Core Role: Responsible for the comprehensive management of high-speed electrical chips (including TIA/CDR, high-speed interfaces, etc.) from technology planning, team building, project development to mass production and delivery; building a first-class domestic high-speed electrical chip design team to support the company's high-end chip product deployment and competitiveness building in optical communication, data centers, and automotive applications.
I. Job Responsibilities
1. Team and Organization Management
- Responsible for the overall construction of the electrical chip design team, talent development, performance evaluation and incentives, managing a design team of 20-60 people.
- Build a complete chip R&D organizational system encompassing front-end design, back-end implementation, verification, DFT, packaging and testing, and reliability.
- Develop team technology roadmaps, capability maps, and training systems to improve overall design level and delivery efficiency.
2. Technology and Product Planning
- Lead high-speed electrical chip technology planning: Driver/TIA, linear driver LPO, analog/mixed-signal chips, etc.
- Based on the needs of optical modules, data centers, automotive, and computing interconnection, output product roadmaps and technology breakthrough paths.
- Master advanced industry architectures (PAM4, Co-packaged optics, LPO/Linear, etc.) to maintain technological leadership.
3. Full-Lifecycle Project Management
- Responsible for the entire lifecycle management of chip R&D projects: project initiation, requirements gathering, front-end design, verification, back-end development, tape-out, packaging, testing, and mass production.
- Control schedule, cost, quality, and risk to ensure successful tape-out on the first attempt, meet yield targets, and achieve on-time mass production.
- Coordinate technical communication and project collaboration with wafer foundries (SMIC/TSMC, etc.), packaging and testing companies, and IP vendors.
4. Technical Breakthroughs and Core Capability Building
- Lead the resolution of key technical bottlenecks such as high-speed signal integrity, low power consumption, high reliability, yield, and ESD/EMC.
- Establish standardized engineering capabilities including chip design specifications, verification platforms, simulation processes, library/IP management, and quality systems.
- Lead patent layout, key technology breakthroughs, and pre-research to form the team's core technological barriers.
5. Cross-departmental Collaboration and Business Support
- Collaborate with systems, optical modules, hardware, marketing, and sales departments to clarify chip requirements, specifications, delivery, and application solutions.
- Support customer implementation, solution review, problem localization, and mass production assurance to enhance product competitiveness and customer satisfaction.
- Participate in technical exchanges with major clients, industry standards, and ecosystem cooperation.
6. Quality and Compliance Management
- Establish a system for chip, reliability, failure analysis, and mass production yield improvement.
- Ensure R&D processes comply with ISO9001/IATF16949, information security, and export control requirements.
II. Job Qualifications
1. Education and Major
- Master's degree or above in microelectronics, electronic engineering, integrated circuit design, communication engineering, or related fields.
2. Work Experience
- Over 8 years of experience in the design and development of high-speed electrical chips/high-speed interface chips, and over 3 years of team management experience.
- Complete responsibility for at least 2 mass-produced chips (Dviver/TIA/high-speed mixed-signal/interface chips preferred). - Prior experience in electrical chips and high-speed data center interconnects is preferred.
3. Professional Technical Skills
- Proficient in high-speed analog/mixed-signal and high-speed I/O design and verification.
- Master the entire chip workflow: front-end RTL/synthesis, UVM verification, DFT, back-end PR, SI/PI, packaging, testing, and yield.
- Experience in successful tape-out and mass production delivery; familiar with advanced processes such as TSMC/SMIC (28nm/14nm/12nm/7nm).
4. Management and Comprehensive Skills
- Strong goal orientation, project management, risk identification, and cross-departmental driving ability.
- Excellent technical judgment, team leadership, communication, negotiation, and reporting skills.
- Able to withstand high pressure and adapt to multiple parallel projects and rapid iteration.
