield and process improvement insights. 

• Demonstrated experience building automated reporting workflows, data pipelines, or process automation solutions using Python scripting or RPA tools within a semiconductor manufacturing environment, with the ability to drive cross-functional decisions across manufacturing, process integration, and engineering teams in the semiconductor industry. 

• Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes 

Embody Micron’s Core Values 

• People – Respect, develop, and empower others. 

• Innovation – Drive continuous improvement and breakthrough thinking. 

• Tenacity – Show grit and determination. 

• Collaboration – Build trust and foster teamwork. 

• Customer Focus – Deliver excellence and value 

As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities:

• Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.

• Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.

• DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time

• Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.

• Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.

• Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.

• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

• Bachelors/Masters Electrical and Electronics Engineering Degree with 3 years of experience in the semiconductor industry. Product Engineering experience is preferred.

• Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis.

• Good knowledge of statistics and data analysis tools and scripting.

• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).

• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.

• Strong sense of responsibility and accountability towards assigned role with professional work ethic.

• Excellent communication and presentation skills.

• Passionate about people leadership, with a drive toward ongoing learning and development in this area.

• Work on site in Singapore with international travel to US, Taiwan and Japan.

Key Responsibilities

Site Reliability & Operations

• Manage and improve the reliability, availability, and operational excellence of the SHIP-HATS platform
• Define, monitor, and maintain Service Level Objectives (SLOs) and Service Level Indicators (SLIs)
• Lead incident management, troubleshooting, root cause analysis, and post-mortem reviews
• Drive continuous improvements to reduce operational toil and prevent recurring incidents
• Perform capacity planning, performance tuning, and system optimisation

Observability & Monitoring

• Design and implement observability solutions across logging, metrics, and distributed tracing
• Build dashboards, alerts, and monitoring strategies to provide deep visibility into platform health
• Manage and maintain monitoring stacks such as Prometheus, Grafana, ELK, or equivalent tools

Infrastructure & Automation

• Develop and maintain Infrastructure-as-Code (IaC) solutions using tools such as Terraform or Ansible
• Automate infrastructure provisioning, deployment, and operational workflows
• Support both cloud and on-premises infrastructure environments
• Contribute to CI/CD pipeline improvements and platform automation initiatives

Collaboration & Engineering Excellence

• Work closely with engineering and product teams to embed reliability and operability practices into the software development lifecycle
• Review system architectures and recommend reliability, scalability, and resilience improvements
• Advocate for DevSecOps, automation, and operational best practices across teams

Requirements

• Degree in Computer Science, Information Technology, Engineering, or related disciplines
• Hands-on experience with Kubernetes and container orchestration platforms
• Experience with CI/CD and DevSecOps tools such as GitLab, Jira, Confluence, Fortify, or similar platforms
• Proficiency in at least one scripting or programming language such as Python, Go, or Bash
• Experience with Infrastructure-as-Code tools such as Terraform or Ansible
• Familiarity with cloud platforms such as AWS, Azure, or GCP
• Experience implementing and managing observability and monitoring solutions such as ELK Stack, Prometheus, or Grafana
• Good understanding of networking, system reliability, security hardening, and operational best practices
• Strong analytical, troubleshooting, and problem-solving skills
• Ability to work effectively in Agile and cross-functional environments
• Good communication and stakeholder management skills

Good to Have

• Experience with GitOps workflows and service mesh technologies such as Istio
• Familiarity with secrets management tools such as HashiCorp Vault
• Exposure to government ICT standards, IM8 policies, or regulated environments
• AI-native mindset and software engineering capabilities
• Experience supporting large-scale enterprise or public sector platforms

Job's mission

As a Senior Process Engineer in Advanced Packaging, you will bring your PhD research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM’s mission to enable the chips that power today’s most advanced technologies.

What you will be working on

• Contribute to the research, development, and optimization of semiconductor processes for Advanced Packaging, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation technologies.
• Design, execute, and analyze experiments using DOE-based approaches, supported by senior technical experts.
• Perform materials and process characterization to evaluate film quality, reliability, and performance.
• Analyze experimental data and clearly document results in technical reports and internal presentations.
• Collaborate with cross-functional teams across R&D, process engineering, and applications.
• Support troubleshooting of process or equipment issues in laboratory and pilot environments.
• Participate in technology reviews and contribute ideas to process improvement and innovation initiatives.
• Learn industry best practices for transitioning processes from development into customer and manufacturing environments.

