Total 2,526 Senior Executive level Engineering job vacancies

The Opportunity: 

This is a senior technical leadership role on our Payments Platform team. You will be a go-to engineer and technical decision-maker, driving architecture, automation, and platform reliability at scale. You will influence how Flywire's treasury and FX systems evolve globally, while mentoring and levelling up the team around you.

What You'll Do

• Architect and deliver scalable, reliable solutions across treasury, FX, and payment processing systems
• Lead technical design discussions and drive decisions with long-term platform impact in mind
• Partner with Product, SRE, and global stakeholders to translate complex requirements into robust engineering outcomes
• Champion automation and optimization initiatives that eliminate manual effort and reduce operational risk
• Establish and uphold engineering best practices: code quality, security, testability, and observability
• Mentor and coach junior and mid-level engineers; conduct technical interviews and support team growth
• Own resolution of complex production issues and drive post-mortems with actionable outcomes
• Proactively identify and address performance bottlenecks and scalability risks

The Opportunity:

We, at Flywire, are looking for an experienced Sr. Software Engineer I, ideally with a background in FinTech. Your primary responsibility will be to build and maintain the platform that supports the money movement of our industry leading payment engine moving hundreds of millions everyday. 

You will be joining a team in charge of designing new functionalities and improving the current capabilities to improve speed, cost and scalability of our product. Thus, a commitment to collaborative problem solving, pragmatic design, building quality products and to convey the sensation that the product is the responsibility of all the team is essential. You will be responsible for ensuring high quality code in a team defined timeframe. 

• Write clean, high quality, testable, secure, maintainable and extendable code
• Solve items such as challenging bugs and production issues within the development environment
• Work on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors.
• Exercise judgment in selecting methods, techniques and evaluation criteria for obtaining results
• Understand scalability and performance status and make improvement for scalability
• Drive change and improvement in all phases of the development lifecycle
• Partake in the recruitment process by identifying and exciting great talent
• Ensure the best possible performance, quality, and responsiveness of the applications
• Contribute to the product vision by collaborating with Product Managers and stakeholders
• Drive initiatives to lead projects as well as mentor team members
• Drive AI readiness and adoption — leverage Claude via AWS Bedrock for AI-assisted development, intelligent code review, automated documentation, and smart observability across payment workflows
• Use AWS Bedrock's enterprise controls (IAM, CloudWatch, VPC, audit logs) to ensure AI usage within the platform remains secure, compliant, and observable
• Partner with Product, SRE, and global stakeholders to translate complex, high-stakes requirements into robust engineering outcomes

Get to Know the Team

Come join the Consumer Experience (CX) Engineering team - we work on a diverse set of consumer problems spanning across core experiences that power the UX navigation and transaction funnels, search and discovery of content and services, user lifecycle covering user growth, engagement and loyalty and the critical platform mission of mobile application developer experience. We are on an exciting mission to connect consumers to Grab's marketplace by allowing them to discover and engage with Grab's services and partners.

Get to Know the Role

We are looking for a Senior Backend Engineer to take part of the CX Team. You will be responsible for ensuring high quality deliverables, spanning across multiple key services powering end to end user journeys going from the login screen to the home and activity pages of the Grab app. You will be reporting to the Engineering Manager for this role. This is an onsite role based in Jakarta.

The Critical Tasks You Will Perform

• Design and write with the cutting edge Go language to improve the availability, scalability, latency, and efficiency of Grab's range of services
• Work with engineering team to explore and create new design / architectures geared towards scale and performance
• Participate in code and design reviews to maintain our high development standards
• Engage in service capacity and demand planning, software performance analysis, tuning and optimization
• Collaborate with product and experience teams to define and prototype feature specifications
• Own end-to-end delivery of product and tech initiatives
• Work closely with infrastructure team in building and scaling back-end services as well as performing root cause analysis investigations
• Design, build, analyze and fix large-scale systems
• Pro-actively debug and solve production incidents during your oncall shift
• Provide technical guidance, mentorship and knowledge sharing to peers.

Role Overview:

Looking for a Site Reliability Engineer (SRE) to support the reliability, availability, and performance of business‑critical systems. This role focuses on AWS cloud infrastructure, DevOps tools, and core SRE practices. You will work closely with development, platform, and operations teams to ensure systems are stable, scalable, and well monitored.

Key Responsibilities:

Reliability & Operations:

• Support high availability, scalability, and performance of production systems
• Implement and maintain SLIs, SLOs, and SLAs for services
• Identify and reduce operational toil through automation and process improvement
• Support design and implementation of fault‑tolerant and resilient systems
• Manage and operate systems hosted on AWS (EC2, EKS/ECS, RDS, S3, Lambda, CloudWatch, IAM, VPC)
• Support cloud deployments and infrastructure changes following best practices
• Assist with backup, disaster recovery, and resiliency planning
• Work with CI/CD pipelines and DevOps tools to support reliable deployments
• Use Infrastructure as Code tools such as Terraform or CloudFormation
• Automate repetitive tasks using scripts (Python, Bash, etc.)

