Total 7 job vacancies by Ssck Pte. Ltd.

Purpose of the Job:

• To continuously improve Wafer processes and capabilities to attain the highest quality and productivity through work simplifications and standardization, implementation of best-known methods and controlled operating procedures

Key Job Accountabilities:

• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time. 
• To provide interim and long-term corrective actions for any discrepancies.
• Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

Scope of the Job:

• In-charge of photo resist coat, exposure, develop and curing process for PI (e.g. HD4100) and PR (Positive, Negative).  Different photo sensitive material is coated in different machines and different exposure machine types (steppers & aligners).
• Setup recipe for new devices.  Process characterization for every new device: coating thickness, exposure recipe and CD after develop. 
• Working closely with mask designer to continuously update wafer process design rules so to improve process capability and productivity.
• Perform continuous improvement activities for top defects, process simplification and throughput improvement.
• Monitor process capability in terms of input parameter control and SPC monitoring

Required Experience and Qualifications:

• Requires Degree in Engineering, Material Sciences, Chemistry or equivalent
• Minimum 2 years of relevant experience in wafer bumping or wafer fabrication
• Minimum 5 years of experience in relevant area is an added advantage

Key Job Accountabilities:

• Operate MEOL/AOI process equipment such as dielectric deposition, etching, and metallization tools
• Operate plating systems for metal deposition including copper or solder plating
• Monitor equipment performance and process parameters during production
• Perform wafer handling and ensure proper lot movement through production stages
• Identify equipment abnormalities and escalate issues
• Support preventive maintenance and equipment checks
• Maintain operational logs and production documentation

Required Experience and Qualifications:

• Associate degree in Engineering or Semiconductor Technology preferred
• Basic knowledge of electroplating and solder reflow processes used in semiconductor packaging
• Experience operating plating equipment or thermal processing systems preferred
• Familiarity with plating chemistry control and process monitoring is a plus
• Understanding of wafer bumping or solder bump formation processes preferred
• Ability to follow chemical handling procedures and cleanroom safety protocols
• Strong troubleshooting and problem-solving skills in manufacturing environments
• Willingness to work rotating shifts in a semiconductor fabrication or packaging facility

Purpose of the Job

• To perform technical maintenance and optimization of advanced packaging equipment (Bump, RDL, CoW, MEOL) to ensure high-precision processing, maximize tool uptime, and support stable mass production.

Key Job Accountabilities:

• Execute scheduled PM and emergency repairs (BM) on diverse toolsets including PVD (Sputter), ECD (Plating), Lithography (Stepper), and TCB/Hybrid Bonders.
• Calibrate high-precision sensors and actuators to maintain critical process parameters (e.g., bonding force, temperature uniformity, and alignment accuracy).
• Diagnose and resolve complex mechanical and electrical failures using schematics, diagnostic software, and measurement tools.
• Track the consumption of critical components and suggest improvements for part lifetime extension.
• Maintain detailed logs of equipment history, repair procedures, and safety checklists.

Required Experience and Qualifications

• Bachelor’s degree in Electrical, Electronic, Mechanical Engineering, or a related field.
• Understanding of the Wafer Level Packaging (WLP) process flow and equipment hardware architecture.
• Ability to read/interpret mechanical drawings and electrical schematics. Proficiency in using multimeters, oscilloscopes, and precision gauges.
• Comfort working in a cleanroom environment and flexibility for shift rotations.

Purpose of the Job

• To perform technical maintenance and optimization of advanced packaging equipment (Bump, RDL, CoW, MEOL) to ensure high-precision processing, maximize tool uptime, and support stable mass production.

Key Job Accountabilities:

• Execute scheduled PM and emergency repairs (BM) on diverse toolsets including PVD (Sputter), ECD (Plating), Lithography (Stepper), and TCB/Hybrid Bonders.
• Calibrate high-precision sensors and actuators to maintain critical process parameters (e.g., bonding force, temperature uniformity, and alignment accuracy).
• Diagnose and resolve complex mechanical and electrical failures using schematics, diagnostic software, and measurement tools.
• Track the consumption of critical components and suggest improvements for part lifetime extension.
• Maintain detailed logs of equipment history, repair procedures, and safety checklists.

Required Experience and Qualifications

• Bachelor’s degree in Electrical, Electronic, Mechanical Engineering, or a related field.
• Understanding of the Wafer Level Packaging (WLP) process flow and equipment hardware architecture.
• Ability to read/interpret mechanical drawings and electrical schematics. Proficiency in using multimeters, oscilloscopes, and precision gauges.
• Comfort working in a cleanroom environment and flexibility for shift rotations.

