Total 595 Senior Executive engineering job vacancies in Singapore

We are seeking a Business Support Executive to provide comprehensive support to senior management, with a strong focus on budget reporting, management updates, and business operations support. This role goes beyond traditional administrative work — you will be actively involved in preparing business reports, coordinating management updates, and ensuring smooth communication across teams.

• Prepare budget reports, tracking expenses, and compiling updates for management.
• Coordinate executive meetings, including agendas, materials, logistics, and follow-ups.
• Manage schedules, correspondence, and preparing briefing decks for senior management.
• Maintain documentation and reporting systems to ensure smooth business operations.

Requirements:

• Diploma or degree in Business Administration or equivalent.
• Proven experience in business/management support in the Construction/Engineering sector.
• Strong skills in MS Excel and PowerPoint, with hands-on experience preparing reports and presentations.
• Excellent communication, organizational skills, and ability to work independently.

If you are keen to apply for the position, kindly email your detailed resume in MS Word to hr@recruit-expert.com

Please note that only shortlisted candidates will be notified.

For more job opportunities, please visit our website at www.recruit-expert.com

EA Licence: 19C9701

Registration: R1326740

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

Join ASM’s Advanced Packaging team and lead the design and development of next-generation semiconductor process equipment. In this role, you will shape system architecture, drive automation strategies, and collaborate across functions to deliver innovative solutions. Your expertise will ensure projects meet the highest standards of safety, quality, and performance.

What you will be working on

• Lead design and development of semiconductor vacuum systems, including equipment selection, process controls, and automation integration.
• Develop and implement automation strategies using PLCs, SCADA, and related tools to optimize efficiency.
• Manage project timelines, budgets, and resources while ensuring compliance with safety and quality standards.
• Collaborate with cross-functional teams in manufacturing, operations, and quality to align on goals and deliverables.
• Provide technical support and troubleshooting for equipment and automation systems, driving root cause analysis and resolution.
• Own BOM release and maintenance, ensuring accurate documentation and reporting for stakeholders.
• Drive continuous improvement initiatives and stay current with industry trends and emerging technologies.
• Apply engineering principles and research data to create designs for semiconductor systems and products.
• Perform engineering calculations for structural, thermal, and fluid dynamics challenges.
• Create and revise CAD models and detailed drawings using Creo Parametric for components and assemblies.
• Prepare comprehensive design documentation for manufacturing and testing of prototypes and production products.

What we are looking for

• Bachelor's, Master’s or PhD in Mechanical Engineering or related field.
• Minimum 8 years of experience in semiconductor equipment design, development, and automation.
• Expertise in complex mechanical systems such as reactors, vacuum chambers, gas delivery systems, pneumatics, and cooling circuits.
• Strong analytical and problem-solving skills with ability to lead innovative design concepts.
• Experience with PLC programming and revision control tools such as Git.
• Ability to work independently and collaboratively in a team environment.

What sets you apart

• Experience with semiconductor capital equipment and metal deposition products.
• Knowledge of CE, NFPA, Semi S2-95, and other relevant standards for semiconductor manufacturing equipment.
• Familiarity with materials including metals, plastics, coatings, and finishes.
• Proficiency in Microsoft applications, CREO, and AutoCAD.
• Knowledge of ASME Y14.5 and/or ISO 1101:2017 geometric dimensioning and tolerancing.
• Strong communication skills to present design concepts effectively to peers and management.
• Ability to manage multiple priorities and meet aggressive deadlines while maintaining quality standards.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Join a Leading Engineering & Infrastructure Organisation

We are looking for passionate and driven Engineering graduates and professionals to join a reputable organization supporting critical infrastructure and engineering operations in Singapore.

Why Join Us?

• Gross Salary : Up to $5,000+++ per month

• Monthly AWS allowance

• Generous performance bonus of up to 3 months

• Starting 18 Days Annual Leave

• Family and Childcare Leave entitlement

• Structured training and career progression opportunities

• Stable career with long-term growth prospects

Key Responsibilities

• Support engineering operations, maintenance, and improvement initiatives.

• Conduct troubleshooting, investigations, and root cause analysis of engineering issues.

• Analyse system performance data and recommend reliability improvements.

• Assist in engineering projects, testing, commissioning, and asset enhancement activities.

• Prepare technical reports, documentation, and work instructions.

• Collaborate with cross-functional teams to improve operational performance and safety standards.

• Ensure compliance with engineering, quality, and safety requirements.
  

Requirements

• Bachelor's Degree in Mechanical Engineering, Electrical Engineering, Electronics Engineering, Mechatronics Engineering, or other relevant Engineering disciplines.

• Candidates with relevant engineering, maintenance, project, reliability, manufacturing, transportation, infrastructure, utilities, aerospace, marine, or industrial experience are encouraged to apply.

• Strong analytical and problem-solving skills.

• Good communication and interpersonal abilities.

