Total 99 operations advisor job vacancies in Engineering category in Singapore

Join Micron as a Senior Process Development Engineer, Dry Etch, NAND, and join a passionate team advancing next-generation NAND process technologies. You will collaborate with proficient professionals, develop inventive process, and assist us in achieving seamless delivery on our demanding projects.

Responsibilities: 

• Rapid deployment of new NAND process technologies.

• Drive development efforts prior to device ramp

• Define and complete effective actions to enable solutions required to hit key achievements and achieve the required performance within timelines

• Complex process development tasks related to ongoing evaluation of Dry Etch tool performance, examination of Dry Etch process windows, and adjustments or refinement of Dry Etch recipes within 3D NAND technology

• Troubleshoot processes as part of cross-functional teams, driving yield and quality improvement.

• Take initiative to identify and own areas for improvement, collaborating with other Fabs and TD teams.

• Proactively identify exciting processes and work with Fabs to find viable solutions

• Drive process simplification initiative across cross-functional teams.

• Integrate best-known manufacturing methods into the early development phase of upcoming nodes

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Successful candidates for this position will have: 

• PhD degree in Material Science, Physics, Chemistry, Electrical/Electronics Engineering, or Bachelors/Masters in Material Science, Physics, Chemistry, Electrical/Electronics Engineering with minimum of 3 years of semiconductor dry etch process development background

• Proven track record of strong publication, patent, or invention disclosure.

• Strong interest in technology development and crafting production-worthy technologies

• Ability to build and maintain relationships with cross-functional teams and vendors

• Excellent communication skills (written, verbal, and presentation).

• Proficiency in statistics, data analysis, Design of Experiments (DOE), and comfort with analysis software tools.

• Ability to work in a fast-paced and dynamic environment

Micron Technology Inc. is a Fortune 500 company & employs about 45,000 workers worldwide, with HQ in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HMCs, and other memory-based systems. Micron is expanding and now starting full-fledged NAND research and development in Singapore co-locating with high volume manufacturing to speed up innovation. Micron has several world class SSD products (NAND) which have revolutionized speed feeding into GPU’s for superior AI performance and achieving blazing fast performance for gaming and pro workloads. Micron is one of the most prolific patent applicants in the world with 60,000 patents granted and still growing.

As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND. You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to:

Main Responsibilities:

• As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts.

• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts

• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications

• Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions

• Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes

• Incorporate best known manufacturing methods into early development phase of upcoming nodes

• Design and implement advanced process monitoring and control methodologies

• Provide strategic roadmap for N+, N++ and future NAND Nodes

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures, and equipment

• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers

• This position requires communication and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property Protection policy is necessary

Other Responsibilities:

• Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems

• Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions

• As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings

Artificial Intelligence

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Education/Job requirements:

• Masters /PhD with 5-10 years or Bachelors degree with 7-12 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication

Must Have Technical Skills

• Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads

• Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology

• Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes

Must Have Soft Skills

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Strong collaboration and communication skills (verbal and written).

• Self-driven, adaptable, and able to manage multiple projects.            

• Proven ability to take calculated risks and execute novel solutions.

• Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.

Highly Desirable/Preferred skills or experience

• An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.

• Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.

As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.

Responsibilities and Tasks

Conduct Electrical Characterization

• Understand PFA techniques available for de-processing failures

• Understand assembly and test process

• Perform electrical verification to confirm failures

• Establish best known method for de-processing package

Provide Data Analysis

• Understand backend test flows, qualification methodologies and be able to pull relevant information

Communicate with Internal/External Groups

• Document failure analysis techniques used to isolate failure for other groups

• Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA

• Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs

Provide Technical Expertise

• Conduct TMO training and FA certification

• Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.

• Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.

• Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.

Maintain Equipment

• Coordinate calibrations (external to Micron)

• Procure parts as needed

• Coordinate host vendors to support equipment repair

Manage Laboratory

• Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.

• Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.

• To manage the exhaust and scrubber systems of the FA Lab.

• To maintain records and procedures as per Micron GOPs

Education and Experience

• PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline. 

• 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.

• Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.

• Strong communication skills with the ability to collaborate effectively across internal teams and external partners.

• A mindset that emphasizes customer focus, continuous improvement, and striving for excellence.

