Total 50 Senior Executive quality control engineer job vacancies in Manufacturing / Production category in Singapore

職位描述

向執行長/營運長和專案負責人匯報

直接下屬

組裝管理器

生產控制經理

組裝專案經理採購

裝配操作員和相關專案成員

職位概述

組裝專案負責人是馬來西亞方面半導體清洗設備組裝專案的總負責人。

該職位負責領導和管理整個組裝專案運營，包括生產計劃、組裝執行、採購協調、發貨控制、成本管理和專案盈利能力提升。

作為日本客戶和日本總部的主要營運窗口，組裝負責人需要協調生產計劃、交付承諾、專案風險和改進活動，以確保實現 QDC 目標。

該職位還要求具備強大的領導能力，以推動整個組裝專案組織的營運效率、組織發展和持續改進。

主要職責

1. 總體專案管理

領導和管理馬來西亞整個半導體設備組裝專案營運。

負責組裝專案的組裝、生產控制和採購工作。

監控和控制整個專案的進度，包括生產、材料準備、組裝狀態和出貨計畫。

確保實現專案品質控制目標。

2. 生產計畫與進度管理

制定和審核半導體製造設備組裝專案的生產計畫。

與生產控制經理協調，優化生產計畫、人力分配和生產能力利用率。

審查每日生產進度，並針對進度延誤或營運問題採取相應的補救措施。

找出生產瓶頸並推動糾正和預防措施。

3. 客戶協調與交付管理

作為與日本客戶和日本總部進行協調的主要窗口。

根據專案要求，處理交貨計劃協調、發貨管理以及客戶請求。

負責回應緊急交付請求、優先變更和工程變更。

向日本客戶和日本總部報告生產風險、進度影響和復原措施。

4. 生產問題管理與持續改進

識別組裝專案中的營運問題、生產風險和流程瓶頸。

領導與組裝、工程、品質保證/品質控制、生產控制和採購團隊進行跨職能改善活動。

促進缺陷減少、流程標準化和卓越營運。

推動精益生產、5S和持續改善計劃。

5. 生產力提升

制定並實施提高生產效率和營運效率的措施。

主導提高勞動效率、優化工作流程和縮短交貨時間的各項措施。

促進裝配流程和操作最佳實踐的標準化。

監控生產關鍵績效指標並實施糾正改善措施。

6. 成本控制與獲利能力提升

管理裝配作業的整體專案成本績效。

領導降低成本的活動，包括提高勞動效率、減少材料損耗和減少返工。

制定並實施提高專案獲利能力的措施。

支援預算管理和盈利能力分析活動。

7. 組織管理

領導和監督組裝經理、生產控制經理和採購經理。

提升組織能力，加強組裝專案結構。

促進有效的跨部門溝通和團隊合作。

確保遵守安全法規、公司政策和操作標準。

■必備：

• 教育
• 工程、製造、工業管理或相關領域的學士學位。
• 經驗
• 至少10年機械設備領域設備組裝、生產管理、生產控製或製造營運的經驗。
• 具備管理裝配專案或製造企業的經驗。
• 技術技能
• 具備紮實的生產計畫、排產和交付控制知識。
• 能夠讀懂機械圖和加工圖。
• 專案管理和組織領導能力。
• 成本控制和獲利能力提升經驗。
• 問題解決和流程改善能力。
• 精通微軟Excel和PowerPoint。

• 申請連結：https://jobs.persolmalaysia.com/detail/39182?apply_id=39182&utm_source=jobstore&utm_medium=sponsored
• 聯絡信箱：Mariko.Takezaki@persolapac.com

福利待遇

• 個人休假
• 開放文化
• 個人發展機會

Responsibilities:

Responsibilities for this position involve working closely with SOC Design, SW/System, and Chipset PE/PM/PdM to validate Digital SOC chip on ATE, SLT and Bench; collaborate with Test Engineering, SLT, and Bench to develop HVM Test Solution. The role is expected from project planning to execution on Digital SOC development. Cross collaboration work is expected with SW, System, Design, Process and Customer Engineering on power and performance related tests for High Volume Manufacturing. The individuals selected for the positions will need to be able to work in a fast paced and dynamic environment and be passionate about delivering quality work.

