Total 7 job vacancies by Stats Chippac Pte. Ltd.

Purpose of the Job

• To perform technical maintenance and optimization of advanced packaging equipment (Bump, RDL, CoW, MEOL) to ensure high-precision processing, maximize tool uptime, and support stable mass production.

Key Job Accountabilities:

• Execute scheduled PM and emergency repairs (BM) on diverse toolsets including PVD (Sputter), ECD (Plating), Lithography (Stepper), and TCB/Hybrid Bonders.
• Calibrate high-precision sensors and actuators to maintain critical process parameters (e.g., bonding force, temperature uniformity, and alignment accuracy).
• Diagnose and resolve complex mechanical and electrical failures using schematics, diagnostic software, and measurement tools.
• Track the consumption of critical components and suggest improvements for part lifetime extension.
• Maintain detailed logs of equipment history, repair procedures, and safety checklists.

Required Experience and Qualifications

• Bachelor’s degree in Electrical, Electronic, Mechanical Engineering, or a related field.
• Understanding of the Wafer Level Packaging (WLP) process flow and equipment hardware architecture.
• Ability to read/interpret mechanical drawings and electrical schematics. Proficiency in using multimeters, oscilloscopes, and precision gauges.
• Comfort working in a cleanroom environment and flexibility for shift rotations.

Purpose of the Job:

• To continuously improve Wafer processes and capabilities to attain the highest quality and productivity through work simplifications and standardization, implementation of best-known methods and controlled operating procedures

Key Job Accountabilities:

• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time. 
• To provide interim and long-term corrective actions for any discrepancies.
• Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

Scope of the Job:

• In-charge of photo resist coat, exposure, develop and curing process for PI (e.g. HD4100) and PR (Positive, Negative).  Different photo sensitive material is coated in different machines and different exposure machine types (steppers & aligners).
• Setup recipe for new devices.  Process characterization for every new device: coating thickness, exposure recipe and CD after develop. 
• Working closely with mask designer to continuously update wafer process design rules so to improve process capability and productivity.
• Perform continuous improvement activities for top defects, process simplification and throughput improvement.
• Monitor process capability in terms of input parameter control and SPC monitoring

Required Experience and Qualifications:

• Requires Degree in Engineering, Material Sciences, Chemistry or equivalent
• Minimum 2 years of relevant experience in wafer bumping or wafer fabrication
• Minimum 5 years of experience in relevant area is an added advantage

To attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and implement robust system solutions.

Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time.

Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

Ability to lead cross functional teams to drive improvement.

• Write process specifications and operator instructions
• Sustain and provide continuous process improvement through evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of cost, yield and cycle time.
• Support on new device, new material and new equipment qualification.
• To provide interim and long-term corrective actions for any discrepancies.
• To support photolithography process including yield improvement, SPC control, trouble shooting on stepper and track issues

Required Experience and Qualifications

• Requires Degree in Electrical, Electronics, Mechanical, Materials Engineering, Physics, or Chemistry.

Key Job Accountabilities

• Write process specifications and operator instructions
• Sustain and provide continuous process improvement through evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of cost, yield and cycle time.
• Support on new device, new material and new equipment qualification.
• To provide interim and long-term corrective actions for any discrepancies.

Required Experience and Qualifications

• Requires Degree in Electrical, Electronics, Mechanical, Materials Engineering, Physics, or Chemistry.
• Minimum 5 years of relevant work experience in process as Engineer.

• To attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and implement robust system solutions.
• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time.
• Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.
• Ability to lead cross functional teams to drive improvement.

Key Job Accountabilities:

• Process capability and continuous improvement plans to meet customer expectation
• Material disposition to meet customer delivery
• Work with cross functional teams in NPI, yield enhancement, cost reduction, productivity improvement
• Interact with customer on special request, audit and visit
• Resource planning to ensure technical strengthen/talents in the team is competitive to the leading edge
• Provide leadership and direction to the consumables Process Engineering team to accomplish all team goals and objectives
• Manage team development through training, coaching and career mapping; develops personal growth opportunities

Required Experience and Qualifications (Required knowledge, skills and experience---howeveracquired):

• Degree in Electrical/Electronics/Mechanical/ChemicalEngineering/Chemistry/Physics/Material Science or its equivalent.
• Minimum 8 years working experience in Wafer Fab orBump Fab.
• Minimum 5 years working at management level.