Total 37 job vacancies by Silicon Box Pte. Ltd.

Position Summary

QA Engineer (Process Quality Control) is responsible to develop & deploy inspection procedures to ensure conformance of material to be released. Candidates with experience in semiconductor manufacturing environment are encouraged to apply for this position.

Key Responsibilities:

• Responsible for backend semiconductor packaging processes which ball drop, bumping, singulation, back grind and mounting.
• Effectively providing engineering support in order to meet production output, product quality, efficiency, productivity, yield, cycle time and safety requirements.
• Responsible to analyse the process data and identify improvement actions and work on the improvement.
• Drive permanent solutions to resolve chronic process and quality issues.
• Responsible to evaluate new product/material/process during the pilot run and ensure process readiness.
• Responsible for the relevance of the Work Instructions, Control Plan, FMEA & Process Control documents.
• Responsible to prepare the line for internal & external audits and the follow-up actions.
• Any other ad-hoc duties as assigned.

Requirements:

• Bachelor’s Degree in Engineering (Mechanical, Electrical, Materials, Chemical, or related field).
• Prior experience in semiconductor packaging processes (ball drop, bumping, singulation, back grind, mounting) would be advantageous.
• Experience in process engineering, yield improvement, and quality control.
• Proficiency in data analysis and statistical process control (SPC).
• Familiarity with Failure Mode and Effects Analysis (FMEA), Control Plan, and Process Control documentation.
• Hands-on experience with new product/material/process evaluations.
• Ability to work in a fast-paced manufacturing environment.

Position Summary

The Customer Service Specialist is accountable for excellent customer service experience. The job incumbent will have frequent interactions with internal stakeholders such as Account Management team and the Operational teams within the organization. He or she will have to interact directly with clients with the guidance and in accordance with the company’s procedures.

Responsibilities

• Build strong relationships with customers.
• Monthly commitment of 6- or 12-months rolling forecast back to customers.
• Work with internal teams and customer on the customer order planning and execution by

1. Providing visibility for incoming wafers.
2. Providing instruction to execute orders and coordinate the priorities of orders.
3. Providing WIP status, ship-out plan and finished good information to customers.
4. Arranging customer wafers to fulfil Forecast/ AOP/ Customer Shipment requirement.

• Maintain pricing and sales order creation for billing and shipment.
• Brief internal team on changes in flow/ process/ customer requirements after understanding customers" specs.
• Co-ordinate any customer returned materials and work with the relevant department on material disposition.
• Attend to customer enquiries and complaints.
• Work with IT to develop reports as per customer’s requirement and maintain the quality of these reports.
• Host Customer Visits and Quarterly Business Review meetings
• Perform any other tasks relevant to support Customer’s requirements.
• Perform any other duties assigned by Supervisor or Manager from time to time.

Requirements

• Degree in Engineering, Business Administration, Marketing Management or similar discipline.
• 2 to 5 years of work experience in OSAT or Semiconductor Industry.
• Able to bridge between and coordinate with customer and internal engineering, logistics, sales & planning teams.
• Possess strong analysis, problem solving, communication and interpersonal skills.
• Ability to work under pressure in a very dynamic environment.

Position Summary 

The Production Planner is responsible for planning of production including release/schedule of the work order. This position will have frequent interactions with internal stakeholders such as Customer Service, Manufacturing Team and Engineering team.  

Responsibilities 

• Manage Production Daily/Weekly demand loading execution and delivery fulfilment per customers’ requirement. 

• Work with Customer Service to understand customer forecast and requirement to utilize secured capacity. 

• Work with Customer Service on Die/Wafers Visibility from customer to ensure its continuously support to production loading. 

• Work with Customer Service to ensure minimum line changes to maximise utilization and output. 

• Monitor daily wafer inventory, input & output performance and highlight potential delinquency to team for immediate resolution. 

• Monitor aging lots, remnant die, aging wafer and work with CS/internal team for disposition. 

• Support ad-hoc, urgent demand request and provide regular tracking status. 

• Drive OTD performance and Cycle time performance. 

• Prepare and update monthly customer Cycle time report. 

• Prepare management report in accordance with KPI (if any). 

• Simplify report generation and be involved in process improvement. 

• Provide assistance to customers when required. 

• Any other ad-hoc duties as assigned. 

Requirements 

• Minimum 3 years’ experience in Production Planning for Assembly/Fab in Semiconductor Industry. 

• Experience working in OSAT environment and experience in multi die planning is a plus. 

• Good communication and interpersonal skills. 

• Able to work with internal and other functional teams in a dynamic and fast-paced environment. 