• Ability to work independently and as part of a team.
  

Apply Now

If you are looking to kickstart or advance your engineering career with an established organization offering attractive compensation, strong career development, and excellent benefits, we would love to hear from you.

Submit your updated resume today for consideration.

Please send in your resume to :

edward.liau@cornerstoneglobalpartners.com or whatapp me at +65 96578518

Edward Liau Xianke R1217423

Cornerstone Global Partners

License Number: 19C9859

The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM).

This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements.

The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle.

Key Responsibilities

Probe Coverage Strategy & Ownership

• Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands.

• Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives are met without unnecessary test overhead.

• Establish probe limits and guard‑bands based on silicon characterization, design intent, and customer specifications, with clear alignment to downstream test.

• Lead probe enablement for new product introductions (NPI) and technology ramps, identifying coverage and manufacturability risks early and driving mitigation plans.

Pre‑Silicon Design‑to‑Probe Staging & DFT Readiness

• Partner with Design, DFT, and DV teams during pre‑silicon phases to drive effective design‑to‑probe staging.

• Review and influence DFT architecture, test hooks, observability, redundancy, and trim structures to enable efficient and manufacturable probe coverage.

• Participate in pre‑silicon verification and simulation reviews to reduce first‑silicon debug risk.

• Define probe coverage intent early and ensure continuity from design features through probe and downstream test (shift‑left learning).

First Silicon Bring‑Up & Device Characterization

• Support first‑silicon bring‑up using engineering probe platforms and lab‑based characterization setups.

• Perform silicon and device‑level characterization (parametric behavior, margins, trims, stress response) to inform probe limits and screening strategy.

• Correlate early silicon behavior with probe results to validate coverage intent, identify gaps, and eliminate redundant content.

• Provide early silicon learning to accelerate probe flow stabilization and yield ramp.

Yield, Quality & Reliability Enablement

• Drive wafer‑level yield learning, bin definitions, and failure‑mode analysis at probe.

• Enable intrinsic and extrinsic screening strategies in collaboration with Reliability teams.

• Provide structured, data‑backed feedback to Fab, Process Integration, Design, and DV teams to close learning loops efficiently.

Test Efficiency & Cost Optimization

• Drive test efficiency improvements through coverage right‑sizing and flow optimization, aligned to product and market needs.

• Support wafer‑level speed (WLS) activities as part of broader probe optimization efforts.

• Balance coverage, yield, quality, and cost trade‑offs using silicon data and product risk understanding.

Data, Analytics & AI Enablement

• Leverage probe, inline, and reliability data for yield analysis, anomaly detection, and decision support.

• Contribute to AI/ML initiatives such as predictive probe, smart sampling, and test optimization.

• Apply data‑driven insights to continuously improve probe effectiveness and efficiency.

Artificial Intelligence

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Experience Level & Entry Consideration

This role is open to both early‑career and experienced engineers, with leveling (GJS) aligned to technical depth, scope of ownership, and demonstrated impact.

• Fresh Bachelor’s/Master’s / PhD Graduates

• Strong fundamentals in semiconductor devices, circuits, physics, or process technology.

• Academic, research, or internship exposure to silicon behavior, characterization, variability, reliability, or design analysis.

• Will grow into full probe ownership with mentorship, focusing on device, design, and process understanding.

• Experienced Engineers (Eligible for Higher GJS)

• Prior experience in product engineering, device engineering, process integration, silicon characterization, or design‑facing roles.

• Demonstrated ownership of first‑silicon learning, qualification strategy, yield mechanisms, or cross‑functional technical trade‑offs.

• Comfortable influencing upstream and downstream teams through technical insight and silicon‑based decision‑making.

Required Qualifications

• Bachelor’s, Master’s degree, or Phd in Electrical / Electronics Engineering, Computer Engineering (with strong hardware, circuits, or semiconductor focus), Semiconductor Physics, or related field.

• Strong fundamentals in semiconductor devices, wafer test, and product engineering.

• Demonstrated ability to use silicon behavior and characterization data to make informed probe, yield, and coverage decisions.

• Experience or strong interest in silicon learning, device behavior, yield mechanisms, DFT intent, or design‑to‑manufacturing integration.

• Strong analytical skills and ability to drive structured root‑cause analysis.

• Effective communication skills and ability to work across global, cross‑functional teams.

Preferred Qualifications

• Experience with NAND / memory products.

• Experience working directly with Design, Process Integration, or Device teams to resolve silicon or product issues.

• Exposure to probe flow optimization, yield learning, or test cost reduction.

• Familiarity with DFT verification, reliability screening, or test correlation methodologies.

• Experience with Python, SQL, JMP, or data / ML tools.

• Demonstrated ability to independently drive complex technical problems from concept through execution.

Career Growth & Impact

• Direct ownership of probe strategy and quality outcomes across the product lifecycle.

