Total 2,023 Senior Executive electronic engineer job vacancies

Job Requirement:

• 7+ years of experience in Linux system administration and/or platform engineering
• 3+ years of hands-on experience with Red Hat OpenShift Container Platform (OCP 4.x)
• Strong proficiency in RHEL 7/8/9 administration and troubleshooting
• Solid understanding of kubevirt architecture and concepts (OpenShift is kubevirt-based)
• Familiarity with enterprise storage, networking, and virtualisation platforms (VMware, KVM)
• Strong knowledge of security hardening, patching processes, and compliance frameworks

Key Responsibilities:

• Red Hat OpenShift Platform Support
• Provide L3 escalation support for Red Hat OpenShift Container Platform (OCP) across on-premise and hybrid cloud environments
• Administer, troubleshoot, and maintain OpenShift clusters including control plane, worker nodes, etcd, and ingress/egress components
• Manage OpenShift upgrades, patching, and version lifecycle planning
• Diagnose and resolve issues related to pods, deployments, namespaces, persistent volumes, operators, and service mesh (Istio/Red Hat Service Mesh)
• Implement and maintain Role-Based Access Control (RBAC), network policies, and security contexts

Linux Platform Support

• Provide L3 support for Red Hat Enterprise Linux (RHEL) and other Linux distributions across physical, virtual, and cloud environments
• Perform root cause analysis (RCA) for OS-level incidents including kernel panics, performance degradation, storage failures, and network issues
• Manage system hardening, patching, and compliance activities in line with security baselines (e.g., CIS)
• Administer system services, daemons, cron jobs, and startup processes (systems)

Thanks, and Best Regards

Karanam Vijaya Kiran

(EA Registration no: R1443178)

HP: +6592333815

Recruitment Manager

Helius Technologies Pte Ltd (EA Licence No: 11C3373)

https://www.linkedin.com/in/vijay-karanam-68462131/

As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.

Responsibilities and Tasks

Conduct Electrical Characterization

• Understand PFA techniques available for de-processing failures

• Understand assembly and test process

• Perform electrical verification to confirm failures

• Establish best known method for de-processing package

Provide Data Analysis

• Understand backend test flows, qualification methodologies and be able to pull relevant information

Communicate with Internal/External Groups

• Document failure analysis techniques used to isolate failure for other groups

• Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA

• Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs

Provide Technical Expertise

• Conduct TMO training and FA certification

• Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.

• Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.

• Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.

Maintain Equipment

• Coordinate calibrations (external to Micron)

• Procure parts as needed

• Coordinate host vendors to support equipment repair

Manage Laboratory

• Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.

• Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.

• To manage the exhaust and scrubber systems of the FA Lab.

• To maintain records and procedures as per Micron GOPs

Education and Experience

• PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline. 

• 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.

• Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.

• Strong communication skills with the ability to collaborate effectively across internal teams and external partners.

• A mindset that emphasizes customer focus, continuous improvement, and striving for excellence.

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Job Description

1. Prepare and review Instrumentation, Control and Automation (ICA) Works specifications.
2. Assist the ICA Lead and manage the engineering design works for the Control System Architecture, Data Communication Networks, and Piping and Instrumentation Diagrams (P&IDs), Programmable Logic Controller / Distributed Control System (PLC/DCS), DDC (Direct Digital Control) and Supervisory Control and Data Acquisition (SCADA) and any other ICA Works as required.
3. With experience in the programming for any of the PLCs like Siemens, Schneider, AB, ABB and others will add on the credits.
4. With experience in the system of Building Management (BMS), Fire Alarm, One-Way and Two-Way, ELV, ACMV will be preferred.
5. Handle equipment package and procurement including technical specifications preparation, technical clarification, technical bid analysis, etc.
6. Collaboration with multiple stakeholders including internal teams of different trades, clients, consultants, other packages contractors, sub-contractors and vendors to ensure success of the project.
7. Prepare, review and liaison with subcontractor(s) in the design and submission, ensuring allproject specifications and design standards are met.
8. Work with cross function project team to support project activities, i.e. schedule, process, progress claims, work progress, etc.
9. Manage and supervise the project execution, site installation, inspection, testing and commissioning, plant proving related to Instrumentation, Control and automation system and interface works with other disciplines and all stakeholders.
10. Attend to clients’ comments and ensure clients’ approval & acceptance to all ICA related design, installation and Testing & Commissioning Works.
11. Resolve the site technical related matters.

