Total 127 Senior Executive process improvement manager job vacancies in Hong Kong

Introduction:

Process integration in development, optimization, and qualification of semiconductor devices/processes to meet performance requirements.

Your Job:

• Process integration in development, optimization, and qualification of semiconductor devices/processes to meet performance requirements.

• DOE design, execution, and analysis of results.

• Partner process module engineers to improve device/yield performance.

• Own and drive technical process problem solving.

• Interact with internal & external customers and respond to technical queries.

• Establish new technology design rules, test structures and test methodologies.

• Innovate new methods of continuous process/device improvement.

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Required Qualifications

• Education - Degree/master's in electrical, Electronics Engineering or equivalent.

• 4 year’s relevant experience for Degree.

  Wafer Fab process integration experience is required.

Preferred Qualifications:

• Knowledge of semiconductor device physics and/or RF fundamentals (e.g. S-parameters) is a plus.

• Independent, resourceful, with a positive attitude toward continuous learning & knowledge acquisition.

• Excellent analytical and optimization skills.

• Great interpersonal skills and ability to work with cross-functional teams.

GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

Roles and Responsibilities:

•  Ensure timely submission of process deliverables, including PFDs, P&IDs, hydraulic profiles, equipment sizing, HAZOP study reports, etc

•  Lead in the P&ID (Piping and Instrumentation Diagrams) drawings submissions utilizing Bentley OPPID, PFD (Process Flow Diagrams), and mass balance calculations

•  Lead in RO Membrane design selection and process.

·   Participate and coordinate in HAZOP (Hazard and Operability) studies for the overall plant and its systems/sub-systems.

•  Integrate equipment and material capabilities to meet process module and technology specifications.

•  Taking the lead in discussion with clients on planning and execution of the testing and commissioning for successful project completion.

•   Analyze and review current processes to streamline them for improvement, productivity enhancement, sequence optimization, unit improvement, and troubleshooting of the plant during testing and commissioning.

•   Attend technical meetings with clients, vendors, sub-contractors, and internal project teams.

•  Collaborate with various disciplines engineers to ensure all interfacing issues are aligned and resolved to mitigate engineering rework.

·   Any other ad-hoc engineering duties to support the Project Manager for successful execution of the project.

Responsibilities

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type

• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs.

• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements

• Identify disruptive processes early on and work with manufacturing and Boise TD to identify viable path forward

• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions

• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes.

• Design and implement advanced process monitoring and control methodologies.

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.

• This position requires communications and collaboration with partners both locally and globally. 

• Strict adherence to Micron Intellectual Property protection policy is a must.

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Bachelors/Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry and related

• A deep understanding of chemistry, chemical kinetics, thermodynamics and  mass transport

• Opportunity to travel overseas for an extended period of time for collaborative R&D work assignment.

• 2-3 years of experience in Semiconductor Equipment/Process development is preferable

• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data

• Working knowledge of Design of Experiments (DoE)

• Proven ability to collaborate with local and overseas teams on projects

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Ability to be a self-motivated individual and be adaptable

• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously

• Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus

Responsibilities

• Lead the development of mass balances, hydraulic profiles (P&IDs) and process flow diagrams for water treatment plants.

• Conducting process modelling, simulations and pilot testing to validate new technologies and process improvements

• Size and specify process equipment, such as pumps, blowers, tanks and etc. to meet system performance and reliability requirements

• Evaluate supplier proposals, quotations to ensure compliance with technical and commercial requirements

• Collaborate with cross-functional teams to plan and execute projects

• Provide onsite technical support during project execution and lead troubleshooting of operational issues

• Lead plant testing and commissioning.

• Prepare commissioning plans, SOPs, O&M manuals and training materials.

• Support proposal development and tender preparation.

• Mentor junior engineers and designers.

