Total 11 job vacancies by Aac Technologies Pte. Ltd.

Responsibilities

Financial Stewardship

• Lead monthly P&L forecasts, annual budgeting, and risk management across markets.
• Ensure timely delivery of financial outputs (weekly sales monitoring, costing analysis, cash flow forecasts) within 1.5 days post-monthly/weekly closing.

Business Partnership

• Collaborate with country managers to provide insights across pricing, trade spend, and channel profitability.
• Precisely identify business root causes from financial data fluctuations and translate needs into strategic actions.

Operational Excellence

• Drive system improvements (e.g., SAP optimization) and implement automation to standardize reporting tools.

Strategic Leadership

• Annually lead 2+ strategic projects from analysis to execution.
• Propose and implement 2+ actionable financial improvement plans to enhance business outcomes.
  

Requirements

• 10 years in FP&A or financial analysis, with at least 2 years in core financial modeling.
• Candidates with Big 4 audit firm background are preferred.
• Experience in consumer goods (FMCG) or manufacturing industry is an advantage.
• Regional exposure in Southeast Asia is a plus.
• Advanced Excel, SAP, financial modeling, and root-cause analysis.
• Knowledge of PowerBI or other data visualization tools is advantageous.
• Proficiency in Mandarin is highly advantageous to support coverage of Greater China markets.
• Independent systematic thinker and collaborative team player.
• Agile in navigating organizational changes.
• CPA, ACCA, or CIMA qualification is preferred.

Key Responsibilities

• Own and deliver revenue targets across assigned territories or key accounts within the semiconductor ecosystem
• Identify, develop, and close new business opportunities with semiconductor OEMs, fabs, and subsystem providers
• Manage and grow strategic accounts by building deep relationships with engineering, procurement, and executive stakeholders
• Lead complex, consultative sales cycles involving precision components and high-spec equipment solutions
• Collaborate with engineering and operations teams to align customer requirements with product capabilities
• Drive RFQs, proposals, pricing strategies, and contract negotiations
• Monitor market trends, competitor activity, and customer roadmaps to identify growth opportunities
• Represent the company at industry events, trade shows, and customer engagements
• Maintain accurate sales forecasts and pipeline visibility in CRM systems

Requirements

• Bachelor’s degree in Engineering, Business, or related field (MBA is a plus)
• 10+ years of sales experience in semiconductor equipment, precision engineering, or related high-tech manufacturing industries
• Knowledge and Exposure to semiconductor front-end or back-end equipment
• Familiarity with precision components such as CNC-machined parts, vacuum systems, motion control, or assemblies
• Proficiency in Mandarin is a must as he or she will be required to communicate & prepare reports to Chinese Stakeholders
• Proven track record of achieving or exceeding revenue targets in an individual contributor role
• Strong network within semiconductor OEMs, fabs, or supply chain (e.g., precision machining, motion systems, vacuum components)
• Experience selling complex, engineered products with long sales cycles
• Ability to engage technical and non-technical stakeholders effectively
• Strong commercial acumen and negotiation skills
• Willingness to travel as required (regional/global)

Roles & Responsibilities

• Work with MEMS Research & Development, ASIC design team & Packaging team to perform electrical failure analysis (EFA) and physical failure analysis (PFA) in root cause finding for product development & yield improvement.
• Perform IV/CV measurements on MEMS and ASIC components.
• To work closely with FA vendor to on product qualification, reliability monitoring failure, specific customer request, customer rejects and fab issue.
• Participate in cross-functional teams over different sites to provide analytical support.
• Develop test programs to support product characterization and testing and failure analysis.

Requirements

• Bachelor's Degree in Engineering in Electrical/Electronic, Physics or equivalent.
• Good understanding of FA techniques (such as FIB-SEM, EDX, SIMS, Obirch, XRF, FTIR, etc.).
• Able to perform IV/CV measurements with curve tracer.
• Knowledge in Excel VBA, Python, C++/C# programming will be an advantage.
• Strong troubleshooting and analytical skills.
• Possess strong written and verbal communication skills.

Responsibilities

1. Industry Research & Analysis

   • Conduct comprehensive research on the global technology industry, covering sub-sectors including AI, semiconductors, SaaS, cloud computing, and emerging tech trends
   • Identify market opportunities, risks, and competitive dynamics through detailed analysis

2. Company Performance Evaluation

   • Track and evaluate the performance of listed technology companies
   • Analyze business models, financial fundamentals, and growth prospects
   • Produce high-quality research reports, market notes, and investment insights

3. Market Monitoring & Expert Engagement

   • Leverage industry resources and engage with experts to gather insights
   • Monitor macroeconomic, regulatory, and policy developments impacting the technology sector across Greater China, Singapore, and global markets

4. Decision Support

   • Support investment and strategic decision-making through data-driven analysis, industry forecasts, and actionable recommendations
   • Present findings to internal teams and stakeholders