Requirements:

Experience in Digital SOC development from planning, silicon validation to High Volume Manufacturing phase. Experience in ATE/SLT test coverage, test HW development, data analytics/ statistics, product reliability qualification (ESD/LU, HTOL and Package Qual), ATE System correlation for power and performance, project updates to upper management and cross functional teams, stakeholder management, and risk management.

Education Requirements:

Min 3 years of related job experience in product, test, product engineering.

Bachelor's/Master’s, Electrical and Electronic Engineering or Computer Engineering 

Position Summary

We are seeking a highly motivated Senior Engineer, Assembly to support research and development activities in Photonics IC Packaging. The role involves machine setup, assembly, testing, troubleshooting, and process improvement for advanced photonics packaging applications. The successful candidate will work closely with cross-functional teams to ensure efficient assembly operations, quality performance, and continuous process optimization.

Key Responsibilities

• Perform machine setup, calibration, testing, and mechanical assembly of active devices onto interposers.
• Conduct testing on assembled devices and generate detailed test reports and summaries.
• Troubleshoot assembly-related issues and document findings for failure analysis and corrective actions.
• Coordinate with internal teams to manage incoming materials and ensure readiness for assembly operations.
• Analyze packaging process performance, including yield, manufacturing cost, process specifications, and cycle time.
• Support the planning and execution of continuous improvement initiatives to enhance manufacturing efficiency and product quality.
• Maintain proper documentation of assembly procedures, testing results, and engineering activities.

Qualifications & Requirements

• Diploma, Advanced/Higher/Graduate Diploma, or Bachelor’s Degree in Engineering or a related discipline.
• Minimum 5 years of relevant working experience in the semiconductor industry.
• Hands-on experience with die-assembly tools, flip-chip bonders, and wire bonders is strongly preferred.
• Familiarity with CAD drawing tools is highly advantageous.
• Knowledge of semiconductor wafer packaging and photonics packaging processes is a plus.

ALG is currently hiring a Senior Manufacturing Engineer for our MNC client with a facility in the East, Singapore. Our client is a global leader in designing, manufacturing, and servicing advanced systems and components for the high-technology and advanced manufacturing industries. This is a permanent role offering strong career progression within a dynamic manufacturing environment.

Roles and Responsibilities:

• Manage the end to end effort for the development and deployment of new production processes and equipment.
• Develop the planning, programming, and production flow of precision metal parts.
• Validation of CNC programs for errors in an offline virtual environment
• Identify and design tooling for production processes .
• Maintain and control process documentation of production processes.
• Work with Quality Engineers to develop gauging and systems for process control.
• Troubleshooting and continuous improvement of production processes.
• Develop paperless shopfloor documentation systems.
• Assist production in the prove-out and debugging of new processes.
• Follow prescribed work rules and safety standards.
• Take ownership of project goals and objectives to ensure project success.

Job Requirements:

• Degree in an Engineering discipline (Mechanical, Manufacturing, Material)
• At least 5 years’ of relevant working experience.
• Knowledge of CNC machines and tools, including their designs and uses.
• Knowledge of ANSI Y14.5 blueprint reading, G-Codes, M-Codes, and CAD/CAM programming.
• Knowledge of tooling and fixturing concepts and standards.
• Demonstrate high level of attention to details.
• Ability to develop and manage a project from concept to implementation.
• Ability to be Flexible and adapt to changing priorities.
• Ability to analyze information and quickly solve problems.
• Experience with metrology standards and equipment.

If you are interested in this role, please APPLY NOW! Please note that only shortlisted candidates will be notified.

EA License Number: 11C4379 | Registration Number: R23119425

As Frontend Central Product Integration Engineering and transformative (CPIE) team at Micron Technology, Inc., you will be leading new initiatives to deliver pioneering process capability, best-in-class bits per wafer (Yield) with the highest quality and fastest speed through innovation and collaboration with multi-functional teams. Your primary focuses include but not limited to:

Initiate new data solutions and methodologies to:

• identify process, test, and design improvement opportunities, specialized in UE_ROW & all quality index, Front End-PTS integration, and high-value-bits (PG2+) yield;

• modeling, monitoring and aiming for tool performance benchmarking;

• Process equipment prognostics and process integration optimization;

• Identity test optimization opportunities for high product grade yield improvement.