• Execute other ad-hoc tasks as assigned to support project and team objectives

Requirement

• Degree in Chemical Engineering, Environmental, Civil Engineering or a related technical discipline

• 8+ years' experience as a Process Engineer or Senior Process Engineer, preferably in the water treatment industry

• Proficient in AutoCAD

• Strong problem-solving, analytical and critical thinking skills

• Excellent interpersonal and communication skills

Job Responsibilities:

• Develop, validate, and maintain special process procedures (e.g., heat treatment, surface treatment, coatings, welding, brazing)
• Perform process capability studies and continuous improvement initiatives
• Ensure compliance with aerospace standards and customer requirements
• Assist the Manager in day-to-day process monitoring and production requirement
• Perform other duties and responsibilities, as assigned

Job Requirements:

• Minimum 3 years of relevant experience in an Aerospace or Manufacturing environment

Interestedapplicants can send their detailed resumes to janelui@recruitexpress.com.sgor call JANE @ 6735 1955.

JANE LUI JIE'EN

CEI: R1104482

Company Reg.No. 199601303W || EA Licence No. 99C4599

The Process engineer plays a vital role in D2W hybrid bonding process optimization, yield improvement and to develop innovating process flow or path finding. PE Works closely between internal Hybrid team, partner and Customers.

• Responsible for process development & CIP’s to improve the product yield
• To conduct DOE’s and experimental process trails and data analysis
• Define new process flow for customer products and run internal feasibilities
• Provides technical subject matter expertise in the area process developments
• Understands the Hybrid bonding upstream & downstream process flow to relate actual Hybrid bonding or Fusion bonding yield related topics
• Process optimization and data analysis to improve the process responses hybrid bonding and annealing
• Supports SOP, technical documentation and product operating manual writing activities and publish BKM process flow
• Builds-up technical know-how on product/problem solving via structured knowledge transfer between the on-site support team
• Machine and Technical Support
• Machine operation and application/product setup
• Prepares and executes customer demo feasibilities and recommend the process flow
• Coordinates and provides technical solutions / problems solving on customer process related issues in collaboration with Field issues
• Investigates process issues at customer site and supports Engineering team

Education

• Master’s in mechanical/electrical/Electronics /Physics or PHD

Work experience

• Minimum 5 years relevant experience in C2W or W2W hybrid bonding and Front end wafer fab/backend process
• Significant practical experience in solving process issues and process optimizations including new process setup
• Hands-on experience in semiconductor front end or backend Process and equipment’s including defectivity & yield engineering

Expertise and methodology

• Good in MS-Office, data analysis SW like JMP, Matlab
• Hands-on Process Development Expertise and able to share the Problem Statement in crystal clear

EA License : 02C3423

EA Personnel : R22108699

Job Description

• Adherence to the established company core values, operations and safety policies and procedures.
• Troubleshoot and take corrective action to ensure operating parameters are within Standard Operating Condition for the production of quality products.
• Perform routine patrol check, collect data and safety inspections on the Ultem Polymerization Process.
• Actively participate in EHSS activities including concern reporting, Safety Risk Assessment (SRA), EHSS committee meeting
• Assist in maintenance works and perform routine cleaning of process equipment such as heat exchanger and strainers.
• Maintain established 5S standard at workplace.
• Capture all the activities and adjustment made during shift in the logbook, and proper escalation for any unresolved operational variances.
• Follow up and follow through all TOI/TA/Interlock bypass according to plan/instruction.
• Manage and coordinate logistic and downstream production team for raw material handling, finish good management, and packaging.
• Participate drills and emergency response trainings to ensure high degree of readiness in response to any emergency situations.
• Conduct patrol checks in the plant and ensure all the process conditions are within SOC/QSOC. Complete daily functional area field log sheets, and daily reporting (logbook)
• Monitor DCS control consoles for process performance on a continuous basis, including process parameters, alarms, and provides feedback of corrective action and optimization to subject matter engineers.
• Monitor sample results from analytical laboratory and follow instructions to make adjustment from DCS console whenever necessary.
• Lead problem-solving within the team and generate quality/safety non-conformance report whenever necessary.
• Conduct on-the-job training for new hires or newly assigned area technicians and complete all required certification per master training plans.
• Lead & Deploy resources within shift teams during plant upset/emergency situations.
• Develop and update SOP, SRA and other training materials when needed.
• Identify opportunities and work with other teams to drive continuous improvement on EHSS, cost saving, quality and/or yield.
• Assign as change leader and raise MOC for production as required.
• Liaise with shift leaders, maintenance, engineering, and contractors to address the identified EHSS/Quality issue.
• Able to support Process Order Technical Completion.