Design, Engineering, FAT, Installation, Testing and Commissioning of:-

1. System Control PLC/DCS, DDC and SCADA.
2. Input / Output list.
3. Data Communication Network for ICA, BMS, ACMV, Fire Alarm Panels.
4. Instrumentation.
5. FAT and SAT of Interfacing Panels, Instruments, Pumps, etc.
6. Cable Support System.
7. Cabling & Termination Works.

Requirements

1. Diploma in Electrical & Electronic Engineering / Instrumentation & Control Engineering /Mechatronics /Advanced Diploma in Process Control and Instrumentation or equivalent.
2. Experience in Selection, Installation, Testing and Commissioning of the Instrumentation.
3. Experience in ICA engineering Works, preferably in water/wastewater projects will be an added advantage.
4. Experience in Programming of PLC/DCS, DDC and SCADA will be an added advantage.
5. Experience in the system of Building Management (BMS), Fire Alarm, One-Way and Two- Way, ELV, ACMV will be preferred.
6. Experience in ICA, BMS, Fire Alarm, One-Way and Two-Way, ELV, ACMV panel design will be an added advantage.
7. Experience in Project Execution, Supervising and Coordination with subcontractors, consultant and Client.
8. Good knowledge in Autocad 2D, familiar with Microstation and Autocad 3D software will be an added advantage.
9. Good technical understanding and experience in water, wastewater and environmental engineering works.
10. Meticulous and analytical with excellent problem-solving skills.
11. Able to work under tight deadlines.
12. Highly motivated and ability to work independently with minimal supervision.
13. Minimum 3 years relevant experience in engineering, installation, testing and commissioning of ICA Works. Candidate with more than 5 years experiences can be considered as senior level.
14. Fresh graduated candidates are also welcome.
15. Able to work in the Tuas South area and Changi East area in Singapore.

Job Description

• Lead and manage the eletrical engineering design works.
• Prepare and review the deisgn of the electrical works, e.g. equipment sizing, cable sizing and voltage drop calculation, power system study, electrical layout single line diagram, schematic drawings, etc.
• Handle equipment packages and procurement including technical specifications, technical clarification, technical bid analysis, etc.
• Develop cost estimates for electrical equipment and eletrical works.
• Develop work schedule and coordination of the project works.
• Review the sub-consultants, sub-contractors and vendors' design and submission, ensuring all project specificaions and design standard are met.
• Prepare all relevant checklists for installation, testing and commissioning works.
• Collaboration with multiple stakeholders including internal teams of different trades, clients, consultants, other packages, sub-contractors, and vendors.
• Attending to client's comments and ensuring client's approval and acceptance of all electrical works related design, installation, testing and commissioning works.
• Handle and resolve all site technical related matters.

Requirements

• Bachelor Degree in Electrical Engineering
• 5 to 8 years of relevant experience in construction industry. Working experience in water or wastewater industry will be an advantage.
• Experience in design, installation, testing and commissioning of electrical works, e.g. high voltage system, low voltage system, transformers, motor starters, cablnig works, earthing and lightning protection system, etc.
• Experience in project execution, project coordination, supervision and coordination with clients, consultants, and all other sub-tier under the Contractor.
• Good technical knowledge in electrical system.
• Well verse in power system anaylsis software e.g. ETAP and BIM software e.g. Bentley, Revit and Navisworks.
• Team player with good interpersonal skills.
• Meticulous and analytical with excellent problem-solving skills.
• Able to work under tight deadlines.
• Highly motivated and able to work independently with minimal supervision.
• WIll be required to work full time at project site.

We are looking for the right people — people who want to innovate, achieve, grow and lead. We attract and retain the best talent by investing in our employees and empowering them to develop themselves and their careers. Experience the challenges, rewards and opportunity of working for one of the world’s largest providers of products and services to the global energy industry.