• Collaborate with site Process & Equipment Engineering, Manufacturing(MFG), Product Integration Engineering (PIE) and Data Science (DS) team to establish feasibility of new initiatives, demonstrate business values, and prototype solution mock-ups;

• Partner with Global Quality (GQ), Product Engineering (PE), Central PEE(CPEE), Smart Mfg Artificial Intelligent (SMAI), Technology Development (TD), and Suppliers to deliver end to end solutions, implement BKM development and deployment to production.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness,exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabledenhancements within one’s scope of work.

Collaboration

• Partner closely with multi-functional teams to ensure successful communication and collaboration for project implementation.

• Detail oriented with the ability to work independently

• Dependability and able to work effectively in multi-functional teams.

• Facilitate and lead activities in designing and optimizing current system, methods, tool, skill to be Best In industry.

• Manage priorities and enhancements to improve business processes and existing systems that are global in nature.

• Willing to work during non-standard hours when needed to provide support to engineering teams at any Micron site.

• Strong growth mindset and willing to continue to learn, unlearn, relearn.

Communication

• Effective communication skills in verbal/written.

• Self-motivated. Able to work independently with minimal supervision.

• Able to travel as required to support department and company objectives.

Requirement and Technical Competency:

• Experience in PIE, Test solution team, product engineering and circuit design engineering. Understanding of Process/Product Integration will be advantageous;

• In depth knowledge of processes, equipment and control system;

• Proficiency in data analytical tools such as Y3, JMP, Python to perform numerical experiment. Proficiency in Statistical/Machine Learning will be additional advantageous; 

• Proven track record to make decisions, multi-task, and solve problems and address root causes.

• Exhibit critical thinking to find opportunities.

• PhD/Masters/Bachelors with relevant course of study and experience

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

The Job:

• Perform process planning and fixture & gauge designs
• Handle quotations and program management
• Apply Six Sigma/Lean Manufacturing methodologies for continuous process improvements
• Planning and scheduling of ERP system

Requirements:

• Machining process, fixture/gauge/tool design
• Degree in Mechanical Engineer or related field with minimum 2-3 years of work experience

Interestedapplicants can send their detailed resumes to janelui@recruitexpress.com.sgor call JANE @ 6735 1955.

JANE LUI JIE'EN

CEI: R1104482

Company Reg.No. 199601303W || EA Licence No. 99C4599

COMPANY DESCRIPTION

Mediacorp is Singapore's largest content creator and national media network, operating a suite of TV channels, radio stations, and multiple digital platforms. Its mission is to engage, entertain, and enrich audiences by harnessing the power of creativity.

We are committed to creating an inclusive and diverse workplace where talent thrives. Our hiring decisions are made based on merit and fit-to-role. If you have a disability or special need which requires accommodation to participate in the recruitment process, please inform us when you submit your online application. We will be happy to support as necessary.

Thank you for your interest and application to this role. Please note that only short-listed candidates will be contacted.

RESPONSIBILITIES

The position requires engineer to carry out tasks related to the support of broadcast and broadcast IT related equipment and systems, including activities such as manning of support hotline, system diagnosis, remediation and monitoring, system administration, patching and preventive maintenance. In addition, the position is required also to support the planning and implementation of broadcast IT system projects.

• Provide technical support to broadcast equipment and systems in News Studios & News Post Production and asset management system, Outside Broadcast production van, News Room Computer System and etc.
• Document, communicate, collaborate, and handle fault incidents
• Assess system vulnerabilities and provide guidance, remediate and mitigate any reliability and security risks
• Perform troubleshooting and repair of broadcast equipment and system.
• Perform preventive and corrective maintenance broadcast and IT equipment.
• Work with different business units to provide technical solutions to enhance existing operation and setup
• Evaluate and recommend new broadcast IT equipment and system.
• Support project implementation of broadcast IT system and infrastructures including the support in drafting of technical specifications and costings documentations.
• Perform shift and standby duty to support broadcast system and infrastructures.

