Total 3,656 Senior Executive process development engineer job vacancies

Job Responsibilities:

• Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.
• Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
• Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
• Upload recipe, check recipe and ensure recipe content compliance using RMS.
• Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN. Provide guidance to junior Engineers.
• Setup and troubleshoot issues in recipes/ job files in all metrology tools within the Module.
• Analyze data from passed down to identify chronic process issues, establish improvement programs and lead engineers to resolve them. Establish CAS / procedures to be followed and work with other departments for resolution if required.
• Work as a team with both Equipment and Manufacturing Engineers to meet Module objectives. Drive team to meet key indices of Uptime and OEE as per the goals set for these indices.
• Take on leadership roles to drive a small cross functional task team to address yield improvement/ excursion issues.
• Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements.
• Resolve complex technical issues in own Module or yield related issues
• Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
• Self audit and update specifications / documentation to meet TS16949 Quality Standard requirements.

Requirements:

• Degree in Electrical / Electronics / Microelectronics / Chemical Process / Chemistry / Physics / Material Sciences / Mechanical
• Min 2 years of relevant work experience in Thin Film CMP Process and Wafer fabrication process.
• An excellent team player with good interpersonal, communication and written skills
• Strong logical thinking capability and good analytical skill
• High level of integrity with strong leadership attributes to lead and coach a team
• Highly committed with good ownership and accountability
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications

Job ID: 20212

• Location: West (Company transport provided)
• Working hours: 8.30am - 5.30pm
• Salary: up to $4,600 (Depending on experiences)

Job Description

Design, develop, and qualify new programs according to customer requirements. Involve in backend process improvement to achieve robust reliability performance.

• Involve in backend process development activities, hardware modification, and improvement.

• Undertake new process development projects for future technological requirements.

• Undertake improvement projects to resolve technical challenges during new product and manufacturing stages.

• Ensure smooth transfer of process settings from R&D team to manufacturing team.

• Work with Reliability team for new evaluations to establish Spin Stand HDD correlation.

• Perform any other duties as assigned by superior.

Job Requirement

Qualification

• Bachelor’s Degree or above in Mechanical Engineering, Science (Chemistry/Physics), or Materials Science and Engineering.

Experience

• At least a few years of working experience in the manufacturing industry

Skills Required (Good to Have)

• Chemistry knowledge to support lubricant development activities.

• Materials science and nanotribology knowledge.

• Process improvement skills; proficiency in Minitab and Microsoft Excel.

Skills Required (Good to Have)

• Lubricant design and synthesis.

• Advanced data analysis and statistical process control.

Interested applicants, kindly send your updated resume to Joanne (R21101135) Joanne@pasona.com.sg with the email subject header "Job Application for "20212, R&D Backend/ Process Engineer (Senior)".

Only shortlisted candidates will be notified, other applications will be updated to our database for future job opportunities.

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Pasona Singapore Pte Ltd

Joanne Yeo Min Qian
EA License No:90C4069

Registration No.: R21101135

We are seeking an innovative and technically skilled researcher to join our team, specializing in adaptive machining. is a key technology for generative and regenerative applications at the heart of ARTC’s remanufacturing and manufacturing research. We are looking for people with the passion and drive to join us as part of the Remanufacturing Process Technology (RPT) Group. The scope of the role will be to work on research in advancing machining technologies by integrating adaptive techniques, leveraging knowledge in CNC machining, CAD/CAM programming, software development, and basic Artificial Intelligence (AI) concepts. This role provides an exciting opportunity to contribute to cutting-edge research aimed at improving efficiency, precision, and sustainability in machining processes.

