Total 21 technology development job vacancies in Bengaluru

• Development of C++/SystemC models for complex ASIC IPs, SOCs and Flash Memories.
• Create System Level Tests and/or Standalone Unit Tests and verify the models.
• Lead and Guide team in the project activities.
• Keen on schedule and quality of the deliverables.
• Timely support to the stakeholders enabling software bring-up.

We are looking for technically sound and highly skilled Analog/High Speed DDR IO Layout designer with 8-12 years of experience. The ideal candidate should have a strong background in analog/IO design principles, hands-on experience with layout tools, and a passion for solving challenging technical problems.

Key Responsibilities:

• Develop and optimize MSIP IC layouts in TSMC 3nm, ensuring high performance and manufacturability.
• Collaborate with design engineers to understand design requirements and translate them into precise layouts.
• Strong experience in debugging DRC, ERC, LVS, EMIR and PERC issues independently.
• Work closely with the physical design team to integrate custom blocks into the overall chip design.
• Identify and resolve layout-related issues, providing creative solutions to meet design specifications.
• Conduct design reviews and provide technical feedback to improve layout practices and methodologies.
• Stay up-to-date with industry trends, tools, and technologies to continuously enhance layout processes
• Any prior AI knowledge/experience which can improve Layout development effort and QoR is a big plus

Qualifications

• 8-12 years of experience in Analog/High Speed DDR IO IC layout design.
• Proficiency in layout tools such as Cadence, Synopsys, or Mentor Graphics.
• Hands-on experience with custom layout design for Analog and IO circuits is required, including expertise in Bandgap references, LDOs, Clocking circuits, GPIOs, High speed DDR IOs.
• Familiarity with custom digital layout (i.e. high speed logic paths).
• Knowledge of signal integrity issues (i.e. clock/data routes, differential routing, shielding).
• Strong understanding of analog/IO design principles, including circuit performance and parasitic effects.
• Aware of layout techniques to mitigate ESD, latch-up issues.
• Holds advanced knowledge of CMOS and FinFET technologies and their impact on design and performance issues in deep sub-micron process nodes, specifically 5nm and below.
• Experience with layout concepts that incorporate reliability considerations, including techniques for managing electromigration (EM), IR drop, and self-heating.
• Experience with layout optimization for power, performance, and area (PPA) metrics.
• Excellent problem-solving skills and attention to detail.
• Effective communication and teamwork abilities.

Preferred Skills:

• Knowledge of scripting languages (e.g., Skill,TCL and SVRF) for automation tasks.

• Work as one of  the senior team members or as lead of analog IPs and deliver analog blocks on-time with state-of-the-art architecture to meet the overall product requirements
• Work closely with team in designing and delivering analog blocks
• Design analog modules from scratch
• Handling assigned tasks independently
• Pro-actively get design issues/problems resolved
• Contribute to or propose innovative design solutions and design methodologies
• Work closely with the layout engineers on providing requirements and guidelines

The candidate to have a passion for complex processor architecture, digital design, and verification in general. The candidate should be team player who has excellent communication skills and experience collaborating with other engineers located in different sites/time zones. The candidate should have strong analytical and problem-solving skills and are willing to learn and ready to take on problems.

KEY RESPONSIBILITIES:
 

• - EMIR closure at Tile /Partition/Subsytem/SOC level on a particular node
• Ownership of EMIR Flow & Signoff
• Drive EMIR closure for design blocks and full-chip integration.
• Align EMIR analysis phases with PD milestones (INIT, PREFINAL, FINAL).
• Ensure compliance with signoff limits provided by SIPI team for given technology node
• Ability to analyze EMIR violations and propose implementation choices.
• Familiarity with DFx and scan architecture for EMIR considerations.
• Technical Leadership

• Define EMIR signoff strategy, including IR drop and electromigration analysis.
• Review floorplan, clocking, and bus structures for IR hotspots.
• Coordinate bump allocation and power rail alignment with integration teams.
• Collaboration & Coordination
  • Work closely with block owners, PD team, and integration team to execute EMIR runs.
  • Conduct EMIR run reviews and debug sessions with stakeholders.
  • Methodology & Flow Development
    • Maintain and improve EMIR flow

    • Engage with SIPI team for current profile analysis and CPA/CPM models

PREFERRED EXPERIENCE:
 

