Total 13 job vacancies by Stats Chippac Pte. Ltd.

Purpose of the Job (Why the job exists):

• Responsible for the overall WLCSP Manufacturing organization to drive production output, quality and cycle time for WLCSP Manufacturing.

• Responsible for the cost, productivity and people & asset effectiveness for WLCSP Manufacturing.

• Manage adhoc projects.

Key Job Accountabilities (Actual daily deliverables):

• Lead and manage semiconductor backend manufacturing operations across Backgrind, Laser Mark, , Laser groove, Wafer Saw, AOI, and Tape & Reel processes to achieve safety, quality, delivery, cost, and productivity targets.

• Drive operational excellence through continuous improvement initiatives focused on yield enhancement, cycle time reduction, equipment utilization, and cost optimization.

• Lead multiple production shifts through supervisors and engineers, ensuring effective manpower planning, workforce development, and operational discipline.

• Manage customer escalations, production risks, and quality excursions, ensuring timely containment, root cause analysis, and corrective actions.

• Partner with Process, Equipment, Quality, Planning, and Maintenance teams to resolve complex manufacturing issues and improve process robustness.

• Monitor and drive key manufacturing KPIs including OEE, yield, UPH, cycle time, on-time delivery, scrap, and labor productivity.

• Support New Product Introduction (NPI), process transfers, and manufacturing readiness activities to meet customer and business requirements.

• Champion Lean Manufacturing, Six Sigma, automation, and Industry 4.0 initiatives to improve factory performance and scalability.

• Ensure compliance with quality systems, customer requirements, EHS standards, and audit expectations.

• Develop and execute manufacturing strategies, organizational capability, and succession plans to support long-term business growth.

Required Experience and Qualifications :

• Minimum Degree in any disciplines.

• Preferably 10 years experience in semiconductor industry.

• Experience managing manufacturing operations for minimum of 5 years

• Oversee the Engineering Section for Wafer Level operations.
• Provide technical leadership for engineers to control,sustain and to continuously drive improvement for yield, quality and cycle time.
• Establishing partnership and work with upstream processes such as Bumping, Backgrind and Wafer Saw to improve quality and yield performance.
• Establish and improve controls to ensure all products meet customers’ requirements in terms of quality and yield.
• Support on engagement with customers on improvement of process, material and equipment capabilities.
• Lead cross-functional teams such as production and equipment for out-of-control situations and provide decision on lot disposition.
• Continuously improve the yield of qualified products through systematic data analysis.
• Productivity improvement through process redesign to maximize productivity of both equipment and processes.

Required Experience and Qualifications (Required knowledge, skills and experience---however acquired):

• Minimum 3 years in managerial/lead role in fast moving semiconductor industry.
• Engineering degree from recognized University.
• Able to provide technical leadership to a team of engineers for customer issues, yield improvement programs and process development activities.
• Ability to interface directly with customers in addressing quality issues, new product introduction and continuous improvement programs.
• Strong knowledge in JMP, 8D, FMEA, DOE and Systematic Problem solving.

Purpose of the Job

• To perform technical maintenance and optimization of advanced packaging equipment (Bump, RDL, CoW, MEOL) to ensure high-precision processing, maximize tool uptime, and support stable mass production.

Key Job Accountabilities:

• Execute scheduled PM and emergency repairs (BM) on diverse toolsets including PVD (Sputter), ECD (Plating), Lithography (Stepper), and TCB/Hybrid Bonders.
• Calibrate high-precision sensors and actuators to maintain critical process parameters (e.g., bonding force, temperature uniformity, and alignment accuracy).
• Diagnose and resolve complex mechanical and electrical failures using schematics, diagnostic software, and measurement tools.
• Track the consumption of critical components and suggest improvements for part lifetime extension.
• Maintain detailed logs of equipment history, repair procedures, and safety checklists.

Required Experience and Qualifications

• Bachelor’s degree in Electrical, Electronic, Mechanical Engineering, or a related field.
• Understanding of the Wafer Level Packaging (WLP) process flow and equipment hardware architecture.
• Ability to read/interpret mechanical drawings and electrical schematics. Proficiency in using multimeters, oscilloscopes, and precision gauges.
• Comfort working in a cleanroom environment and flexibility for shift rotations.