Responsibilities:

• Perform research, conduct experimental work and analysis in a project-based environment
• Lead / Support the technical execution and delivery of projects, including project scoping activities and industrial customer engagement as well as capability development in line with the technical roadmap of the Group and Division, fostering collaboration with other teams / groups / research entities as needed
• Conduct research on adaptive machining techniques, including automated decision-making systems, dynamic process adjustments, toolpath optimization, scanning and data gathering technologies, and machine to machine communication.
• Algorithm Development: Design, develop, and implement algorithms for 3D data analysis for feature recognition and machining strategy selection for automatic tool path generation, and adaptive machining. Collaborate with cross-functional teams to integrate these algorithms into existing machining systems.
• Data Analysis: Analyse large datasets generated from machining operations to identify patterns, anomalies, and optimization opportunities. Develop predictive models to optimize machining parameters and improve overall efficiency.
• Documentation and Reporting: Prepare technical reports, documentation, and presentations to communicate research findings, project progress, and recommendations to stakeholders. Publish research papers in relevant journals and present findings at conferences and seminars.
• Technical Innovation Culture: Mentor and coach interns, fostering a culture of technical innovation and excellence.
• Any other ad-hoc work for the team, Group, Organisation and A*STAR with possible secondary roles

Job Requirements:

• At least a Bachelor’s Degree in in Mechanical Engineering, Manufacturing Engineering, Computer Science, or a related field.
• Prior experience of CNC machining, familiarity with machining processes and equipment, knowledge of machine communication (OPC-UA, TCP/IP) is advantageous.
• Proficiency in CAD/CAM/CAE software, preferably in Siemens NX / Solidworks / PowerMill
• Proficiency and/or knowledge in programming languages such as Python, VB.Net, C#, C++, MatLab, etc.
• Preferably with experience working in an industry-driven R&D environment
• Fluency in English with good written, spoken and comprehension skills
• Ability to communicate, interact and work professionally in a collaborative environment as a team player
• Ability to work in a dynamic fast-paced environment in an agile manner to adapt to fast-changing requirements of internal and external stakeholders
• Ability to think critically and is problem-solving oriented
• Ability to work effectively and independently
• Ability to demonstrate high level of initiative to learn and adapt new technologies to stay relevant

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

Job Summary

The ideal candidate will lead Topsides Process Engineering for FPSO, FLNG, or offshore projects, providing strategic focus across Conceptual, pre-FEED, FEED, and EPC(I) phases with hands-on engineering expertise and leadership in offshore oil and gas.

Responsibilities

• Lead development and continuous improvement of corporate technical standards, procedures, workflows, and engineering platforms to ensure practical, fit-for-purpose solutions incorporating project lessons learned
• Manage topside process engineering resources by monitoring project progress and assigning competent personnel aligned with project needs in close collaboration with Project Management Teams
• Maintain and disseminate the Lessons Learned database for project execution and operations to enable preventive and mitigative actions and promote design standardization
• Serve as Project Discipline Lead for Topsides Process, applying hands-on engineering expertise to guide project execution and technical decisions
• Report regularly to Head of Process Discipline on project concerns, resource planning, progress updates, and forecasts, participating in corporate meetings
• Provide technical guidance and career development opportunities for engineers and designers, facilitating access to international conferences and training
• Support Hanwha Ocean engineering teams across global locations including India, Seoul, and Houston for offshore project phases from Conceptual to FEED
• Travel internationally as required to support project and team needs

Required competencies and certifications

• Bachelor’s or Master’s degree in Petroleum or Chemical Engineering
• Proven hands-on process engineering experience in FPSO or offshore EPCI projects, including process simulation (steady state, dynamic), HB/MB, utility consumption, blowdown/flarenet studies, hydraulic and equipment sizing, control narrative, HAZOP, and technical safety action close-out
• Experience leading FPSO FEED/EPCI projects as Project Lead for Topsides Process, covering Conceptual and Feasibility Studies
• Experience managing topside process engineering resources and project progress in offshore or onshore oil and gas industry projects
• Proficiency with process engineering tools such as Aspen HYSYS, Flarenet, Pipe-net, or equivalents, with ability to interpret simulation results
• Extensive knowledge of process engineering principles, industry codes, standards, and scientific problem-solving methods
• Strong analytical and problem-solving skills applied to engineering challenges
• Effective communication skills in English, both oral and written, to collaborate with multidisciplinary teams, vendors, and clients
• Ability to work independently and collaboratively with strong attention to detail and accuracy

Preferred competencies and qualifications

• Experience in Field Engineering during construction or onshore/offshore commissioning phases
• Familiarity with zero carbon emission technologies and CCUS (Carbon Capture, Utilization, and Storage) technologies

Responsibilities:

• In charge of establishing the process and work in the team to implement risk management best practices in projects
• Implement and maintain the office's ISO 13485 and IEC 62304 compliant quality management system processes and procedures across departmental work and projects.
• Responsible in providing guidance and development support to the projects handled
• Taking charge of validating and advising project teams on regulatory, quality and risk requirements
• In charge of implementing and maintaining ISO 13485 and IEC 62304-compliant quality management system processes and procedures
• Responsible in
• In charge of managing project tasks which includes ensuring of timely completion of project milestones and meeting KPIs
• In charge of compliance with quality, regulatory and organisational policies and systems while supporting required record-keeping and documentation.