• Exposure to advanced technology nodes, customer‑driven requirements, and large‑scale manufacturing systems.

• Clear growth paths across senior technical contributor, product leadership, or people management tracks within STPG Product Engineering.
  

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Key Responsibilities:

• Carry out daily inventory store activities;
• Receive, inspect, and verify incoming materials, goods, and supplies against delivery documentation;
• Issue materials and products in accordance with authorized requests and record all stock movements;
• Work with inventory store manager-in-charge to review process workflow and implement process improvements to increase efficiency and effectiveness;
• Ensure safe, proper and effective housekeeping of inventory store;
• Issue items, update inventory and monitor stock levels;
• Manage disposal of waste and carry out regular inspections of inventory store items and storage conditions;
• Label, store and file stock items and ensure all required documentation are completed;
• Conduct regular stock takes, support reconciliation and compile necessary reports;
• Allocate storage space and ensure safe equipment handling at all times;
• Participate in innovation and work improvement projects;
• Perform any other duties as assigned.
  

The ideal candidate should preferably:-

• Possess at least Nitec/Higher Nitec qualifications; and
• Be willing to perform shift work.

The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM).

This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements.

The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle.

Key Responsibilities

Probe Coverage Strategy & Ownership

• Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands.

• Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives are met without unnecessary test overhead.

• Establish probe limits and guard‑bands based on silicon characterization, design intent, and customer specifications, with clear alignment to downstream test.

• Lead probe enablement for new product introductions (NPI) and technology ramps, identifying coverage and manufacturability risks early and driving mitigation plans.

Pre‑Silicon Design‑to‑Probe Staging & DFT Readiness

• Partner with Design, DFT, and DV teams during pre‑silicon phases to drive effective design‑to‑probe staging.

• Review and influence DFT architecture, test hooks, observability, redundancy, and trim structures to enable efficient and manufacturable probe coverage.

• Participate in pre‑silicon verification and simulation reviews to reduce first‑silicon debug risk.

• Define probe coverage intent early and ensure continuity from design features through probe and downstream test (shift‑left learning).

First Silicon Bring‑Up & Device Characterization

• Support first‑silicon bring‑up using engineering probe platforms and lab‑based characterization setups.

• Perform silicon and device‑level characterization (parametric behavior, margins, trims, stress response) to inform probe limits and screening strategy.

• Correlate early silicon behavior with probe results to validate coverage intent, identify gaps, and eliminate redundant content.

• Provide early silicon learning to accelerate probe flow stabilization and yield ramp.

Yield, Quality & Reliability Enablement

• Drive wafer‑level yield learning, bin definitions, and failure‑mode analysis at probe.

• Enable intrinsic and extrinsic screening strategies in collaboration with Reliability teams.

• Provide structured, data‑backed feedback to Fab, Process Integration, Design, and DV teams to close learning loops efficiently.

Test Efficiency & Cost Optimization

• Drive test efficiency improvements through coverage right‑sizing and flow optimization, aligned to product and market needs.

• Support wafer‑level speed (WLS) activities as part of broader probe optimization efforts.

• Balance coverage, yield, quality, and cost trade‑offs using silicon data and product risk understanding.

Data, Analytics & AI Enablement

• Leverage probe, inline, and reliability data for yield analysis, anomaly detection, and decision support.

• Contribute to AI/ML initiatives such as predictive probe, smart sampling, and test optimization.

• Apply data‑driven insights to continuously improve probe effectiveness and efficiency.

Artificial Intelligence

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Experience Level & Entry Consideration

This role is open to both early‑career and experienced engineers, with leveling (GJS) aligned to technical depth, scope of ownership, and demonstrated impact.

• Fresh Bachelor’s/Master’s / PhD Graduates

• Strong fundamentals in semiconductor devices, circuits, physics, or process technology.

• Academic, research, or internship exposure to silicon behavior, characterization, variability, reliability, or design analysis.

• Will grow into full probe ownership with mentorship, focusing on device, design, and process understanding.

• Experienced Engineers (Eligible for Higher GJS)

• Prior experience in product engineering, device engineering, process integration, silicon characterization, or design‑facing roles.

• Demonstrated ownership of first‑silicon learning, qualification strategy, yield mechanisms, or cross‑functional technical trade‑offs.

• Comfortable influencing upstream and downstream teams through technical insight and silicon‑based decision‑making.

Required Qualifications

• Bachelor’s, Master’s degree, or Phd in Electrical / Electronics Engineering, Computer Engineering (with strong hardware, circuits, or semiconductor focus), Semiconductor Physics, or related field.

• Strong fundamentals in semiconductor devices, wafer test, and product engineering.

• Demonstrated ability to use silicon behavior and characterization data to make informed probe, yield, and coverage decisions.

• Experience or strong interest in silicon learning, device behavior, yield mechanisms, DFT intent, or design‑to‑manufacturing integration.

• Strong analytical skills and ability to drive structured root‑cause analysis.