5. Collaboration & Communication

   • Collaborate with cross-functional teams to deliver timely industry updates
   • Participate in research meetings and present analysis in clear, concise formats

6. Database & Framework Management

   • Maintain and update industry databases, financial models, and research frameworks
   • Ensure accuracy and relevance of analytical tools and data sources

Requirements

• Bachelor's degree or above in Finance, Economics, Computer Science, Information Technology, or related field with Master's degree preferred
• 3–5 years of experience in a Tier-1 Securities Firm (Equity Research) or Leading Investment House (PE/VC/Hedge Fund)
• Proficiency in Mandarin is a must as he or she will be required to communicate & prepare reports to Chinese Stakeholders
• Strong analytical and critical thinking capabilities
• Ability to interpret complex industry data, financial statements, and market trends
• Proven experience in technology industry research, drafting research reports, and supporting investment/strategic decisions
• Experience covering specific tech sub-sectors (e.g., AI, semiconductor, cloud computing) is a strong plus
• Self-motivated, detail-oriented, and able to work independently
• Able to perform under pressure and meet tight deadlines
• Excellent communication and presentation skills for both technical and non-technical audiences

Job Responsibilities:

• Operate and set up CNC machines (milling / turning), EDM (sinker), Wire Cut (AGIE / FANUC), or Surface Grinding machines.

• Read and interpret engineering drawings, specifications, and GD&T requirements.

• Perform workpiece setup, alignment, tooling installation, and machine parameter setting.

• Carry out in-process and final inspection using precision measuring tools.

• Ensure parts meet dimensional tolerances, surface finish, and quality standards.

• Troubleshoot machining issues and optimize machining parameters/process.

• Maintain production records and follow safety & 5S practices.
  

Job Requirements:

• Diploma / NITEC / Higher NITEC in Precision Engineering or related field.

• 2–5 years of machining experience (CNC, EDM, Wire Cut, or Grinding), preferably in optics, semiconductor, electronics, or precision components industries.

• Hands-on experience in production optimization, yield improvement, and adherence to quality systems.

• Ability to read and interpret technical drawings with good understanding of tolerances and GD&T.

• Basic knowledge of CNC or EDM programming is an added advantage.

• Responsible, detail-oriented, able to work independently, and willing to perform shift work.
  

Preferred Skills:

• Experience in semiconductor, aerospace, medical, or tooling industries.

• Experience in any of the following:
  a) CNC 3-axis / 4-axis / 5-axis machining
  b) Wire EDM (AGIE / FANUC) & Super Drill
  c) EDM (sinker) programming
  d) Surface grinding (tight tolerance & finishing)

• Ability to achieve high precision (±0.005mm or better).

Key Responsibilities

• Perform dimensional inspection using Mitutoyo CMM machines
• Conduct visual and optical inspections to identify surface defects (e.g. scratches, burrs, imperfections)
• Interpret engineering drawings, specifications, and GD&T requirements
• Record, analyse, and prepare accurate inspection reports
• Use statistical tools (e.g. Minitab) to support quality control and process improvement
• Identify non-conforming parts and coordinate with production/engineering teams on corrective actions
• Maintain inspection equipment, including calibration and routine upkeep
• Comply with quality standards, safety procedures, and 5S practices

Requirements

• NITEC / Higher NITEC / Diploma in Mechanical or related field
• 2–5 years of CMM / QA / optical inspection experience
• Proficient in GD&T and technical drawing interpretation
• Experience with Mitutoyo CMM and measurement tools
• Familiar with visual inspection and defect detection
• Knowledge of Minitab or similar tools (preferred)

Job Description :

• Support engineering teams in development & qualification of new technology solutions in a Testing Lab environment
• Support engineering teams in operating & troubleshooting of engineering equipment & test hardware in R&D Testing Lab. (Audio Precision, Function generator, Multimeter, Oscilloscope, Microscope, soldering station, Probe station).
• Responsible for both ASIC Chips in engineering equipment.
• Prepare and update report if there is any finding during testing.

Requirement:

• Min. Degree in Electronics Engineering or equivalent
• At least 3 years of relevant technical hands-on experience in test equipment, preferably from semiconductor industry.
• Self-discipline with a positive, pro-active attitude & abundance curiosity to learn and expand personal knowledge and skills.

Job Responsibilities:

• Lead process integration across the full product lifecycle, from concept, prototyping to mass production for MEMS microphone products.

• Translate device designs into robust and scalable manufacturing processes with strong focus on DFM, cost, and reliability.

• Collaborate with foundry partners to develop, qualify, and optimize key MEMS processes (e.g. DRIE, deposition, lithography, release).

• Drive yield improvement and resolve process-related issues through failure analysis (FA) and root cause analysis (RCA).

• Act as the technical interface between foundries and internal teams (design, packaging, reliability, test) to ensure smooth development.

• Prepare and maintain process documentation including process flows, FMEA, control plans, and qualification reports.

• Support R&D activities, including experimentation, new materials/process development, and technology roadmap initiatives.

