Total 2,754 Senior Executive systems engineer job vacancies in Singapore

Job Description

• Lead cross-functional teams across Design, Systems, Validation, Product/Test Engineering, Firmware, Supply Chain, Procurement, and Quality to ensure seamless program execution in NPI projects.
• Lead COGS reduction programs from impact assessment through qualification, PCN, safelaunch, and production ramp – quantifying savings, evaluating ROI, and assessing the business impact of schedule slips and risk scenarios.
• Drive capacity expansion initiatives across global manufacturing sites, aligning engineering, operations, and supply chain to support production scalability.
• Build and manage detailed schedules for NPI, COGS and capacity programs; track progress, remove roadblocks, and implement data‑driven mitigation plans.
• Manage Engineering Build Request prioritization, conducting bi‑weekly reviews with PMO and Business Operations leadership to ensure alignment with organizational priorities.
• Act as a liaison between the product group, operations/supply chain teams, and key OSAT interface teams to ensure alignment, clarity, and seamless execution across all stages of the program.
• Drive sample readiness and ramp readiness, ensuring cross‑functional teams maintain schedules that support committed customer delivery timelines.
• Coordinate and conduct Project Gate reviews, ensuring cross‑functional readiness, milestone alignment, and clear communication of risks and dependencies.
• Oversee wafer fab, assembly, and test operations to ensure timeline adherence, cost efficiency, and quality standards across programs.
• Provide structured leadership updates on program status, risks, and mitigation plans, maintaining accurate schedules and qualification documentation.

Job Summary

• We are seeking a highly skilled Senior Failure Analysis Engineer to join our team and drive advanced failure investigation in cutting-edge technologies, including AI-related products. Be part of a high-impact engineering team solving real-world reliability challenges

Key Responsibilities:

• Perform failure analysis at both physical package and die levels, identifying root causes and recommending corrective actions.
• Lead electrical fault isolation using advanced techniques & tools.
• Develop and execute bench-level test applications to validate hypotheses and reproduce failure mechanisms.
• Interpret CAD layouts, schematics, and design documentation to support failure root cause determination.
• Collaborate cross-functionally with design, process, product, and reliability teams to resolve complex technical issues.
• Support analysis for advanced technologies and AI-related products.

Senior Design Engineer

• Working Location: 609935 (Jurong East)
• Working Days: Monday - Friday
• Working Hours: 8:30am - 5:15pm
• Salary range: SGD 5,500 to SGD 7,500 monthly, 13th month, SGD 250 transport allowance

Basic Functions

Specialize in customization on electrical design work related to diesel generator sets, synchronizing system, switchgears, controllers and associated equipment. Design drawings, BOM for factory production fabricating. Preparing documentation for approval. Integration with other equipment industry, such as generators protection, switchgears, BMS, etc.

Specific Responsibilities

1. Design & produce electrical drawings, BOM and documentation for factory production
2. Understands the ISO standards and various regions standards for design considerations
3. Works closely with procurement to engage and qualify suppliers and parts
4. Works closely with manufacturing team in the electrical installations of the product and ensures smooth flow in the production line
5. Have good understanding of generator controller and alternator working concepts
6. Works closely with Industrial Solutions and sales to understand the design requirements and provide timely response to tender submission
7. Support in testing and validation of design including parameter optimization for controllers, governors, AVR, PLCs, HMI 
8. Design & Program various controllers, PLCs, HMI if necessary
9. Provides on-site and remote troubleshooting support if needed
10. Lead in continuous improvement projects to reduce costs and improve work efficiency
11. Assists in managing, training, developing and mentoring junior engineers, ensure standard engineering practice among the engineers

Qualifications / Requirements

• Degree in Electrical Engineering with 7-8 years of relevant experience; or
• Diploma in Electrical Engineering with 10-12 years of relevant experience
• Required to be skilled in SEE Electrical.
• Experience in process change management tools and methodologies
• Specialized skills or subject matter expert in electrical related field will be an advantage 
• Knowledge in PLC electrical design, controllers, generators, switchgears and transformers

