Total 3 job vacancies by Ssck Pte. Ltd.

Purpose of the Job:

• To continuously improve Wafer processes and capabilities to attain the highest quality and productivity through work simplifications and standardization, implementation of best-known methods and controlled operating procedures

Key Job Accountabilities:

• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time. 
• To provide interim and long-term corrective actions for any discrepancies.
• Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

Scope of the Job:

• In-charge of photo resist coat, exposure, develop and curing process for PI (e.g. HD4100) and PR (Positive, Negative).  Different photo sensitive material is coated in different machines and different exposure machine types (steppers & aligners).
• Setup recipe for new devices.  Process characterization for every new device: coating thickness, exposure recipe and CD after develop. 
• Working closely with mask designer to continuously update wafer process design rules so to improve process capability and productivity.
• Perform continuous improvement activities for top defects, process simplification and throughput improvement.
• Monitor process capability in terms of input parameter control and SPC monitoring

Required Experience and Qualifications:

• Requires Degree in Engineering, Material Sciences, Chemistry or equivalent
• Minimum 2 years of relevant experience in wafer bumping or wafer fabrication
• Minimum 5 years of experience in relevant area is an added advantage

Key Job Accountabilities:

• Operate MEOL/AOI process equipment such as dielectric deposition, etching, and metallization tools
• Operate plating systems for metal deposition including copper or solder plating
• Monitor equipment performance and process parameters during production
• Perform wafer handling and ensure proper lot movement through production stages
• Identify equipment abnormalities and escalate issues
• Support preventive maintenance and equipment checks
• Maintain operational logs and production documentation

Required Experience and Qualifications:

• Associate degree in Engineering or Semiconductor Technology preferred
• Basic knowledge of electroplating and solder reflow processes used in semiconductor packaging
• Experience operating plating equipment or thermal processing systems preferred
• Familiarity with plating chemistry control and process monitoring is a plus
• Understanding of wafer bumping or solder bump formation processes preferred
• Ability to follow chemical handling procedures and cleanroom safety protocols
• Strong troubleshooting and problem-solving skills in manufacturing environments
• Willingness to work rotating shifts in a semiconductor fabrication or packaging facility

Purpose of the Job

• To perform technical maintenance and optimization of advanced packaging equipment (Bump, RDL, CoW, MEOL) to ensure high-precision processing, maximize tool uptime, and support stable mass production.

Key Job Accountabilities:

• Execute scheduled PM and emergency repairs (BM) on diverse toolsets including PVD (Sputter), ECD (Plating), Lithography (Stepper), and TCB/Hybrid Bonders.
• Calibrate high-precision sensors and actuators to maintain critical process parameters (e.g., bonding force, temperature uniformity, and alignment accuracy).
• Diagnose and resolve complex mechanical and electrical failures using schematics, diagnostic software, and measurement tools.
• Track the consumption of critical components and suggest improvements for part lifetime extension.
• Maintain detailed logs of equipment history, repair procedures, and safety checklists.

Required Experience and Qualifications

• Bachelor’s degree in Electrical, Electronic, Mechanical Engineering, or a related field.
• Understanding of the Wafer Level Packaging (WLP) process flow and equipment hardware architecture.
• Ability to read/interpret mechanical drawings and electrical schematics. Proficiency in using multimeters, oscilloscopes, and precision gauges.
• Comfort working in a cleanroom environment and flexibility for shift rotations.