Purpose of the Job:

• To continuously improve Wafer processes and capabilities to attain the highest quality and productivity through work simplifications and standardization, implementation of best-known methods and controlled operating procedures

Key Job Accountabilities:

• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time. 
• To provide interim and long-term corrective actions for any discrepancies.
• Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

Scope of the Job:

• In-charge of photo resist coat, exposure, develop and curing process for PI (e.g. HD4100) and PR (Positive, Negative).  Different photo sensitive material is coated in different machines and different exposure machine types (steppers & aligners).
• Setup recipe for new devices.  Process characterization for every new device: coating thickness, exposure recipe and CD after develop. 
• Working closely with mask designer to continuously update wafer process design rules so to improve process capability and productivity.
• Perform continuous improvement activities for top defects, process simplification and throughput improvement.
• Monitor process capability in terms of input parameter control and SPC monitoring

Required Experience and Qualifications:

• Requires Degree in Engineering, Material Sciences, Chemistry or equivalent
• Minimum 2 years of relevant experience in wafer bumping or wafer fabrication
• Minimum 5 years of experience in relevant area is an added advantage

To attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and implement robust system solutions.

Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time.

Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

Ability to lead cross functional teams to drive improvement.

• Manage Customer production order releases inclusive weekend support if require
• Drive Customer Service Index to improve operational indices for customers.
• Purchase Order Management. Acknowledge purchase orders within 24 hours, maintain/cancel redundant purchase orders and ensure correct shipping address.
• Ensure there is always an active purchase order with pricing in SAP setup by Account Manager.
• Assist Account Manager with customer’s material liability (EXOB – Excess and Obsolescence) to minimize STATS ChipPAC revenue exposure.
• Analyze WIP projection daily & highlight any potential issues in missing daily shipment commit with actively alerted   customer & handle customer request/complaints in a timely manner, actively and reasonably resolve them, control the deterioration of the situation, improve customer satisfaction.
• Meet or exceed forecasted revenue. Ensure production and service billings and invoiced promptly with minimal debit / credit notes.
• Handle with Shipping on inbound/outbound requests.
• Make arrangements for customer visits and maintain good relationships with customer

Key Responsibilities:

• Conduct thorough reviews and analysis of capital expenditure (CAPEX) proposals, ensuring alignment with strategic objectives and financial feasibility.
• Develop and implement initiatives to optimize CAPEX utilization, enhancing operational efficiency and driving CAPEX avoidance
• Collaborate with cross-functional teams to standardize the internal cost model, establish pricing strategies that maximize profitability while remaining competitive in the market.
• Monitor market trends and conduct regular pricing analysis to identify opportunities for pricing optimization and revenue growth.
• Identify low-load production lines, provide order guidance, and accelerate the development progress of new products.
• Evaluate new product introduction (NPI) pipeline and provide recommendations for further investment based on market potential and strategic fit.
• Collaborate with finance and other stakeholders to review the annual operating plan (AOP)by setting realistic targets, defining key performance.
• Monitor business performance by pipeline tracking.
• Provide leadership, guidance, and mentorship to the team, fostering a culture of collaboration, continuous improvement, and accountability.
  

Qualification and requirements:

• Bachelor's degree in business administration, finance, or a related field. MBA or equivalent advanced degree is preferred.
• Strong financial acumen and the ability to analyze complex financial data.
• Solid understanding of pricing strategies, cost management, and investment planning.
• Exceptional communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams
• Results-oriented mindset with a focus on driving continuous improvement and achieving targets.

• Write process specifications and operator instructions
• Sustain and provide continuous process improvement through evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of cost, yield and cycle time.
• Support on new device, new material and new equipment qualification.
• To provide interim and long-term corrective actions for any discrepancies.
• To support photolithography process including yield improvement, SPC control, trouble shooting on stepper and track issues

Required Experience and Qualifications

• Requires Degree in Electrical, Electronics, Mechanical, Materials Engineering, Physics, or Chemistry.

