Total 722 Senior Executive level Health / Beauty / Fitness job vacancies

Responsibilities:

• Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing.

• Product Development and Validation: This role is pivotal in developing, validating, characterizing, and qualifying Micron’s next-generation HBM products. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products.

• Support for New Product Design Validation: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies.

• Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets.

• Root Cause and Resolution of Manufacturing Test Flow Issue, Qual and RMA Device Issues

• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.

• At least 3 years experience in semiconductor devices, circuit design, or product validation is a plus.

• Solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.

• Familiarity with CMOS technology, DRAM architecture, and basic device physics.

• Exposure to data analysis, statistics, and scripting tools such as Python or JMP.

• Strong attention to detail and a commitment to quality.

• Ability to work effectively in team-based projects, contributing to shared goals and outcomes.

• Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.

• Responsible and accountable, with a professional work ethic and ownership of assigned tasks.

• Clear and effective communication skills, especially when articulating technical concepts and findings
  

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Responsibilities:

• Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.

• Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.

• DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time

• Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.

• Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.

• Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.

• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.

• At least 3 years experience in semiconductor devices, circuit design, or product validation is a plus.

• Solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.

• Familiarity with CMOS technology, DRAM architecture, and basic device physics.

• Exposure to data analysis, statistics, and scripting tools such as Python or JMP.

• Strong attention to detail and a commitment to quality.

• Ability to work effectively in team-based projects, contributing to shared goals and outcomes.

• Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.

• Responsible and accountable, with a professional work ethic and ownership of assigned tasks.

• Clear and effective communication skills, especially when articulating technical concepts and findings
  

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.