• Effective communication skills and ability to work across global, cross‑functional teams.

Preferred Qualifications

• Experience with NAND / memory products.

• Experience working directly with Design, Process Integration, or Device teams to resolve silicon or product issues.

• Exposure to probe flow optimization, yield learning, or test cost reduction.

• Familiarity with DFT verification, reliability screening, or test correlation methodologies.

• Experience with Python, SQL, JMP, or data / ML tools.

• Demonstrated ability to independently drive complex technical problems from concept through execution.

Career Growth & Impact

• Direct ownership of probe strategy and quality outcomes across the product lifecycle.

• Exposure to advanced technology nodes, customer‑driven requirements, and large‑scale manufacturing systems.

• Clear growth paths across senior technical contributor, product leadership, or people management tracks within STPG Product Engineering.

The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM).

This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements.

The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle.

Key Responsibilities

Probe Coverage Strategy & Ownership

• Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands.

• Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives are met without unnecessary test overhead.

• Establish probe limits and guard‑bands based on silicon characterization, design intent, and customer specifications, with clear alignment to downstream test.

• Lead probe enablement for new product introductions (NPI) and technology ramps, identifying coverage and manufacturability risks early and driving mitigation plans.

Pre‑Silicon Design‑to‑Probe Staging & DFT Readiness

• Partner with Design, DFT, and DV teams during pre‑silicon phases to drive effective design‑to‑probe staging.

• Review and influence DFT architecture, test hooks, observability, redundancy, and trim structures to enable efficient and manufacturable probe coverage.

• Participate in pre‑silicon verification and simulation reviews to reduce first‑silicon debug risk.

• Define probe coverage intent early and ensure continuity from design features through probe and downstream test (shift‑left learning).

First Silicon Bring‑Up & Device Characterization

• Support first‑silicon bring‑up using engineering probe platforms and lab‑based characterization setups.

• Perform silicon and device‑level characterization (parametric behavior, margins, trims, stress response) to inform probe limits and screening strategy.

• Correlate early silicon behavior with probe results to validate coverage intent, identify gaps, and eliminate redundant content.

• Provide early silicon learning to accelerate probe flow stabilization and yield ramp.

Yield, Quality & Reliability Enablement

• Drive wafer‑level yield learning, bin definitions, and failure‑mode analysis at probe.

• Enable intrinsic and extrinsic screening strategies in collaboration with Reliability teams.

• Provide structured, data‑backed feedback to Fab, Process Integration, Design, and DV teams to close learning loops efficiently.

Test Efficiency & Cost Optimization

• Drive test efficiency improvements through coverage right‑sizing and flow optimization, aligned to product and market needs.

• Support wafer‑level speed (WLS) activities as part of broader probe optimization efforts.

• Balance coverage, yield, quality, and cost trade‑offs using silicon data and product risk understanding.

Data, Analytics & AI Enablement

• Leverage probe, inline, and reliability data for yield analysis, anomaly detection, and decision support.

• Contribute to AI/ML initiatives such as predictive probe, smart sampling, and test optimization.

• Apply data‑driven insights to continuously improve probe effectiveness and efficiency.

Artificial Intelligence

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Experience Level & Entry Consideration

This role is open to both early‑career and experienced engineers, with leveling (GJS) aligned to technical depth, scope of ownership, and demonstrated impact.

• Fresh Bachelor’s/Master’s / PhD Graduates

• Strong fundamentals in semiconductor devices, circuits, physics, or process technology.

• Academic, research, or internship exposure to silicon behavior, characterization, variability, reliability, or design analysis.

• Will grow into full probe ownership with mentorship, focusing on device, design, and process understanding.

• Experienced Engineers (Eligible for Higher GJS)

• Prior experience in product engineering, device engineering, process integration, silicon characterization, or design‑facing roles.

• Demonstrated ownership of first‑silicon learning, qualification strategy, yield mechanisms, or cross‑functional technical trade‑offs.

• Comfortable influencing upstream and downstream teams through technical insight and silicon‑based decision‑making.

Required Qualifications

• Bachelor’s, Master’s degree, or Phd in Electrical / Electronics Engineering, Computer Engineering (with strong hardware, circuits, or semiconductor focus), Semiconductor Physics, or related field.

• Strong fundamentals in semiconductor devices, wafer test, and product engineering.

• Demonstrated ability to use silicon behavior and characterization data to make informed probe, yield, and coverage decisions.

• Experience or strong interest in silicon learning, device behavior, yield mechanisms, DFT intent, or design‑to‑manufacturing integration.

• Strong analytical skills and ability to drive structured root‑cause analysis.

• Effective communication skills and ability to work across global, cross‑functional teams.

Preferred Qualifications

• Experience with NAND / memory products.

• Experience working directly with Design, Process Integration, or Device teams to resolve silicon or product issues.