Requirements:

• Min Degree in Engineering /Science or relevant
• Min 2 years of working experience in QMS, Risk Management and design & development in medical industry
• Experience in ISO13485 /IEC62304 audit is required

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900

THE ROLE: 

As a Senior Engineer, you will collaborate with various Product Development Groups. This individual serves as a critical technical point of contact to the business, design, platform validation and product engineering teams. We have competitive benefit packages and an award-winning culture. Join us!  

THE PERSON: 

A successful candidate is one who can drive technical decisions independently, has accountability for accuracy, reliability and completeness of assignment results critical to the project’s success. This role allows the opportunity to influence technical decisions that have a significant impact on multiple products or the product line.  

KEY RESPONSIBILITIES: 

• Ensures high uptime, ensures preventive maintenance (PM) execution, and seamless vendor coordination for resolving tools hardware and software issues. Primary advanced toolset coverage: Focused Ion Beam, Reactive Ion etchers, Nano‑probers, Scanning electron microscopes and Transmission electron microscopes 
• The role partners closely with equipment owners, lab operations, EHS, and external OEMs to sustain capability, drive MTBF/MTTR improvements, and enable rapid turns on high‑priority cases.
• Design new lab space with strict environmental control involving vibration, EMI and acoustics.
• Lead structured troubleshooting and root‑cause eradication (5‑Why, Ishikawa, FMEA); convert escapes into standard work and documented fixes
• Serve as single point of contact for OEMs and third‑party service providers; coordinate field service, escalations, and remote diagnostics
• Manage service contracts, PM bundles, and time‑and‑materials events; negotiate scope vs. cost; track vendor KPI adherence and corrective actions
• Enforce LOTO, ESD, chemical/gas handling, UHV safety, and radiation/beam compliance as applicable
• Partner with FA engineers on readiness gates for new methods/fixtures; support tool installation, lab moves, and capability upgrades
• Provide on‑call/shift coverage as needed for bring‑up, critical debug, and factory‑stop events

PREFERRED EXPERIENCE: 

• Hands on maintenance experience with complex capital equipment involving vacuum systems, motion/servo control, pneumatics, high voltage, and embedded SW/FW
• Demonstrated ability in systematic troubleshooting, reading electrical/pneumatic schematics, and using diagnostic tools (oscilloscope, DMM, leak detector, RGA)
• Effective communication with vendors and cross site teams; ability to coordinate multi party interventions under time pressure
• Experience in failure analysis tools, including alignments, stage/probe calibration, column health, and detector
• Knowledge of UHV, turbo/cryogenic pumps, gas handling, plasma sources, beam columns, and vibration/thermal isolation
• Lab‑based role with occasional off‑shift or weekend coverage during critical events and planned PMs
• Some travel for OEM training, factory repair, or acceptance tests may be required

ACADEMIC CREDENTIALS: 

• Bachelor’s degree in Mechatronics Engineering (or Mechanical/Electrical with mechatronics focus)

Job Description:

• Develops and optimizes BCD process technology and devices for power applications, involving TCAD simulations, device layout, characterization, and bench testing
• Develop and integrate new BCD device architectures and process modules for company BCD platforms.
• Conduct TCAD simulations to understand device behavior and calibrate simulation models to match experimental results.
• Design and lay out device test structures and new BCD device platforms.
• Analyze device performance and reliability through bench testing and data collection.
• Work with cross-functional teams, including the modeling team, to satisfy customer needs and develop advanced device models.