Key Job Accountabilities

• Write process specifications and operator instructions
• Sustain and provide continuous process improvement through evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of cost, yield and cycle time.
• Support on new device, new material and new equipment qualification.
• To provide interim and long-term corrective actions for any discrepancies.

Required Experience and Qualifications

• Requires Degree in Electrical, Electronics, Mechanical, Materials Engineering, Physics, or Chemistry.
• Minimum 5 years of relevant work experience in process as Engineer.

• To attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and implement robust system solutions.
• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time.
• Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.
• Ability to lead cross functional teams to drive improvement.

Purpose of the Job (Why the job exists):

• Lead team of NPI Staff/Senior/Engineers/Associate Engineers on:

• New design reviews and checks against existing package design rules.   

• Supporting new product/customer feasibility build, characterization and qualifications.

• Liaise with customers, TPM, PTM on engineering build support with regular conferences calls & meetings.

• Undertake technology/project transfer from R&D to Operations.

• Process optimization and improvements in eWLB technology.

• Taking the lead for risk assessment, FMEA, optimization/DOE (if required) for new products.

• Taking the lead in coordination with the various operation and support teams (mfg, process, equipment, mfg system, IE, CS etc) in preparing the line for new device startup/ramp. Ensure Excursion Free ramp.

• Taking the lead for issues that arises from engineering builds.

• Documentation of product eNPI phase/qual reports.

• Supporting new customer engagement and fab visits.

Key Job Accountabilities (Actual daily deliverables):

• Set up and track KPIs for department to ensure successful qualification.

• Ensure timely delivery of all NPI lots.

• Ensure excursion free ramp of all NPIs.

• Train and develop team on Process Characterization Techniques using Statistical methods.

• Liaise with R&D on technology transfers, new products.

Required Experience and Qualifications:

• Requires B. Eng, B. Sc, M. Eng, M. Sc or PhD in Electrical, Electronics, Mechanical, Chemical Engineering, Physics, Material Science or its equivalent.

• Minimum 5 years working experience in Wafer Fab or Bump Fab.

• Minimum 3 years working at Management level.

Key Job Accountabilities:

• Process capability and continuous improvement plans to meet customer expectation
• Material disposition to meet customer delivery
• Work with cross functional teams in NPI, yield enhancement, cost reduction, productivity improvement
• Interact with customer on special request, audit and visit
• Resource planning to ensure technical strengthen/talents in the team is competitive to the leading edge
• Provide leadership and direction to the consumables Process Engineering team to accomplish all team goals and objectives
• Manage team development through training, coaching and career mapping; develops personal growth opportunities

Required Experience and Qualifications (Required knowledge, skills and experience---howeveracquired):

• Degree in Electrical/Electronics/Mechanical/ChemicalEngineering/Chemistry/Physics/Material Science or its equivalent.
• Minimum 8 years working experience in Wafer Fab orBump Fab.
• Minimum 5 years working at management level.

Program Details

1. Tailored Education Program

• A global learning environment, including overseas rotational assignments (18–24 months).
• Professional technical and corporate culture training leveraging STATS ChipPAC’s global network.

2. Learning and Development Support

• Coaching: Expert coaching to enhance individual competencies.
• Mentoring: Dedicated mentoring from experienced professionals.
• Peer Learning: Knowledge sharing and teamwork-driven collaboration.
• HR Support: Systematic career development and growth opportunities.

3. Practical, Hands-on Learning

• Collaborate with semiconductor packaging experts through domestic and international assignments.
• Gain real-world problem-solving experience by participating in diverse team projects.

Eligibility

• Fields of Study: Semiconductor Packaging, Chemical Engineering, Mechanical Engineering, and other related fields.
• Academic Requirements: Master’s or Doctoral degree holders (including expected graduates).
• Additional Qualifications:
• Willingness to participate in overseas rotational assignments.
• Strong teamwork and problem-solving skills.
• Proficiency in global communication.