Total 10 job vacancies by Tecnisco Advanced Materials Pte. Ltd.

As part of the Process Engineering group, this position involves contributing to the development of thin film solutions for thermal management product.

The role also involves establishing and optimizing related process parameters related to dicing, mask design, plating/sputtering thin films.

Also work closely with internal cross-functional teams, external vendors and technology partners on application development from concept prototype phase to production introduction.

Roles & Responsibilities

• Develop processes to deposit conductive (metal) films by Plating, PVD Sputtering and Vacuum Evaporation.
• Develop film characterization techniques for metrology and inspection.
• Provide day-to-day operations of deposition tools - tool and process monitoring, post PM process qualification, troubleshooting.
• Prepare project updates and goals.
• Work closely with integration and test teams on developing critical to quality (CTQ)metrics, root cause analysis (RCA) and corrective actions for yield improvements.
• Work closely with equipment engineers and external suppliers on tool improvements and selection of new equipment.

Requirements

• ITE/Polytechnic/Degree in Materials Engineering or related field
• Min. 2 years of experience leading manufacturing process development in at least one of the following fields: semiconductor front or back end such as wafer bumping, dicing, mask design, plating and thin film process development.
• Experience of using UHV vacuum manufacturing equipment and associated sensors and components (Pumps, valves, pressure sensors, spectrometers, MFC's, pressure controllers, pyrometers, etc.)
• Experience working on material development and process engineering.
• Experience in statistical analysis methods and tools, design of experiment.
• Understanding of materials characterization and FA techniques
• Good communication and teamwork skills.
• Willing to work in Tuas South area.

Benefits

• Company transport will be provided at mrt.
• Transport allowance will be given.
• Additional company holidays shutdown per year will be given.
• Other staff welfare benefits.

Key Responsibilities:

• Operate laser marking machines to engrave or mark parts according to specifications and drawings
• Set up programs, parameters, and fixtures for different product types
• Perform alignment and calibration of laser systems to ensure accuracy
• Inspect marked parts to ensure quality standards are met (e.g., clarity, position, depth)
• Conduct routine maintenance and cleaning of laser equipment
• Troubleshoot minor equipment issues and escalate when necessary
• Maintain proper documentation of production output and machine logs
• Ensure compliance with safety procedures, especially for laser operation
• Work closely with engineering and production teams to improve processes

Requirements:

• Diploma / NITEC / Technical certification in Engineering or related field
• Experience in laser marking, CNC, or similar precision equipment preferred
• Basic understanding of CAD drawings or marking layouts
• Familiarity with laser systems (e.g., fiber laser, CO₂ laser) is an advantage
• Good attention to detail and quality control mindset
• Ability to work in a production environment

Job Description & Requirements

• Conduct preventive maintenance and corrective repairs on plant and machineries.
• Troubleshoot and resolve issues in electrical, mechanical, pneumatic, and hydraulic systems.
• Perform inspections and diagnostic tests to identify faults; analyze technical problems and implement solutions.
• Utilize appropriate tools and equipment for diagnosis and repair; liaise with suppliers for parts ordering and replacement.
• Maintain accurate maintenance records and manage spare parts inventory.
• Respond promptly to equipment breakdowns, minimize downtime, and implement effective maintenance practices to optimize performance.
• Ensure adherence to Health & Safety standards, maintain workplace cleanliness, and follow proper safety protocols.

Requirements

• Diploma, NITEC, NTC-2, or ITC in Mechatronics or Electrical Engineering preferred.
• Solid understanding of industrial equipment and systems.
• Working knowledge of AC drives, electric motors, pneumatic cylinders, and roller/chain conveyors.
• Familiarity with PLCs, control circuits, and electrical systems.
• Minimum 3 years of relevant experience in a manufacturing environment.

Key Responsibilities:

• Operate wafer dicing machines to cut wafers into individual dies according to specifications
• Perform mask alignment processes using mask aligner equipment for photolithography
• Load and unload wafers, masks, and related materials safely and accurately
• Set up machine parameters (alignment, cutting depth, speed, exposure settings, etc.)
• Conduct routine inspection of wafers and dies to ensure quality standards are met
• Monitor process performance and report any abnormalities or defects
• Perform basic troubleshooting and preventive maintenance on equipment
• Maintain cleanroom discipline and comply with EHS (Environment, Health & Safety) requirements
• Record production data, process parameters, and inspection results accurately
• Support engineers in process improvement and yield enhancement activities

Requirements:

• Diploma / NITEC in Engineering, Semiconductor Technology, or related field
• Minimum 1–3 years of experience in semiconductor manufacturing (dicing or photolithography preferred)
• Familiar with dicing saw and mask aligner equipment
• Ability to read and follow technical work instructions and drawings
• Basic understanding of cleanroom protocols and wafer handling
• Good attention to detail and quality awareness
• Able to work in a cleanroom environment and shift work (if required)

Job Description & Requirements

The Quality System / QC Engineer is responsible for maintaining and improving the Quality Management System (QMS) and ensuring Product Quality through inspection, testing, and continuous improvement activities. The role ensures compliance with ISO 9001, ISO 14001, and ISO 45001 standards, customer requirements, and regulatory guidelines while supporting operational excellence.