• Proactive, self-starter and good team player. 

Position Summary

The Engineer, Product Development (Fresh Grad) is responsible for the developmentand establishment of new product and transfer process into production.

Responsibilities

• New product development as requested by customer and internal roadmap, and transfer into production
• New material, process & machine development and qualification, and transfer into production
• Troubleshoot process issues and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Establish, review and update specifications, workflow, quality and safety related documentation for new products and transfer to production line.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• Handle and manage customer audits and 8D reports.
• Any other ad-hoc duties as assigned.

Requirements

• At least a Bachelor’s Degree in Materials Science, Microelectronics, Electrical or Chemical engineering.
• Knowledge in process engineering, process control engineering and yield enhancement preferred
• Knowledge in DOE, FMEA, and 8D reports.
• Prior experience in the semiconductor industry would be an added advantage.

Position Summary
The Technical Program Specialist is responsible for overall management of customers’ technical projects and related matters.
Candidates with wafer bumping, WLCSP, or fanout packaging experience are encouraged to apply for this position.

Responsibilities

• Works with account management and customer service teams in all technical aspects of the customers’ engagements
• Provides technical support to sales team to gain market share and improve customer’s profitability status.
• Communicates new customer technology requirements to the internal teams. Communicates and manage all customer process and package roadmap strategies.
• Coordinates factory/customer technical projects and act as the point of contact for new quality/reliability programs.
• Implements change notices and resolves technical issues.
• Prepares and participates in audits and factory visits with customers.
• Other ad-hoc activities assigned by the management.

Requirements

• At least a Bachelor’s Degree in any engineering discipline.
• At least 2 - 3 years of relevant working experience in the assembly process of the back end of semiconductor production.
• Possess good knowledge and hands-on experience in assembly processes especially in wafer-level packaging like wafer bumping, eWLB or other wafer-level Fanout Packaging.
• Knowledge on DOE, reliability requirements, material selection, FMEA, Failure Analysis and other quality and statistical tools.
• Self-driven and has excellent problem resolution and organizational skills for daily customer support and managing on-going and future programs.
• Has initiative and demonstrate excellent follow-up on active programs with multiple customers.
• Able to communicate and present effectively in small and large groups.
• Able to work independently and as a team player with customers and cross-functional teams within the organization.
• Familiarity with SAP or other ERP systems is an added advantage.
• Able and willing to travel as needed.

Position Summary
The Process Engineer (Thin Film) is responsible for development and establishment of production process.

Responsibilities

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive SPC control towards zero defects. Review and update FMEA, Control plan OCAP with cross-functional teams.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.
• Other ad-hoc duties as assigned

Requirement

• Minimum bachelor’s degree in Materials Science, Microelectronics, Chemical Engineering or relevant disciplines
• Minimum 3 years hands-on working experience in thin film process
• Experience working in Wafer-level Fanout packaging production line or LCD/FPD production line preferred
• Experience in process engineering, process control engineering and yield enhancement
• Experience in SPC, DOE, FEMA, and 8D reports

Position Summary

The Process Engineer (Lithography) is responsible for the development and establishment of production process.

Responsibilities

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line for lithography process
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive SPC control towards zero defects. Review and update FMEA, Control plan OCAP with cross-functional teams.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.
• Any other ad-hoc duties as assigned.

Requirements

• Minimum Bachelor’s Degree in Materials Science, Microelectronics, Chemical Engineering or relevant engineering degrees.
• Minimum 3-years hands-on Lithography process experience in area of in the Wafer-level Fanout packaging production line or LCD/FPD production line.
• Knowledge in process engineering, process control engineering and yield enhancement.
• Experience in SPC, DOE, FMEA, and 8D reports

Position Summary

The Engineer, Product Development is responsible for the development and establishment of new product and transfer process into production.

Responsibilities

• New product development as requested by customer and internal roadmap, and transfer into production
• New material, process & machine development and qualification, and transfer into production
• Troubleshoot process issues and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Establish, review and update specifications, workflow, quality and safety related documentation for new products and transfer to production line.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• Handle and manage customer audits and 8D reports.
• Any other ad-hoc duties as assigned.

Requirements

• Bachelor’s Degree in Materials Science, Microelectronics, Electrical, Chemical engineering or similar disciplines
• At least 3 years of experience in product development or NPI work in area of Wafer-level Fanout packaging production line or LCD/FPD production line, focusing on processes such as:

1. Die Preparation/ Recon
2. AOI/ Lithography/ Wet etch
3. Backend

• Knowledge in process engineering, process control engineering and yield enhancement
• Experience in DOE, FMEA, and 8D reports

Position Summary

The Account Specialist is responsible for customer order planning including management, logistics arrangement and other ad-hoc services for customers. This is not a sales position, but a key functionary in post-sales account management needed to drive success in execution.