Job Requirement:

• Min Degree in Physics or Electrical Engineering.
• Min 3 year of expereince in TCAD (Technology Computer-Aided Design) tools for simulation and calibration.
• Experience with device layout, design rule checks, and test structure generation.
• Knowledge of BCD process development and device characterization techniques.

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900

Responsibilities:

• In charge of establishing the process and work in the team to implement risk management best practices in projects
• Implement and maintain the office's ISO 13485 and IEC 62304 compliant quality management system processes and procedures across departmental work and projects.
• Responsible in providing guidance and development support to the projects handled
• Taking charge of validating and advising project teams on regulatory, quality and risk requirements
• In charge of implementing and maintaining ISO 13485 and IEC 62304-compliant quality management system processes and procedures
• Responsible in
• In charge of managing project tasks which includes ensuring of timely completion of project milestones and meeting KPIs
• In charge of compliance with quality, regulatory and organisational policies and systems while supporting required record-keeping and documentation.

Requirements:

• Min Degree in Engineering /Science or relevant
• Min 2 years of working experience in QMS, Risk Management and design & development in medical industry
• Experience in ISO13485 /IEC62304 audit is required

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900

THE ROLE:

As a senior staff member of the product characterization team, you will evaluate the performance of AMD AECG products, develop, lead and characterize the next generation Memory Controller IPs.

THE PERSON:

• Strongly motivated individual from post-silicon validation background.
• Excellent communication and presentation skills, demonstrated through technical publications, presentations, training, executive briefings, etc.
• Adept at collaboration and mentorship skills to train and guide fellow engineers and elevate the skills of the team around you.

KEY RESPONSIBILITIES:

• Gain expertise into the AMD SoC architecture to characterize next generation Memory Subsystem (Controller, PHY and IO) for various supported protocols such as DDR4, LPDDR4, DDR5, LPDDR5, DDR6 and LPDDR6.
• Understand Pattern development nuances and guide the team for bench data collection and debug with lab instruments when necessary.
• Work closely with cross functional teams from design and firmware side to identify key new features, firmware stability and ensure proper test coverage for the same.
• Drive continuous improvement initiatives on automated test scripts and test frameworks for efficient data collection, test-time optimization and data analysis.
• Stay updated with the latest developments in Memory specifications and trends to inform product strategy and direction
• Statistical data analysis to post process volume results for data correlation across Process corners and outlier analysis.
• Responsible for isolating the issue to a specific area such as test gaps, SW bug, silicon bug, or process deviation using bench setup and instill good debug practices in the team.
• Drive cross-functional discussions to address the issues uncovered from debugs and collaborate for ensuring screens are in-place for gaps identified.

PREFERRED EXPERIENCE:

• Extensive years of experience into post-silicon validation with strong background on SoC validation and system level testing.
• Technical leadership experience leading a small group of senior engineers.
• Strong understanding of ARM SoC architecture and Memory protocols such as DDR5 and LPDDR5.
• Experienced on bench testing and debug skills with lab instruments usage.
• Proficiency in using test equipment such as oscilloscopes, logic analyzers and protocol analyzers.
• Experienced in Linux environment, data analysis and scripting languages (e.g. Python, Perl) for automation and data processing.
• Strong communication and leadership skills, including data presentation and ability to work well in a group environment that spans across continents.
• Experience with AMD/Xilinx Vivado and FPGA design flow is a plus.

ACADEMIC CREDENTIALS:

• BS in EE, CS, ECE or related field; MS preferred.

The Project Development/Service Engr will be responsible for overseeing and managing multiple projects from initiation to completion. This role requires strong leadership skills, excellent organizational abilities, and a proven track record of successfully delivering projects on time and within budget.

Project Planning and Execution:

o Develop project plans, including timelines, resource allocation, and budgets.

o Coordinate project activities, ensuring adherence to project objectives, timelines, and deliverables.

o Monitor project progress, identify and resolve issues, and manage changes to project scope.

o Propose, design and develop novel applications involving sensors and control systems for sustainable Industrial 4.0 applications.

o Perform system integration work involving sensors, electrical and mechanical components and peripherals.

o Develop software for system control, automation and IoT applications.

o Test, evaluate and commission IoT and Control Systems.

o Conduct regular project status meetings, providing updates to stakeholders and addressing any concerns or questions.