Job Description :

• Under general supervision, applies functional specifications and uses engineering tools to design hardware for product changes and new development.
• Independently processes data, writes engineering reports, and conducts diagnosis of routine hardware malfunctions.
• Contributes in reliability analysis such as risk assessments and Failure Mode Effects Analysis by compiling and examining data.
• Identifies the testing requirement at a system level with the emphasis on complying with test standards and Halliburton's Health, Safety, and Environment procedures.
• Contributes to Halliburton's Intellectual Property portfolio by preparing Invention Disclosures and recognizing ideas that have Intellectual Property potential without disclosing confidential information.
• Coordinates with project leads to produce project deliverables by assessing input requirements and applying functional specifications.
• Develops relationships through excellent communication skills and acts as a key resource to provide innovative solutions.
• May participate in professional societies in area of specialization.

Requirement:

Requires completion of a bachelor's degree in Mechanical Engineering or similar discipline; master's degree preferred.

Requires two years of related experience (requirement may be waived with master's degree).

Leadtop Technology Pte Ltd is a chip design company based in Singapore. The Company has strong R&D capabilities and the core technical team members all have numerous years of experience in the semiconductor industry. We have rich industry experience and deep practical accumulation in IC design and business management.

Job Description:

1. Works with the front-end design team to complete the chip floorplan , clock architecture, and powerplan .

2. Takes charge of the physical design tasks from the Netlist to the GDSII, including P&R, formal verification, static timing analysis, physical verification, power analysis, design for reliability and tapeout.

Position Requirements:

1. Holds a bachelor's degree or above in electronic engineering, microelectronics, or computer science.

2. At least 2 years of work experience in the digital backend design field. Tapeout experience at advanced technology is preferred.

3. Those with experience in TCL , Perl or Python script development and familiar with EDA tool design will be a plus.

4. Strong communication ability, good confidence and self-motivation, good teamwork spirit.

5. Salary is negotiable for excellent candidates.

• Well Established Company
• Excellent Welfare and Benefits + Career progression
• Basic $ 4500 to $ 7300 + AWS + VB
• Working location: North-East
• Working Hours: Monday to Friday (8:30am to 5:30pm)
• Must have C / C++

Job Responsibilities:

• Responsible for software prototyping, requirement analysis, design, development, test, system integration and site integration for developed applications
• Design, configuration, test, integration and maintenance of Automation & SCADA Systems and applications
• Provide technical, deployment and commissioning support to Project Teams and Customers
• Maintain and enhance software applications in both functionality
• Provide software support via on-site troubleshooting, testing and tuning of applications, software, network, protocols and communication issues

Requirements:

• Diploma/Degree in Electronics Engineering or Computer Science
• Experienced with two or more languages such as C/C++, C#, Python
• Experienced in at least one scripting language sch as Python, bash, ksh, bat, ps
• Experience in real tome/embedded system
• At least 2-3 years experience in C/C++ and at least 1 full SDLC
• Knowledge/Experience with SCADA protocols, RDBMS, REST, MQTT are desired

Candidates are encouraged to apply this position via Apply Now button with the following information in the resume

• Work experiences and job responsibilities
• Current and Expected salary
• Reason for leaving
• Date of availability
• Education background

We regret that only shortlisted candidates will be contacted.

NG DIAUM YEE (R2198031)

EA Recruitment Pte Ltd

EA License No: 21C0492

Leadtop Technology Pte Ltd is a chip design company based in Singapore. The Company has strong R&D capabilities and the core technical team members all have numerous years of experience in the semiconductor industry. We have rich industry experience and deep practical accumulation in IC design and business management.

Job Description:

1. Works with the front-end design team to complete the chip floorplan , clock architecture, and powerplan .

2. Takes charge of the physical design tasks from the Netlist to the GDSII, including P&R, formal verification, static timing analysis, physical verification, power analysis, design for reliability and tapeout.

3.Researches the physical design methodology of advanced process nodes, and improvise the automatic physical design platform.

Position Requirements:

1. Holds a bachelor's degree or above in electronic engineering, microelectronics, or computer science.

2. At least 5 years of work experience in the digital backend design field. Hands-on project experience is required. Tapeout experience at advanced technology is preferred.

3. Those with experience in TCL , Perl or Python script development and familiar with EDA tool design will be a plus.

4. Strong communication ability, good confidence and self-motivated, good teamwork spirit.

5. Salary is negotiable for excellent candidates.

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  
 

Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.  

