Total 12 job vacancies by United Test And Assembly Center Ltd

Responsibilities:

• Responsible for Production Planning and Scheduling
• Responsible for recovery planning to mitigate impact of line performance issue to customer
• Monitor forecasted plan, track and report on machine utilization and performance and drive operations to meet output and shipments and revenue to ensure timely delivery to customers and meet KPI such as cycle time and on time delivery
• Provides input to Customer Service department in term of forecast loading, revenue attainment, shipment and performance
• Collaborate with cross functional teams to ensure that customer requirements can be met for current and future demand
• Responsible for documentation of Processes and Procedure for continuity and training purposes
• Continuous Improvement and Innovation
• Address issues and exercise judgement within broadly defined practices and approaches to solve complex problems on production performance, outputs and requirement
• Participate in all continuous improvement and/or automation projects to fully optimize the manufacturing process, improving CT, improving flow and cost effectiveness
• Responsible to improve the planning processes

Requirements:

• Degree in any discipline
• Minimum 3 years of relevant experience in planning, preferably in semiconductor industry
• Good leadership, communication and interpersonal skills
• Able to work in a dynamic and fast-moving environment

Responsibilities

• Maintain and ensure stable communication between equipment and host systems - Tools: GPTC UFO-300, AMAT charger, Evatec Hexagon, LAM sabre, Althete BM-1310W
• Troubleshoot and resolve issues when equipment fails to connect or respond to host commands
• Perform sustaining activities to support daily manufacturing operations
• Ensure equipment capability and integration within PPC, RMS, and FDC systems
• Work with Inficon FDC system for fault detection and classification to improve process control
• Conduct Equipment Automation testing, including User Acceptance Testing (UAT)
• Collaborate closely with IT CIM teams to analyze tool output data, identify data linkages, and implement data-driven solutions/innovations
• Monitor system performance and implement corrective actions when necessary

Requirements:

• Degree in Engineering/ Information Technology/ Computer Science or equivalent
• 2-3 years of experience in the semiconductor industry or in a manufacturing plant with automation
• Good understanding of SECS/GEM communication protocol in semiconductor equipment
• Familiarity with factory automation systems such as PPC, RMS, and FDC
• Experience with Inficon FDC system for fault detection and classification
• Basic programming knowledge (e.g., Python, C++, scripting) is an added advantage
• Basic knowledge of TCP/IP networking
• Experience in equipment automation or CIM environment is an advantage
• Strong troubleshooting and problem-solving skills

Responsibilities:

• Responsible for overseeing the manufacturing, production planning, scheduling and controlling of a12" bumping fab to ensure that production targets are met, and the fab operates efficiently and effectively
• Manage high-demand customer orders and ensure that manufacturing operations run smoothly, safely, and efficiently on a shift-by-shift basis
• Develop and implement production plans to meet customer demand, ensuring on-time delivery and optimal fab utilization
• Create and manage production schedules, considering equipment capacity, material availability, and labour resources
• Oversee inventory management, ensuring that materials and WIP (Work-In-Progress) are properly tracked and managed
• Analyze and optimize fab capacity to meet production demands, identifying opportunities for improvement
• Track and analyze key performance indicators (KPIs), such as cycle time, throughput, and yield, to identify areas for improvement
• Work closely with cross-functional teams, including manufacturing, engineering, and supply chain, to ensure alignment and effective production planning
• Identify and resolve production-related issues, working with teams to implement corrective actions and prevent future occurrences
• Drive initiatives to improve production efficiency, reduce costs, and enhance overall fab performance

Requirements:

• Degree in Engineering, Manufacturing, Industrial Engineering or related field
• Minimum 8–10 years of experience in semiconductor manufacturing or wafer fab operations
• Strong knowledge of production planning, scheduling, and factory operation
• Leadership, communication, and stakeholder management skills
• Excellent communication and collaboration skills, with ability to work with cross-functional teams

Responsibilities:

• Provide strategic direction and leadership for the 12" bumping engineering team, aligning with company goals and objectives
• Oversee the development, optimization, and qualification of 12" bumping processes, ensuring high yield, quality, and reliability
• Develop and execute a technology roadmap for 12" bumping, staying ahead of industry trends and requirements
• Collaborate with cross-functional teams, including manufacturing, quality, equipment engineering and RnD, to ensure seamless integration of bumping processes
• Manage resources, including personnel, equipment, and budget, to achieve departmental goals and objectives
• Foster a culture of innovation and continuous improvement, identifying opportunities for process enhancements and implementing changes
• Identify and mitigate risks associated with bumping processes, ensuring minimal impact on production and quality

Requirements:

• Bachelor's or Master's degree in Engineering, Physics, Materials Science, or related field
• Minimum 8-10 years of experience in bumping engineering or a related field, with experience in 12" wafer processing
• Strong technical expertise in bumping processes, including process development, integration, and optimization
• Proven leadership experience, with a track record of managing teams and driving strategic initiatives
• Excellent communication and collaboration skills, with ability to work with cross-functional teams
• Strong analytical and problem-solving skills, with ability to identify and resolve complex technical issues