• Degree in Information Technology, Information Systems, IT Security or equivalent. CCNA, Certification in Information Technology networking field is an advantage.
• Candidate without the required academic qualifications but with at least 3 years of relevant experience in IT, Broadcast or Media Production related field are welcome to apply.
• Microsoft certifications such as MCSA preferred
• Project management experience preferred.
• Basic understanding of cloud / enterprise system architecture
• Network troubleshooting skills of IT devices maintenance and experience with management and configuration of networking devices (switches, routers, firewalls) will be preferred.
• Perform shift and standby duty to support broadcast system and infrastructures.

The Job:

• Perform process planning and fixture & gauge designs
• Handle quotations and program management
• Apply Six Sigma/Lean Manufacturing methodologies for continuous process improvements
• Planning and scheduling of ERP system

Requirements:

• Machining process, fixture/gauge/tool design
• Degree in Mechanical Engineer or related field with minimum 2-3 years of work experience

Interestedapplicants can send their detailed resumes to janelui@recruitexpress.com.sgor call JANE @ 6735 1955.

JANE LUI JIE'EN

CEI: R1104482

Company Reg.No. 199601303W || EA Licence No. 99C4599

Senior .NET Production Support Engineer (Cloud & SRE Focus)

Job Summary

We are seeking a highly skilled and experienced Senior .NET Production Support Engineer to manage and enhance mission-critical, cloud-native applications. This role requires expertise in Site Reliability Engineering (SRE), observability, and modern DevOps practices, ensuring high availability, scalability, and performance of distributed systems.

You will lead incident management, advanced troubleshooting, root cause analysis (RCA), and automation initiatives, while collaborating with cross-functional teams to drive resilience, reliability, and continuous improvement.

________________________________________

Key Responsibilities

• Provide L2/L3 production support for.NET (Core/6/7/8+) and ReactJS-based microservices applications

• Implement and maintain SRE practices (SLIs, SLOs, error budgets) for system reliability

• Perform advanced troubleshooting in distributed, microservices-based architectures

• Monitor system health using observability stacks (logs, metrics, traces)

• Drive root cause analysis (RCA) with a focus on preventive and automated solutions

• Collaborate with DevOps and development teams in CI/CD pipelines and release automation

• Support containerized deployments (Docker, Kubernetes) and cloud environments

• Automate repetitive operational tasks using scripting (PowerShell, Python)

• Participate in on-call rotations and incident response (Major Incident Management)

• Integrate AI-driven monitoring and anomaly detection tools for proactive issue detection

• Ensure compliance with ITIL, security, and DevSecOps standards

• Maintain detailed runbooks, knowledgebase, and operational dashboards

Required Skills & Qualifications

• Bachelor’s degree in Computer Science, Engineering, or related field

• 5+ years of experience in .NET application support, SRE, or backend development

Core Technical Skills

Strong expertise in:

• C#, ASP.NET, .NET Core / .NET 6+(preferred latest versions)

• RESTful APIs, Web API, Microservices architecture

• SQL Server, MySQL (plus performance tuning & query optimization)

• Experience in:

• Multithreading, async programming, memory management

• Debugging production issues (dump analysis, profiling, thread analysis)

• Performance optimization &scalability engineering

• High-Niche & In-Demand Skills (Added)

Cloud &Cloud-Native

• Azure (App Services, AKS, Functions, Application Insights) / AWS (EKS, Lambda, CloudWatch)

• Cloud-native design patterns &distributed systems

 Containers & Orchestration

• Docker, Kubernetes (AKS/EKS), Helm charts

• Experience managing production workloads in containerized environments

Observability &Monitoring

• Advanced tools: Prometheus, Grafana, ELK Stack, Open Telemetry

• Expertise in distributed tracing (Jaeger, Zipkin)

DevOps & CI/CD

• Azure DevOps / GitHub Actions / Jenkins pipelines

• Infrastructure as Code (Terraform, ARM templates)

DevSecOps

• Secure coding practices, vulnerability scanning

• Tools like Snyk, SonarQube, OWASP compliance

• AI & Automation (Advanced Niche Edge)

• AI-driven monitoring (AIOps tools)

• Basic knowledge of ML models for anomaly detection

• Experience integrating GenAI / ChatOps for support automation

Tools &Technologies

• Incident Management: ServiceNow, JIRA

•  Monitoring: Splunk, AppDynamics, Dynatrace

•  Version Control: Git (GitHub / GitLab /Bitbucket)

Preferred Skills

•  Certifications:

•  Azure / AWS Certified Solutions Architect or DevOps Engineer

•  ITIL Foundation / Advanced ITIL[i]

Exposure to:

•  Python automation & scripting

•  AI/ML certifications or hands-on experience

•  Financial services / high-availability environments (bonus)

• Perform process planning and fixture & gauge designs
• Handle quotations and program management
• Apply Six Sigma/Lean Manufacturing methodologies for continuous process improvements
• Planning and scheduling of ERP system

• Control of machining cycle time within target including all in-machine activities such as probing, machining, appropriate cutter checks etc.