Key responsibilities and duties include:  

Process Development:  

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Establish and improve process management projects to deliver technology node requirements  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities 

Requirements 

• B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields  

• 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field  

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes  

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  

We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! 

Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.  

Key responsibilities and duties include:   

Technology Development:  

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Integrate semiconductors while partnering with process and product engineering teams  

Yield Improvement:  

• Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements  

• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes  

• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Requirements  

• B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields  

• 2 or more years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team  

• Ability to resolve complex issues through root-cause or model-based problem solving  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes  

Job Responsibilities:

• Perform checks on the structural, architectural and M&E materials/works to ensure that the final touch-up works are ready for inspections.
• Conduct regular inspections to ensure works are in compliance with method statements (in accordance to BCA’s Good Industry Practice)
• Monitor the performance of subcontractor workers for all trades and ensure any defects are properly rectified
• Involved in preparing relevant QA/QC reports
• INvolved in implement QA/QC plans and ensure PPVC quality before delivery
• Ensure the functionality of the product before handing over to buyers
• Assist in preparing for QM submissions
• Assist in yearly ISO audits
• Assess, feedback on the construction process and procedures
• Execute quality control as per site specific materials and Works Quality Plan.
• Conduct relevant training for sub-con and internal staff.
• Issuance and handling of Site Memo.
• Monitor undertaken corrective and preventive actions against non-conformities.
• Arrange and liaise with BCA for CONQUAS/QM assessments.
• Recommends solutions for critical and/or frequent recurring defects to Project Team.
• Ensure all the method statement used has obtained approval from the clients and consultants.
• Follow-up all the required tests as per contract requirement.
• Attend regular site meetings – QAQC, Landscape Coordination Meeting and Client Meeting.
• Attend off-site inspection – Precast and Structural Steel Works (Malaysia and Singapore Factory)
• Follow the developer’s Quality Inspectors (QI) and Customer Service Officers (CSO) for inspection prior to building handover to owners.
• Attend to client ’s defects during Defect Liability Period.
• Assisting in handover of the common areas to management team.

Job Requirements:

• Min Diploma or Degree related to QA/QC or Engineering / Construction related field
• Prior experience related to construction industry (HDB, Condominium projects etc.) is added advantage
• Good knowledge of construction quality control/assurance is necessary

Key Responsibilities

• Lead Development team to Design, develop, and maintain full-stack applications using Golang (backend) and SvelteKit (frontend).

• Build, optimize, and maintain GraphQL APIs for data-driven applications.

• Implement microservices for modular, scalable, and resilient systems.

• Familiar with PostgreSQL databases, including schema design and query tuning.

• Collaborate cross-functionally with product, design, and operations teams to deliver high-quality software.

• Ensure code quality through peer reviews, testing, and CI/CD practices.

• Contribute to system architecture discussions and drive engineering best practices.

• Support performance tuning of application systems.

Required Qualifications

• 7+ years of professional experience as a full stack or backend engineer.

• Strong proficiency in Golang for backend development.

• Proficient in SvelteKit or similar modern frontend frameworks (React, Vue, etc.).

• Experience building and maintaining GraphQL APIs.

• Deep understanding of microservices architecture and distributed systems.

• Strong SQL skills with experience in MS SQL and PostgreSQL.

• Familiarity with CI/CD pipelines, testing, and version control systems.

• Excellent problem-solving, debugging, and communication skills.

Good to Have

• AWS project experience (e.g., Lambda, ECS, RDS, S3, API Gateway).

• Familiarity with Temporal Workflow or similar orchestration frameworks.

• Experience with Node.js for backend or API development.

• Experience with containerization/orchestration (Docker, Kubernetes).

• Background in performance tuning, observability, and system optimization.

• Experience mentoring or leading small engineering teams.

JOB TITLE: SENIOR ENGINEER

Responsibilities

- Involve in Design, Costing, Proposal of Projects.

- Procurement of Equipments, Parts and Fittings etc.

- Responsible for planning, scheduling, conducting and coordinating projects.

- Perform project execution, site supervision, testing and commissioning, training of systems in projects.

- Oversees preventive maintenance jobs such as troubleshooting, installation, testing, calibration, monitoring, water & air qualities checks and maintain proper records according to customer’s requirement for systems such as UPW, WWTP, DI, RO, SCRUBBER etc.