• Exposure to probe flow optimization, yield learning, or test cost reduction.

• Familiarity with DFT verification, reliability screening, or test correlation methodologies.

• Experience with Python, SQL, JMP, or data / ML tools.

• Demonstrated ability to independently drive complex technical problems from concept through execution.

Career Growth & Impact

• Direct ownership of probe strategy and quality outcomes across the product lifecycle.

• Exposure to advanced technology nodes, customer‑driven requirements, and large‑scale manufacturing systems.

• Clear growth paths across senior technical contributor, product leadership, or people management tracks within STPG Product Engineering.

As a Senior Mechanical Engineer, you will lead the design and standardization of mechanical systems for next-generation data centers. You will own the development of Reference Designs for hyperscale and retail product tracks, ensuring scalability, cost efficiency, and compliance with global standards.

This role is pivotal in shaping advanced mechanical infrastructure solutions that enable hyperscale growth, high-density and liquid-cooled deployments, and future-ready data center designs—while ensuring uncompromising reliability, efficiency, and sustainability, and leading continuous improvement initiatives in partnership with Operations and Construction teams.

Key responsibilities

· Develop and maintain mechanical HVAC Reference Designs for hyperscale and retail data center product offerings, including liquid cooling and air-based systems.

· Design resilient, scalable HVAC mechanical systems such as chilled water loops, CDUs, piping, and heat rejection systems for high-density environments.

· Define and analyze piping and pipe supports to meet industry standards and regulatory requirements.

· Ensure compliance with regional mechanical codes and internal standards.

· Collaborate with Design Delivery & Construction teams to localize designs and ensure constructability.

· Partner with Operations to identify improvement opportunities and implement design enhancements for reliability and maintainability.

· Conduct root cause analysis and implement corrective actions for mechanical system issues.

· Drive innovation and R&D for emerging technologies (e.g., liquid cooling integration, modular mechanical systems).

· Work with global suppliers and manufacturers to specify appropriate cooling equipment and assemblies.

· Produce clear technical documentation: design specifications, schematics, and white papers.

· Lead technical forums and provide subject matter expertise across regions

· Actively champion and implement policies and procedures for occupational health & safety in the workplace, information security management, environmental management systems; incident management; and comply with all legal regulatory requirements of the organization

The successful candidate:

· Bachelor’s degree in Mechanical Engineering or related discipline

· 10+ years of experience in heavy industrial environments including 5+ years in mission-critical facilities

· Preferred Professional Engineer (PE) or Chartered Engineer certification.

· Experience designing piping and plumbing systems for cooling in data centers.

· Prior experience executing product designs from concept to production, including specification, prototyping, validation, and testing.

· Knowledge of air- and water-cooled systems for high-heat density applications.

· Familiarity with medium-temperature chilled water systems, CDUs, and liquid cooling integration.

· Understanding of industry standards (ASME B31.1 & B31.3) and mechanical codes.

· Ability to research and implement new designs and technologies from concept through deployment.

· Experience managing supplier relationships and conducting factory acceptance tests.

· Preferred proficiency with modelling software tools (e.g., AutoCAD, Revit, BIM)

About our group:

Media new product launch is to provide technical solutions to new product qualification, product yield, quality and reliability through developing new process and metrology. The team also needs to work closely with media R&D group and drive design center to continue optimize media process in order to meet product electrical recording performance as well as mechanical, tribology, manufacturability. Internally, the team need to work with different functional groups to deliver new mag design in very dynamic and challenging environment. 

About the role - you will:

Reporting to the Engineering Director, the incumbent will:

• Develop on HAMR sputter process to improve media ADC and mechanical performance to meet new product timeline.
• Design of experiment to understand the process window/margin.
• Good understanding of recording physics.
• Work with cross functional team on new alloys/process related defect issues.
• Transfer new product process into mass production and continue improve process to meet customer requirement.
• Technical lead of sputter projects.

About you:

Key characteristics defining outstanding candidates:

• Good understanding on magnetic recording materials, process and thin film technology.
• Teamwork and self-motivated.
• Fast learning capability.
• Strong communication and technical leadership skills.
• Ability to drive technical innovation into rapid product solutions.
• Flexibility and excellent time and task management capabilities.

Your experience includes:

• Master or Ph.D degree in Material science, magnetic recording physics or related engineering disciplines.
• Knowledge and skills in any of these areas – Material science, HAMR knowledge, thin film sputter process.
• R&D in magnetic recording media process, including process DOE, magnetic characterization tools, and data analysis techniques are all skills that will be beneficial in this role.
• Proficient in English speaking and writing.

As a Senior Electrical Engineer, you will lead the design and standardization of electrical infrastructure for next-generation data centres. You will own the development of Reference Designs for hyperscale and retail product tracks, ensuring scalability, cost efficiency, and compliance with global standards.