• Control overall costs for machining taking into consideration cycle time and cost of cutters.

Requirements

- Minimum Degree in Mechanical Engineering/ Manufacturing Engineering

- Preferably with 3-5 years of relevant manufacturing engineering

- Experience in Six Sigma/Lean Manufacturing methodologies

Interested candidates please send in your resume to:
Topaz Liang Huimin (CEI No. R1104500), email to: topaz@recruitexpress.com.sg

EA License No. 99C4599

We regret that only shortlisted candidates will be notified.

• Focus and responsibility for after sales quality related tasks
• Responsible for setting up improvement activities on dedicated products.
• Driving Product Quality Circle within dedicated parties (Sustaining Teams, Platform leaders, HOD’s ..)
• Central part of improvement team in sense of input, coordinator, support on dedicated tasks.
• Supporting escalation in the after sales area (NPI or customer escalation)
• Participating in customer quality calls and task force meeting.
• Close collaboration with the product line & technical support according to the learning's out of onsite trouble shooting and raising preventive knowledge within the organisation.
• Lead all project related documentation and ensure communication (8D-Report, action plans and follow up)
• Initiating and supporting product related analysis
• Interaction with production facility
• Participate customer audits and customer improvement programs.
• Preparation of after sales data and KPI monitoring and reporting.
   

Education

• Minimum Degree in Mechanical / Electrical / Mechatronics / Machining related with 3 years working experience in similar industry.
• Knowledge in project management and Quality Tools

Work experience

• Good understanding of reliability theories & methods (DFMEA, SPC, 8Ds…) and semiconductor manufacturing processes,
• Experienced in quality methods, data analysis and continuous improvement.
• Being in a driver role and push improvements,
• Fast ability to understand company structure and interact with many interfaces
   

Expertise and methodology

• Knowledge in process management for product related business processes, specifically design, engineering, SCM and production (i. e. operational)
• Familiarity with cleanroom protocols (class 10/100) and semiconductor workflows
• Competency in MS-office for data analysis, reporting & presentation
• Familiarity with the Atlassian JIRA system

Other requirement criteria

• Capabilities in analysis, and creation of measures
• Driving and Setting standards and defining roles and responsibilities in own job, processes, and departments
• Agile in sense to drive improvements, but to accept progress on a pragmatic level.
• Flexibility and practice-oriented proceeding, reacting on rapid moving situations and taking appropriate initiatives.
• Experience in handling Die attach equipment is nice to have

Our vision is to transform how the world uses information to enrich life for all.  
 
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 

As part of the HIG HBM Product Engineering organization, you will help drive the development of next-generation GenAI, machine learning, and advanced data analytics solutions for semiconductor engineering. In this role, you will work on intelligent systems that improve engineering productivity, strengthen technical decision-making, and unlock insights from complex manufacturing, validation, and engineering workflows. 

You will collaborate with cross-functional teams across Product Engineering, Design Engineering, System Engineering, Data Science, IT, and Manufacturing to prototype, build, and scale practical AI-driven solutions that improve quality, cost, cycle time, and engineering efficiency. 

Key Responsibilities 

• GenAI System Development: Design, build, and improve GenAI-powered and agentic systems supporting semiconductor engineering workflows such as code generation, data extraction, analytics, documentation automation, failure triage, and technical knowledge retrieval.  

• Large-Scale Data Pipelines: Develop scalable data pipelines and analytical workflows to ingest, clean, transform, and analyze large, complex, and heterogeneous datasets from multiple manufacturing and engineering systems.  

• Advanced Data Analytics: Apply Python, SQL, and data science libraries (e.g., pandas, matplotlib) to perform deep analysis, generate visualizations, and deliver actionable engineering insights.  