Requirements

• Min. NITEC or Higher NITEC in Chemical Process / Mechanical Engineering with extensive years of working experience in Polymer and Chemical Plant Operations.
• Diploma or Bachelor degree in Chemical Process Technology / Mechanical Engineering or other equivalent.
• 2-3 years’ relevant work experience in Chemical Process Plant.
• Good knowledge and experience in PTW system and ERT training.
• In-depth knowledge in polymerization processing, fire vessel operation, and solid handling.
• Mechanical related working experience is a plus
• Knowledgeable about chemical process plant operation
• Knowledgeable in mechanical equipment
• Knowledgeable about emergency response practices
• Basic investigation skills to make right judgement in the continuous operational environment
• Basic knowledge in results trend analysis
• Working knowledge of office software.
• Good communication skills (both oral and written) and interpersonal skills.
• Capable of calm and clear communication under pressure
• Strong adherence to EHSS requirements
• Able to perform 12hrs rotating shift work.

Role Summary

As a Senior Member of Technical Staff (SMTS), you are a module‑level CMP technical authority, responsible for defining CMP technical direction, leading FOAK developments, and driving cross‑functional execution across NAND nodes. As a SMTS (Senior Member of Technical Staff), you will be a part of revolutionary Next Generation NAND research & development CMP team driving Advanced NAND and CMP technology forward. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with Next Generation NAND. A SMTS CMP Engineer is a senior individual contributor responsible for defining, developing, and transferring advanced CMP processes for Micron NAND technologies. You will work directly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will work on state of the art and best in class CMP chambers & own the process roadmap to meet program and yield goals.

Main Responsibilities

• Own and lead key NAND CMP process modules, translating technology challenges into executable roadmaps across current and future nodes

• Drive cross‑functional execution across Technology Development, Process Integration, Manufacturing, and Equipment teams

• Lead FOAK CMP process development, including recipe architecture, control strategies, and integration alignment

• Ensure process robustness and manufacturability through run‑to‑run controls, SPC, qualification execution, and risk mitigation

• Resolve complex yield, defectivity, and integration issues using model‑based and data‑driven problem solving

• Define and execute process‑level hardware strategies in collaboration with equipment suppliers

• Act as a CMP technical leader, mentoring engineers, influencing adjacent process roadmaps, and communicating technology status and plans to senior stakeholders

<>·

Other Responsibilities

• Mentor engineers through structured development; build SME pipelines; publish internal papers/BKMs and present to senior leadership; uphold Micron’s technical leadership expectations

• Integrates AI assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Qualifications / Experience

• PhD ≥12 yrs, or Master’s ≥15 yrs, of relevant experience in
  Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,

• Experience in CMP Process Development

• Deep expertise in CMP chemistry, physics, and integration

• Publications/patents and strong record of technical contributions.

Must-Have Technical Skills

• In‑depth expertise in CMP fundamentals, including pad–slurry–wafer interactions, slurry chemistry at a mechanistic level, and pattern density/layout effects

• Strong understanding of multiple CMP process types (e.g., metal, dielectric, barrier/hardmask, poly‑Si/Si CMP)

• Extensive hands‑on experience with advanced 300 mm CMP OEM platforms, including driving hardware capability, throughput, and cost improvements

• Proven expertise in statistical process control (SPC), data analysis, and qualification methodologies

• Ability to independently drive complex technical execution, resolve yield and defectivity issues, and influence cross‑functional teams

Must-Have Soft Skills

• Demonstrated technical leadership in problem solving, with experience leading complex or multi‑disciplinary technical projects