About Sembcorp
Sembcorp is a leading energy and urban solutions provider headquartered in Singapore. Led by its purpose to drive energy transition, Sembcorp delivers sustainable energy solutions and urban developments by leveraging its sector expertise and global track record.

Join us in shaping a sustainable energy future

Drive Asia’s energy transition with us! Our Gas & Related Services segment is a key growth engine, delivering reliable and efficient energy to industries and communities across multiple countries. We support Asia’s growing energy needs while advancing the shift to a lower-carbon future. 

Key Roles and Responsibilities

• Able to perform corrective Mechanical Maintenance for all mechanical equipment located in Sembgas & Service corridor for the plants.
• Carry out inspections as per daily maintenance schedule; attend defects, breakdowns, including the repairing and calibration of Mechanical Equipment.
• Hands on experience of valves, piping, safety valves, control & shutoff valves etc.
• Take charge to troubleshoot/ fault diagnosis/ failure analysis to determine cause of failure.
• Develop Risk Assessment and mitigation measures for every Maintenance job in the plant
• Apply for Permit to Work (PTW) as the Competent Person (CP) for every Maintenance work in the plant
• Supervise contractors and liaise with other maintenance crafts and technicians to execute maintenance activities
• Withdraw and prepare spares from warehouse for job execution.
• Manage Capex and Opex for all Mechanical activities
• Prepare daily updates on Maintenance activities for the day to all stakeholders (operations)
• Successful candidate can be appointed as part of the Company Emergency Response Team (CERT) (training will be provided)

Qualifications & Experience 

• Engineering Degree Holder in Mechanical
• 3~5 years of experience on  maintenance  of mechanical and piping systems in the utilities & process industry
• Well organized & Target oriented
• Able to communicate effectively with vendor contractor, technician, customer and manager
• Should posses knowledge on instrumentation, control valves, piping, international standards etc.
• Team player
• Strictly follower of company HSE requirement 

Our Culture at Sembcorp

At Sembcorp, our culture is shaped by a strong set of shared behaviours that guide the way we work and uphold our commitment to driving the energy transition.

We foster an institution-first mindset, where the success of Sembcorp takes precedence over individual interests. Collaboration is at the heart of what we do, as we work seamlessly across markets, businesses, and functions to achieve our goals together. Accountability is a core principle, ensuring that we take ownership of our commitments and deliver on them with integrity and excellence. These values define who we are and create a workplace where our people can thrive while making a meaningful impact on driving energy transition.

Join us in making a real impact!

Responsibilities

• Manage and support enterprise infrastructure across Windows and Linux environments
• Perform system administration tasks including health checks, patching, upgrades, and troubleshooting
• Monitor system performance and ensure high availability of infrastructure services
• Plan and execute patching activities following best practices and change management processes
• Deploy and configure servers and virtual machines to support application requirements
• Manage Active Directory, domain controllers, and core Wintel infrastructure
• Handle incident response, root cause analysis, and coordinate issue resolution with vendors
• Support system migrations, upgrades, and improvements to enhance performance and stability

Requirements

• Nitec, Higher Nitec, or Diploma in IT or related field with at least 2 years of experience in enterprise environments
• Hands-on experience with Windows servers, Active Directory, and basic Linux administration
• Familiar with patch management, system monitoring, and IT change management processes
• Exposure to virtualisation technologies (e.g. VMware, vSphere) and strong troubleshooting skills

Additional Information

• Exposure to enterprise IT environments with structured processes and systems
• Opportunity to work across infrastructure, virtualisation, and system operations

Tyson Jay Management Pte Ltd | EA License No.: 24C2479

Ivan Lim | EA Personnel No.: R1109856

Micron Technology Inc. is a Fortune 500 company & employs about 45,000 workers worldwide, with HQ in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HMCs, and other memory-based systems. Micron is expanding and now starting full-fledged NAND research and development in Singapore co-locating with high volume manufacturing to speed up innovation. Micron has several world class SSD products (NAND) which have revolutionized speed feeding into GPU’s for superior AI performance and achieving blazing fast performance for gaming and pro workloads. Micron is one of the most prolific patent applicants in the world with 60,000 patents granted and still growing.