• Master the architecture of assigned features and participate in the design of new microservices
• Act as a mentor for the development team to promote autonomy and continuous skill development
• As a Full Stack Developer, design, develop, test, deploy, monitor, and continuously improve applications
  • Own the full product lifecycle (“build it, own it”), including process workflows, data extraction, maintenance, and user support
• Maintain, enhance, and support existing Java applications
• Fully understand customer and business requirements and develop solutions aligned with those needs
• Apply robust coding practices, including strong unit/component test coverage and effective debugging
• Adapt to different technology stacks based on evolving job requirements

• Master the architecture of assigned features and participate in the design of new microservices
• Act as a mentor for the development team to promote autonomy and continuous skill development
• As a Full Stack Developer, design, develop, test, deploy, monitor, and continuously improve applications
  • Own the full product lifecycle (“build it, own it”), including process workflows, data extraction, maintenance, and user support
• Maintain, enhance, and support existing Java applications
• Fully understand customer and business requirements and develop solutions aligned with those needs
• Apply robust coding practices, including strong unit/component test coverage and effective debugging
• Adapt to different technology stacks based on evolving job requirements

•  Lead subsurface investigations, develop geotechnical design parameters, and author comprehensive geotechnical data/recommendation reports.
• Execute advanced analyses for foundations, earth retention, slope stability, seismic/soil-structure interaction, settlement, and ground improvement.
• Develop designs and calculations for shallow/deep foundations, retaining structures, embankments, ground improvement, tunnels/shafts, dams/levees, and pavements.
• Prepare and review technical deliverables: calculations, drawings, specifications, cost estimates, and construction-phase RFIs/submittals.
• Manage scopes, schedules, budgets, risk, and change; support proposal development, level-of-effort estimates, and client presentations.
• Coordinate with cross-functional teams (structural, civil, water, environmental, construction management) to integrate geotechnical solutions.
• Oversee field programs (borings, test pits, in-situ testing) and lab testing plans; ensure health, safety, and quality compliance.
• Mentor and technically develop junior engineers; conduct QA/QC reviews in alignment with our quality management processes.
• Engage with clients and stakeholders, building trusted relationships and identifying opportunities for innovation and delivery excellence.

• $2,500 to $3,500
• Mon to Fri, 5 days - 8.30am to 5.30pm
• Office Location: Ubi

 Job Overview:

 The Project Coordinator supports Project Manager by handling tasks such as coordinating project activities, tracking progress, managing schedules and maintaining proper documentations to ensure project completion on time, within the scope and specifications and within the budget and resources allocated.

Responsibilities                        

• Participate in project meetings both internal and external and propose improvements if necessary
• Evaluate potential problems and technical hitches and develop solutions with technical specialists or the various stakeholders
• Plan and manage deliverables, project schedules and new information
• Supervise current projects and coordinate all team members to keep workflow on track
• Develop and manage project-related documents/paperwork by ensuring all necessary materials are current, properly documented and filed – Risk assessment, Safe work procedure etc.
• Direct project correspondences by preparing and reviewing project requirements, memos, meeting minutes and emails
• Keeping well documented project documents such as as-builds, punch lists as well as equipment special circuitry documents
• Communicate with clients to identify and define project requirements, scope and objectives
• Adhere to budget by monitoring expenses and implementing cost-saving measures
• Provide simple adjustments/troubleshooting support to newly installed equipment

Job Requirements:

• Diploma in Engineering or relevant discipline
• Certified WSQ Supervise Construction Work for WSH (Formerly BCSS Course)
• Relevant project coordination experience
• Possess valid Class 3 Manual Driving License
• Proficient in Microsoft Office (Word, Excel, PowerPoint)
• Proficiency in reading and interpreting construction and shop drawings
• Able to use analytical tools (e.g. multimeter, spirit level, laser alignment markers, and torque meter)

The Supreme HR Advisory Pte. Ltd || 14C7279

Chua Jie Ying (Cai Jie Ying), Evelynn || EA Personnel License R24120580

Job Highlights:

• Successful candidates will be assigned to a multi-million medical Center project. 
• An M&E Contractor with 40 years of establishment in Singapore.
• Career advancement, learning opportunity and bonus entitlements.