• Strong ability to influence without authority across process integration, equipment, and manufacturing teams

• Clear and structured technical communication skills, including written documentation and stakeholder updates

• Strong analytical mindset with disciplined, data‑driven decision making

Embody Micron’s core values:

• People – Respect, develop and empower others

• Innovation – Drive continuous improvement and breakthrough thinking

• Tenacity – Show grit and determination

• Collaboration – Build trust and foster teamwork

• Customer Focus – Deliver excellence and value

Job Responsibilities:

• Develop, validate, and maintain special process procedures (e.g., heat treatment, surface treatment, coatings, welding, brazing)
• Perform process capability studies and continuous improvement initiatives
• Ensure compliance with aerospace standards and customer requirements
• Assist the Manager in day-to-day process monitoring and production requirement
• Perform other duties and responsibilities, as assigned

Job Requirements:

• Minimum 3 years of relevant experience in an Aerospace or Manufacturing environment

Interestedapplicants can send their detailed resumes to janelui@recruitexpress.com.sgor call JANE @ 6735 1955.

JANE LUI JIE'EN

CEI: R1104482

Company Reg.No. 199601303W || EA Licence No. 99C4599

Key Responsibilities:

• Lead the architecture design (e.g. memory cells, select transistors, and peripheral devices), process integration, electrical characterization, modeling and simulation, failure analysis for 3D NAND devices.
• Design and execute DoE, analyze the impact of process variations on device performance and reliability (such as durability and data retention), and propose improvement solutions.
• Collaborate with the process development team to assess new device architectures, driving technology iteration.
• Write detailed technical reports and support customers or internal teams in resolving related technical issues.

Required Qualifications:

1. Education: Master's degree or above
2. Major: Microelectronics, physics, material science & engineering, chemistry;
3. Other Requirements:

• 8+ years of semiconductor device work experience, 3+ years of 3D NAND work experience.
• In-depth knowledge of 3D NAND device physics, familiar with its principles, failure modes, and reliability mechanisms.
• Troubleshooting, and problem-solving capabilities, with experience in successfully improving device performance or yield.
• Familiar with advanced semiconductor manufacturing processes and integration flows.
• Strong cross-team communication and collaboration skills.

Responsibilities:

·Responsible for API manufacturing process technical support and improvement initiatives for ongoing operations.

·Develops API analytical techniques including HPLC, GC, FTIR, titration and other analyticalmethods for process characterization and process mapping.

·Experience in establishing a robust GMP documentation system for data recording including ELN and Empower, ensuring data integrity and compliance with regulatory standards.

·Acquire knowledge on setting up empower and electronic lab note book

· Designs and executes process improvements and lab studies/experiments

· Serves as at echnical SME; Provides technical expertise to production and S&T

· Addresses and solves technical problems independently.

·Performs independent, advanced and complex data analysis.

·Generates new ideas and demonstrates a high level of scientific initiative.

·Responsible for continuous process improvement activities.

·Identifies equipment or techniques that improve manufacturing processes and operations.

·Authors technical reports and monitors consistency and quality of technical reports.

Requirements:

·Bachelor’s, Master’s in scientific or engineering discipline with 3 to 5+ years of Active Pharmaceutical Ingredient (API) Manufacturing experience, depending on degree held.

·Candidate with knowledge of setting up GMP lab is preferred.

·Detailed knowledge of cGMP and regulatory requirements relating to the pharmaceutical industry is required

·Demonstrated strong process development skills,including the ability to deliver innovative process chemistry at scale.

· Strong record of scientific accomplishment

·Proficiency with Empower software

·Demonstrated record of independent thought and creativity

·Bases technical decisions, within own discipline, on sound engineering or scientific judgment.

·Evaluates and integrates appropriate state-of-the-art technology to improve processes or solve problems.

·Gathers information from multiple sources to assist in problem solving.

·Understands and aligns project goals with business objectives.

Contract Duration: 6 months

Micron’s Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology.