As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND. You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to:

Main Responsibilities:

• As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts.

• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts

• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications

• Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions

• Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes

• Incorporate best known manufacturing methods into early development phase of upcoming nodes

• Design and implement advanced process monitoring and control methodologies

• Provide strategic roadmap for N+, N++ and future NAND Nodes

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures, and equipment

• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers

• This position requires communication and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property Protection policy is necessary

Other Responsibilities:

• Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems

• Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions

• As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings

Artificial Intelligence

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Education/Job requirements:

• Masters /PhD with 5-10 years or Bachelors degree with 7-12 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication

Must Have Technical Skills

• Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads

• Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology

• Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes

Must Have Soft Skills

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Strong collaboration and communication skills (verbal and written).

• Self-driven, adaptable, and able to manage multiple projects.            

• Proven ability to take calculated risks and execute novel solutions.

• Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.

Highly Desirable/Preferred skills or experience

• An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.

• Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.

As a Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

Job Description

Micron’s NAND Process Development (PD) Singapore group is looking for process development engineer to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Responsibilities

• Process module ownership involving Chemical Mechanical Planarization (CMP) process characterization and advanced process development for 3D NAND and beyond.

• Work with process development engineers in Singapore and Boise, US TD site and vendors to develop processes that meet integration requirements for next-generation 3-D NAND nodes.

• Transfer CMP processes to high volume manufacturing (Fab10N), and work on continuous improvements to manufacturability.

• Address process issues working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.

• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts.

• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions

• Identify process simplification opportunities and drive multi-functional teams in implementation

• Incorporate best known manufacturing methods into early development phase of upcoming nodes.

• Design and implement advanced process monitoring and control methodologies.

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.

• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.

• This position requires communications and collaboration with partners both locally and globally.  Strict alignment to Micron Intellectual Property protection policy is a must.

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Requirements

• Bachelors’/Masters in Materials Science, Chemical Engineering or Physics with minimum 5 years hands-on experience in groundbreaking CMP polishing equipment such as AMAT or EBARA, or

• PhD in Materials Science, Chemical Engineering or Physics.

• Lead and mentor CMP engineers early in their careers while driving technical excellence.

• Build, lead, grow a capable CMP team for NAND technology development

• Excellent problem-solving skills and critical decision making

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data

• Working knowledge of Design of Experiments (DoE)

• Proven ability to collaborate with local and overseas teams on projects

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously

We are looking for a responsible, hardworking candidate to join our dynamic family to help produce fresh food for dogs and cats!

This is not a cushy position and you are expected to carry heavy items and do cooking and washing.

(Please note that this is a long term, part-time position)

Commitment Level:

3 days a week = approx 25-30 hours a week (For Part Time only)
5 days a week = approx 40-44 hours a week (For Full Time only)

The ideal candidate should possess the following characteristics:

- Able to handle frozen, raw and cooked food (There will be heat from cooking, but it will be in an air-conditioned environment)

- Able to handle raw meat

- Detailed

- Loves pets!

- Physically fit and able to stand for long hours

- Willing to learn

- Always looking to improve

- Takes initiative at tasks and things

- Good communicator

- Problem solver

- Honest and responsible

- Able to carry around 5-12kg of food at one go

General Job Duties

1. Managing overall food production processes

• Ensure raw ingredients are adequate and taken out to thaw before each production day.
• Blend, mix and cook dry goods and vegetables that needs to be pre-cooked before production day and pack according to the required amounts in each recipe.
• Operate cooking equipment and set the correct setting for each recipe

2. Coordinating food production workflows

• Ensure correct amounts of food ingredients are cooked at the right portions and timings for each recipe and poured out in trays for packing

3. Prepare and pack orders

• Consolidate all orders for delivery and distribute to drivers for delivery
• Print delivery labels for packing of orders
• Prepare address list to tabulate packed orders and for drivers to reference
• Packing and sorting of orders

4. Logistics organisation

• Coordinate with drivers on delivery route and special delivery requests
• Update customers on the delivery schedule
• Organising and keeping of stocks

5. Inventory management

• Stock take on raw and dry ingredients for upcoming production days
• Keep track on packaging stocks and inform the team if inventory runs low
• Procurement of raw and dry ingredients for food production
• Ensure healthy volume of in-stock meals available for delivery
• Assist with the unloading of deliveries