Team Management:

o Work in cross-functional project teams, assigning tasks, and ensuring effective collaboration.

o Provide guidance and support to team members, promoting a positive work environment.

o Facilitate communication and foster strong relationships with internal and external stakeholders.

Budget and Resource Management:

o Develop and manage project budgets, ensuring cost-effectiveness and efficient resource utilization.

o Identify resource requirements, allocate resources appropriately, and monitor resource utilization throughout the project lifecycle.

Be involved in field service activities and support field service department.

Provide front line support for key field service activities in line with customer requirements

Adapt to both on site and service center roles.

 Good interpersonal, Coordination and Communication Skills.

 Strong knowledge of project management methodologies and tools

 Strong programming skills in languages such as python, Java or C++, CodeSys. [preferred]

 Knowledge of robotics, PLCs (Programmable Logic Controllers), and control systems. [preferred]

 Keen interest in Sensors, IoT and Industrial Control Systems.

 Strong problem-solving and decision-making skills.

 Ability to manage multiple projects simultaneously, prioritize tasks, and meet deadlines

Good technical and analytical skills.

 Able to work in cleanroom

 Microsoft office knowledge.

 Able to work overtime on weekend/standby as required

THE ROLE:

We are the high-end test engineering team providing test solutions for Data Center New Product Introduction (NPI) under the Product Engineering Organization. We do exciting product development for leading-edge technology that will power the next generation processors used for high performance computing, data centers, and enterprise servers.

If you are looking for a fulfilling and challenging career as an engineer leading SLT (System Level Test) Thermal and Board SME (Subject Matter Expert), you are at the right place! As a MTS System Level Technical Lead, you will be responsible for defining, driving and enabling SLT test solution to meet NPI business milestones and KPI (test time, yield, cost, quality .The expectation is to perform leadership to have interaction with Silicon/Board/Power design teams, Product & Test Engineering teams, Customer Quality teams, software & platform teams to ramp GPU coverage with aggressive schedule while debug GPU fallout to ensure high yield. You will experience working with and learning from AMD’s talented engineering teams around the world.

THE PERSON:

We are looking for someone with strong technical, analytical, leadership and problem-solving skills, as well as demonstrating the characteristic of an independent and resourceful individual.

You will be proficient in your understanding about PCB Board and High Power Delivery (above 1kW) design methodology, Thermal dissipation as well as a broad understanding of various industry standards in OCP (Open Compute Project), such as JEDEC HBM3/4, PCIe, I2C/I3C, UEC (Ultra Ethernet Consortium) and UCIe (Unified Chiplet Interconnect Express) etc.

KEY RESPONSIBILITIES:

• Accountable to provide leadership to meet business milestone, cost and quality in GPU system level test area.
• Collaborate with internal teams to drive SLT board and power swim lane from pre-silicon, ASIC initial bring up to HVM (High Volume Manufacturing)
• Conduct engineering evaluations and analysis to drive closure of GPU production issues, qualify cutting-edge high power SLT thermal system for HVM
• Profile or characterize PI (Power Integrity), voltage droop, or power delivery issue observed on SLT platforms in collaboration with board/silicon designers
• Involves collaboration on or assuming the consultative or leadership responsibilities for a specific project or for product development initiatives
• May provide technical supervision or mentoring junior engineers
• Upscale overall team capabilities on low level system debug for AMD data center product families

PREFERRED EXPERIENCE:

• Experience and with good understanding of PCB board and Power Delivery design for high power GPU product (above 1kW), and board lifecycle from Eval to HVM (High Volume Manufacturing)
• Strong expertise with using analyzers and oscilloscopes, and other debug tools
• Knowledge and working experience on GPU and HBM architecture, SoC design and SoC power management features are a strong plus
• Strong and effective presentation, written and verbal communication skills, and the ability to work with geographically distributed product engineering teams
• Proficiency in Windows, and Linux operating systems
• Basic scripting proficiency for automation (Shell script, Perl, Ruby, Python)

ACADEMIC CREDENTIALS:

• BS/MS Electrical Engineering, Computer Engineering, or comparable disciplines

Job Description:

• Develops and optimizes BCD process technology and devices for power applications, involving TCAD simulations, device layout, characterization, and bench testing
• Develop and integrate new BCD device architectures and process modules for company BCD platforms.
• Conduct TCAD simulations to understand device behavior and calibrate simulation models to match experimental results.
• Design and lay out device test structures and new BCD device platforms.
• Analyze device performance and reliability through bench testing and data collection.
• Work with cross-functional teams, including the modeling team, to satisfy customer needs and develop advanced device models.