- Prepare Risk Assessment & maintain proper Workplace Health & Safety records according to WSH standards for Audit purpose. Able to handle internal and external audit, eg. ISO 45001, Bizsafe Star etc.

- With Piping, PLC Control & Electrical knowledge added advantage.

- Able to hands-on, attend site jobs and work independently as well as in a team.

- Ability to handle multiple projects at same time.

Requirement

- Degree/Diploma in Environmental Engineering/Chemical Engineering/Mechanical Engineering / Electrical & Electronics Engineering with at least 6 years Water Treatment experiences can apply.

- Good working attitude and interpersonal skills.

- Preferably with driving license. Is required to travel Island-wide in Singapore. May need to travel overseas.

- Proficient in MS Office/ Power point/ Auto CAD .

- Remuneration commensurate with qualification & experience.

- ONLY those with Water & Waste Water experiences need apply.

Job Description

Location: Singapore, CNC

Organization: Service Technologies Lab

About

Applied Materials is establishing the Service Technologies Lab in Singapore—an innovation space focused on the future of automated servicing, robotics, and cobot‑enabled service solutions.

The Senior Robotics Applications Engineer is an experienced technical contributor responsible for developing, integrating, and deploying advanced robotic and cobot applications. This role operates at the intersection of robotics software, hardware integration, and systems engineering, with a strong emphasis on translating prototypes into robust, repeatable, and maintainable robotic systems.

The position requires a hands-on engineer who can work independently in ambiguous environments, make sound technical judgments, and apply appropriate engineering rigor while maintaining execution velocity.

Key Responsibilities
 

Robotics Application Development

• Design, develop, and validate robotic and cobot applications using industrial robots, collaborative robots, and automation platforms.

• Develop application software using robotics frameworks and/or vendor provided SDKs.

• Integrate motion execution, sensing, IO, and peripheral devices to deliver working robotic applications.

• Debug and resolve complex, cross-disciplinary problems spanning robotics software, hardware integration, and system behavior.

• Systems Integration & Architecture

• Own the end-to-end technical integration of robotic systems platforms, including definition of interfaces between software, hardware, and external systems.

• Apply system level thinking and robotics fundamentals (e.g., kinematics, reference frames, calibration, safety constraints) to guide architecture and implementation decisions.

• Evaluate and integrate off-the-shelf components such as grippers, sensors, and perception systems.

• Ensure robotic systems are observable, diagnosable, and maintainable.

• Engineering Discipline & Quality

• Develop and maintain excellent technical documentation, including system architecture, interfaces, and design rationale.

• Follow best practices for source control, testing, CI/CD, and configuration management appropriate for robotics systems.

• Balance rapid prototyping with long-term maintainability and scalability.

• Apply appropriate robot safety, risk assessment, and collaborative operation constraints during development and deployment.

• Collaboration & Technical Leadership

• Work closely with Technicians, Engineers, Product, Field Services and other cross functional partners to execute hands-on development and integration activities.

• Provide technical guidance and mentorship as needed.

• Interface with internal teams and external suppliers to resolve technical challenges and influence system design choices.

Core Technical Capabilities

• The successful candidate will be able to demonstrate strength in several of the following areas, applied in real world robotic systems deployments:

• End‑to‑end development and deployment of industrial or collaborative robotic applications, such as automation, maintenance, inspection, servicing, or related real‑world use cases.

• Hands‑on ownership across multiple layers of the robotics stack, including robot programming, system integration, controls, perception, and application logic.

• Experience with vendor‑specific robot programming environments (e.g., UR PolyScope, ABB RobotStudio, TMflow, or similar), including commissioning and troubleshooting.

• Hands on experience with offline programming, simulation, or virtual commissioning tools (e.g., RoboDK, RobotStudio, Gazebo, Isaac Sim, or equivalent) used to validate robotic applications.

• Experience with manipulation, motion planning, and task orchestration frameworks (e.g., MoveIt, behavior‑tree‑based systems, or skill‑based automation approaches) in real world applications platform (not simulation only).

• Integration of vision systems, force sensing, end‑effectors, safety systems, PLCs, and equipment interfaces in robots or cobots.