6. Maintaining general cleanliness and tidiness at the place of work

• Ensure general cleanliness of the workplace especially the kitchen and the cooking equipment and appliances (sweep, mop, scrub, wipe)
• Maintain hygiene and a clean environment to avoid pest infestation (We are handling food so quality is important :) )

Requirements:

- No minimum educational qualifications

- Good verbal and written communication in English / Chinese as this are the main languages to communicate with customers, business partners and suppliers

- 0 to 2 years experience in the F&B / food manufacturing industry

- Able to start work as soon as possible

Responsibilities

• Manage and support enterprise infrastructure across Windows and Linux environments
• Perform system administration tasks including health checks, patching, upgrades, and troubleshooting
• Monitor system performance and ensure high availability of infrastructure services
• Plan and execute patching activities following best practices and change management processes
• Deploy and configure servers and virtual machines to support application requirements
• Manage Active Directory, domain controllers, and core Wintel infrastructure
• Handle incident response, root cause analysis, and coordinate issue resolution with vendors
• Support system migrations, upgrades, and improvements to enhance performance and stability

Requirements

• Nitec, Higher Nitec, or Diploma in IT or related field with at least 2 years of experience in enterprise environments
• Hands-on experience with Windows servers, Active Directory, and basic Linux administration
• Familiar with patch management, system monitoring, and IT change management processes
• Exposure to virtualisation technologies (e.g. VMware, vSphere) and strong troubleshooting skills

Additional Information

• Exposure to enterprise IT environments with structured processes and systems
• Opportunity to work across infrastructure, virtualisation, and system operations

Tyson Jay Management Pte Ltd | EA License No.: 24C2479

Ivan Lim | EA Personnel No.: R1109856

Job Description:

1. Plan, prioritize, and coordinate daily factory operations and manpower.
2. Prepare tools, and spare parts ahead of scheduled work.
3. Maintain a safe, clean, and organized factory environment, including lifting gear upkeep.
4. Lead the team to execute operations safely, including onsite lifting and hot-work activities.
5. Prepare safety documents (e.g., SWP, RA) and ensure compliance with ISO 45001.

Job Requirements:

1. Diploma in Mechanical Engineering or related field.
2. WSH certification is an added advantage.
3. Proficiency in Mandarin for communication with mandarin speaking team members.
4. Minimum 3 years of relevant industrial or operations experience.
5. Knowledge of industrial machinery, mechanical systems, and basic electrical controls.

Working hours:

Mon to Fri – 7.30am to 4.30pm / Sat 7.30am to 11.30am (5.5 days work week)

IAM Operations Engineer – Singapore (Singaporeans Only)

We are looking for a skilled and motivated IAM OperationsEngineer to support and enhance our enterprise Identity and Access Management(IAM) environment across cloud and enterprise platforms.

The ideal candidate will have hands-on experience withMicrosoft Entra ID and AWS IAM Identity Center, with strong knowledge ofauthentication, authorization, SSO, MFA, federation, and cloud identitysecurity best practices.

This role works closely with security, infrastructure, andapplication teams to ensure secure, seamless, and compliant user accessmanagement across the organization.

Key Responsibilities

Identity Platform Management

• Administer, operate, and support enterprise IAM platforms including:
• Microsoft Entra ID (Azure AD)
• AWS IAM Identity Center
• Manage and support:
• Single Sign-On (SSO)
• Multi-Factor Authentication (MFA)
• Conditional Access
• Federation services
• Implement and maintain IAM policies, standards, and operational procedures
• Integrate IAM solutions with cloud services, SaaS applications, and on-premises systems
• Perform user access reviews, audits, and compliance activities
• Participate in IAM upgrades, maintenance, and enhancement activities during scheduled maintenance windows

User Support & Operations

• Provide Level 2 / Level 3 operational support for IAM-related incidents and service requests
• Monitor IAM platform health, availability, and performance
• Troubleshoot authentication, access, and federation-related issues

IT Service Management

• Work within ITIL processes for:
• Incident Management
• Problem Management
• Change Management
• Maintain detailed ticket updates, troubleshooting records, and resolution documentation
• Ensure SLA compliance and timely issue resolution