• LLM Workflow Engineering: Build, evaluate, and optimize LLM-based workflows, including prompting, retrieval-augmented generation (RAG), inference orchestration, benchmarking, and quality evaluation.  

• Machine Learning Production: Develop and productionize machine learning and deep learning models for classification, regression, anomaly detection, failure analysis, and engineering decision support.  

• Distributed Data Processing: Implement robust data processing techniques such as data cleansing, outlier detection, and missing-data handling using distributed or large-scale frameworks (e.g., PySpark, BigQuery).  

• Cross-Functional Collaboration: Partner with domain experts and cross-functional teams to translate complex engineering problems into scalable AI/ML and analytics solutions.  

• Production Deployment: Support deployment, monitoring, and operationalization of AI/ML solutions in cloud and enterprise environments.  

• Technical Communication: Communicate technical findings, recommendations, and model outcomes clearly to both technical and non-technical stakeholders.  

• Innovation Leadership: Identify and drive high-impact opportunities where GenAI, machine learning, and analytics can improve engineering productivity and business outcomes. 

Minimum Qualifications 

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Science, Data Science, Statistics, Artificial Intelligence, or a related field. 

• Minimum 2 years of hands-on experience developing and deploying AI applications in semiconductors, electronics, or other engineering industries. 

• Strong programming proficiency in Python and SQL.  

• Strong technical foundation in data analytics and visualization, including tools and libraries such as pandas, scikit-learn, matplotlib, plotly, or similar ecosystems.  

• Familiarity with agentic AI frameworks such as LangGraph, Google ADK, AutoGen and evaluation tools like AgentEval. 

• Familiarity with modern AI coding tools / agentic coding harnesses, such as Claude Code, Roo Code, Cursor, Cline, Windsurf, Gemini CLI, or similar tools.  

• Hands-on experience developing and deploying AI/ML systems involving LLMs, including RAG, agentic workflows, and frameworks such as PyTorch or TensorFlow. 

• Cloud experience with GCP, AWS, or Azure, including deploying ML pipelines in production. 

• Experience with LLM training, inference, and evaluation workflows, including prompt design, benchmarking, validation, or retrieval-augmented systems.  

• Experience analyzing large, complex, and heterogeneous datasets from multiple systems and applying sound techniques for data cleansing, outlier handling, and missing-data treatment.  

• Strong analytical, problem-solving, and software development skills.  

• Strong communication skills with the ability to explain technical concepts and findings effectively.  

• Strong sense of ownership, accountability, and engineering rigor. 

Preferred Qualifications 

• Experience building agentic systems or AI solutions for semiconductor manufacturing, product engineering, validation, yield improvement, reliability, or failure analysis. 

• Deep understanding of semiconductor-specific AI/ML applications 

• Demonstrated understanding of deep learning architectures and computer vision.  

• Experience using enterprise data platforms such as BigQuery, Snowflake, MSSQL, Oracle, or Redshift. 

• Experience with Kubernetes or similar production infrastructure and deployment frameworks. 

• Experience with web application technologies such as JavaScript, HTML, and CSS.  

• Experience designing scalable, enterprise-grade AI/ML systems with attention to reliability, traceability, and operational readiness. 

• Familiarity with document-processing pipelines, technical knowledge platforms, or retrieval systems for engineering content. 

• Experience working in cross-functional environments spanning engineering, manufacturing, data science, and IT. 

As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities:

• Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.

• Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.

• DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time

• Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.

• Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.

• Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.

• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

• Bachelors/Masters Electrical and Electronics Engineering Degree with 3 years of experience in the semiconductor industry. Product Engineering experience is preferred.

• Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis.

• Good knowledge of statistics and data analysis tools and scripting.

• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).

• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.

• Strong sense of responsibility and accountability towards assigned role with professional work ethic.

• Excellent communication and presentation skills.

• Passionate about people leadership, with a drive toward ongoing learning and development in this area.

• Work on site in Singapore with international travel to US, Taiwan and Japan.

