Total 261 technology development job vacancies in Engineering category in The Philippines

Experience in ASIC verification, Expertise in System Verilog and UVM, Verilog.

·        Experience in IP level verification, testbench architecture development, Testbench component developments. Expertise in coverage closer, code coverage, functional coverage Experience in Gate level simulations.

·        The candidate should be able to define verification plan, create testbenches, testcases,gate level simulations etc independently.

·        Knowledge on serial protocols UFS, PCIe, USB, MIPI or any other serial protocol. Knowledge on memory protocols - AXI, PCIE, UFS and Flash etc.

·        Knowledge on scripting languages like Python, Perl etc.

·        Keen on continuous process improvement to improve Quality and time

The SoC Development team is seeking highly motivated engineers to join a team of experienced engineers working on the development of controller SoCs.

As a Verification Engineer in SoC Development Team, you will develop test-plans and tests for use in testing complex hardware in System On Chip (SoC) ASIC’s.  Your work will enable industry-leading data storage control SoC’s that get deployed into high volume consumer and enterprise products.

The growing diversity of data creates an exponential number of new possibilities – for the world, our company and you. You’ll be part of a team driving the innovations necessary to outpace new demands and challenges everywhere data lives, from sensors to mobile devices to the cloud. We’ve only started to scratch the surface of what data can do. You can help unlock its full potential.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Responsible for driving verification strategy, creating Test Plans, and developing Test Benches for SoC.
• Collaborate with architects, designers,  pre-and post-silicon verification teams to develop test plans
• Responsible to develop C-based tests on SoC. Processor knowledge is a plus.
• Define and meet all functional coverage goals
• Run and debug gate-level simulations 
• Understanding and generation of functional patterns for ATE

SoC Verification Engineer

The SoC Development team at Sandisk is seeking highly motivated SoC Verification Engineers to join our talented team, working on cutting-edge controller development for high-performance SoCs used in industry-leading products.

Role & Responsibilities:

As a SoC Verification Engineer, you will play a key role in ensuring the quality and reliability of our SoC designs. You will be responsible for:

• Developing verification test plans based on design specifications.
• Creating and executing test cases across multiple platforms, including RTL simulation, FPGA prototyping, and Palladium emulation.
• Verification test structures (DFx Verification)
• Performing Gate-Level Simulations (GLS) and debugging complex SoC designs.
• Collaborating with design, architecture, and firmware teams to define verification strategies and drive coverage-driven verification methodologies.
• Contributing to the development of advanced verification environments, including UVM, PSS testbenches.
• Analyzing functional coverage and simulation results to enhance verification efficiency and effectiveness.
• Genrating Fucntional patterns required for Wafer Sorting. 

Why Join Us?

At Sandisk, you’ll be part of a team of highly skilled engineers solving complex verification challenges and driving innovations in data storage solutions. Your work will directly impact the performance and reliability of high-volume new age data solutions, consumer and enterprise products.

Together, we’ll push the boundaries of technology, unlock the full potential of data, and shape the future of storage solutions.

The SoC Development team is seeking highly motivated engineers to join a team of experienced engineers working on the development of advanced controller SoCs.

As a Technologist Verification Engineer in the SoC Development Team, you will be responsible for planning, architecting, and executing verification strategies to validate complex hardware in System-on-Chip (SoC) ASICs. Your work will enable industry-leading data storage control SoCs deployed into high-volume consumer and enterprise products.

The growing diversity of data creates an exponential number of new possibilities – for the world, our company, and you. You’ll be part of a team driving the innovations necessary to outpace new demands and challenges everywhere data lives, from sensors to mobile devices to the cloud. We’ve only started to scratch the surface of what data can do. You can help unlock its full potential.