What we are looking for

• PhD in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, Electrical Engineering,
• Hands-on research experience with thin-film deposition processes such as ALD, CVD, PECVD, or PVD.
• Strong experimental background, including designing experiments and analyzing complex data sets.
• Solid problem-solving and analytical skills, with a structured approach to research challenges.
• Clear written and verbal communication skills, with the ability to explain technical concepts to diverse audiences.
• Curiosity, initiative, and motivation to apply academic research in an industrial setting.
• Strong understanding of electro/mechanical equipment and software systems

What sets you apart

• Research experience related to advanced packaging, interconnects, or semiconductor manufacturing
• Familiarity with statistical methods, DOE tools, or data modeling techniques.
• Experience with materials characterization methods such as SEM, TEM, XRD, or ellipsometry.
• Exposure to cross-disciplinary or collaborative research environments.
• Interest in long-term growth within semiconductor technology development and process engineering.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

The Senior Vice President, Engineering establishes the overall strategy and direction of the Engineering team with a view of growing its business and driving its competitiveness in a globalised environment. He/She ensures the strategic alignment of business plans with the organisation’s vision, mission and business objectives.

The Senior Vice President, Engineering oversees and provides leadership to engineering team to ensure that divisional deliverables are achieved in a timely and cost-effective manner. He/ She drives the continuous improvement through innovation, safety, productivity and efficiency initiatives. He/ She builds strong networks with diverse stakeholders and subsidiaries with a view of advancing the organisation’s interests. In addition, he/ she drives organisational capability development and succession planning to ensure a competent workforce and continuous talent pipeline.

The Senior Vice President, Engineering is a calculated risk-taker and strategic thinker with excellent business acumen. He/ She is decisive, results-driven and demonstrates exceptional leadership and communication abilities.

Support and collaborate with NSHD Group Engineering on Global Network and Programs within four cores

·       Support and initiate the Networking channel for the four cores.

·       Collaborate with MTG on HyCO business.

·       Participate in CoP program initiated by NGE and TNSC

Continue to have close engagement with group companies in Asia & Oceania to render Technical and Management support

·      Lead engineering team to provide support to subsidiaries in Proposal, Technical Review, Maintenance Review, Equipment Sourcing and Engineering programs

·       Communicate closely with all Management and Technical personnel in Group Companies.

·       To update the program’s progress constantly

·       Periodical visit after easing of boarder restriction

Initiate Project Execution Function and DX program in Asia & Oceania region.

·       Structure the Project Execution Function formation and promote to Group Companies.

·       Implement CMMS with developed GC.

·       Promote CMS and Telemetric system and standardize the requirement within Group Companies.

Continue to promote Technical Talent Development program in Asia & Oceania region.

·       Continue to identify good potential technical person from group companies in Asia & Oceania region.

·       Make recommendation for secondment to NSHS and other operating group companies.

Collaborate and support Safety and Quality group on their activities for Asia & Oceania region.

·       Participate in Safety audits with Group Companies.

·       Support in the investigation of safety and quality incidents.

·       Collaborate in safety and quality programs.

Lead manufacturing operations

·       Ensure the delivery of the organisation's business and annual production plans and schedules

·       Control capital and operational budgets

·       Recommend changes in production objectives, according to market conditions

·       Set strategic objectives for plant maintenance and asset integrity management systems

·       Drive the development of new and innovative products to improve customer value proposition

·      Drive continuous improvement through innovation, safety, productivity and efficiency initiatives

Drive business and organisational development

·       Provide leadership to uphold and shape the organisation's culture, values and behaviour

·       Drive organisational succession planning, capability and talent development

·       Build business and professional networks

·       Drive the formulation of technology strategies and roadmaps

·       Empower the senior management team to make decisions and ensure their accountability in achieving departmental performance targets

·      Synergise crisis management and business continuity plans to mitigate business impact during disruptive events

Establish strategy and direction

·       Lead business planning and strategic alignment with the organisation's business objectives

·       Steer the implementation of the organisation's business strategies

·       Lead strategic resource planning and management to optimise organisational capacity and capability

·       Establish business performance indicators and measurement standards

·      Establish the organisation's vision, objectives and strategy

·      Bachelor degree from reputable universities in Mechanical, Electrical, Chemical or relevant field.

·      At least 10 years of relevant working experience, of which 5 years of managerial experience in Gas and Chemical Industry.

·      Willing and able to travel

·      Possess initiative, drive and able to work independently and result-oriented.

·      English speaking & writing skill

·      Possess good communication and interpersonal skills for technical aspect

·      Energetic and positive attitude

. Proficiency in Auto CAD software

• Well Established Company
• Salary: $2500 to $4000 + VB
• Working location: Gul Circle
• Working Hours: Mon to Fri, 8am to 6pm

Job Responsibilities:

• Responsible for sourcing and purchasing spare parts and consumables requested by Engineers.
• Manage store inventory and ensure sufficient stock levels to support daily operations.
• Ensure the quality and compliance of all products supplied to the company.
• Negotiate contracts, pricing, and credit terms with suppliers to achieve cost efficiency.
• Process purchase orders and monitor delivery timelines to ensure on-time supply.
• Identify, evaluate, and manage suppliers to secure competitive pricing and reliable service.
• Maintain accurate purchasing records and prepare monthly reports for management review.
• Conduct supplier evaluations and audits to ensure performance and compliance standards.
• Support the implementation and maintenance of ISO 9001:2015 quality management system requirements.