Cheong Yeat Long | R25145358

The Supreme HR Advisory Pte Ltd | EA 14C7279

1. Planning of assembly processes flow considering manufacturing efficiency. Collaborate
with project team to seek and strive for minimizing product cost through design and
process optimization.
2. Support in the RFQ calculation; calculate and provide investment needed for standard
assembly process modules.
3. Define equipment specification in accordance to product specification. Plan, purchase
(with supervision), setup and release manufacturing cells on time, at budget and with
desired requirement.
4. Involve in each project stages to evaluate equipment and process performance.
Formulate technical and/or performance reports by collecting, analyzing and
summarizing information and trends.
5. Identify and establish process specifications, maintenance strategies and other
manufacturing documents required for line release activity.
6. Conduct problem solving methodology in assembly processes and equipment. In
meantime also developing troubleshooting guide and training of technical know-how to
technician.
7. Actively participate in system CIP on value disposition as in S-Q-C-D (Safety, Quality,
Cost & Delivery).
8. Provide effective countermeasure in technical flaw encompassed with corrective and
preventive action plan.
9. Study, evaluate and improve the technical capacity and capability in assembly
processes accorded to customer’s demand.
10. Continuously strive for higher and sustainable OEE, FPY, MTTR, MTBF.
11. Emphasize the intensity of team work culture in VSO (Value Stream Organization)
moving towards operational excellence.
12. Any other duties assigned by immediate superior from time to time.

As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) High Bandwidth Memory (HBM) Returned Material Authorization (RMA) Engineer at Micron Technology, Inc., you will be responsible for overseeing and tracking the formal Failure Analysis (FA) of customer-returned product. You will summarize analysis at the electrical and physical level, identify root cause, and establish associated containment plan. In this role, you will work with various engineering and manufacturing groups to evaluate and implement corrective actions (CAs) for the identified issues. You will also be required to regularly communicate FA results to customers as well as other Micron engineering and manufacturing teams. Additionally, you will need to sustain knowledge of device capabilities and characteristics along with a basic understanding of the associated manufacturing processes.

The DEMQRA RMA Engineer must demonstrate the ability to handle multiple customers and deal with multiple issues at one time, while providing detailed and timely follow-up between all applicable internal organizations at Micron.

You will:

Manage FA of Customer Concerns

• Understand the customer complaint as it relates to the DRAM component or module

• When not already provided, initiate contact with customer or customer representative to identify specific failing conditions

• Oversee and direct initial bench level, system level, and ATE level analysis and interpret results

• Coordinate detailed component level analysis (electrical (EFA) and physical (PFA)) and interpret results

Manage Communication of Results with Manufacturing and Engineering Teams

• Review feedback/Corrective Action (CA) from various manufacturing areas

• Ask follow-up questions as necessary to provide an adequate customer response

• Translate results to a customer friendly format

• Analyze data from various sources for trends and variations

• Communicate the needed process improvements

Provide FA Reports to External Customers

• Summarize the RMA background and FA results

• Identify the root cause and potential improvements for use in reports

• Identify and provide containment information and associated risk assessment

• Generate both interim and final FA reports for customer consumption

• Provide customer support for ongoing questions/concerns related to the FA report

Maintain Knowledge of Device Capabilities and Characteristics

•             Understand the latest process technology

•             Recognize differences from previous technology nodes with the associated risks

•             Understand the datasheet specifications for each device

•             Stay up-to-date on common customer DRAM applications

•             Partner with field support teams to understand ongoing customer status

Education:

• Required: Bachelor’s degree in Electrical / Electronics/ Computer Engineering

• Desired: Master’s Degree in Electrical / Electronics/ Computer Engineering

Required Qualifications:

• 5+ years of experience in semiconductor field

• Knowledge of DRAM operation, fabrication process and semiconductor device physics

• Advanced understanding of electronic circuit.

• Basic understanding of DRAM/motherboard/CPU architecture and operation.

• Familiarity with failure analysis, troubleshooting/debugging, advanced packaging, wafer testing, component testing and module testing concept and flow.

• Good written and oral communication skills

• Self-confidence in speaking and chairing a meeting.

• Experienced in computer, laptop or server OEM and focus on system level debug or CPU or DRAM or SYSTEM FAE is a plus.