Job Requirement:

• Min Degree in Physics or Electrical Engineering.
• Min 3 year of expereince in TCAD (Technology Computer-Aided Design) tools for simulation and calibration.
• Experience with device layout, design rule checks, and test structure generation.
• Knowledge of BCD process development and device characterization techniques.

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900

About VSMC

VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), a joint venture between Vanguard International Semiconductor Corporation (VIS) and  NXP Semiconductors (NXP) has started construction on a 300mm wafer manufacturing facilityin Singapore, targets automotive, industrial, consumer, and mobile end markets.

Role Summary

You will be responsible to deliver robust and efficient semiconductor manufacturing process with data driven analytics and systemic problem-solving skills in the respective modules: Etch (Dry Etch and Wet Etch); Photolithography; Diffusion; Chemical Mechanical Planarization (CMP); Chemical Vapor Deposition (CVD) or Physical Vapor Deposition (PVD)

Key Responsibilities

• Lead and ensure smooth daily manufacturing operations, promptly resolving complex issues to minimize downtime and maintain production efficiency in respective module.
• Drive cross-functional collaboration with equipment and material suppliers and partners to identify technology deficiencies; develop, evaluate, and validate corrective and preventive solutions
• Oversee the qualification and sustaining manufacturing processes, ensuring rapid capacity scale-up while maintaining high standards of quality, consistency, and operational readiness
• Continuously improve process stability and capability, enhance quality, reliability, yield, productivity, and safety standards
• Design, lead and execute experiments, analyze complex data sets, and derive actionable insights to optimize manufacturing processes and precise controls
• Implement statistical process control methods to establish and uphold robust manufacturing processes

Education Qualification & Essential Experiences

• Bachelor’s or higher degree in Electrical and Electronics Engineering, Chemical Engineering, Material Science, Physics or STEM related fields
• Minimum of 5 years of experience as an Process Engineer in respective module; Experience working in a 12'' Fab would be advantageous

Key Skills and Attributes

• Good interpersonal and communication skills to work effectively across functions and geographical teams with diverse background
• Strong analytical and problem-solving skills to achieve positive results and outcome
• Goal driven and an excellent team player that can work under pressure in a dynamic and fast-paced environment
• Has a growth mindset, prioritizing adaptability, resilience, innovation, and ongoing learning to support business needs

VSMC promotes diversity and inclusivity in our workforce; and hiring will be conducted in phases.

Position title : Senior TCB Application & Technical Sales Engineer

Location: Admirax St

Working Days:  5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : SGD 7,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities:

• Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.

• Support technical sales activities and customer discussions.

• Benchmark competitor equipment and identify technology gaps.

• Translate customer requirements into internal equipment specifications.

• Develop and optimize TCB process parameters on TCB Equipments.

• Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.

• Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage.

• Conduct DOE and process characterization activities.

• Work closely with Mechanical, Software, Electrical, Motion and Vision teams.

• Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process windows.

• Lead machine qualification, FAT and SAT activities.

• Act as the internal customer during machine development.

• Support customer buyoff and onsite qualification activities.

Requirements:

• Bachelor’s or Master’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Semiconductor Engineering or related fields.

• 5–15 years of semiconductor packaging experience preferred.

• Hands-on experience in TCB, Flip Chip and Advanced Packaging.

• Experience in HBM / CoWoS / 2.5D / 3D packaging.

• Experience in OSAT, IDM or semiconductor equipment environments preferred.

• Experience with fluxless or N2 bonding environment is an advantage.

• Strong understanding of Thermo Compression Bonding (TCB), Flip Chip processes, thermal management, warpage control, alignment systems, vision systems, process qualification, SPC and yield analysis.

• Experience with DOE, statistical analysis tools, failure analysis workflows and semiconductor process characterization.