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Key Responsibilities

1. Quality Management System (QMS)

• Maintain and improve the Quality Management System in accordance with ISO 9001 / IATF 16949 / ISO 13485 (as applicable).

• Create and update Work Instructions, Procedures, Process Flow charts, Control Plans, and FMEA documents.

• Control and manage all QMS documents, including customer drawings, specifications, and procedures.

• Coordinate and conduct internal audits for ISO 9001, ISO 14001, and ISO 45001.

• Support customer audits and certification audits.

• Monitor corrective and preventive actions (CAPA) and ensure timely closure.

• Ensure compliance with customer-specific requirements.

• Cross-Functional Collaboration - Work closely with Planning, Production, R&D/Engineering Team

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2. Quality Control (QC) Operations

• Supervise and manage QC Inspectors in their daily activities on the production floor.

• Establish and monitor incoming, in-process, and final inspection activities on the production floor.

• Review incoming, in-process, and final inspection reports, ensuring proper documentation and record retention in the system.

• Track and monitor in-coming and final outgoing product yield

• Manage non-conforming materials and disposition activities.

• Establish Statistical Process Control (SPC) and monitor process capability (Cp, Cpk).

• Analyze process data to identify trends, variations, and improvement opportunities.

• Drive root cause analysis and corrective actions report for process-related quality issues or customer complaints.

• Support new process introduction (NPI)

• Provide guidelines and training to QC Operators

Job Description

The Process Technician is responsible for developing, sustaining, and improving semiconductor and advanced materials manufacturing processes to meet customer and business requirements in quality, yield, cost, and cycle time.

Key Responsibilities

• Sustain and continuously improve manufacturing processes through planning, evaluation, verification, and execution to meet customer specifications for quality, yield, reliability, and cycle time.
• Investigate process deviations and implement interim and long-term corrective and preventive actions to ensure stable production.
• Support new product introduction and process development involving mould design, metal infiltration, heat treatment  waterjet cutting, PVD, plating and metallurgical processes, including setup and optimization of process recipes.
• Perform process characterization, qualification, and validation activities to ensure repeatable and robust manufacturing performance.
• Monitor process performance using statistical process control (SPC) and analyze data to identify trends and improvement opportunities.
• Prepare, maintain, and update process documentation, work instructions, and control plans; review and update process FMEA as required.
• Provide technical training and guidance to technicians and operators to ensure compliance with process requirements and quality standards.
• Lead or participate in cost reduction, yield improvement, and quality improvement projects.
• Collaborate with internal teams and customers on process, material, and equipment capability development and improvement.
• Support audits, customer technical reviews, and production ramp-up activities.

Job Requirements

• Poly Diploma, ITE in Engineering (Materials, Mechanical, Chemical, Physics, or related field).
• Relevant experience in semiconductor, advanced materials, or precision manufacturing environments.
• Knowledge of process control methodologies such as SPC, root cause analysis, and process qualification.
• Experience with thin-film deposition (PVD), plating, or related advanced manufacturing processes is preferred.
• Ability to work cross-functionally with production, quality, and engineering teams.
• Japanese-speaking capability is an added advantage for coordination with Japanese customers and suppliers.

Job Scope

- Pick and load electronic components onto trays based on work orders

- Perform basic visual inspection to ensure quality

- Handle components carefully (ESD compliance where required)

- Follow SOPs and maintain a clean and safe work environment

- Work closely with technicians, supervisors, and QA personnel

Requirements

- Minimum GCE ‘N’ Level or ‘O’ Level, or equivalent

- Able to perform repetitive tasks with good hand-eye coordination and attention to detail

- Comfortable working in a fast-paced production environment (including cleanroom, if required)

- Prior manufacturing experience is an advantage

Job Description

The Process Engineer is responsible for developing, sustaining, and improving semiconductor and advanced materials manufacturing processes to meet customer and business requirements in quality, yield, cost, and cycle time.