Essential Duties and Responsibilities

• Ownership: End-to-end ownership of one or more subsystems or SoC verification flows, including planning, execution, and closure
• Mentorship: Experience mentoring junior and mid-level engineers, reviewing their test plans, code, and coverage.
• Define verification strategy, create detailed test plans, and develop robust test benches for SoC verification.
• Collaborate with architects, RTL designers, and pre- and post-silicon verification teams to ensure end-to-end verification coverage.
• Develop and run UVM/SystemVerilog-based verification environments.
• Write, run, and debug C-based tests on SoCs; processor and embedded software knowledge is a must.
• Define and achieve functional and code coverage goals; track and close coverage gaps.
• Run, debug, and sign off gate-level simulations with SDF annotation.
• Develop and validate functional patterns for ATE (Automatic Test Equipment).
• Debug complex issues across multiple domains (digital logic, firmware, timing, DFT).
• Participate in IP and subsystem-level integration verification and ensure smooth transition to SoC-level verification.
• Support low-power verification using UPF and ensure power intent validation.
• Automate regression setup, execution, and result analysis using scripting languages (Python, Perl, TCL, etc.).
• Contribute to verification methodology improvements, reusable environments, and verification infrastructure scalability.
• Work closely with validation and bring-up teams to ensure test portability from pre-silicon to post-silicon.

As a SoC Validation/Verification Engineer, you will play a key role in ensuring the quality and reliability of our SoC designs. You will be responsible for:

• Understanding complex ASIC specifications to create comprehensive Verification/Validation plans for both pre- and post-silicon validation.
• Independently developing and executing tests for verification and validation.
• Collaborating with cross-functional teams to drive closure of verification and validation activities.
• Signing off on verification and validation deliverables.
• Debugging and root cause analysis of issues found during validation.
• Developing and maintaining automated test environments and regression suites.
• Contributing to the continuous improvement of verification methodologies and best practices.

Your work will enable industry-leading data storage control SoCs that are deployed in high-volume consumer and enterprise products.

Why Join Us?

At SanDisk, you’ll be part of a team of highly skilled engineers solving complex verification challenges and driving innovation in data storage solutions. Your work will directly impact the performance and reliability of next-generation data solutions for both consumer and enterprise markets.

Together, we’ll push the boundaries of technology, unlock the full potential of data, and shape the future of storage solutions.

Location:  Singapore (with 6 months on-job training inSuzhou, China) 

Employment Type:  Full-time, Permanent

 ProgramOverview

We are offering a unique opportunity forfresh graduates to kick-start their careers in a dynamic, high-technologyenvironment. Selected candidates will undergo a structured 6-month on-jobtraining at our state-of-the-art facility in Suzhou, China, where you will gainhands-on experience in cutting-edge analytical techniques, laboratoryoperations, and customer project management. Upon successful completion of thetraining, you will return to our Singapore site to contribute directly to ourlocal operations and grow with a global team.

Key Responsibilities

- Participate in a comprehensive trainingprogram covering advanced failure analysis, materials characterization, andsemiconductor testing methodologies.

- Operate and maintain sophisticatedanalytical instruments under the guidance of experienced mentors.

- Support engineering teams introubleshooting, data analysis, and report preparation.

- Collaborate with cross-functional teamsto deliver high-quality technical services to customers.

- Upon return to Singapore, apply acquiredskills to support local projects and contribute to continuous improvementinitiatives.

Requirements

- Fresh graduate or recent graduate with aDiploma or Bachelor/Master/PhD Degree in Engineering (preferably Mechanical,Electrical, Electronics, Materials, or a related discipline).

- Strong interest in the semiconductor andhigh-tech manufacturing sectors.

- Willingness to relocate to Suzhou, Chinafor 6 months of intensive on-job training.

- Adaptable, self-motivated, and eager tolearn in a fast-paced environment.

- Good communication and teamwork skills.

- Proficiency in English is required; basicMandarin is an advantage for integration during the training period.

What We Offer

- A structured training program designed tobuild deep technical expertise and industry knowledge.

- Opportunities to work with leading-edgetechnologies and global industry experts.

- Competitive remuneration and benefitspackage.

- A clear career development pathway withina growing international organization.

- Support for work pass applications andrelocation arrangements for the training period.

Key responsibilities and duties include:  

• Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking  

• Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity

• Establish and improve equipment management projects to deliver tech node requirements  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing  

• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products. cost, availability, and improve hardware and process capability

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities with SMAI team

• Good knowledge of Wafer Fab Manufacturing system, eg: MES, ETO, Autoshell and E3 FDC is preferred

• Develop hardware roadmaps for 5+ years in post probe wafer and die processing process area

• Collaborating with process development teams to develop innovative new solutions.

