Total 20,189 process improvement manager job vacancies in The Philippines

Job Responsibilities:

• Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.
• Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
• Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
• Upload recipe, check recipe and ensure recipe content compliance using RMS.
• Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN. Provide guidance to junior Engineers.
• Setup and troubleshoot issues in recipes/ job files in all metrology tools within the Module.
• Analyze data from passed down to identify chronic process issues, establish improvement programs and lead engineers to resolve them. Establish CAS / procedures to be followed and work with other departments for resolution if required.
• Work as a team with both Equipment and Manufacturing Engineers to meet Module objectives. Drive team to meet key indices of Uptime and OEE as per the goals set for these indices.
• Take on leadership roles to drive a small cross functional task team to address yield improvement/ excursion issues.
• Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements.
• Resolve complex technical issues in own Module or yield related issues
• Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
• Self audit and update specifications / documentation to meet TS16949 Quality Standard requirements.

Requirements:

• Degree in Electrical / Electronics / Microelectronics / Chemical Process / Chemistry / Physics / Material Sciences / Mechanical
• Min 2 years of relevant work experience in Thin Film CMP Process and Wafer fabrication process.
• An excellent team player with good interpersonal, communication and written skills
• Strong logical thinking capability and good analytical skill
• High level of integrity with strong leadership attributes to lead and coach a team
• Highly committed with good ownership and accountability
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications

Job Description:

• Analyze SPC charts. Understand the rules and their significance. Perform proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.
• Use JMP and Klarity ACE to analyze split lot, DOE data, and sort yield.
• Upload recipes using RMS, check recipes, and ensure recipe content compliance.
• Follow up on 3L5W, MRB, 8D, TECN, or update specifications through ECN. Provide guidance to junior engineers.
• Set up and troubleshoot issues in recipes/job files in all metrology tools within the module.
• Act as a process engineer for new equipment acceptance. Understand the concept of repeatability and reproducibility (R&R) run.

Requirements:

• PhD/Master/ Degree in Electrical/Electronics/Microelectronics/Chemical Process/Chemistry/Physics
• Excellent team player with good interpersonal, communication, and written skills
• Strong logical thinking capability and good analytical skills
• High level of integrity, commitment, with good ownership and accountability
• Able to adapt in a fast-paced environment and work under pressure
• Proficient in MS Office applications like Excel, PowerPoint, PowerBI

Job Summary

The ideal candidate will lead Topsides Process Engineering for FPSO, FLNG, or offshore projects, providing strategic focus across Conceptual, pre-FEED, FEED, and EPC(I) phases with hands-on engineering expertise and leadership in offshore oil and gas.

Responsibilities

• Lead development and continuous improvement of corporate technical standards, procedures, workflows, and engineering platforms to ensure practical, fit-for-purpose solutions incorporating project lessons learned
• Manage topside process engineering resources by monitoring project progress and assigning competent personnel aligned with project needs in close collaboration with Project Management Teams
• Maintain and disseminate the Lessons Learned database for project execution and operations to enable preventive and mitigative actions and promote design standardization
• Serve as Project Discipline Lead for Topsides Process, applying hands-on engineering expertise to guide project execution and technical decisions
• Report regularly to Head of Process Discipline on project concerns, resource planning, progress updates, and forecasts, participating in corporate meetings
• Provide technical guidance and career development opportunities for engineers and designers, facilitating access to international conferences and training
• Support Hanwha Ocean engineering teams across global locations including India, Seoul, and Houston for offshore project phases from Conceptual to FEED
• Travel internationally as required to support project and team needs

Required competencies and certifications

• Bachelor’s or Master’s degree in Petroleum or Chemical Engineering
• Proven hands-on process engineering experience in FPSO or offshore EPCI projects, including process simulation (steady state, dynamic), HB/MB, utility consumption, blowdown/flarenet studies, hydraulic and equipment sizing, control narrative, HAZOP, and technical safety action close-out
• Experience leading FPSO FEED/EPCI projects as Project Lead for Topsides Process, covering Conceptual and Feasibility Studies
• Experience managing topside process engineering resources and project progress in offshore or onshore oil and gas industry projects
• Proficiency with process engineering tools such as Aspen HYSYS, Flarenet, Pipe-net, or equivalents, with ability to interpret simulation results
• Extensive knowledge of process engineering principles, industry codes, standards, and scientific problem-solving methods
• Strong analytical and problem-solving skills applied to engineering challenges
• Effective communication skills in English, both oral and written, to collaborate with multidisciplinary teams, vendors, and clients
• Ability to work independently and collaboratively with strong attention to detail and accuracy

Preferred competencies and qualifications

• Experience in Field Engineering during construction or onshore/offshore commissioning phases
• Familiarity with zero carbon emission technologies and CCUS (Carbon Capture, Utilization, and Storage) technologies

Our client is a well-established MNC specializing in precision manufacturing and engineering solutions, supporting customers across various industries globally. They are looking for a Mold Process Engineer (SPD Tester) to join their Engineering team. They are located in the (West) – easily accessible.