Senior Project Engineer

Work Location: Changi, office at (Lavender area)

Working days: 5.5 days 8am to 5pm, Alternate Saturday Full Day

Salary: $4500 to $6000 (depends on experience)

Requirements

• Diploma/Degree/ master’s in civil & engineering or equivalent, recognized universities under the BCA, possess quantity surveying skills is a plus.
• Experience in a marine construction company is favorable
• Proficient in Microsoft Office, MS Project and AutoCAD.

Job scope

• Attend meetings with client, consultants & subcontractor to ensure that all project requirements are compiled and executed accordingly.
• Develop detailed project plans, including timelines, budgets, and resource allocation.
• Coordinate with cross-functional teams to ensure project objectives are met.
• Identify potential risks and implement mitigation strategies.
• Lead a team of supervisors / engineers /workers to carry out their works accurately and timely to ensure that works on site are carried out according to client requirement.
• Manage end to end delivery of project through defined project scope, detailed project plan & seek stakeholder’s agreement for sign-off.
• Handle a few minor projects concurrently.
• Conduct regular site inspections and audits.
• Mentor and supervise junior engineers and project staff.
• Evaluate team performance and provide constructive feedback.
• Provide technical guidance and support to project teams.
• Ensure compliance with safety regulations and quality standards.
• Prepare and present project reports to management and clients.
• Monitor, track, and provide timely project progress reports to the management.
• Good knowledge and experience in building related works such as civil engineering, structural, architectural, building repair, piling, A&A, plumbing works etc.
• Other ad-hoc duties as per assigned.

Cheong Yeat Long | R25145358

The Supreme HR Advisory Pte Ltd | EA 14C7279

As a Global Quality (GQ) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer on the DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA) at Micron Technology, Inc., you will be responsible for the electrical characterization and electrical failure analysis (EFA) of all HBM products. You will need to distinguish whether it is package or device related failures. Preferably, you are equipped with knowledge of DRAM functionality, process, test program and device necessary for making solid judgment. You will also use a variety of test tools including the uMate tester, Merlin, Mongoose SM3, Prober, CAD layout tool, and a variety of technical drawings and schematics to perform detailed characterization on HBM products. You will record and categorize failures in order to determine failure mechanisms and characteristics. In this role, you will communicate with various engineering groups, assist lab users with equipment setup and interpretation of data, and maintain critical EFA knowledge database. You will also be expected to seek ways to improve the EFA process in order to reduce test time, increase throughput, and increase failure mechanism assignment accuracy and consistency.

You will:

Analyze Failed Components from Reliability Testing

• Interpret historical tests results

• Adjust timing/level/testmode/code/temp to find out the sensitivities of failures for array fails

• Perform visual inspection to identify physical defects

• Utilize schematics/layouts/process to recognize abnormalities

• Document failed conditions and test results

• Categorize electrical failures

• Communicate results

• Coordinate next level analysis to various groups including PYE (Product Yield Enhancement) for CSAM (C-mode scanning acoustic microscope)/functional open (FO)/PFA (Physical Failure Analysis), Product Engineering and Package Reliability.

• Identify and communicate new or unusual results (electrical signals)

Respond to Equipment Issues

• Understand test software and hardware configurations

• Troubleshoot hardware issues

• Identify and report software and hardware issues

• Repair or coordinate repair of equipment

• Configure and upgrade test equipment

• Develop and deploy failure analysis (FA) software

Provide Technical Support and Conduct Training

• Assist lab users with equipment setup

• Teach operation of equipment

• Conduct on-the-job training (OJT) for new hires and transfers

• Provide data interpretation

• Suggest failure root cause

• Provide suggestions for further analysis

• Introduce new users to basic DRAM functionality/process/device

Perform Engineering Requests and Supplemental Tasks

• Submit package level physical failure analysis (PFA)

• Provide FA for other groups as requested (RMA, Module)

• Determine engineering test requirements

• Execute request and experiments

• Summarize test results and provide feedback

• Create repair converters

Manage Failure Analysis (FA) Information

• Create and maintain specific FA database

• Track FA data

• Identify false failures

• Analyze and summarize data

Perform Quality/Reliability request and review

• Perform review on test time reduction requests

• Perform review on Design/Marketing datasheet requests

• Perform review on Modify Qual requests

• Perform review on Material Review Board (MRB)

• Perform review on Process of Record Review Board (PORRB)

• Perform review on customer reports/data

Education:

• Required: Bachelor’s degree in Electrical / Electronics/ Computer Engineering

• Desired: Master’s Degree in Electrical / Electronics/ Computer Engineering

Required Qualifications:

• 5+ years of experience in semiconductor field

• Knowledge of DRAM operation, fabrication process and semiconductor device physics

• Familiarity with failure analysis, troubleshooting/debugging, advanced packaging, wafer testing, component testing and module testing concept and flow.