Purpose of the Job

• To lead the equipment engineering team in managing the entire infrastructure for Bump, RDL, CoW, and MEOL, driving long-term operational excellence and aligning equipment capabilities with next-generation packaging roadmaps.

Key Job Accountabilities:

• Oversee the structural integrity of Under Bump Metallization (UBM) and Sputtering/PVD processes to ensure electrical connectivity and mechanical adhesion.
• Strategic planning for equipment upgrades and modifications to meet the precision requirements for 2.5D/3D and Chiplet packaging.
• Lead technical negotiations and manage relationships with global equipment suppliers (e.g., AMAT, ASML, TEL, Besi, EVG) for new capacity expansion.
• Accountable for departmental performance metrics including MTBF (Mean Time Between Failures), MTTR (Mean Time To Repair), and Maintenance Cost.
• Mentor engineers to build "full-stack" expertise across multiple process stages and manage performance evaluations.

Required Experience and Qualifications:

• Bachelor’s degree in Electrical, Electronic, Mechanical Engineering, or a related field
• 10+ years in Semiconductor Equipment Engineering, with specialized experience in Advanced Packaging (WLP, Flip-Chip, or SiP).
• Deep knowledge of high-precision bonding (CoW), thin-wafer handling, and RDL process-tool interactions.
• Proven ability to manage CapEx projects from tool selection to Final Acceptance Test (FAT).
• Strong leadership, negotiation, and cross-functional communication skills in a global corporate environment.

Purpose of the Job

• To lead the development, optimization, and stabilization of plating and etching processes for advanced semiconductor packaging, contributing to mass production readiness, yield improvement, and customer-specific technical solutions.

Key Job Accountabilities:

• Develop and optimize electroplating, seed etching, and PR stripping processes
• Design and improve processes for TSV, RDL, Cu pillar, and micro bump formation
• Evaluate and introduce new materials and equipment for plating/etching process integration
• Conduct pre-production process validation and yield stabilization
• Perform DOE planning and analyze experimental data using statistical tools (e.g., SPC, Minitab, JMP)
• Develop customized processes and provide technical support for customer programs
• Set up equipment and optimize operating conditions in coordination with vendors
• Troubleshoot quality issues across plating and etching processes
• Support development of advanced packaging technologies including 2.5D, fan-out, and SiP

Required Experience and Qualifications:

• Bachelor’s degree or higher in Engineering or Science (e.g., Materials Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials
• Minimum 3 years of hands-on experience in plating, etching, or stripping processes in semiconductor manufacturing.
• Fundamental understanding of advanced semiconductor fabrication and integration processes
• Strong skills in experiment design, statistical data analysis (e.g., SPC, Minitab, JMP), and technical reporting
• Proficiency in preparing technical documentation and delivering presentations
• Ability to communicate technical content clearly in English (written and verbal)
• Basic knowledge of semiconductor process equipment and materials
• Experience in key back-end processes such as TSV, RDL, and micro bump
• Knowledge of advanced packaging technologies including 2.5D, fan-out, and flip-chip
• Familiarity with related processes such as photo, chip attach, and underfill
• Proven experience in joint development projects with global customers
• Hands-on collaboration with material or equipment suppliers for co-evaluation or integration
• Expertise in process reliability testing (e.g., thermal cycling, HAST)
• Experience in process automation or smart fab environments
• Working proficiency in tools such as AutoCAD or ANSYS
• In-depth understanding of etch/strip conditions for back-end photoresist materials

Job description

• Design and develop photolithography processes and material
• Photolithography equipment installation and process optimization
• Proposal of customized process solutions and based on customer product requirements
• Identify root causes of process issues and implement corrective actions to improve performance, yield and reliability
• Write detailed process documentation, standard operating procedures (SOPs), and development reports
• Implement DOE (Design of Experiments), SPC (Statistical Process Control), and other methodologies to improve process robustness and reduce variability

Required Experience and expertise

• Bachelor’s degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials

• Minimum 3 years hand-on experience in process development for photolithography
• In-depth knowledge and on hand experience of lithographic techniques, photoresist chemistry, and exposure systems
• Proficiency in data analysis tools (e.g., JMP, MATLAB, Excel)
• Strong analytical and problem-solving skills
• Excellent communication and teamwork abilities
• Strong ability to drive actions and solutions through cross-functional teams.

Preferred experience

• Experience in process development for 2.5D/3D, TSV CoWoS and fan-out packaging technologies
• Hands-on experience operation photolithography equipment
• Proven capability in corss-process integration and optimization
• Familiarity with reliability evaluation and qualification criteria
• Proficiency in writing technical documents and communicating with global customers in English