Candidates must have proven success in executing manufacturing requirements, supply chain management and support for enterprise level clients, preferably in semiconductors manufacturing and/or packaging.

Responsibilities

• Support Quarterly Business Review meetings for existing clients
• Lead sales order creation for billing and shipment, post-sale
• Work with IT to develop reports for customers and maintain the quality of these reports
• Brief internally the changes in customer requirements according to customers' specs
• Update clients on changing product specifications and processes related to their business
• Work with internal teams and customers and be responsible for customer order planning and execution by

1. Provide visibility for incoming wafers.
2. Provide instruction to execute orders and coordinate the priorities of orders
3. Provide WIP status, ship-out plan and finished good information to customers
4. Arrangement of customer wafers to fulfill Forecast/ AOP/ Customer Shipment requirements
5. Attend to customer enquiries and complaints
6. Upselling

• Other ad-hoc activities assigned by the management.

Requirements

• Bachelor's Degree in Business, Finance, Engineering, Project/Supply Chain Management.
• At least 5 years of experience in leading customer service for enterprise level clients (note: internships do not count as experience; candidate must have been responsible for revenue goals).
• Proven track record of success in client engagement, upsell, and execution outcomes
• Must understand manufacturing expectations, willingness to understand technical details and client requirements, and ensure outcomes.
• Experience in leading/ managing a team would be advantageous.
• Liaise and coordinate with customers as well as internal engineering, production, logistics, sales & planning teams.
• Must take ownership and possess strong problem solving, communication and interpersonal skills.
• Ability to work under pressure in a very dynamic environment.

The Project Manager (PM) is responsible for overseeing all aspects of any project assigned by the Management, which includes managing stakeholders to ensure projects are completed on time, within budget, and good quality.

Some of the day-to-day duties includes:

• Develop plan, budget and schedule
• Manage project and operational, and safety risks
• Submit weekly update and progress reports
• Resourceful in seeking various vendors for competitive, best pricing quotation prior to award
• Support FM on problem-solving, utilities optimization
• Support BMS and FMCS systems’ integration

Requirements:

• Have a good degree in mechanical engineering or other relevant qualifications
• Minimum 10 years relevant experiences in project management in semi-conductor, advanced manufacturing, or projects with high complexity.
• Good communication and analytical skills with all levels.
• Good computer skills in Microsoft Office and CAD software.
• Good negotiation and analytical skills on cost assessment and claims

Position Summary

This position is responsible for product and tooling design.

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Responsibilities

• With reference to internal design guidelines, work with the internal & external customer to:
• Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
• Generate test vehicle design and the related PCB design.
• Prepare design risk assessment report.
• Generate reticle and stencil design.
• Generate other schematics or drawing as requested.

• Review, maintenance and update the design guidelines.
• Manage the conversion of internal design into suppliers’ final design.
• Document all the drawing revisions and change records.
• Support audits
• Any other ad-hoc duties as assigned

Requirements

• Minimum Bachelor's Degree or Master’s Degree in electrical engineering or similar discipline
• Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability
• Experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes will bean advantage
• Hands-on skills on design software tools like Linkcad, Cadence, CAM350, AutoCAD, GDS, Gerber editors
• Experience with PCB test board design
• Fresh graduates are welcome to apply

Position Summary

Package Design Manager (BGA & Substrate & WLCSP) is responsible for management of product and tooling design.

Candidates with management of wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Key Responsibilities

• Lead packaging design team.
• With reference to internal design guidelines, work with the internal & external customer to:
• Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
• Generate test vehicle design and the related PCB design.
• Prepare design risk assessment report.
• Generate reticle and stencil design.
• Generate other schematics or drawing asrequested.
• Review,maintenance and update the design guidelines.
• Manage the conversion of internal design into suppliers’ final design.
• Document all the drawing revisions and change records.
• Support audits
• Any other ad-hoc duties as assigned

Requirement

• Manage packaging design team.
• 5~10years hand-on experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes. Other similar experience could be considered if relevant.
• Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability.
• Familiar with other design software like Link cad, CAM350, AutoCAD, GDS editor and Gerber editors.
• Familiar with PCB test board design.
• Knowledge and understanding of wafer-level process and product reliability as well as other packaging assembly process will be the advantage.

Responsibilities:

• Manage all aspects of the Facilities related utilities Hook Up tasks include review of Tools’ schematic drawings and specified parameters.

