Total 12 test engineer job vacancies in Engineering category

ESSENTIAL DUTIES AND RESPONSIBILITIES: 

• Perform failure analysis, root cause investigation, and fault isolation on SSD products during NPI, qualification, and mass production phases using test logs, diagnostic tools, and hardware analysis techniques. 

• Debug hardware and manufacturing-related failures by analyzing tester logs, power rails, NAND, DRAM, controller behavior, and interface issues to drive corrective and preventive actions. 

• Collaborate with cross-functional teams including Product Engineering, Process Engineering, Quality, Manufacturing, and Suppliers to resolve yield, process, and test related issues. 

• Develop and maintain debug procedures, cookbooks, troubleshooting guides, debugging tools, and knowledge databases to improve diagnostic accuracy, turnaround time (TAT), and operational efficiency. 

• Generate technical reports and present failure findings, corrective actions, and yield improvement recommendations to management and stakeholders while supporting continuous improvement initiatives. 

ESSENTIAL DUTIES AND RESPONSIBILITIES: 

• You will work as SiP (System In Package ) package integration engineer in packaging engineering group. Leads new SiP product development from concept design and qualification to mass production. Generate innovative product concepts and transform them into tangible, market-ready products.
• Work closely with global functional teams in US, India, China, and Taiwan, review feasibility design drawings and propose design options. Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFx (Design for x) analysis, Product performances , Quality , Cost , Manufacturability and etc, as well as review mechanical and electrical simulations, initiate assembly process flow, and deliver most optimized design for manufacturing with yield and quality.
• Ensuring build readiness, execute package qualification plan, follow up package reliability status, investigate and close failures on time. Monitor assembly and test yield on engineering/customer sample and low volume production builds. Drive yield improvement and manage excursions.
• Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production.
• Lead new technology transition (new wafer tech/process/material) from engineering stage to volume production.

ESSENTIAL DUTIES AND RESPONSIBILITIES: 

• Develop/Characterize, validate & verify new process dev for NPI products to successful qualify 
• Design and develop processes to optimize efficient process flow, reduce process or product variability, improve process capability 
• Develop process improvements for high efficiency and cost effectiveness 
• Develop and maintain process optimization and validation programs 
• Evaluate current processes and provide recommendations 
• To review & buyoff process CTQs data, PFMEA, control plan, SPC 
• To work close with design team for new packing/giftbox construction relate to process window/guideline 
• Sustaining production process/assembly engineering management: Yield/Cycle time/production efficiency CIP 
• Cost saving initiative from product and process introduction 

ESSENTIAL DUTIES AND RESPONSIBILITIES 

In this position, you will work in the Material Engineering team within the Packaging R&D organization who owns and deploys best-in-class material engineering solutions to the top-edge product and technology development across advanced semiconductor packaging, flash memory product and host levels. Your essential duties and responsibilities include:

• Drive advancement in packaging materials by addressing material-related design and process challenges. Develop solutions to support next-generation package requirements, including smaller form factors, thinner die, higher interconnect density, increased power, and enhanced reliability.
• Lead the evaluation, development, and qualification of advanced packaging materials for both product development and high-volume manufacturing. Ensure compliance with industry standards and sustain high material quality to enable reliable, high-yield, and cost-efficient manufacturing.
• Responsible for material characterization, lab testing, and design of experiments (DOE) to simulate manufacturing processes and use-condition failure. Analyze thermal, mechanical, and environmental performance to ensure materials meet reliability and performance targets.
• This position will interface with package and product design (in particular, thermal and mechanical), reliability, failure analysis, assembly R&D, and process teams to define material requirements and solutions. Collaborate with suppliers to develop, optimize, and qualify materials for successful production integration.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
• The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
• The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.

