As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) High Bandwidth Memory (HBM) Returned Material Authorization (RMA) Engineer at Micron Technology, Inc., you will be responsible for overseeing and tracking the formal Failure Analysis (FA) of customer-returned product. You will summarize analysis at the electrical and physical level, identify root cause, and establish associated containment plan. In this role, you will work with various engineering and manufacturing groups to evaluate and implement corrective actions (CAs) for the identified issues. You will also be required to regularly communicate FA results to customers as well as other Micron engineering and manufacturing teams. Additionally, you will need to sustain knowledge of device capabilities and characteristics along with a basic understanding of the associated manufacturing processes.
The DEMQRA RMA Engineer must demonstrate the ability to handle multiple customers and deal with multiple issues at one time, while providing detailed and timely follow-up between all applicable internal organizations at Micron.
You will:
Manage FA of Customer Concerns
Understand the customer complaint as it relates to the DRAM component or module
When not already provided, initiate contact with customer or customer representative to identify specific failing conditions
Oversee and direct initial bench level, system level, and ATE level analysis and interpret results
Coordinate detailed component level analysis (electrical (EFA) and physical (PFA)) and interpret results
Manage Communication of Results with Manufacturing and Engineering Teams
Review feedback/Corrective Action (CA) from various manufacturing areas
Ask follow-up questions as necessary to provide an adequate customer response
Translate results to a customer friendly format
Analyze data from various sources for trends and variations
Communicate the needed process improvements
Provide FA Reports to External Customers
Summarize the RMA background and FA results
Identify the root cause and potential improvements for use in reports
Identify and provide containment information and associated risk assessment
Generate both interim and final FA reports for customer consumption
Provide customer support for ongoing questions/concerns related to the FA report
Maintain Knowledge of Device Capabilities and Characteristics
• Understand the latest process technology
• Recognize differences from previous technology nodes with the associated risks
• Understand the datasheet specifications for each device
• Stay up-to-date on common customer DRAM applications
• Partner with field support teams to understand ongoing customer status
Education:
Required Qualifications:
5+ years of experience in semiconductor field
Knowledge of DRAM operation, fabrication process and semiconductor device physics
Advanced understanding of electronic circuit.
Basic understanding of DRAM/motherboard/CPU architecture and operation.
Familiarity with failure analysis, troubleshooting/debugging, advanced packaging, wafer testing, component testing and module testing concept and flow.
Good written and oral communication skills
Self-confidence in speaking and chairing a meeting.
Experienced in computer, laptop or server OEM and focus on system level debug or CPU or DRAM or SYSTEM FAE is a plus.