This role is pivotal in shaping advanced electrical infrastructure solutions that enable hyperscale growth, high-density and liquid-cooled deployments, and future-ready data center designs—while ensuring uncompromising reliability, efficiency, and sustainability, and leading continuous improvement initiatives in partnership with Operations and Construction teams.

Key responsibilities

• Develop and maintain electrical Reference Designs for hyperscale and retail data center product offerings.
• Design resilient, scalable electrical distribution systems and substation solutions for high-density environments.
• Ensure compliance with regional electrical codes and internal standards.
• Conduct engineering analysis, feasibility studies, and value engineering for cost and performance optimization.
• Collaborate with Design Delivery & Construction teams to localize designs and ensure constructability.
• Partner with Operations to identify improvement opportunities and implement design enhancements for reliability and maintainability.
• Review and approve critical equipment submittals, including vendor FATs and acceptance tests.
• Partner with suppliers and manufacturers to specify and qualify electrical equipment.
• Conduct root cause analysis and implement corrective actions for electrical system issues.
• Drive innovation and R&D for emerging technologies (e.g., liquid cooling integration, advanced monitoring).
• Produce clear technical documentation: design specifications, schematics, and white papers.
• Lead technical forums and provide subject matter expertise across regions.
• Actively champion and implement policies and procedures for occupational health & safety in the workplace, information security management, environmental management systems; incident management; and comply with all legal regulatory requirements of the organization

Thesuccessful candidate:

·       Bachelor’s degree in Electrical Engineering or related discipline

·      10+ years of experience in heavy industrial or commercial electrical design, including 5+ years in mission-critical facilities

·      Strong understanding of regional electrical codes (IEC, NEC, CCC, etc.)

·      In-depth knowledge of critical data center electrical systems, including:

-       Medium-voltage distribution systems.

-       UPS systems, diesel generators, electrical switchgear, PDUs, VFDs, and ATS/STS.

-       High voltage substations

·      Experience with controls systems and integration

·      Proven ability to research and implement new designs and technologies from concept through deployment

·      Experience managing supplier relationships and conducting factory acceptance tests

·      Proficiency with modelling software tools (e.g., AutoCAD, Revit, BIM)

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

As a Senior Manufacturing Engineer, you’ll play a critical role in turning breakthrough designs into real-world manufacturing solutions. From concept to customer delivery, you’ll drive new product industrialization by working cross-functionally to optimize for quality, cost, and lead time. You’ll be a strategic partner to both Global Operations and our Business Units, influencing design, improving processes, and supporting the full product lifecycle.

What you will be working on

• Provide first line engineering support in resolving daily operation issues in semiconductor equipment manufacturing, through collaboration with a team of multidisciplined manufacturing engineers, manufacturing supervisors and technicians.
• Achieve daily targets on product delivery to global customers in alignment with manufacturing engineering strategies, production schedules, quality and safety standards.
• Design and develop cost-effective testing methods with innovations for systems and equipment throughout product development and manufacturing in meeting manufacturing efficiency and customer quality.
• Prepare test and diagnostic programs according to product requirements, refine detailed test specifications, develop detailed procedures.
• Provide holistic technical solutions for highly complex problems from the suppliers, contract manufacturing, and internal manufacturing by liaising with cross functional teams in GOPS and Business Units (BU).
• Perform systematic troubleshooting and root cause analysis of manufacturing issues and deviations, provide immediate containment actions, and pursue long term corrective solutions.
• Partner with cross functional teams in Global Operations (Manufacturing, Production Planning, Procurement, and Quality Engineering), organize and lead internal and external review meetings, ensuring alignment and progress with focus on manufacturing processes, cycle time, assembly sequence, and quality.
• Lead the execution of continuous improvement projects on quality, cost, capacity, and efficiency enhancement with cross functional teams in GOPS and BU.

What we are looking for

• Bachelor’s degree in Electrical/Electronic Engineering, Automation engineering or equivalent.
• Minimum 8 years of experience in a manufacturing or engineering environment
• Minimum 5 years of relevant engineering experience in semiconductor capital equipment industry.
• Hands-on experience in electrical testing and troubleshooting.
• Working knowledge of testing methodology, C#, Python, or other scripting languages.
• Proven track record of managing technical projects to completion while accomplishing objectives and influencing cross-functional teams
• Experience with control systems utilized in testing automation, serial communication protocols, TwinCAT PLC, Device Net, Ethercat, RS 485, RS 232, etc.
• Proficient in operational excellence tools such as FMEA, 8D, SPC, DMAIC, GR&R, and Six Sigma

What sets you apart

• Strong cross-functional communication and stakeholder engagement skills
• Experience in project management for multiple NPI programs
• Background in supplier development or contract manufacturing environments
• Exposure to manufacturing digitization or data-driven process improvement

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

About our group:

The team is responsible for Drive Backend Assembly processes, including monitoring, controlling, maintaining, and improving product performance. This role applies engineering principles—such as Six Sigma and Lean—together with strong skills in data analysis, problem‑solving, and solution implementation to achieve performance metrics aligned with company goals.