ESSENTIAL DUTIES AND RESPONSIBILITIES: 

• Maintain and develop the reliability test procedure.
• Managing the reliability test capability, improvement /automation. 
• Characterize various test profiles to meet customer specific requirements.
• Hands-on experience (tester setup) with automated test equipment (tester) and environmental chambers focusing on Temperature Cycling Test (TCT), Temperature Humidity, Highly Accelerated Stress Test (HAST) or other relevant equipment.
• Develop reliability test capability /test programs/ testing methods for new products or technologies.
• Involve in tester development & improvement. 
• Hands-on experience with electronic testing, debugging, and measurement tools (e.g., oscilloscopes, multimeters, thermal chambers, power supplies) or any other relevant tools/ equipment.
• Build and maintain dashboards and visualizations to support data‑driven decision making within the Reliability Engineering team.
• Support equipment and lab readiness initiatives through data tracking, automation, and system enablement.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Maximize wire bond process capability to handle wide range of product portfolio.
• Drive for Wire Bond process yield improvement and monitoring.
• Drive for Wire Bond related test QDN investigation and improvement plan.
• Drive for wire bond related improvement projects.
• Hand-sake with NPI team on new technology / product / wire bond methodology transfer to mass production.
• Liaise and work with equipment team on equipment related improvement and new machine qualification.
• Project management in project related to wire bond yield improvement, cost saving and process efficiency.

We are seeking a highly skilled and motivated Staff Engineer to join our Automation Development Engineering team. The ideal candidate will possess strong expertise in multi-system integration, equipment communication (SECS/GEM), .NET technologies (C# and VB), web services, database management (Oracle and SQL Server), and development tools such as TFS. You will collaborate closely with factory operations and internal IT teams to gather requirements, design and develop solutions, and ensure seamless deployment and support.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Design and develop automation applications to support factory operations.
• Analyze business challenges and deliver efficient, scalable solutions.
• Provide technical expertise to evaluate and implement cost-effective systems and procedures.
• Collaborate across departments to gather requirements and deliver solutions that emphasize reusability, scalability, and simplicity.
• Investigate and resolve operational issues, conduct root cause analysis (RCA), and implement preventive measures.
• Manage all phases of the Software Development Life Cycle (SDLC), ensuring thorough documentation and alignment with business needs.
• Work independently or as part of a team to execute tasks and projects assigned by project leads or managers.
• Provide Level-2 technical support to the 24/7 application support team.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Integrate assembly/test data pipeline, analyze and transform process data.
• Develop new process for NPI, transfer to HVM without major quality issues. 
• Analyze and optimize existing manufacturing processes to enhance efficiency and product quality.
• Develop and implement process improvement initiatives using methodologies such as Six Sigma and Lean.
• Design and conduct experiments to troubleshoot process issues and validate improvements.
• Develop and maintain factory automation applications with modern frontend tools.
• Develop and optimize Oracle SQL and Microsoft SQL Server queries for data access and reporting.
• Integrate factory systems and manufacturing equipment via web services, API calls, or SECS/GEM communication protocols.
• Collaborate closely with process, equipment, factory automation and IT teams to deliver robust and efficient automation, machine learning and AI solutions.

• Providing technical leadership and expertise to define requirements for framework through programming/scripting of verification and emulation flows.
• Partnering with ASIC engineers to deploy and support framework for technologies like advanced verification environment configuration and management.
• Collaborating cross-functionally to optimize verification and emulation workflows and standardize methodologies.

In this position, the individual will be responsible for design & development of device FW for next-generation PCIe / NVMe SSD products.

Responsibilities:

• Design, implement, debug firmware for the next generation of SSDs
• HW Interface drivers, algorithm design and implementation
• Contribute to the SSD firmware and play a significant role in delivering next generation SSDs to market
• Design and implement firmware algorithms needed to achieve best in class performance goals
• Support failure analysis on test systems
• Active participation in technical design, implementation reviews across teams and functions

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified, and introduced into production in a timely manner while meeting all mechanical, electrical, performance, reliability, and quality requirements.        
• Lead cross-functional teams, factories, and other engineers while managing the entire package life cycle process.          
• Works with the Packaging R&D teams worldwide to develop and qualify new and emerging packaging technology required to support business needs
• Support assembly yield improvement and package cost reduction programs.  
• Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production.
• Work on innovative ideas for best-in-class package design.