Responsibilities:

• To support day to day shift duties, facility system operation, and preventive/predictive maintenance programs for facilities system, ensuring good system reliability and optimum efficiency
• Conduct routine monitoring of all the Building Facilities and systems such as cooling towers, vacuum pumps, condenser water pumps, AHU, air compressors, air dryers, electrical system, plumbing and temperature & RH monitoring system
• Respond to feedback/issues and perform troubleshooting to restore/resume the operation back to normal
• Assist the Engineer in system improvement and modification projects
• Maintain proper records of maintenance-related documentation
• Assist the Engineer in the development and implementation of maintenance programs
• Coordinate contractor services for equipment maintenance, housekeeping activities
• Coordinate with Vendors to conduct mandatory servicing of facilities system and equipment
• Carry out all daily work activities complying with the applicable local government regulations, applicable corporate directives and applicable standards
• Inspect, identify and resolve issues of facilities system
• Assist the Engineer for inventories tracking such as appropriate spares, consumables, and other resources necessary for the day-to-day operation
• Provide administrative support to upkeep ISO or auditable documentation (i.e. ISO, IATF, RBA, VDA, EAL6, Customers, etc)
• Keep abreast of changes to the applicable local government regulations and applicable corporate directives

Requirements:

• NITEC / Higher NITEC / Diploma in Electrical or Mechanical Engineering
• At least 2 years of relevant experience in a semiconductor or manufacturing environment
• Able to work 12-hour shifts

Responsibilities:

• Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer
• Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production
• Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification
• Initiates team discussion/ review on customer document gaps/ discrepancies and recommend proposals to customer
• Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders
• Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance
• Develop and grow people project management skills, adopting on dynamic changes and crisis management
• Drive for productivity improvement and cost reduction in process integration
• Work with TPM/ Sales/ customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue

Requirements:

• Degree/Diploma in Electrical/Electronics, Engineering or equivalent
• Minimum 3 years of Engineering experience in Semiconductor manufacturing industry
• Preferably with Project Management Certification
• Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred
• Knowledge on WLCSP bumping process of 2P2M; DOE/SPC/ FMEA /JMP/ APQP standard
• Bumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred

Responsibilities:

• Manage automated optical inspection (AOI) tools to ensure optimal performance
• Create and optimize recipes for AOI tool (Nikon)
• Provide technical support for AOI and metrology-related issues in the production line
• Monitor manufacturing processes to reduce process variations
• Analyse manufacturing process stability and troubleshoot deviations
• Assist in resolving process engineering issues
• Conduct GR&R studies and ensure measurement system reliability
• Qualify new metrology tools to meet production requirements
• Collect data for analysis to identify improvement opportunities
• Assist in the implementation of improvement projects
• Perform evaluations and experiments to enhance process performance
• Analyzing defect and shutdown tool for excursion if necessary
• Perform Measurement System Analysis (MSA) to validate metrology tools
• Enforce correct processing based on SOPs and working instructions
• Assist in developing on-the-job training programs for technicians
• Share knowledge and best practices to enhance team capabilities
• Supervise manufacturing works for Workplace Safety and Health compliance
• Enforce good safety culture and good manufacturing practices
• Ensure the robustness of processes using process control tools

Requirements:

• Degree in Engineering or related discipline
• Minimum 3 years of relevant experience in process control, AOI, and/or metrology in a manufacturing or semiconductor industry
• Good knowledge of metrology tools and process control
• Strong problem-solving, analytical, and troubleshooting skills

This role is for hiring fresh graduates who have graduated within the last 3 years from NITEC /HIGHER NITEC qualification with any engineering discipline.
ORD Personnel within the last 3 years with NITEC / HIGHER NITEC qualification in any engineering discipline may also apply.

Successful candidates can expect a starting salary of $2,300 + allowance (if applicable). You can also look forward to a retention bonus of up to $15,000 in the first year.

We are currently hiring for the following departments.
(1)   Smart Factory
(2)   Operations Training Department
(3)   Quality Assurance Department

Job Scope may include but no limited to the following:

(1)   Smart Factory - Assist with monitoring production metrics, and support AMR deployment and progress tracking. This role involves documenting workflows, troubleshooting basic technical issues, and helping Project team to optimize autonomous mobile robot operations and getting involve in Industry 4.0technologies and manufacturing process improvement

(2)   Operations Training Department - Support Bump engineering and operational activities while undergoing structured development to become a certified associate trainer. This role supports the expanding Bump area by strengthening training capability, ensuring effective knowledge transfer, process compliance, and long-term sustainability of training resources.

(3)   Quality Assurance – Support the Quality Engineering team by ensuring Statistical Process Control (SPC) systems are effectively maintained and optimized. The role also involves coordinating with Process Engineering teams on SPC requests, assisting with basic system tasks, and supporting audit preparation and customer requirements at an administrative level.