• Practical experience with calibration, motion planning, collision avoidance, task sequencing, error handling, and commissioning in operational environments.

• Strong understanding of robot safety, collaborative operation constraints, reliability, and maintainability in industrial or lab settings.

Minimum Qualifications

• Bachelor’s degree in Robotics, Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related fields.

• 7+ years of hands-on experience developing, integrating, and debugging robotic or automated systems on physical hardware (not simulation only roles).

• Strong practical understanding of robot kinematics, coordinate frames, and motion execution, sufficient to diagnose and correct real-world robot behavior.

• Experience developing robotics applications using ROS or ROS2, including:

• Node based architectures, message passing, TF

• Integration of robot drivers, sensors, and end-effectors

• Hands-on experience integrating and operating robots, end-effectors and sensors, such as:

• Force/torque sensors and torque-controlled tools (e.g., torque wrenches)

• Vision systems (RGB, RGB‑D, or industrial cameras)

• Proximity, safety, or ranging sensors (e.g., LiDAR, Ultrasonic or similar subsystems)

• Strong software development experience in Python and/or C++, including debugging multi-process systems on Linux-based platforms.

• Experience integrating COTS hardware and vendor SDKs where documentation may be incomplete or inconsistent.

Preferred Qualifications

• Master’s or PhD in Robotics or related discipline.

• Proven experience commissioning and deploying industrial or collaborative robot arms (e.g., Universal Robots, KUKA, FANUC, ABB, Yaskawa, or equivalent), including:

• Tool definition (TCP), payload modeling, and mass/inertia configuration

• Frame management, calibration, and repeatable motion execution

• Depth in one or more robotics domains (e.g., motion planning, perception, human robot interaction, system integration), combined with demonstrated cross disciplinary capability.

• Experience building or extending robotic software stacks beyond vendor's "out-of-the-box" functionality.

• Familiarity with motion planning frameworks, perception libraries, or robot safety concepts relevant to collaborative robotics.

• Hands-on experience with one or more applicable robotics, machinery safety, semiconductor equipment, or cleanroom standards (e.g., ISO 10218, ISO/TS 15066, ISO 12100, ISO 13849, IEC 62061, SEMI S2/S8/S22, ISO 14644) is a plus
   

Prior responsibility for establishing or contributing to engineering practices such as:

• Source control strategies

• CI/CD pipelines for robotics software

• Automated testing, logging, or system observabilityExperience working within large, matrixed, or regulated engineering organizations where documentation, traceability, and design intent are required

Additional Job Description

• Comfortable working hands-on with physical robotic systems.

• Able to operate independently and make sound technical judgments in ambiguous or evolving environments.

• Willingness to mentor and coach others and augment the combined organization knowledge base through knowledge sharing initiatives.

• Values documentation, clarity, and engineering rigor as enablers of scale and long‑term success.

• Balances execution speed with quality, safety, and maintainability.

• Comfortable setting technical standards and influencing others without formal authority

A Senior System Tester to support quality assurance across complex systems. The role involves validating functionality, performance, and reliability in a high-availability environment, ensuring high-quality system delivery.

Key Responsibilities:

• Lead end-to-end testing activities, including test planning, analysis, design, implementation, execution, and closure
• Design and execute test cases based on functional and technical requirements
• Perform functional, integration, system, regression, and performance testing
• Validate system integrations across multiple components and platforms
• Analyze real-time data flows and ensure accuracy and consistency across the system
• Identify, log, and track defects, working closely with development teams to ensure timely resolution
• Review requirements and system design documents to ensure testability and coverage
• Support simulation and scenario-based testing where applicable
• Mentor junior testers and promote best practices in testing
• Collaborate with cross-functional teams including developers, stakeholders, and operations
• Other testing duties as assigned

Requirements:

• Bachelor’s degree in Computer Science, Engineering, or related field
• Minimum 8 years of relevant experience in system or software testing
• Strong understanding of SDLC/STLC and QA methodologies
• Basic to intermediate knowledge of database testing (e.g., SQL) and API testing concepts
• Experience testing complex or mission-critical systems
• Experience with test management and defect tracking tools (e.g., JIRA, TestRail)
• Ability to work independently with minimal supervision and proactively drive tasks
• Strong analytical, troubleshooting, and communication skills