Key Responsibilities

• Develop and optimize unit processes to meet yield and quality targets for advanced NAND devices

• Evaluate innovative process and equipment solutions for early experimentation and process margin improvement

• Collaborate with Singapore-based Diffusion manufacturing teams to identify and prioritize key technology challenges

• Integrate and troubleshoot processes within cross-functional teams focused on yield and quality enhancement

• Partner with Boise TD Films teams to align future device requirements with process capabilities

• Identify disruptive process technologies early and define viable implementation paths with global TD and manufacturing teams

• Conduct fundamental research, hardware evaluations, and novel process testing to support intellectual property generation

• Design and execute experiments to expand process margins and validate manufacturability of next-node solutions

• Lead cross-functional initiatives to simplify processes and implement improvements

• Embed best-known manufacturing practices into early-stage development of new nodes

• Develop and apply advanced process monitoring and control methodologies.

• Serve as a technical expert, contributing to process, equipment, and procedural improvements

• Lead multidisciplinary projects across teams, sites, and suppliers focused on quality, yield, cost, and productivity

• Advise management on significant technical issues and drive innovation through patents and technical publications

• Maintain strict adherence to Micron’s Intellectual Property protection policies

• Engage continuously with global TD partners and suppliers to push for breakthrough solutions

• Own and manage module-level business processes

Requirements

• Bachelor/Masters in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics with minimum 5 years of relevant experience or PhD in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics

• Strong understanding of:

• - Flow dynamics, thermodynamics, and physical phenomena in deposition

• - Precursor depletion effects in 3D structures and mitigation strategies

• - Interface characterization techniques (e.g., SIMS, XPS, EDX, SEM/TEM)

• - Integration and structural constraints in film deposition processes

• - Memory process flows, especially for planar and vertical NAND

• Proficiency in data analysis tools (e.g., Y3) and Design of Experiments (DoE)

• Excellent communication skills for both in-person and remote interactions

• Self-motivated, adaptable, and capable of managing multiple projects in a dynamic environment

Job Description

• Process development and optimization for silk screen printing, die cutting, lamination, assembly and converting processes
• Support new product introduction (NPI), process parameters, validation (IQ, OQ, PQ) and capability studies
• Troubleshoot production and quality issues, conduct root cause analysis, and implement corrective and preventive actions (CAPA)
• Drive Kaizen initiatives for productivity, yield, cycle time, scrap reduction and cost improvement
• Evaluate and qualify new materials, equipment, tooling, and manufacturing methods
• Coordinate tooling fabrication, ECN implementation, and ERP system setup
• Ensure compliance with ISO 9001, ISO 13485, ISO 14001, ISO 45001, safety, environmental, and customer requirements
• Support equipment setup, maintenance coordination, and process capability studies
• Participate in customer audits, supplier audits, and technical discussions when required
• Prepare SOPs, work instructions and engineering documents
• Any other task assigned by the Superior

Requirements

• • Minimum Degree with at least 5 year(s) experience in a Manufacturing environment with mechanical and electronics assembly
  • Independent, self-motivated, team player and able to work under pressure with minimal supervision
  • Proficiency in Microsoft Office, AutoCad, GD&T, PFMEA, QCP and process validation per ISO 13485 is preferred
  • Experience in Kaizen, Lean Manufacturing, Six Sigma, Yield Improvement, Productivity Improvement, Cost Reduction preferably
  • Mechanical system understanding with electrical / electronic knowledge

Interested candidates please send Resume in Ms Word format with full Certificate to diana.soh@boydcorp.com. Regret only shortlisted candidate will be contacted.

Job's mission

As a Senior Process Engineer in Advanced Packaging, you will bring your PhD research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM’s mission to enable the chips that power today’s most advanced technologies.