Responsibilities:

• Responsible for laser groove process qualification, implementation, procedure generation and control. Coordinates with Manufacturing, QA, Planning and NPI on Quality and process issues. Maintain a good production performance such as yield, quality and provide analysis and solutions to production quality and process related issues
• Responsible for Monitor and sustain Engineering/Qualification/Preproduction/Ramp-up devices to ensure parts have met quality requirements and ship in time
• Hands-on process during Qualification/Evaluation/FAI of new devices in Laser Groove to ensure customer process requirement are being met
• Develop evaluation, characterization plans for new products and conducts failure analysis and process troubleshooting
• Responsible for qualification of machine, materials and tools for new products to ensure its compatibility with the existing standard process flow
• Liaise with inter-department, customers and potential customers on establishment and improvement of process, direct/in-direct material and equipment capabilities
• Ability to perform cross functional projects to drive improvement

Requirements:

• Degree in Engineering or related field
• 3 years’ experience in semiconductor manufacturing or process engineering
• Good communication, analytical and problem‑solving skills

Responsibilities:

• Identify risk areas and ensure risk control plans are deployed for excursion-free launch
• Deploy control plans for smooth production flows
• Conduct qualification and validation tests for new materials
• Manage quality system certification
• Evaluate calibration and measurement analysis systems for improvements
• Conduct audit validation and drive systemic solutions with team members
• Manage quality planning to complement quality systems. Drive compliance in quality policies and procedures
• Develop, drive, and communicate quality systems to ensure operations meet both internal and external parties' quality requirements
• Formulate and implement quality project plans in collaboration with stakeholders, driving improvement activities to achieve organizational goals
• Identify system gaps and enhancements in the quality management systems
• Lead cross-functional teams in continuous improvement projects
• Develop on-the-job training programs and workplace learning plans
• Coach and build team leaders’ capabilities
• Lead team leaders in formulating business unit strategies and operational plans

Requirements:

• Degree in Engineering or a related discipline
• Minimum 3 years of experience in the semiconductor industry, with exposure to operations support in high-volume manufacturing
• Strong knowledge of quality systems, audits, and continuous improvement methodologies
• Good communication skills and ability to work effectively with cross-functional teams

Responsibilities:

• Perform failure analysis on customer returns, production/process rejects, reliability failures, and R&D sample
• Identify failure mechanisms and root causes through detailed analysis
• Prepare clear and high‑quality failure analysis reports within committed turnaround time
• Advise teams on suitable failure analysis techniques and ensure all potential failure mechanisms are evaluated
• Collaborate with cross‑functional teams to support new package failure analysis readiness
• Develop and enhance failure analysis capabilities, techniques, and lab processes for better efficiency and detection capability
• Conduct training on failure analysis procedures and support continuous improvement initiatives
• Drive cost‑reduction activities and improve key failure analysis performance indices
• Lead safety practices and 5S activities in the QA Lab, including equipment checks and audit support
• Maintain ISO/ISM documentation and oversee QA Decap Room operations

Requirements:

• Degree in Materials, Electrical, Electronics Engineering or equivalent
• Minimum 2 years of relevant experience in Failure Analysis or Reliability
• Good analytical skills in reliability and failure analysis
• Knowledge of semiconductor failure modes, final testing processes, and manufacturing concepts
• Skilled in FMEA, Statistical Process Control (SPC), and Design of Experiments (DOE)
• Good understanding of manufacturing processes, quality systems, and WSH practices

Responsibilities:

• Develop and optimize ball drop process parameters such as flux printing, ball placement, and reflow profile. Define and maintain process windows for various ball sizes and pitches
• Improve yield, reduce defects, and enhance throughput
• Support new device qualification and technology transfers
• Create recipes for new devices
• Troubleshoot ball‑related defects including missing balls, ball shift/misalignment, ball bridging, non‑wet/weak attach, and voiding issues
• Perform root cause analysis (8D, Fishbone, 5‑Why), monitor SPC charts, and control process variation
• Qualify new ball drop tools and support equipment buy‑offs
• Optimize machine settings including placement accuracy, vacuum control, and alignment systems
• Work with suppliers on solder ball materials (composition, diameter tolerance, oxidation control)
• Ensure proper flux type selection and usage
• Handle documentation and reporting tasks such as creating SOPs, process specifications, and FMEA
• Prepare engineering reports and conduct yield analysis
• Support customer and internal audits

Requirements:

• Degree in Engineering (Electronics, Chemical, Materials, Mechanical, or related field)
• Min 3 years’ experience in semiconductor assembly, preferably WLCSP
• Strong knowledge of Solder ball attach process, Flux printing and reflow, DOE and statistical analysis, SPC and yield improvement methodology
• Understanding of IMC formation (Cu-Sn intermetallic), Surface finish (UBM, Cu pillar, ENIG). Reflow thermal profiling
• Proficiency in MP / Minitab, SPC software, MS Office tools
• Strong problem-solving skills. Good communication and cross-functional collaboration
• Detail-oriented with strong analytical mindset