• Minimum 13+  years of relevant work experience.
• Expertise in Synthesis , ICC2/ FC (Fusion Compiler) Physical Design flows/methodologies or equivalent tools.
• Expertise in Signoff tools like Ansys Redhawk/RHSC on EMIR, PT-PX for Power signoff and Primetime for Timing
• Should have worked as a go to person or technical lead for at least few full chip projects.
• Strong technical leadership and ability to mentor/guide/coach design engineers to achieve and deliver project goals.
• Strong inter-personal skills and ability to collaborate with teams spread across multiple geos.
• Should have good scripting experience in Shell, Python, Perl, TCL, UNIX along with decode/debug old existing scripts.
• Must be using AI technologies in day to day problem solving

We are looking for technically sound and highly skilled Analog/High Speed DDR IO Layout designer with 8-12 years of experience. The ideal candidate should have a strong background in analog/IO design principles, hands-on experience with layout tools, and a passion for solving challenging technical problems.

Key Responsibilities:

• Develop and optimize MSIP IC layouts in TSMC 3nm, ensuring high performance and manufacturability.
• Collaborate with design engineers to understand design requirements and translate them into precise layouts.
• Strong experience in debugging DRC, ERC, LVS, EMIR and PERC issues independently.
• Work closely with the physical design team to integrate custom blocks into the overall chip design.
• Identify and resolve layout-related issues, providing creative solutions to meet design specifications.
• Conduct design reviews and provide technical feedback to improve layout practices and methodologies.
• Stay up-to-date with industry trends, tools, and technologies to continuously enhance layout processes
• Any prior AI knowledge/experience which can improve Layout development effort and QoR is a big plus

Qualifications

• 8-12 years of experience in Analog/High Speed DDR IO IC layout design.
• Proficiency in layout tools such as Cadence, Synopsys, or Mentor Graphics.
• Hands-on experience with custom layout design for Analog and IO circuits is required, including expertise in Bandgap references, LDOs, Clocking circuits, GPIOs, High speed DDR IOs.
• Familiarity with custom digital layout (i.e. high speed logic paths).
• Knowledge of signal integrity issues (i.e. clock/data routes, differential routing, shielding).
• Strong understanding of analog/IO design principles, including circuit performance and parasitic effects.
• Aware of layout techniques to mitigate ESD, latch-up issues.
• Holds advanced knowledge of CMOS and FinFET technologies and their impact on design and performance issues in deep sub-micron process nodes, specifically 5nm and below.
• Experience with layout concepts that incorporate reliability considerations, including techniques for managing electromigration (EM), IR drop, and self-heating.
• Experience with layout optimization for power, performance, and area (PPA) metrics.
• Excellent problem-solving skills and attention to detail.
• Effective communication and teamwork abilities.

Preferred Skills:

• Knowledge of scripting languages (e.g., Skill,TCL and SVRF) for automation tasks.

Key Responsibilities

• Lead, mentor and deliver technical contributions for designing advanced high bandwidth ASIC packages.
• Conduct advanced power and signal integrity analysis for board and MCM packages.
• Provide expert design guidance for power distribution networks, collaborating with digital design, package, and board teams.
• Recommend and implement improvements to power and signal nets, enhancing overall system reliability.
• Perform circuit simulations using Hspice netlists and full-chip models.
• Develop and validate behavioral models (IBIS) for I/Os, supporting high-speed USB3/USB2 interfaces in integrated mobile platforms.
• Utilize industry-standard tools (Cadence PowerSI, 3DEFM, T2B, PowerDC, Agilent ADS, Nimbic, AllegroSIP) for analysis and design.

Required Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics, or related field.
• Familiarity and expertise with at-least one of the high speed interfaces such PCIe Gen6/7, DDR5/LPDDR5, ONFI, USB3.2/USB4 etc.
• Minimum 8–12 years of relevant experience in SI/PI analysis, board/package design, and use of modern simulation tools (Hspice, ADS, Cadence, HFSS, Siemens Advanced Solvers).
• Expertise in Power delivery network concepts and signal integrity analysis.
• Technical proficiency in S-parameter extraction, 3D modeling, system-level SI simulation, and IBIS model development.
• Programming skills in Perl, TCL, Shell, and C.
• Hands-on experience with industry-standard EDA tools (Cadence PowerSI, Agilent ADS, Allegro SIP, Ansys SIwave, Siemens Advanced Solver).
• Familiarity with CMOS process technologies and specifications of various I/Os.
• Comfortable working in Linux environments.
• Relevant certifications in SI/PI analysis, simulation tools, or hardware design (preferred).