Key Responsibilities

• Sustain and continuously improve manufacturing processes through planning, evaluation, verification, and execution to meet customer specifications for quality, yield, reliability, and cycle time.
• Investigate process deviations and implement interim and long-term corrective and preventive actions to ensure stable production.
• Support new product introduction and process development involving mould design, metal infiltration, heat treatment  waterjet cutting, PVD, plating and metallurgical processes, including setup and optimization of process recipes.
• Perform process characterization, qualification, and validation activities to ensure repeatable and robust manufacturing performance.
• Monitor process performance using statistical process control (SPC) and analyze data to identify trends and improvement opportunities.
• Prepare, maintain, and update process documentation, work instructions, and control plans; review and update process FMEA as required.
• Provide technical training and guidance to technicians and operators to ensure compliance with process requirements and quality standards.
• Lead or participate in cost reduction, yield improvement, and quality improvement projects.
• Collaborate with internal teams and customers on process, material, and equipment capability development and improvement.
• Support audits, customer technical reviews, and production ramp-up activities.

Job Requirements

• Bachelor’s degree in Engineering (Materials, Mechanical, Chemical, Physics, or related field).
• Relevant experience in semiconductor, advanced materials, or precision manufacturing environments.
• Knowledge of process control methodologies such as SPC, root cause analysis, and process qualification.
• Experience with thin-film deposition (PVD), plating, or related advanced manufacturing processes is preferred.
• Ability to work cross-functionally with production, quality, and engineering teams.
• Japanese-speaking capability is an added advantage for coordination with Japanese customers and suppliers.

1. Perform incoming, in-process, and final inspections according to inspection procedures and control plans.
2. Conduct dimensional measurements using the following measuring equipment:
   • Nikon Measuring Scope
   • Keyence 3D Measurement System
   • Keyence SmartScope • Mitutoyo CNC Vision Measuring System
   • Digital Indicator
3. Perform product visual inspections using a low-power microscope.
4. Verify that products meet customer specifications, drawings, and quality standards.
5. Record inspection results accurately in inspection reports, check sheets, or quality systems.
6. Identify and segregate non-conforming products and report issues to the supervisor or QA Engineer.
7. Support root cause analysis and corrective actions for quality issues.
8. Ensure compliance with ISO standards, customer requirements, and company quality procedures.
9. Maintain proper documentation and traceability of inspection records.
10. Ensure measuring equipment is properly calibrated and handled.
11. Work closely with production teams to resolve quality issues and improve processes.
12. Follow safety procedures and workplace regulations.
13. Willing to work in a cleanroom environment, wearing a jumpsuit
14. Factory location: Tuas South Street 5, Tuas.

Qualifications, Essential Knowledge, and Skills Requirements:

1. Education: Minimum A Level or ITE
2. Minimum 2–3 years of experience in quality inspection in a manufacturing environment is preferred.
3. Basic understanding of quality control methods and inspection techniques.
4. Ability to read and interpret engineering drawings and specifications.
5. Strong attention to detail and accuracy.
6. Good documentation and reporting skills.
7. Basic computer skills in Microsoft Excel, Word, and PowerPoint.
8. Ability to work independently as well as in a team environment.

Job Description

• As part of the CNC Machinist group, this position involves development of new manufacturing processes and lean manufacturing practices.
• The role also involves Design tools and fixtures with Autocad and CNC Programming
• To Operate of high Vacuum and Sinter HIP furnace, CNC, Dicing Saw and Precision Waterjet. Support the training of staff and line operators on manufacturing processes.
• Inspection with wide variety of measuring devices, gages, optical equipment as well as develop quality procedures to ensure robust processes.
• Perform preventive maintenance of machines and ensure Work Health and Safety in all processes

Roles & Responsibilities

• Support processes to deposit conductive (metal) films by Plating, PVD Sputtering and Vacuum Evaporation.
• Support film characterization techniques for metrology and inspection
• Perform day-to-day operations of deposition tools - tool and process monitoring, post PM process qualification, troubleshooting
• Work closely with integration and test teams on developing critical to quality (CTQ) metrics, root cause analysis (RCA) and corrective actions for yield improvements

Requirements

• Min. Secondary/ITE-NTEC/Diploma/Degree level PE/ME/Mfg/Mechatronics or related displicine.
• Min. 2 years of experience leading manufacturing processes in at least one of the following fields: semiconductor front or back end such as wafer bumping, dicing, mask design, plating and thin film process development.
• Good analytical, verbal, written and interpersonal skills
• Hands on fabrication: mechanical assembly, mechanical design and manufacturing and mask design.
• Experience working around delicate high-tech equipment.
• Experience in statistical analysis methods and tools, design of experiment
• Understanding of materials characterization and FA techniques
• Good communication and teamwork skills.