Required Skills & Qualifications

• Singaporeans only
• Degree in Computer Science, Information Technology, Cyber Security, or related discipline
• 6–8 years of relevant IT experience
• Minimum 1 year of hands-on IAM or identity operations experience
• Strong practical experience with:
• Microsoft Entra ID (Azure AD)
• Users & groups
• Conditional Access
• MFA
• Enterprise Applications
• SSO
• AWS IAM Identity Center
• Permission Sets
• Account Assignments
• Federation
• Strong understanding of:
• Authentication & Authorization
• RBAC
• Least Privilege
• Federation concepts
• Experience with IAM protocols:
• SAML 2.0
• OAuth 2.0
• OpenID Connect
• Familiarity with cloud security best practices
• Strong troubleshooting and analytical skills
• Good communication and documentation abilities
• Ability to collaborate effectively withtechnical and business stakeholder

Preferred Skills

• Experience supporting hybrid identity environments (On-Prem AD + Cloud)
• Relevant certifications such as:
• Microsoft Certified: Identity and Access Administrator Associate

Job Overview

We are seeking a Datacenter Operations Engineer tosupport the smooth operation of mission critical datacenter facilities andphysical infrastructure. This role will be responsible for monitoring facilityconditions, supporting hardware activities, maintaining documentation, andcoordinating on site operational tasks to ensure service continuity.

This is a strong fit for candidates with hands on experiencein datacenter support, facilities monitoring, rack and stack activities, andasset handling.

Key Responsibilities

• Monitor datacenter facility conditions and respond to environmental or infrastructure alerts
• Support operations involving UPS, CRAC units, chillers, fire suppression systems, and leak detection panels
• Perform routine checks and assist in maintaining uptime of critical datacenter infrastructure
• Support rack and stack activities, equipment installation, cable patching, labeling, and structured cable management
• Assist with server provisioning and decommissioning coordination across infrastructure teams
• Maintain rack layouts, asset records, physical documentation, and inventory accuracy
• Support vendor visits, hardware deliveries, and site access coordination within secured environments
• Assist in incident response for facility, hardware, or power related issues
• Support capacity tracking for rack space and floor utilization
• Escalate complex technical or facility related issues to the relevant lead or specialist teams

Requirements

• Diploma, NITEC, Higher NITEC, or Degree in IT, Engineering, or related field
• Experience in datacenter operations, infrastructure support, or facilities related environments
• Basic to good knowledge of UPS, CRAC, cooling systems, fire suppression, and environmental monitoring tools
• Hands on experience with rack and stack, cabling, patching, labeling, and equipment handling
• Familiarity with asset tagging, inventory tracking, and physical infrastructure documentation
• Able to coordinate with vendors, internal teams, and site stakeholders effectively
• Good troubleshooting skills and ability to respond to operational incidents in a structured manner
• Comfortable working in secure datacenter environments and supporting shift or on call coverage where required
• Team player with good communication and documentation skills

Please send your detailed resume in MS Word format to resume@goldtecHRs.com with

• Education Level
• Working experiences
• Each employment background
• Reason for leaving each employment
• Last drawn salary
• Expected salary
• Date of availability

As a PDE Central Yield Enhancement (YE) Engineer within Package Development Engineering (PDE), you will own and execute yield learning and improvement activities across advanced package technologies during HBM and NCG New Product Introduction (NPI). Your scope includes yield monitoring, excursion response, and yield stabilization, with an emphasis on rapid learning, early risk identification, and scalable solutions. 

This role plays a key part in driving robust yield performance from first silicon through NPI ramp and early HVM, partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing and Quality teams. You will act as a hands‑on yield owner for NPI builds, translating data into actionable insights, driving fast learning cycles, early risk detection, and leading disciplined yield recovery. 