• Performing fundamental research to drive innovative solutions for next-generation equipment products.

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives  

• Lead the equipment team to work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Lead and ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Constructs forecasts, proposals and strategic/tactical plans based on business data and market intelligence

Education and Experience.

• B.S/M.S./Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.

• 5 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field stacking process equipment TC bonder/ Hybrid Bonder

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding

• Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware  

• Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe failure

• Knowledge of semiconductor processing, solid-state device physics desirable

• Consistent track record to solve problems and address root causes 

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.   

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Oversees the installation, modification, upgrade and maintenance of manufacturing equipment. Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. Establishes programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process. Provides technical support to the manufacturing equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules.

Summary:

• MNC

• Monday to Friday, 8.30am - 5.30pm

• UP$3400-$4600

• AWS+VB

• Pioneer Cres, company transport provided island-wide

Responsibilities:

• Supervise and lead a team of Engineering Assistant and Technicians

• Summarize reliability testing results and correlate with head/media design data

• Improve current test methodology to meet customers' new requirements

• Perform failure analysis on post-tested head and media

• Develop new setups and new methodology to test head media interference reliability

• Ensure compliance to ISO Standard Operating Procedures
  
  

Requirements:

• Bachelor's Degree in Computer Science, Data Science, Science/Engineering field or equivalent

• Possessing data analytics or machine learning experience will be of advantage

• Proficiency in Python and standard data science libraries (e.g., pandas, NumPy, scikit-learn, TensorFlow, Keras)

• Working knowledge of SQL and relational databases (e.g., PostgreSQL, Oracle) will be preferred
  
  

Please submit your updated resume in MS Word format by clicking the QUICK APPLY button.

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Ng Yi Jie Benedict
Registration Number: R2091806
AlwaysHired Pte Ltd
EA Licence No: 24C2293

As a MTS/Principal Photolithography Process Development Engineer in Micron's R&D Technology Development group, you will lead advanced photolithography process development for next-generation memory devices, driving innovation in process integration and technology transfer across Micron's global manufacturing network.

Key Responsibilities:

• Lead development and optimization of photolithography processes to achieve yield, quality, and performance targets for advanced technology nodes.

• Define and convert future device requirements into reliable process specifications and equipment roadmaps.

• Drive early adoption of innovative process and equipment solutions to improve margin and manufacturability.

• Identify and integrate exciting technologies into production flows.

• Collaborate with global R&D teams and manufacturing sites to ensure seamless technology transfer.

• Partner with suppliers to accelerate breakthrough solutions and maintain strategic vendor relationships.

• Implement advanced process control methodologies using statistical tools, DOE, and simulation software.

• Conduct material evaluations, reticle/layout/OPC development, process window analysis, and overlay optimization.

• Develop intellectual property via patents and publications; deliver technical mentorship and guide technology strategy.

Required Qualifications:

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or related field.

• 10+ years in semiconductor photolithography or related process engineering (outstanding candidates with 7+ years considered).

• Deep expertise in optics, immersion lithography, polarized illumination, and low k1 imaging.

• Proven track record in defining and accomplishing photolithography process and equipment roadmaps.

• Proficiency in lithography simulation tools, material characterization, and statistical analysis.

• Strong understanding of semiconductor process flows and memory architecture.

• Excellent problem-solving, leadership, and communication skills.

Preferred Experience:

• Experience with advanced lithography materials (365nm, 248nm, 193nm) and EUV processes.

• Hands-on experience with innovative photolithography equipment and metrology tools.

• Established skill in managing cross-functional projects and directing technology strategy.

Job Summary

Our Company is working closely with a Prestigious Public Listed organisation in Singapore. Due to our dynamic expansion in projects, we are looking for Systems Engineers to be part of the project team, who is able to maintain, upgrade and manage server system hardware and networks and in-house development environment software applications.