• Conduct daily toolbox meeting with assigned vendors and monitor Permit to Work system and effectiveness.

• Supervise Hook Up contracts and Service providers including M&E, UPW, Gas, Chemical, Exhaust and Industrial Waste / drainage systems.

• Ensure team approach to work with other stakeholders, IE, Process, EHS and facilities operations team to effectively manage Tools Hook Up related assigned tasks.

• Develop and implement Facilities Hook Up programs leading to improve safety, quality and cost.

• Proactively identify improvements and make use of information systems that increase efficiency and effectiveness of the Hook Up tasks.

• Ensure that a safe, reliable, and collaborative work environment is a top priority, and is managed effectively and maintained, including contractors.

• Participate in review of Facilities Hook Up Standard Operating Procedures and ensure compliance to SOP.

• Utilize existing databases for coordinating and tracking work.

• Research and evaluate latest industry trends. Implement and share best practices of Hook Up tasks execution.

• Work effectively across organizations and sites to promote best practice sharing.

• Be a key contributor in the Facilities disaster management and business recovery process.

• Any other ad-hoc duties as assigned.

Minimum requirements:

• Bachelor’s Degree in Mechanical, Electrical, Chemical Engineering or similar discipline.

• Minimum 5 years of related experience supporting semiconductor, solar, or other similar manufacturing facilities.

• Technical training in plant engineering or maintenance, or comparable professional experience.

• Able to manage materials which contain hazardous chemicals.

• Self-directed, self-motivated, and self-managing with ability to simultaneously prioritize tactical and strategic objectives.

• Strong teamwork and communication skills.

Preferred qualifications:

• Ability to motivate, manage and work with others at all levels in the organization.

• Ability to supervise and prioritize multiple projects at once, delivering results and best reliability.

• Strong preventative management skills needed to support facilities systems operating flawlessly.

• Able to keep Hook Up section supporting document control and upkeep of tools’ schematic and documents.

• Ability to assess problems, applying Root Cause Analysis, and developing corrective/preventative actions.

• Motivated, self-directed, and flexible, possessing good judgment and problem-solving skills.

• Strong teaming, negotiation skills and ability to successfully influence others through collaboration within and across organizations.

• Must be able to deliver clear, concise, and timely oral and written communications.

• Good communication skills along with customer relations.

• Strong leadership qualities with ability to positively influence overall team performance and earn followership.

Position Summary

The Electrical Simulation Engineer is responsible for product package electrical simulation. 

Candidates with semiconductor packaging experience are encouraged to apply for this position. 

Responsibilities 

• Conduct simulation on SiPi and High speed digital area in component & system level 

• Conduct simulation on RF, EMI, EMC, in component & system level 

• Provide comments and recommendation to product design and process optimization 

• Provide electrical input to mechanical simulation for thermal and stress analysis. 

• Prepare the simulation reports with data analysis and recommendation. 

• Other ad-hoc activities assigned by the reporting manager. 

Requirements

• Master Degree in electrical engineering or similar discipline. 

• At least 5 years’ experience in electrical simulation, internal & customer projects. 

• Hands-on skills on EDA tools: Cadense (PowerSi, PowerDC, ExtractIM, Clarity, etc), ANSYS (Siwave, Q3D, HFSS, Circuit, etc.), Keysight (ADS, etc.)

Position Summary

The Process Associate Engineer (Backend) is responsible to support the engineering activities as well as the daily production activities reliably and efficiently. 

Candidates with related experience in Semiconductor and LCD processes are encouraged to apply for this position. 

Responsibilities 

• Ensure process integrity for machines related to production 

• Monitor process via SPC chart/real time monitoring system 

• Work on continuous improvement projects 

• Perform lots on hold and disposition 

• Support in recipe setup and qualification for production 

• Troubleshoot process-related issue 

• Collect engineering data 

• Prepare manufacturing documents 

• Maintain good housekeeping in the production area 

• Any other ad-hoc duties as assigned by reporting supervisor 

Requirements 

• Minimum Diploma in Electrical / Electronics / Mechatronics / Mechanical/ Microelectronics Engineering or similar disciplines 

• Prior process experience in Backend Processes: Pick and Place, SMT/SMD, Ball mounting, Reflow, Laser Marking and Package Sawing would be advantageous

• Experience in Packing (TnR, Tray, MBB, etc) is an added advantage 

• Experience working in semiconductor manufacturing environment 

• Experience in manufacturing documentation of SPC, WI, SOP, FMEA, etc. 

• Able to work under various shift patterns. The selected candidate will start with normal office hours, and eventually transition to 12-hour rotating shift between day and night