About the role - you will:

• Perform process setup and buyoff for both Drive Backend Assembly, ensuring that yield, cycle time, and quality outcomes meet defined targets.
• Support product ID label buyoff to ensure compliance with product specifications and standards.
• Monitor production yield to detect any excursions, conduct process mapping, implement immediate containment (stop bleeding), establish hypotheses, design experiments to identify root causes, propose corrective actions, and report findings to engineers. Escalate issues appropriately per PMP requirements.
• Conduct basic data queries and analysis to provide relevant information and insights for engineering teams.
• Ensure process sustainability by monitoring KPIVs/KPOVs and managing Fast Triggering systems to maintain stable and controlled operations.
• Collaborate closely with engineers to achieve aggressive goals while upholding high-quality standards.
• Lead or participate in continuous improvement projects aimed at enhancing production efficiency in a consistent and sustainable manner.
• Perform additional tasks and responsibilities as assigned to support team, department, and company Objectives and Key Results (OKRs).

About you:

• Diploma in Engineering and related disciplines.
• Able to perform effectively under pressure, meet deadlines, and maintain a positive and professional attitude.
• Enjoys taking on challenging assignments and demonstrates strong resilience and adaptability.
• Open‑minded with a consistently positive work attitude.
• Strong data querying and analytical capabilities.
• Proficient in English with strong verbal and written communication skills.

Your experience includes:

• Experience in the manufacturing process is preferable.
• Process setup, buyoff, process mapping, and control.
• Failure analysis experience is preferable.
• Strong verbal and written communication.

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

Job's mission

As a Principal / Senior Engineer, Electrical Engineering at ASM, you will act as a technical lead for electrical systems within advanced semiconductor equipment. You will drive system-level design decisions, ensuring robust architecture, seamless integration, and high-performance delivery. By combining deep technical expertise with strong ownership, you will guide the development of complex systems from concept through production while influencing cross-functional engineering outcomes.

What you will be working on

• Lead the design and development of electrical systems and sub-assemblies, setting technical direction and ensuring alignment with product architecture
• Lead fabrication and test of electrical test structures (ex. MOS capacitors, MIM capacitors, FETs) for semiconductor logic and memory applications
• Own system-level integration, ensuring electrical, mechanical, and control elements work cohesively to meet performance, safety, and reliability targets
• Define and validate digital and analog I/O architectures, enabling flexible, customer-specific configurations
• Drive technical decision-making across new product development, capital projects, and system improvements
• Review and approve engineering changes, ensuring technical integrity, risk mitigation, and adherence to timelines
• Act as a key contributor in design reviews, providing expert guidance and ensuring readiness for production release
• Define and oversee system validation strategies, including hardware testing, instrumentation, and performance verification
• Analyze, understand and interpret electrical test data (ex. CV, IV, Dit) to guide process development and integration of ASM's products such as ALD films
• Evaluate feasibility of new concepts and technologies, solving complex system-level challenges with a structured and innovative approach
• Influence and collaborate with global cross-functional teams, acting as the electrical domain expert
• Mentor and guide junior engineers, elevating technical capability within the team
• Drive high-quality technical documentation, reporting standards, and stakeholder alignment

What we are looking for

• Master’s or PhD in Electrical and Electronics Engineering
• Minimum 5 years of experience in system engineering within semiconductor equipment manufacturing
• Strong expertise in electrical hardware design, system architecture, and integration (e.g., reactors, plasma sources, or similar systems)
• Proven ability to lead technical problem-solving and make system-level design decisions
• Proficiency in AutoCAD and data analysis tools such as JMP
• Hands-on experience in hardware testing, instrumentation, and system validation
• Ability to operate effectively in a fast-paced, global engineering environment
• Strong communication skills in English, with the ability to influence technical discussions

What sets you apart

• Experience acting as a technical lead or subject matter expert on complex engineering projects
• Strong understanding of semiconductor processes and equipment architecture
• Experience defining or improving system validation strategies and test methodologies
• Familiarity with data analysis or scripting tools (e.g., Python)
• Proven track record of driving cost reduction, reliability improvements, or product innovation
• Experience working across regions or with international engineering teams
• Proactive, ownership-driven mindset with the ability to influence without formal authority

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Job's mission

As a Senior Process Engineer in Advanced Packaging, you will bring your PhD research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM’s mission to enable the chips that power today’s most advanced technologies.

What you will be working on

• Contribute to the research, development, and optimization of semiconductor processes for Advanced Packaging, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation technologies.
• Design, execute, and analyze experiments using DOE-based approaches, supported by senior technical experts.
• Perform materials and process characterization to evaluate film quality, reliability, and performance.
• Analyze experimental data and clearly document results in technical reports and internal presentations.
• Collaborate with cross-functional teams across R&D, process engineering, and applications.
• Support troubleshooting of process or equipment issues in laboratory and pilot environments.
• Participate in technology reviews and contribute ideas to process improvement and innovation initiatives.
• Learn industry best practices for transitioning processes from development into customer and manufacturing environments.