Job Responsibilities 

Yield Loss Accounted For 

• Account for HBM NPI builds across PWF, Assembly, and test through defect breakdown and PFA submission to understand fail mode 

• Own and execute assigned Central YE responsibilities for HBM NPI program, work closely with PI to identify defects that is coming from their area to brainstorm for CIP 

• Learn NPI processes, phase gates, and yield best practices 

• Assist in maintaining yield dashboards and trackers. Support PI/PE/RDA in identifying and transforming processing data to account/ breakdown a yield loss 

Yield Deviation Control 

• Analyze and report on yield deviation issue and trigger action from PI, PE or RDA 

• Support block run and partial conversion build yield analysis to early detect any impact on yield 

• Work closely with PCS team to identify SPC or FDC charts to put into YLR dashboard for shift left monitoring 

Yield Improvement Opportunities 

• Brainstorm with staff from other departments for improvement opportunities and propose to PI 

• Design and implement new solutions, including hotspot analytics, to improve the effectiveness of the automated defense line system. 

• Utilize software tool like Auto-diagnostics to find yield improvement opportunities 

Integrating Artificial Intelligence 

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgement and complying with organizational standards and legal requirements 

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work 

Job Requirements 

• Bachelor's or Master's degree in Electrical/ Electronics Engineering/ Computer Engineering / Computer Science with 2 to 5 years of experience in semiconductor industry, specifically involving yield analysis, defect/root cause investigation, or data-driven process optimization in advanced memory (HBM, DRAM, NAND) or high-volume semiconductor packaging. 

• Proficiency in Python (e.g., Pandas, NumPy) and SQL for semiconductor manufacturing data analysis, with hands-on experience developing interactive dashboards and visual reports using tools (including Spotfire and Power BI/Tableau) to translate large manufacturing datasets into actionable yield and process improvement insights. 

• Demonstrated experience building automated reporting workflows, data pipelines, or process automation solutions using Python scripting or RPA tools within a semiconductor manufacturing environment, with the ability to drive cross-functional decisions across manufacturing, process integration, and engineering teams in the semiconductor industry. 

• Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes 

Embody Micron’s Core Values 

• People – Respect, develop, and empower others. 

• Innovation – Drive continuous improvement and breakthrough thinking. 

• Tenacity – Show grit and determination. 

• Collaboration – Build trust and foster teamwork. 

• Customer Focus – Deliver excellence and value 

As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) High Bandwidth Memory (HBM) Returned Material Authorization (RMA) Engineer at Micron Technology, Inc., you will be responsible for overseeing and tracking the formal Failure Analysis (FA) of customer-returned product. You will summarize analysis at the electrical and physical level, identify root cause, and establish associated containment plan. In this role, you will work with various engineering and manufacturing groups to evaluate and implement corrective actions (CAs) for the identified issues. You will also be required to regularly communicate FA results to customers as well as other Micron engineering and manufacturing teams. Additionally, you will need to sustain knowledge of device capabilities and characteristics along with a basic understanding of the associated manufacturing processes.

The DEMQRA RMA Engineer must demonstrate the ability to handle multiple customers and deal with multiple issues at one time, while providing detailed and timely follow-up between all applicable internal organizations at Micron.

You will:

Manage FA of Customer Concerns

• Understand the customer complaint as it relates to the DRAM component or module

• When not already provided, initiate contact with customer or customer representative to identify specific failing conditions

• Oversee and direct initial bench level, system level, and ATE level analysis and interpret results

• Coordinate detailed component level analysis (electrical (EFA) and physical (PFA)) and interpret results

Manage Communication of Results with Manufacturing and Engineering Teams

• Review feedback/Corrective Action (CA) from various manufacturing areas

• Ask follow-up questions as necessary to provide an adequate customer response

• Translate results to a customer friendly format

• Analyze data from various sources for trends and variations

• Communicate the needed process improvements

Provide FA Reports to External Customers

• Summarize the RMA background and FA results

• Identify the root cause and potential improvements for use in reports

• Identify and provide containment information and associated risk assessment

• Generate both interim and final FA reports for customer consumption

• Provide customer support for ongoing questions/concerns related to the FA report

Maintain Knowledge of Device Capabilities and Characteristics

•             Understand the latest process technology

•             Recognize differences from previous technology nodes with the associated risks

•             Understand the datasheet specifications for each device

•             Stay up-to-date on common customer DRAM applications

•             Partner with field support teams to understand ongoing customer status

Education:

• Required: Bachelor’s degree in Electrical / Electronics/ Computer Engineering

• Desired: Master’s Degree in Electrical / Electronics/ Computer Engineering

Required Qualifications:

• 5+ years of experience in semiconductor field

• Knowledge of DRAM operation, fabrication process and semiconductor device physics

• Advanced understanding of electronic circuit.