• Lead and support NPI activities, including Lab-to-Fab and Fab-to-Fab transfers, ensuring process readiness and yield performance.

Job Requirements:

• Bachelor’s or Master’s degree in Electrical/Electronic Engineering, Microelectronics, Materials Science, Mechanical Engineering, or a related field.

• Minimum 1 year of experience in MEMS/CMOS processing, semiconductor fabrication, or microfabrication R&D.

• Knowledge of MEMS devices (e.g., microphones, sensors) and key fabrication processes such as DRIE, LPCVD/PECVD, lithography, and release techniques.

• Hands-on experience with cleanroom operations, metrology, and failure analysis tools (e.g., SEM, AFM), along with DOE and data analysis tools (e.g., JMP, Python).

• Strong ability to work in a fast-paced, cross-functional R&D environment.

Responsibilities:

• The Mixed-Signal IC (MEMS Interface) Design Engineer will be responsible for the design and development of capacitive and/or piezoelectric MEMS interface ASICs, including the required amplifiers, ADCs, filters and control logic, with characteristic high impedance inputs, ultra low power, low noise circuits etc .
• The responsibility of the Mixed-Signal IC Design Engineer includes scheduling, design, simulation and layout of mixed-signal circuit blocks, including pre- and post-silicon verification.
• It is also expected that you will conduct periodic design reviews, including with application engineers.
• It is also expected that you will support test development and product development teams in bringing projects to production.

Requirements:

• PhD/Master’s Degree in Electronics/Electrical Engineering.
• Minimum 6 years’ experience in Analog or Mixed-signal IC design.
• Very good knowledge of CMOS processes.
• Highly proficient in analog and mixed-signal IC design EDA tools.
• Experienced in analog and mixed-signal circuit designs, such as regulators, DC-DC converters, low-power, low-noise biasing circuits and amplifiers, sigma-delta modulation and ADCs, etc
• Experience in design of high resolution, low power sigma-delta modulation preferred.
• Experience in design of ultra low power ADC preferred.
• Skilled in laboratory testing of IC prototypes.
• Knowledge of Linux operating system required.
• Experience in MEMS interface ASIC design advantageous.

Responsibilities

Financial Stewardship

• Lead monthly P&L forecasts, annual budgeting, and risk management across markets.
• Ensure timely delivery of financial outputs (weekly sales monitoring, costing analysis, cash flow forecasts) within 1.5 days post-monthly/weekly closing.

Business Partnership

• Collaborate with country managers to provide insights across pricing, trade spend, and channel profitability.
• Precisely identify business root causes from financial data fluctuations and translate needs into strategic actions.

Operational Excellence

• Drive system improvements (e.g., SAP optimization) and implement automation to standardize reporting tools.

Strategic Leadership

• Annually lead 2+ strategic projects from analysis to execution.
• Propose and implement 2+ actionable financial improvement plans to enhance business outcomes.
  

Requirements

• 6+ years in FP&A or financial analysis, with at least 2 years in core financial modeling.
• Candidates with Big 4 audit firm background are preferred.
• Experience in consumer goods (FMCG) or manufacturing industry is an advantage.
• Regional exposure in Southeast Asia is a plus.
• Advanced Excel, SAP, financial modeling, and root-cause analysis.
• Knowledge of PowerBI or other data visualization tools is advantageous.
• Proficiency in Mandarin is highly advantageous to support coverage of Greater China markets.
• Independent systematic thinker and collaborative team player.
• Agile in navigating organizational changes.
• CPA, ACCA, or CIMA qualification is preferred.

Key Responsibilities:

• Develop and optimize 3+2 axis CNC programs using Siemens NX (UG) to improve machining efficiency and accuracy.
• Lead end-to-end machining process planning for high-precision components (Aluminum, Stainless Steel, Tool Steel, etc.).
• Perform electrode design and splitting, and coordinate EDM processes.
• Prepare and maintain complete process documentation (Process Sheets, Tool Lists, Setup Sheets).
• Define tooling strategies, manage tool life, and drive cost optimization initiatives.
• Design and improve machining fixtures to enhance stability, repeatability, and productivity.
• Support machine setup, conduct trial runs, and troubleshoot machining issues (dimension, deformation, surface finish).
• Drive continuous improvement initiatives to enhance productivity, OEE, and yield.
• Collaborate closely with Production, Quality Assurance, and Engineering teams to meet semiconductor manufacturing standards.

Requirements:

• Diploma/Degree in Mechanical, Precision, Manufacturing Engineering, or related field, with at least 5 years of CNC programming experience in precision machining.
• Proficient in Siemens NX (UG) 3+2 axis programming; 5-axis experience is an advantage.
• Strong knowledge of precision machining, tolerance control, cutting tools, HSM, and machining parameters.
• Experience in fixture design (datum and clamping) and machining of Aluminum, Stainless Steel, and Tool Steel.
• Strong analytical, troubleshooting, and problem-solving skills; NPI experience is a plus.