Job Requirements:

• Diploma in Mechanical Engineering or equivalent

Candidates are encouraged to apply this position via Apply Now button with the following information in the resume

• Work experiences and job responsibilities
• Current and Expected salary
• Reason for leaving
• Date of availability
• Education background

We regret that only shortlisted candidates will be contacted.

Barry Ang Ze Xin (Reg No : R26159529)

EA Recruitment Pte Ltd

EA License No: 21C0492

Job's mission

As a Senior Process Engineer at ASM, you will drive the development of high‑thermal‑conductivity thin films that enable next generation high‑performance computing (HPC) and advanced packaging. You’ll lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. By translating demanding customer requirements into breakthrough materials and processes, you’ll help position ASM at the forefront of thermal management for heterogenous integration of advanced logic, foundry, and memory devices.

What you will be working on

• Contribute to research development areas focused on high thermal conductivity thin films for advanced packaging and HPC applications, fostering innovation, technical excellence, and collaboration
• Own the roadmap to develop thermal films or materials aligned to customer performance and integration requirements.
• Leverage ASM’s ALD/PEALD, CVD/PECVD, and surface preparation expertise to design, optimize, and qualify high thermal conductivity materials and stacks for use in advanced devices and packages.
• Drive high thermal conductivity thin film development, including process optimization for deposition rate, uniformity, materials properties, morphology and bondability.
• Define, influence, and drive new hardware requirements and development in close collaboration with hardware and software engineering teams to meet advanced on high thermal conductivity process specifications and integration schemes.
• Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.
• Partner with corporate and global R&D organizations to deliver new materials, surface preparation schemes, and applications that support critical technology inflections in thermal management and advanced packaging.
• Ensure generation and protection of intellectual property and technical publications.
• Stay at the forefront of state‑of‑the‑art semiconductor processing and thermal management technologies, maintaining strong technical communication with industry peers and key customers.
• Communicate at a highly technical level with end customers to build trust in ASM’s ability to solve their most advanced thermal and device challenges.

What we are looking for

• Ph.D. degree in Physics, Physical Chemistry, Chemical Engineering, Materials Science, or a related field
• Minimum 10 years of experience in the semiconductor or semiconductor capital equipment industry
• Proven track record of developing and delivering new semiconductor process technologies to customers
• Strong working knowledge of semiconductor device physics and manufacturing processes
• Demonstrated credibility working with semiconductor fab managers, senior engineers, and executive stakeholders
• Ability to operate effectively in a fast-paced, results-oriented, and highly competitive environment
• Excellent communication skills in English; ability to collaborate in a global R&D environment
• Willingness to travel approximately 10–20%

What sets you apart

• Deep expertise in ALD/PEALD, CVD/PECVD, including RF and/or microwave based
• Experience developing high‑thermal‑conductivity materials
• Track record generating patents or publications in thin‑film or thermal‑materials innovation
• Strong reputation for building high-performance, collaborative engineering cultures
• Experience influencing product direction through process innovation, materials engineering, and hardware collaboration
• Recognized thought leadership through patents, publications, or industry contributions
• Ability to balance technical innovation, customer satisfaction, and business priorities

Job Description

• Design, develop, and implement Advanced engineering and process control solutions to optimize production processes, streamline workflows, and boost manufacturing productivity.
• Continuously assess and enhance Advanced engineering and process control capabilities/features to meet evolving production requirements, ensuring maximum efficiency and minimal operational disruptions.
• Generate and manage comprehensive reports on production and manufacturing KPIs
• Take charge of Advanced process control (APC) and fault detection classification (FDC) projects from initiation to conclusion, defining E2E integration scope, managing timelines, and providing regular progress updates.
• Proactively monitor APC/FDC performance, pre-emptively identify potential system issues, and implement preventive measures to minimize unplanned downtime.
• Conduct regular maintenance of APC/FDC software and hardware, troubleshoot technical issues, and ensure systems operate at peak performance.
• Collaborate with production and IT teams to identify opportunities for overall Advanced engineering process control improvement and implement changes that align with long-term operational objectives.