What you will be working on

• Contribute to the research, development, and optimization of semiconductor processes for Advanced Packaging, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation technologies.
• Design, execute, and analyze experiments using DOE-based approaches, supported by senior technical experts.
• Perform materials and process characterization to evaluate film quality, reliability, and performance.
• Analyze experimental data and clearly document results in technical reports and internal presentations.
• Collaborate with cross-functional teams across R&D, process engineering, and applications.
• Support troubleshooting of process or equipment issues in laboratory and pilot environments.
• Participate in technology reviews and contribute ideas to process improvement and innovation initiatives.
• Learn industry best practices for transitioning processes from development into customer and manufacturing environments.

What we are looking for

• PhD in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, Electrical Engineering,
• Hands-on research experience with thin-film deposition processes such as ALD, CVD, PECVD, or PVD.
• Strong experimental background, including designing experiments and analyzing complex data sets.
• Solid problem-solving and analytical skills, with a structured approach to research challenges.
• Clear written and verbal communication skills, with the ability to explain technical concepts to diverse audiences.
• Curiosity, initiative, and motivation to apply academic research in an industrial setting.
• Strong understanding of electro/mechanical equipment and software systems

What sets you apart

• Research experience related to advanced packaging, interconnects, or semiconductor manufacturing
• Familiarity with statistical methods, DOE tools, or data modeling techniques.
• Experience with materials characterization methods such as SEM, TEM, XRD, or ellipsometry.
• Exposure to cross-disciplinary or collaborative research environments.
• Interest in long-term growth within semiconductor technology development and process engineering.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Job's mission

As a Senior Process Engineer at ASM, you will drive the development of high‑thermal‑conductivity thin films that enable next generation high‑performance computing (HPC) and advanced packaging. You’ll lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. By translating demanding customer requirements into breakthrough materials and processes, you’ll help position ASM at the forefront of thermal management for heterogenous integration of advanced logic, foundry, and memory devices.

What you will be working on

• Contribute to research development areas focused on high thermal conductivity thin films for advanced packaging and HPC applications, fostering innovation, technical excellence, and collaboration
• Own the roadmap to develop thermal films or materials aligned to customer performance and integration requirements.
• Leverage ASM’s ALD/PEALD, CVD/PECVD, and surface preparation expertise to design, optimize, and qualify high thermal conductivity materials and stacks for use in advanced devices and packages.
• Drive high thermal conductivity thin film development, including process optimization for deposition rate, uniformity, materials properties, morphology and bondability.
• Define, influence, and drive new hardware requirements and development in close collaboration with hardware and software engineering teams to meet advanced on high thermal conductivity process specifications and integration schemes.
• Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.
• Partner with corporate and global R&D organizations to deliver new materials, surface preparation schemes, and applications that support critical technology inflections in thermal management and advanced packaging.
• Ensure generation and protection of intellectual property and technical publications.
• Stay at the forefront of state‑of‑the‑art semiconductor processing and thermal management technologies, maintaining strong technical communication with industry peers and key customers.
• Communicate at a highly technical level with end customers to build trust in ASM’s ability to solve their most advanced thermal and device challenges.

What we are looking for

• Ph.D. degree in Physics, Physical Chemistry, Chemical Engineering, Materials Science, or a related field
• Minimum 10 years of experience in the semiconductor or semiconductor capital equipment industry
• Proven track record of developing and delivering new semiconductor process technologies to customers
• Strong working knowledge of semiconductor device physics and manufacturing processes
• Demonstrated credibility working with semiconductor fab managers, senior engineers, and executive stakeholders
• Ability to operate effectively in a fast-paced, results-oriented, and highly competitive environment
• Excellent communication skills in English; ability to collaborate in a global R&D environment
• Willingness to travel approximately 10–20%

What sets you apart

• Deep expertise in ALD/PEALD, CVD/PECVD, including RF and/or microwave based
• Experience developing high‑thermal‑conductivity materials
• Track record generating patents or publications in thin‑film or thermal‑materials innovation
• Strong reputation for building high-performance, collaborative engineering cultures
• Experience influencing product direction through process innovation, materials engineering, and hardware collaboration
• Recognized thought leadership through patents, publications, or industry contributions
• Ability to balance technical innovation, customer satisfaction, and business priorities