Responsibilities

• Install and configure software and hardware to ensure optimal system performance and reliability
• Manage network devices and technology tools to support seamless connectivity and operations
• Analyze and understand overall system network architecture to support infrastructure planning and troubleshooting
• Monitor system performance and maintain systems according to operational requirements and standards
• Troubleshoot technical issues and outages promptly to minimize downtime and impact on users
• Implement and maintain security measures including access controls, backups, and firewalls to protect system integrity
• Upgrade systems with new releases and models to enhance functionality and security
• Generate and maintain comprehensive technical documentation, manuals, and IT policies to support knowledge sharing and compliance

Required competencies and certifications

• Proven experience as a System Engineer, System Administrator, Network Administrator, or similar role
• Experience and knowledge in VMware and SAN technologies
• Proficiency with databases, networks (LAN, WAN), and patch management processes
• Knowledge of system security practices including intrusion detection systems, OS hardening, and data backup/recovery
• Familiarity with various operating systems and platforms, with preference for MS Windows and Red Hat
• Demonstrated resourcefulness and problem-solving aptitude in diagnosing and resolving technical issues

Preferred competencies and qualifications

• Degree or Diploma in Information Technology, Computer Science, Computer Engineering, or a related discipline

ob Responsibilities

1. Design, develop and maintain high-performance, highly scalable and stable Java backend systems and services.

2. Be responsible for the development of the company's digital currency business services, promote the connection of digital currency channels and distribution channels, and oversee the construction and optimization of relevant management systems.

Job Requirements

1. Bachelor’s degree or above in Computer Science, Software Engineering, Mathematics or a related field.

2. At least 2 years of development experience; proficient in Java and core technologies including JVM, multithreading, IO and collection frameworks; familiar with mainstream frameworks such as Spring Boot, Spring Cloud and MyBatis.

3. Familiar with relational databases (MySQL) and NoSQL databases (Redis, MongoDB), with experience in database performance optimization.

4. Familiar with protocols such as TCP/IP and Socket, familiar with the development process of RESTful interfaces, and understand distributed systems, Redis, MQ messaging and other components.

5. Strong problem-solving skills, good communication and teamwork skills, with a passion for technical research and innovation.

6. Knowledge of blockchain, cryptocurrency or stablecoin is preferred.

Your Role

Key responsibilities in your new role

• Drive MEMS Package Technology Development at Infineon, from concept to high-volume ramp-up.
• Act as the lead engineer and primary point of contact for direct communication with Infineon’s key customers regarding MEMS package technology.
• Perform process development activities (including parameter scouting, optimization, verification, and process freeze) within development projects to achieve targets related to timeline, quality, cost competitiveness, and manufacturability.
• Define and drive technical specifications (BOM, package design, assembly process) for MEMS package projects involving major changes, risks, or new introductions.
• Lead a global team of process development engineers to successfully execute multiple MEMS package NPI (New Product Introduction) projects. Share your technical expertise and foster professional growth within your team.
• Serve as the partner and technical consultant for package definition activities, collaborating closely with the Business Division, particularly on aspects of MEMS and Silicon Microphone back-end (BE) assembly technology.
• Provide support during the pre-development and project definition stages, maintaining your role as the package design expert throughout the project lifecycle.
• Innovate novel MEMS package concepts, leveraging your experience as a technical leader.

Your Profile

Qualifications and skills to help you succeed

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, or similar).
• Minimum of 9 years of relevant experience in MEMS package technology development.
• Demonstrated success and proven track record in developing innovative MEMS Silicon Microphone technologies.
• Experience in representing your company as a MEMS package expert, with direct communication to Tier 1 customers.
• Comprehensive knowledge of MEMS packaging processes, materials, and equipment engineering.
• Proven ability to lead and mentor a team of process development engineers in MEMS package development.
• Hands-on experience collaborating with OSATs (Outsourced Semiconductor Assembly and Test providers) in package development projects.
• Expertise in Failure Analysis and Reliability Engineering methodologies.
• Strong analytical and problem-solving skills including 8D and FMEA.
• Proficiency in AutoCAD and 3D drafting tools.
• Highly motivated, driven to excel and grow within Infineon, and thrives on tackling challenges to deliver innovative solutions

Summary

We live in a mobile and device driven world where knowledge of the physical world around us is needed. We rely on this knowledge to get around, to learn about our environment and to enable spectacular new features for custom applications. Apple is meeting those needs as robustly and as creatively as possible and is interested in people who want to help meet that commitment. The success we are striving will be the result of very skilled people working in an environment which cultivates creativity, partnership, and thinking of old problems in new ways. If that sounds like the kind of environment that you find intriguing, then let's talk. These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a team that sets the standard in cultivating excellence, creativity and innovation. Excellent opportunity to join our Process Development team. You will conduct feasibility studies, develop new process and material development for new module technologies under research and development. Will you help us design the next generation of revolutionary Apple products?