• Strong troubleshooting skill

• Good organizational skills and sharp attention to detail

• Good written and oral communication skills

• Efficient computer skills

• Knowledge of the DRAM fabrication process/test program/functionality

• Familiarity with Unix, DFII/Cadence, and/or uMate preferred

• Ability to work independently or in a group environment

• Basic understanding of electrical equipment

• Ability to use the analytical tools provided on the various test equipment, such as uMate, Curve Tracer, or Oscilloscope

About VSMC

VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), a joint venture between Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors (NXP) has started construction on a 300mm wafer manufacturing facility in Singapore, targets automotive, industrial, consumer, and mobile end markets.

Role Summary

You will be responsible and focused on improving tool performance and availability, in charge if maintenance, diagnosing failures and implementing effective solutions to meet uptime and cycle time requirements in the Etching (Dry Etch and Wet Etch); Photolithography; Metrology; Diffusion; Thin Film - Chemical Mechanical Planarization (CMP); Chemical Vapor Deposition (CVD); or Physical Vapor Deposition.

Key Responsibilities

• Lead and ensure equipment performance in cleanroom environment for quality production.
• Handle on-duty tasks and conduct fundamental alarm troubleshooting; identify root cause and problem-solve critical equipment issues with urgency
• Install and qualify new tool sets on schedule to increase capacity promptly
• Continually improve tool uptime availability, drive defect reduction and enhance hardware capability
• Develop defense and monitoring system to prevent equipment failure or performance lost.
• Analyze complex data sets and derive actionable insights to optimize equipment parameters and controls
• Actively collaborate with equipment suppliers and partners to identify tool deficiencies; develop, evaluate, and validate corrective and preventive solutions
• Mentor junior engineers and technicians, fostering technical excellence, operational discipline, and continuous improvement.

Education Qualification & Essential Experiences

• A bachelor’s degree or higher in Electrical and Electronics Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related STEM field
• Minimum of 4 years of experience as any of the respective module equipment engineer, possessing in-depth knowledge.
• Experience working in a 12” fab would be advantageous

Key Skills and Attributes

• Good interpersonal and communication skills to work effectively across functions and geographical teams with diverse background
• Strong analytical and problem-solving skills to achieve positive results and outcome
• Goal driven and an excellent team player that can work under pressure in a dynamic and fast-paced environment
• Has a growth mindset, prioritizing adaptability, resilience, innovation, and ongoing learning to support business needs

VSMC promotes diversity and inclusivity in our workforce; and hiring will be conducted in phases.

Position title : Senior TCB Application & Technical Sales Engineer

Location: Admirax St

Working Days:  5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : SGD 7,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities:

• Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.

• Support technical sales activities and customer discussions.

• Benchmark competitor equipment and identify technology gaps.

• Translate customer requirements into internal equipment specifications.

• Develop and optimize TCB process parameters on TCB Equipments.

• Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.

• Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage.

• Conduct DOE and process characterization activities.

• Work closely with Mechanical, Software, Electrical, Motion and Vision teams.

• Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process windows.

• Lead machine qualification, FAT and SAT activities.

• Act as the internal customer during machine development.

• Support customer buyoff and onsite qualification activities.

Requirements:

• Bachelor’s or Master’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Semiconductor Engineering or related fields.

• 5–15 years of semiconductor packaging experience preferred.

• Hands-on experience in TCB, Flip Chip and Advanced Packaging.

• Experience in HBM / CoWoS / 2.5D / 3D packaging.

• Experience in OSAT, IDM or semiconductor equipment environments preferred.

• Experience with fluxless or N2 bonding environment is an advantage.

• Strong understanding of Thermo Compression Bonding (TCB), Flip Chip processes, thermal management, warpage control, alignment systems, vision systems, process qualification, SPC and yield analysis.

• Experience with DOE, statistical analysis tools, failure analysis workflows and semiconductor process characterization.