What we are looking for

• PhD in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, Electrical Engineering,
• Hands-on research experience with thin-film deposition processes such as ALD, CVD, PECVD, or PVD.
• Strong experimental background, including designing experiments and analyzing complex data sets.
• Solid problem-solving and analytical skills, with a structured approach to research challenges.
• Clear written and verbal communication skills, with the ability to explain technical concepts to diverse audiences.
• Curiosity, initiative, and motivation to apply academic research in an industrial setting.
• Strong understanding of electro/mechanical equipment and software systems

What sets you apart

• Research experience related to advanced packaging, interconnects, or semiconductor manufacturing
• Familiarity with statistical methods, DOE tools, or data modeling techniques.
• Experience with materials characterization methods such as SEM, TEM, XRD, or ellipsometry.
• Exposure to cross-disciplinary or collaborative research environments.
• Interest in long-term growth within semiconductor technology development and process engineering.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

The Senior Vice President, Engineering establishes the overall strategy and direction of the Engineering team with a view of growing its business and driving its competitiveness in a globalised environment. He/She ensures the strategic alignment of business plans with the organisation’s vision, mission and business objectives.

The Senior Vice President, Engineering oversees and provides leadership to engineering team to ensure that divisional deliverables are achieved in a timely and cost-effective manner. He/ She drives the continuous improvement through innovation, safety, productivity and efficiency initiatives. He/ She builds strong networks with diverse stakeholders and subsidiaries with a view of advancing the organisation’s interests. In addition, he/ she drives organisational capability development and succession planning to ensure a competent workforce and continuous talent pipeline.

The Senior Vice President, Engineering is a calculated risk-taker and strategic thinker with excellent business acumen. He/ She is decisive, results-driven and demonstrates exceptional leadership and communication abilities.

Support and collaborate with NSHD Group Engineering on Global Network and Programs within four cores

·       Support and initiate the Networking channel for the four cores.

·       Collaborate with MTG on HyCO business.

·       Participate in CoP program initiated by NGE and TNSC

Continue to have close engagement with group companies in Asia & Oceania to render Technical and Management support

·      Lead engineering team to provide support to subsidiaries in Proposal, Technical Review, Maintenance Review, Equipment Sourcing and Engineering programs

·       Communicate closely with all Management and Technical personnel in Group Companies.

·       To update the program’s progress constantly

·       Periodical visit after easing of boarder restriction

Initiate Project Execution Function and DX program in Asia & Oceania region.

·       Structure the Project Execution Function formation and promote to Group Companies.

·       Implement CMMS with developed GC.

·       Promote CMS and Telemetric system and standardize the requirement within Group Companies.

Continue to promote Technical Talent Development program in Asia & Oceania region.

·       Continue to identify good potential technical person from group companies in Asia & Oceania region.

·       Make recommendation for secondment to NSHS and other operating group companies.

Collaborate and support Safety and Quality group on their activities for Asia & Oceania region.

·       Participate in Safety audits with Group Companies.

·       Support in the investigation of safety and quality incidents.

·       Collaborate in safety and quality programs.

Lead manufacturing operations

·       Ensure the delivery of the organisation's business and annual production plans and schedules

·       Control capital and operational budgets

·       Recommend changes in production objectives, according to market conditions

·       Set strategic objectives for plant maintenance and asset integrity management systems

·       Drive the development of new and innovative products to improve customer value proposition

·      Drive continuous improvement through innovation, safety, productivity and efficiency initiatives

Drive business and organisational development

·       Provide leadership to uphold and shape the organisation's culture, values and behaviour

·       Drive organisational succession planning, capability and talent development

·       Build business and professional networks

·       Drive the formulation of technology strategies and roadmaps

·       Empower the senior management team to make decisions and ensure their accountability in achieving departmental performance targets

·      Synergise crisis management and business continuity plans to mitigate business impact during disruptive events

Establish strategy and direction

·       Lead business planning and strategic alignment with the organisation's business objectives

·       Steer the implementation of the organisation's business strategies

·       Lead strategic resource planning and management to optimise organisational capacity and capability

·       Establish business performance indicators and measurement standards

·      Establish the organisation's vision, objectives and strategy

·      Bachelor degree from reputable universities in Mechanical, Electrical, Chemical or relevant field.

·      At least 10 years of relevant working experience, of which 5 years of managerial experience in Gas and Chemical Industry.

·      Willing and able to travel

·      Possess initiative, drive and able to work independently and result-oriented.

·      English speaking & writing skill

·      Possess good communication and interpersonal skills for technical aspect

·      Energetic and positive attitude

. Proficiency in Auto CAD software