Description

The successful candidate will have the opportunity to develop processes for next generation products in Apple’s ecosystem. Responsible to establish new baseline processes by conducting proof of concept (POC) studies and Design of Experiments (DOEs). Also be responsible to define Critical-To-Quality (CTQ) metrics, their specifications and the necessary metrology tools/procedures required to measure these CTQs. Have the opportunity to develop new process equipments with the support from external vendors, and showcase analytical skills by preparing and presenting engineering reports to cross-functional teams.

Responsibilities

• Work on process equipment to conduct proof of concept evaluation and DOEs 
• Establishment of baseline process and CTQ metrics
• Perform process characterization
• Establish design guidelines for manufacturability
• Define procedures and metrologies for CTQ measurements
• Generate engineering report based on studies and evaluation
• Reporting of engineering studies and providing recommendations based on engineering assessment to cross-functional teams

Minimum Qualifications

• Degree of Science in Engineering or equivalent
• Minimum 2 to 3 years of experience in doing process R&D
• Clear and effective written and communication skills
• Hands-on experience in various module assembly processes such as flip chip, flex attach, pick and place, glue dispensing, wire bonding, filling, laser soldering, component cleaning, curing, plating, singulation, wafer bonding

Preferred Qualifications

• Good knowledge and hands-on experience in camera or laser projector module assembly processes with high placement accuracy requirements, such as lens and VCSEL attach
• Good knowledge in design of experiment (DOE), engineering statistic, root cause analysis and problem solving
• Familiarity on different metrology tools and quantitative measurement methodology
• Knowledge of statistical analysis software (e.g. JMP or Minitab)
• Resourceful and innovative
• Knowledge and work experience in one or more of the following processes & handling such processes equipment - 1) Flip Chip bonding (Thermosonic, Thermocompression and etc) OR 2) EVO die bonder or any Pick & Place equipment platform OR 3) Wirebond/Studbump) OR 4) Flex Attach (Flexible Printed Circuit Board Bonding), OR 5) Glue / Solder Paste Dispensing, OR 6) Solder Jetting/Laser Wire Soldering OR 7) SMT (e.g. solder printing, component pick&place, AOI, SPI and reflow) OR 8) Wire cutting & crimping
• Knowledge on adhesive or epoxy or other bonding material
• Experience in optical components, active alignment and high accuracy bonding process

Apple is an equal opportunity employer that is committed to inclusion and diversity, and thus we treat all applicants fairly and equally. Apple is committed to working with and providing reasonable accommodation to applicants with physical and mental disabilities.

Summary

We live in a mobile and device driven world where knowledge of the physical world around us is needed. We rely on this knowledge to get around, to learn about our environment and to enable spectacular new features for custom applications. Apple is meeting those needs as robustly and as creatively as possible and is interested in people who want to help meet that commitment. The success we are striving will be the result of very skilled people working in an environment which cultivates creativity, partnership, and thinking of old problems in new ways. If that sounds like the kind of environment that you find intriguing, then let's talk. These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a team that sets the standard in cultivating excellence, creativity and innovation. Excellent opportunity to join our Process Development team. You will conduct feasibility studies, develop new process and material development for new module technologies under research and development. Will you help us design the next generation of revolutionary Apple products?

Description

The successful candidate will have the opportunity to develop processes for next generation products in Apple’s ecosystem. Responsible to establish new baseline processes by conducting proof of concept (POC) studies and Design of Experiments (DOEs). Also be responsible to define Critical-To-Quality (CTQ) metrics, their specifications and the necessary metrology tools/procedures required to measure these CTQs. Have the opportunity to develop new process equipments with the support from external vendors, and showcase analytical skills by preparing and presenting engineering reports to cross-functional teams.