Responsibilities for Mold Process Engineer (SPD Tester):

• Provide engineering support for injection moulding, assembly, packaging, and manufacturing operations.
• Troubleshoot process, tooling, and equipment issues to improve production efficiency and minimise downtime.
• Analyse process variances and implement corrective actions to improve yield and process stability.
• Support process development, optimisation, and validation activities for new and existing products.
• Execute validation activities including Installation Qualification (IQ), Operational Qualification (OQ), and Performance Qualification (PQ).
• Conduct Design of Experiments (DOE), process studies, and technical evaluations to enhance process capability.
• Prepare and maintain Standard Operating Procedures (SOPs), validation reports, and technical documentation.
• Perform Process Failure Mode and Effects Analysis (pFMEA) and support continuous improvement initiatives.
• Work closely with Production, Quality Assurance (QA), Maintenance, and Engineering teams to ensure smooth manufacturing operations.
• Ensure manufacturing activities comply with ISO 9001, ISO 13485, and ISO 14001 standards.

Requirements:

• Diploma or Degree in Mechanical Engineering or related discipline.
• Minimum 3–5 years of relevant working experience in plastic injection moulding environment.
• Knowledge of validation protocols including IQ, OQ, and PQ.
• Familiar with Scientific Process Development (SPD) methodologies.
• Experience in DOE, process optimisation, and troubleshooting will be advantageous.
• Exposure to ISO 9001 and ISO 13485 environments will be an added advantage.

Interested candidates who wish to apply for the advertised position, please click APPLY NOW or email an updated copy of your resume/CV.
We regret that only shortlisted candidates will be notified.

Email Address: jobs@recruitpedia.sg
EA License No: 19C9682
EA Personnel No: R22104769
EA Personnel Name: Ong Boon Kiet (Travys)

Job Description

We are seeking a talented and self-motivated Scientist, the successful candidate will join the Advanced Process Modules (APM) team at IME, develop specialty technologies for CMP process.

Key Roles and Responsibilities

1. Develop CMP process for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications to enable process and/or product realization.
2. Provide technical leadership in collaboration with process development, optimization, and troubleshooting for both industrial and grant-funded projects.
3. Own innovation strategy for CMP raw materials, slurry, methodologies, and approaches to enhance CMP uniformity, stability and defect performance.
4. Prepare and deliver technical reports and presentations for both internal stakeholders and external customers, effectively communicating project progress and technical insights.
5. File patents and know-hows for new development activities.
6. Publish research findings in leading journals and conferences

Job Requirements

1. Ph.D degree in Electronics, Microelectronics, Materials Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Physics, or equivalent.
2. Minimum 2 years of relevant working experiences in R&D and/or semiconductor industry, preferably in CMP technologies.
3. Hands-on experience with 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara) is highly desirable.
4. Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor platforms is advantageous.
5. Hands-on experience with basic process characterization techniques such as SEM, Ellipsometry, and AFM is a plus.
6. Strong skills in experimental design (DOE), data analysis, and process optimization.
7. Good analytical and communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
8. Self-motivated with a strong interest in advancing next-generation CMP applications and industry trends.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

The Grant Process team oversees all grant applications and claim submissions for the grants managed by the organization. You will be part of the team to ensure compliance and accountability in grant administration, work with internal and external stakeholders to achieve targets and deliver good client experience.

• Evaluate the eligibility of grant applications and issue grant offers to companies.
• Verify claims submissions on project achievements and eligibility of claim, and guide juniors on the same.
• Maintain proper records of applications and claims, fulfill system processes and ensure accurate data inputs in system.
• Work with stakeholders (including but not limited to internal teams/ groups, clients, call centers and system vendors) to ensure daily operation effectiveness and excellent client service delivery.
• Assist with provision of inputs for data collection, reports and budget utilization, and in conducting User Acceptance Testings.
• Provide support on grant audits, PDPA compliance & management, and address queries from other teams.
• Handle administrative duties, and provide support for ad-hoc assignments to events/ projects as assigned.