About Doodle Labs 

Doodle Labs is the global leader in high-performance private wireless systems. We build cutting-edge mesh networks for robotics, drones, and the Industrial Internet of Things. Doodle Labs has experienced rapid growth over the past five years as our radio systems have been adopted by Fortune 500 companies (e.g. Airbus, General Electric) and industry-leading innovators (e.g. Boston Dynamics, FLIR) 

Your Opportunity 

Your opportunity to work with cross-functional teams of RF, Software, Mechanical design, NPI, Operations and Manufacturing/Quality assurance to build the next generation of Doodle Labs' radio portfolio.  

The successful candidate will have significant experience in RF development, Product Engineering and manufacturing of Radio products. 

Key Responsibilities: 

• Lead product engineering activities for one or more radio product lines from design through validation and manufacturing.  

• Own technical execution for product bring‑up, debugging, test, and validation.  

• Drive design for manufacturability (DFM), design for test (DFT), and cost optimization initiatives. 

• Develop and improve test setups, automation scripts, and validation processes to reduce test time and improve coverage.  

• Support regulatory and compliance certifications (FCC, CE, etc.).  

• Manage component obsolescence and support End‑of‑Life (EOL) transitions.  

• Produce and review technical documentation including datasheets, integration guides, and application notes.  

• Mentor and provide technical guidance to junior Product Engineers. 

Job Requirements 

• Bachelor’s or Master’s in Electronics Communication Engineering or a related field  6-9 years of industry experience 

• In-depth knowledge of radio/Wi-Fi product development, Product Engineering and quality control 

• Strong hands‑on experience with hardware bring‑up, debugging, and manufacturing support.  

• Solid understanding of quality control, validation, and production test methodologies.  

• Ability to work independently in a fast‑paced, cross‑functional environment. 

THE ROLE: 

As a Senior Engineer, you will collaborate with various Product Development Groups. This individual serves as a critical technical point of contact to the business, design, platform validation and product engineering teams. We have competitive benefit packages and an award-winning culture. Join us!  

THE PERSON: 

A successful candidate is one who can drive technical decisions independently, has accountability for accuracy, reliability and completeness of assignment results critical to the project’s success. This role allows the opportunity to influence technical decisions that have a significant impact on multiple products or the product line.  

KEY RESPONSIBILITIES: 

• Ensures high uptime, ensures preventive maintenance (PM) execution, and seamless vendor coordination for resolving tools hardware and software issues. Primary advanced toolset coverage: Focused Ion Beam, Reactive Ion etchers, Nano‑probers, Scanning electron microscopes and Transmission electron microscopes 
• The role partners closely with equipment owners, lab operations, EHS, and external OEMs to sustain capability, drive MTBF/MTTR improvements, and enable rapid turns on high‑priority cases.
• Design new lab space with strict environmental control involving vibration, EMI and acoustics.
• Lead structured troubleshooting and root‑cause eradication (5‑Why, Ishikawa, FMEA); convert escapes into standard work and documented fixes
• Serve as single point of contact for OEMs and third‑party service providers; coordinate field service, escalations, and remote diagnostics
• Manage service contracts, PM bundles, and time‑and‑materials events; negotiate scope vs. cost; track vendor KPI adherence and corrective actions
• Enforce LOTO, ESD, chemical/gas handling, UHV safety, and radiation/beam compliance as applicable
• Partner with FA engineers on readiness gates for new methods/fixtures; support tool installation, lab moves, and capability upgrades
• Provide on‑call/shift coverage as needed for bring‑up, critical debug, and factory‑stop events

PREFERRED EXPERIENCE: 

• Hands on maintenance experience with complex capital equipment involving vacuum systems, motion/servo control, pneumatics, high voltage, and embedded SW/FW
• Demonstrated ability in systematic troubleshooting, reading electrical/pneumatic schematics, and using diagnostic tools (oscilloscope, DMM, leak detector, RGA)
• Effective communication with vendors and cross site teams; ability to coordinate multi party interventions under time pressure
• Experience in failure analysis tools, including alignments, stage/probe calibration, column health, and detector
• Knowledge of UHV, turbo/cryogenic pumps, gas handling, plasma sources, beam columns, and vibration/thermal isolation
• Lab‑based role with occasional off‑shift or weekend coverage during critical events and planned PMs
• Some travel for OEM training, factory repair, or acceptance tests may be required

ACADEMIC CREDENTIALS: 

• Bachelor’s degree in Mechatronics Engineering (or Mechanical/Electrical with mechatronics focus)