Responsibilities

• Work on process equipment to conduct proof of concept evaluation and DOEs 
• Establishment of baseline process and CTQ metrics
• Perform process characterization
• Establish design guidelines for manufacturability
• Define procedures and metrologies for CTQ measurements
• Generate engineering report based on studies and evaluation
• Reporting of engineering studies and providing recommendations based on engineering assessment to cross-functional teams

Minimum Qualifications

• Degree of Science in Engineering or equivalent
• Minimum 15 years of experience in doing process R&D
• Clear and effective written and communication skills
• Hands-on experience in various module assembly processes such as flip chip, flex attach, pick and place, glue dispensing, wire bonding, filling, laser soldering, component cleaning, curing, plating, singulation, wafer bonding

Preferred Qualifications

• Good knowledge and hands-on experience in camera or laser projector module assembly processes with high placement accuracy requirements, such as lens and VCSEL attach
• Good knowledge in design of experiment (DOE), engineering statistic, root cause analysis and problem solving
• Familiarity on different metrology tools and quantitative measurement methodology
• Knowledge of statistical analysis software (e.g. JMP or Minitab)
• Resourceful and innovative
• Knowledge and work experience in one or more of the following processes & handling such processes equipment - 1) Flip Chip bonding (Thermosonic, Thermocompression and etc) OR 2) EVO die bonder or any Pick & Place equipment platform OR 3) Wirebond/Studbump) OR 4) Flex Attach (Flexible Printed Circuit Board Bonding), OR 5) Glue / Solder Paste Dispensing, OR 6) Solder Jetting/Laser Wire Soldering OR 7) SMT (e.g. solder printing, component pick&place, AOI, SPI and reflow) OR 8) Wire cutting & crimping
• Knowledge on adhesive or epoxy or other bonding material
• Experience in optical components, active alignment and high accuracy bonding process

Apple is an equal opportunity employer that is committed to inclusion and diversity, and thus we treat all applicants fairly and equally. Apple is committed to working with and providing reasonable accommodation to applicants with physical and mental disabilities.

About the Role

Join us as a DevOps Engineer / Technology Architect (Puppet), where you’ll work on infrastructure automation, Puppet‑based configuration management, and enterprise DevOps solutions across large‑scale environments.

What You’ll Gain

✔ Hands‑on Puppet Enterprise / Puppet Open Source work
✔ Experience building automated, reliable infrastructure solutions
✔ Collaboration with architects, engineers, and enterprise clients
✔ Opportunities to contribute to open‑source and DevOps tooling
✔ Exposure to modern automation and infrastructure standards

Responsibilities

• Design and implement solutions that improve software delivery using Puppet
• Deliver Puppet training sessions and workshops
• Work with education teams to maintain training content
• Support Sales/Marketing with pre‑sales technical input
• Develop and maintain Puppet modules and related tools
• Build integrations and automation around Puppet
• Contribute to technical blogs and documentation

Minimum Qualification

Diploma or Degree in:

• Computer Science
• Information Technology
• Software Engineering
• Computer Engineering

Related Fields Accepted:
Electronics & Communication Engineering, Electrical Engineering (with IT/Systems focus), Cybersecurity, Information Security, Network Engineering, Telecommunications

Must‑Have Skills

• Strong experience with Puppet Enterprise or Puppet Open Source (Puppet 4+)

Good‑to‑Have Skills

• DevOps Architecture
• Automation (strong)
• Network Infrastructure (strong)
• Systems Administration (strong)

Requirements

• Solid hands‑on Puppet experience (Enterprise or OSS, Puppet 4+)
• 5+ years in DevOps, Systems Admin, Automation, or Network Infrastructure
• Strong Unix/Linux background with automation expertise
• Confident customer‑facing and presentation skills
• Experience interacting with clients and internal stakeholders
• Strong analytical and problem‑solving abilities
• Passion for Puppet and open‑source ecosystems
• Technical degree or equivalent practical experience
• Ability to travel up to 10% domestically

Preferred (Nice to Have)

• Programming: Ruby, Python, Go
• Windows administration (incl. PowerShell)
• Experience with large‑scale infrastructure
• Knowledge of data centers, networking, security, monitoring
• Professional services background (enterprise/open‑source)
• Puppet Certification