Job Requirements:

• Diploma in business management, computer science, finance, or related field, with at least 3 years relevant experience in claims or grants management/administration. Fresh diploma holders are welcome to apply.
• Strong analytical ability, detail-oriented and adept in business understanding
• Meticulous, and adept at problem-solving
• Good interpersonal skills and effective communication skills (both written & verbal)
• A team player with a strong sense of responsibility and initiative

Only Singaporeans may apply.
Designation and salary will be commensurate with experience.
We will only contact shortlisted candidates

• Support departmental objectives and daily test operations
• Coordinate Glide and TDS processes, including spec enhancement, process improvement, and special rescreen specifications
• Support continuous cost improvement initiatives related to test heads
• Support continuous quality improvement initiatives especially analysis on customer returns.
• Drive continuous test process and quality system improvement (e.g. SMART Test, CAS)
• Coordinate Test Cell Controller processes, including recipe setup to meet product requirements and support engineering runs
• Improve product quality through early detection, prevention, and post‑test failure analysis
• Support continuous improvement of test quality triggering systems and media yield without impacting HDD performance
• Ensure all test process indicators, triggering limits, monitoring, and reaction plans are adequate and effective
• Verify, control, monitor, and propagate new processes and new equipment into PN Test
• Coordinate deployment and updates of test machine, robot, and tester software
• Assist engineers with daily operational support and special projects
• Ensure compliance with ISO standards, documentation, safety rules, and cleanroom protocols

• Support departmental objectives and daily test operations
• Coordinate Glide and TDS processes, including spec enhancement, process improvement, and special rescreen specifications
• Support continuous cost improvement initiatives related to test heads
• Support continuous quality improvement initiatives especially analysis on customer returns.
• Drive continuous test process and quality system improvement (e.g. SMART Test, CAS)
• Coordinate Test Cell Controller processes, including recipe setup to meet product requirements and support engineering runs
• Improve product quality through early detection, prevention, and post‑test failure analysis
• Support continuous improvement of test quality triggering systems and media yield without impacting HDD performance
• Ensure all test process indicators, triggering limits, monitoring, and reaction plans are adequate and effective
• Verify, control, monitor, and propagate new processes and new equipment into PN Test
• Coordinate deployment and updates of test machine, robot, and tester software
• Assist engineers with daily operational support and special projects
• Ensure compliance with ISO standards, documentation, safety rules, and cleanroom protocols

• You’ll lead process ownership and automation initiatives, driving straight-through processing (STP), defining platform requirements, and partnering with technology teams on system implementations and workflow improvements.

• You’ll optimise fund accounting and reconciliation processes, ensuring accurate and timely data inputs, overseeing cash book closure, and defining exception management and “human-in-the-loop” controls.

• You’ll embed governance, scalability, and standardisation, introducing frameworks, toolkits, and training to support consistent, high-quality delivery across clients and regions.

• You’ll leverage data, MI, and emerging technologies, monitoring STP rates, conducting root cause analysis, and recommending automation and AI-driven solutions to enhance efficiency and performance.

• You’ll collaborate with cross-functional stakeholders, including product managers, leadership, and regional teams, to refine processes, prioritise technology initiatives, and improve service quality and operational outcomes.

What we offer 

• Comprehensive remuneration: Competitive financial packages based upon market rates for your role, proportionate to your qualifications, level of experiences and skills profile 
• Pension Scheme: Generous employer contribution with the ability to increase employee contributions 
• Wellbeing: Additional social benefits such as medical insurance & life assurance, discounted gym memberships and the opportunity to engage with our local community via sports activities, charity programmes & environmental initiatives 
• Flexible working: We recognise the value of working flexibly and enable our employees to enjoy an excellent work-life blend 
• Support and development: We will ensure you have the right training, tools and development plan to grow and improve your skills every day.

Position title : Senior TCB Application & Technical Sales Engineer

Location: Admirax St

Working Days:  5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : SGD 7,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities:

• Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.

• Support technical sales activities and customer discussions.

• Benchmark competitor equipment and identify technology gaps.

• Translate customer requirements into internal equipment specifications.

• Develop and optimize TCB process parameters on TCB Equipments.

• Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.

• Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage.

• Conduct DOE and process characterization activities.

• Work closely with Mechanical, Software, Electrical, Motion and Vision teams.

• Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process windows.

• Lead machine qualification, FAT and SAT activities.

• Act as the internal customer during machine development.

• Support customer buyoff and onsite qualification activities.

Requirements:

• Bachelor’s or Master’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Semiconductor Engineering or related fields.

• 5–15 years of semiconductor packaging experience preferred.

• Hands-on experience in TCB, Flip Chip and Advanced Packaging.

• Experience in HBM / CoWoS / 2.5D / 3D packaging.

• Experience in OSAT, IDM or semiconductor equipment environments preferred.

• Experience with fluxless or N2 bonding environment is an advantage.

• Strong understanding of Thermo Compression Bonding (TCB), Flip Chip processes, thermal management, warpage control, alignment systems, vision systems, process qualification, SPC and yield analysis.

• Experience with DOE, statistical analysis tools, failure analysis workflows and semiconductor process characterization.