Requirements

• Strong knowledge of programming languages such as Java, C#, Groovy or Python and experience with database management such as Oracle
• Proficient in Model predictive control definition and understanding in semiconductor manufacturing system, processes and technologies
• Proven track record in Advanced Process control system (APC, FDC) development, integration, and optimization in a semiconductor environment.
• Understanding of AMAT E3 and PDF Exensio application will be added advantage.
• Effective communication and collaboration skills, with the ability to work with IT cross functional team (MES, EA, IMC)
• Bachelor's degree or higher in Computer Engineering, Computer Science or equivalent experience

As a Senior Equipment Engineer specializing in sputter media, you will be responsible for leading equipment sustaining, reliability, and continuous improvement activities to support high-volume hard disk media manufacturing. You will play a key role in driving equipment performance, improving operational efficiency, and supporting new technology implementation. This role requires strong technical leadership to guide technicians in maintaining stable manufacturing operations, reducing equipment downtime, and enabling next-generation product and process requirements.
 
ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Lead day-to-day equipment sustaining activities, including troubleshooting, failure analysis, and resolution of equipment-related production issues.
• Drive equipment reliability improvement initiatives to enhance equipment uptime, reduce chronic failures, and improve overall operational stability.
• Develop, implement, and optimize preventive and predictive maintenance strategies to improve long-term equipment performance.
• Lead root cause analysis (RCA) for major equipment failures and implement effective corrective and preventive actions.
• Support equipment upgrades, hardware modifications, and machine conversion activities to meet product and technology roadmap requirements.
• Coordinate new equipment installation, commissioning, qualification, and acceptance to ensure systems meet operational and safety standards.
• Monitor and analyze equipment performance indicators such as OEE, MTBF, MTTR, and downtime trends to identify improvement opportunities.
• Collaborate closely with Process Engineering, Yield Engineering, Production, and Quality teams to improve process capability and manufacturing performance.
• Drive engineering projects related to equipment improvements, automation enhancement, and productivity optimization.
• Develop and maintain equipment documentation including SOPs, maintenance procedures, troubleshooting guides, and best practices.
• Work closely with OEM vendors and suppliers to resolve technical issues, implement upgrades, and support equipment technology development.
• Support cost reduction initiatives through engineering optimization, reliability improvements, and maintenance efficiency.
• Ensure all equipment operations comply with company safety policies, regulatory requirements, and industry standards.
• Participate in continuous improvement initiatives, including Lean manufacturing, automation deployment, and digitalization programs.
• Perform other duties and responsibilities as assigned by management.

ESSENTIAL DUTIES AND RESPONSIBILITIES 

In this position, you will work in the Material Engineering team within the Packaging R&D organization who owns and deploys best-in-class material engineering solutions to the top-edge product and technology development across advanced semiconductor packaging, flash memory product and host levels. Your essential duties and responsibilities include:

• Drive advancement in packaging materials by addressing material-related design and process challenges. Develop solutions to support next-generation package requirements, including smaller form factors, thinner die, higher interconnect density, increased power, and enhanced reliability.
• Lead the evaluation, development, and qualification of advanced packaging materials for both product development and high-volume manufacturing. Ensure compliance with industry standards and sustain high material quality to enable reliable, high-yield, and cost-efficient manufacturing.
• Responsible for material characterization, lab testing, and design of experiments (DOE) to simulate manufacturing processes and use-condition failure. Analyze thermal, mechanical, and environmental performance to ensure materials meet reliability and performance targets.
• This position will interface with package and product design (in particular, thermal and mechanical), reliability, failure analysis, assembly R&D, and process teams to define material requirements and solutions. Collaborate with suppliers to develop, optimize, and qualify materials for successful production integration.

Job Highlights:

• 2 Years Contract (Extendable / Convertible)

• Performance Bonus & Variable Bonus

• Tuas

• 5 Days (Office Hours)

Job Summary

We are looking for a motivated Procurement Executive to support sourcing and procurement activities within an engineering and operations environment. This role involves end-to-end procurement processes, supplier management, and coordination with internal stakeholders to ensure timely and cost-effective delivery of materials and services.

Key Responsibilities

• Provide procurement support, including sourcing, tendering, evaluation, contracting, and contract management.

• Ensure materials and services procured meet required specifications and operational needs.

• Monitor supplier performance in terms of quality, delivery timelines, and pricing to ensure compliance with organisational standards.

• Liaise with Finance on payment-related matters and ensure smooth transaction processes.

• Conduct market research to identify potential suppliers and stay updated on market trends and supply conditions.

• Engage with vendors and stakeholders to maintain strong supplier relationships.

• Ensure compliance with procurement policies, procedures, and governance standards.

Requirements

• Diploma or Bachelor’s Degree in Engineering, Business, Supply Chain, or related disciplines.

• Minimum 2 years of procurement experience, preferably in engineering, logistics, or related industries.

Applicants who possess relevant experience for the above responsibilities are most welcome to apply. If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.

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Toh Cheng Jie (Martin)

Registration Number: R23117397

EA Licence No: 06C2859 (MCI Career Services Pte Ltd)