• Basic understanding of DRAM/motherboard/CPU architecture and operation.

• Familiarity with failure analysis, troubleshooting/debugging, advanced packaging, wafer testing, component testing and module testing concept and flow.

• Good written and oral communication skills

• Self-confidence in speaking and chairing a meeting.

• Experienced in computer, laptop or server OEM and focus on system level debug or CPU or DRAM or SYSTEM FAE is a plus.

As a Global Quality (GQ) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer on the DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA) at Micron Technology, Inc., you will be responsible for the electrical characterization and electrical failure analysis (EFA) of all HBM products. You will need to distinguish whether it is package or device related failures. Preferably, you are equipped with knowledge of DRAM functionality, process, test program and device necessary for making solid judgment. You will also use a variety of test tools including the uMate tester, Merlin, Mongoose SM3, Prober, CAD layout tool, and a variety of technical drawings and schematics to perform detailed characterization on HBM products. You will record and categorize failures in order to determine failure mechanisms and characteristics. In this role, you will communicate with various engineering groups, assist lab users with equipment setup and interpretation of data, and maintain critical EFA knowledge database. You will also be expected to seek ways to improve the EFA process in order to reduce test time, increase throughput, and increase failure mechanism assignment accuracy and consistency.

You will:

Analyze Failed Components from Reliability Testing

• Interpret historical tests results

• Adjust timing/level/testmode/code/temp to find out the sensitivities of failures for array fails

• Perform visual inspection to identify physical defects

• Utilize schematics/layouts/process to recognize abnormalities

• Document failed conditions and test results

• Categorize electrical failures

• Communicate results

• Coordinate next level analysis to various groups including PYE (Product Yield Enhancement) for CSAM (C-mode scanning acoustic microscope)/functional open (FO)/PFA (Physical Failure Analysis), Product Engineering and Package Reliability.

• Identify and communicate new or unusual results (electrical signals)

Respond to Equipment Issues

• Understand test software and hardware configurations

• Troubleshoot hardware issues

• Identify and report software and hardware issues

• Repair or coordinate repair of equipment

• Configure and upgrade test equipment

• Develop and deploy failure analysis (FA) software

Provide Technical Support and Conduct Training

• Assist lab users with equipment setup

• Teach operation of equipment

• Conduct on-the-job training (OJT) for new hires and transfers

• Provide data interpretation

• Suggest failure root cause

• Provide suggestions for further analysis

• Introduce new users to basic DRAM functionality/process/device

Perform Engineering Requests and Supplemental Tasks

• Submit package level physical failure analysis (PFA)

• Provide FA for other groups as requested (RMA, Module)

• Determine engineering test requirements

• Execute request and experiments

• Summarize test results and provide feedback

• Create repair converters

Manage Failure Analysis (FA) Information

• Create and maintain specific FA database

• Track FA data

• Identify false failures

• Analyze and summarize data

Perform Quality/Reliability request and review

• Perform review on test time reduction requests

• Perform review on Design/Marketing datasheet requests

• Perform review on Modify Qual requests

• Perform review on Material Review Board (MRB)

• Perform review on Process of Record Review Board (PORRB)

• Perform review on customer reports/data

Education:

• Required: Bachelor’s degree in Electrical / Electronics/ Computer Engineering

• Desired: Master’s Degree in Electrical / Electronics/ Computer Engineering

Required Qualifications:

• 5+ years of experience in semiconductor field

• Knowledge of DRAM operation, fabrication process and semiconductor device physics

• Familiarity with failure analysis, troubleshooting/debugging, advanced packaging, wafer testing, component testing and module testing concept and flow.

• Strong troubleshooting skill

• Good organizational skills and sharp attention to detail

• Good written and oral communication skills

• Efficient computer skills

• Knowledge of the DRAM fabrication process/test program/functionality

• Familiarity with Unix, DFII/Cadence, and/or uMate preferred

• Ability to work independently or in a group environment

• Basic understanding of electrical equipment

• Ability to use the analytical tools provided on the various test equipment, such as uMate, Curve Tracer, or Oscilloscope