Job Responsibilities:

• Able to interpret construction engineering drawings and detect discrepancies for combined services.
• Assist the team to ensure the mechanical systems especially in ACMV equipment are designed and installed according to project standards and codes.
• Assist in execution of the power calculation for all ACMV equipment.
• Installation of HVAC equipment's chillers, AHU, FCU, MV systems, packaged unit, VRV system and split units
• Site test inspections to ensure quality of standards and all health & safety requirements are adhered to.
• Conduct site visits and inspections to ensure that ACMV systems are installed correctly and according to the design plans and specifications.
• Works closely with the project team and site personnel in the execution of task schedule
• Coordinate and work with the contractors, sub-contractors, suppliers, and staff at site
• Reviewing and ensuring compliance, including drawings, reports, specifications, survey, access, and preparation of appraisals.
• Manage projects or project components, budgets, schedules, quality assurance and client feedback and ensuring effective communication of any changes/modifications to ensure cost control, maintain project timeline, manage manpower resources for the project.
• Ensure quality, sound and efficient engineering design service being reflected in project deliverable.

Job Requirements:

• Degree in Mechanical Engineering.
• For Engineer position: Fresh graduates and/or 1to 2 years of experiences are welcome to apply.
• For Senior Engineer Position: Candidate possesses at least >3 years of relevant working experience in high-rise building/Hospital/Data Centre are added advantage.
• Candidates’ technical knowledge/experience that are more inclined towards in Mechanical(ACMV) are preferred.
• Good knowledge in Building M&E services, with project site experience in ACMV Systems for M&E specifications, installations, and maintenance.
• Familiar with local statutory regulations and codes in Singapore requirements.
• Good understanding of local legislations on M&E works due to work required.
• Self-driven, independent and team-player.

If you are shortlisted for the first round of screening, our Recruiter will contact you directly.

EA License No: 21C0571 | EA Reg No:21103634 (Johnny Wu)

Key Responsibilities

• Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products.

• Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure.

• Drive yield breakthroughs by understanding the end‑to‑end test flow, product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements.

• Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs.

• Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification.

• Lead cross‑functional and cross‑site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges in a timely manner.

• Promote network Best‑Known‑Method (BKM) development, standardization, and business process creation or re‑engineering to improve productivity and efficiency.

• Maintain strong working relationships with stakeholders in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams.

• Communicate project status, risks, and proposals effectively through clear written reports and technical presentations.

• Proactively identify obstacles, escalate when needed, and partner with management to drive successful outcomes.

• Travel to Micron fab and development sites as needed to support project execution and alignment.
  

  Minimum Qualifications

  • Bachelor’s, Master’s, or PhD degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science Engineering, or a related field.

  • 2+ years of experience in one or more of the following:

  • Product Integration

  • Test Engineering

  • Yield Engineering

  • Design Engineering

  • BEOL semiconductor processing or process integration

  • Strong knowledge of Semiconductor Device Physics and DRAM product operations.

  • Understanding of wafer fabrication process flows, parametric/electrical testing, and probe yield.

  • Strong data analysis, debugging, troubleshooting, and problem‑solving skills with attention to detail.

  • Effective verbal and written communication skills with the ability to present to both small and large technical audiences.

  • Demonstrated ability to collaborate across functions and cultures, building strong customer and co‑worker relationships.

  • Ability to work independently with minimal supervision, manage multiple priorities, and stay organized.

  • Intermediate to advanced PC skills, including Microsoft Office.

  • Willingness to travel approximately 20–50% to support global project needs.

  • Flexibility to adapt to changing priorities and take on additional responsibilities as needed.

  Preferred Qualifications

  • Experience in DRAM High Bandwidth Memory (HBM) products.

  • Exposure to DRAM HPM, advanced packaging, chip‑package interaction, BEOL integration, or layout‑related topics.

  • Experience working across Test, Product, Yield, Design, Packaging, and Manufacturing organizations.

  • Proven ability to drive alignment and execution in central or network‑level roles.

  • Strong interest in innovation, continuous improvement, and scalable solution development.

Responsibilities and Tasks

• Drive E2E yield improvement initiatives across FE wafer fabrication, probe, assembly, and final test through deep data analysis and technical insight, with primary ownership from a Central YE perspective.

• Lead global yield analytics and learning loops, connecting FE process data, electrical/parametric test results, and AT test outcomes to rapidly identify root causes and improvement opportunities.

• Define and execute yield strategies to ensure FE process readiness and robustness are fully aligned and qualified to support downstream AT performance and overall product yield.

• Serve as a technical integrator across FE–AT boundaries, working with cross-functional teams to close gaps in yield, quality, and test coverage.

• Champion standardization of yield analysis methodologies, dashboards, and business processes across the Micron network, leveraging best-known methods (BKM) and benchmarking internal and external intelligence.

• Lead or actively participate in cross-site taskforces to resolve critical yield and quality excursions, ensuring timely containment, root cause identification, and sustainable corrective actions.

• Apply strong statistical and data-driven problem-solving techniques to large, complex manufacturing and test datasets to support decision-making and executive communication.

• Maintain and continuously enhance domain expertise in yield engineering, test methodologies, and FE–AT interactions, proactively identifying innovation opportunities with a structured and strategic mindset.

• Build strong working relationships with global peers and stakeholders in Fab, AT, TD, Product Engineering, and GQ. Communicate status, risks, and recommendations clearly and effectively.

• Deliver clear and compelling technical presentations to diverse audiences, including project updates, yield deep-dives, and new initiative proposals.

• Align regularly with management on goals, priorities, and execution status, proactively escalating risks and driving resolution.

• Travel to Micron global manufacturing and assembly/test sites as needed to support yield learning and execution.

Requirements

• Solid knowledge of semiconductor manufacturing and yield engineering, including FE wafer fabrication processes, electrical/parametric test, probe yield, and AT test fundamentals.

• Strong experience in E2E data analysis, correlating FE process data with probe and final test results to drive yield and quality improvements.

• Hands-on capability in statistical analysis, data mining, root cause analysis, and problem solving, with strong attention to detail.

• Experience with DRAM device operation, test flows, and yield learning methodologies is highly desirable.

• Exposure to FE integration, advanced packaging, AT processes, or test development is a plus.

• Excellent written and verbal communication skills, with the ability to clearly explain complex technical issues to cross-functional and global audiences.

• Demonstrated ability to work effectively in a matrixed, global environment, with strong collaboration and influence skills.

• Strong organizational skills and the ability to manage multiple priorities with minimal supervision.

• Intermediate to advanced PC skills, including Microsoft Office; experience with data analysis tools or scripting languages is a plus.

• Self-motivated, flexible, and proactive in taking ownership and driving results beyond defined responsibilities.

• Travel Required: Yes
  

  Job Profile:

  E2/3/4

As FE CPIE CPI PI Senior Engineer or Engineer at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

 In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity. 

Responsibilities and Tasks

• Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.

• Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.  

• Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.

• Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.

• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.

• Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.

• Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.

• Travel to Micron Fab locations as necessary for face-to-face work.

Requirements

• Bachelor’s  or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field .

• Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.

• The experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position.

• Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail.

• Good multi-tasking, verbal, and written communication skills.

• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.

• Good organizational capabilities and ability to work effectively with minimal supervision.

• Intermediate to advanced PC skills including Microsoft Office.

• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.

• Travel Required: Yes. Willing to travel as needed to support department goals

• Travel Frequency: 20-50%.
  

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

Requirements

• Candidate must possess EMA Electrical Worker Licence namely Electrician's Licence (EMA LEW Grade 7), Electrical Technician's Licence (EMA LEW Grade 8).
• Candidate must possess at least Nitec education.
• Preferably LEW specialized in electrical work or electrical installation.
• Preferably at least 2 year(s) of working experience.
• Able to start within a short notice and or immediate
• Preferably experienced in Facilities Management environment.

Responsibilities

• Able to lead a team of technicians for troubleshooting works
• Able to coordinate A&A works independently.
• Coordination with clients and contractors. A&A etc.

As Front End Central Product Integration Engineer-Chip Package Interaction at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity. 

Responsibilities and Tasks

• Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.

• Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.  

• Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.

• Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.

• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.

• Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.

• Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.

• Travel to Micron Fab locations as necessary for face-to-face work.

Requirements

• Bachelor’s  or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field

• A minimum of 2 years of experience in Back-End-of-Line (BEOL) semiconductor processing or process integration is required

• Must be willing to travel as needed to support departmental goals, with an expected travel frequency of approximately 20–50%

• Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.

• The experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position.

• Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail.

• Good multi-tasking, verbal, and written communication skills.

• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.

• Good organizational capabilities and ability to work effectively with minimal supervision.

• Intermediate to advanced PC skills including Microsoft Office.

• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
  

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

Job Description:

• In charge of developing and implementing new optic / illumination components/system
• Responsible for designing and developing automated visual inspection systems for a full range of semiconductor equipment. 
• In charge of resolving existing optical/illumination issues within the equipment.
• Identify necessary and desirable improvements for vision optical system performance.

Job Requirement:

• Minimum Degree in Optics Engineering, Physics, Photonics, or a related field is required.
• Minimum with 5 year working experience in optical design software, alignment, testing, and high magnification optics.
• Knowledge of LED illumination systems, lenses, specifications, design trade-offs, and basic optics modeling techniques
• Experience in 2D drawing

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900