Total 9 job vacancies by Stats Chippac Pte. Ltd.

• To support and maintain business web applications.
• To discuss with business users to understand business requirements for systems enhancements.
• To provide enhancement to the systems based on time to time business needs.
• To liaise and support year-end audit activities on related systems eg., wafer map systems
• To maintain and enhance operation web applications related to MES related systems.
• To write technical procedures and documentation for the applications including operations, user guide, etc.
• To Investigate and resolve application functionality with vendor, if enhancement is needed.
• To assist in troubleshooting software application issues.

Required Experience and Qualifications (Required knowledge, skills and experience---however acquired):

• Degree in Computer Science or Computer Engineering with at least 2-5 years’ of relevant experience
• Experiences in Platforms like ASP.Net, VB.Net, and C#.net with J2 EE & JavaScript are required.
• Hands on experience in Oracle & SQL Server databases SQL queries and stored procedures.
• Knowledge in SQL Server Reporting Service will be added advantage.
• Been through at least 2 cycles of full SDLC Implementation.
• Understanding of the semiconductor industry business will be added advantage.
• Independent,strong analytical skills and ability to work under pressure with tight deadlines.

As a Senior/Staff LithographyProcess Engineer, you will lead the development and optimization of lithographyprocesses for both Fan-In and Fan-Out eWLB (Embedded Wafer Level Ball GridArray) packaging technologies. You will be responsible for driving keyengineering projects such as yield improvement, cost reduction, and processtransfers across global manufacturing sites.

Key Responsibilities:

• Own and optimize lithography processes for PI, PR, and other patterning layers in both FO and FI eWLB.
• Manage photolithography tools (GHI/i-line stepper, coat/develop tracks, etc.), including recipe setup and troubleshooting.
• Lead cross-functional projects focused on cost reduction, process robustness, and NPI transfer.
• Lead process improvements to enhance yield, throughput, and cost efficiency.
• Evaluate and implement new lithography materials (PSPI, PR) and tools.
• Define and maintain process documentation (SOP, OCAP, FMEA, SPC) and training programs.
• Collaborate with equipment vendors, materials suppliers, and internal engineering teams to evaluate and qualify new tools or materials.
• Design and perform DOE, root cause analysis, and statistical data analysis (e.g., JMP, Camline, etc.).
• Support daily fab operations with issue resolution and yield improvement initiatives.
• Mentor junior engineers and provide technical direction to the litho team.
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Qualifications:

• Bachelor’s or Master’s degree in Engineering (Materials, Chemical, EE, or related field).
• 5+ years hands-on experience in photolithography process, preferably in advanced packaging (eWLB, WLP, FO-PLP).
• Strong knowledge of lithography tooling, including exposure systems and coater/developer tracks.
• Skilled in project management, process transfer, and cost/yield improvement.
• Familiar with SPC, FMEA, and problem-solving methodologies.
• Excellent communication skills, with proven ability to engage with both internal stakeholders and external customers.
• Fluent in both English and Chinese. (This role will need to liaise with customers and counterpart from China)

• Co-ordinate / Execute new  product offloads plan
• Interface with customer on product offloads and provide assessment and information on test capabilities and providing resolutions to barriers/constraints
• Performs required test correlation, evaluation, and test characterization on new product offloads, and shall  communicate to customer the test results or if any- test correlation issues and resolutions
• Generate Test Setup Specification based on customer’s test requirements for production to support the product
• Identify andclose gaps in product and test cell performance to meet organization goals
• Evaluate and recommend process change/s forimprovements to help improve yield, quality, and cycle time
•  Provide required test support needs by Customers /Resident Engineers
• Sustain test program, hardware and major setupissues in mass production

Required Experience and Qualifications (Required knowledge, skills and experience---however acquired):

• Strong ability to develop and modify test programs
• Degree in Electronics / Electrical Engineering or its equivalent
• Diploma in engineering or its equivalent with minimum 5 years of working experience

Purpose of the Job

• To perform technical maintenance and optimization of advanced packaging equipment (Bump, RDL, CoW, MEOL) to ensure high-precision processing, maximize tool uptime, and support stable mass production.

Key Job Accountabilities:

• Execute scheduled PM and emergency repairs (BM) on diverse toolsets including PVD (Sputter), ECD (Plating), Lithography (Stepper), and TCB/Hybrid Bonders.
• Calibrate high-precision sensors and actuators to maintain critical process parameters (e.g., bonding force, temperature uniformity, and alignment accuracy).
• Diagnose and resolve complex mechanical and electrical failures using schematics, diagnostic software, and measurement tools.
• Track the consumption of critical components and suggest improvements for part lifetime extension.
• Maintain detailed logs of equipment history, repair procedures, and safety checklists.

Required Experience and Qualifications

• Bachelor’s degree in Electrical, Electronic, Mechanical Engineering, or a related field.
• Understanding of the Wafer Level Packaging (WLP) process flow and equipment hardware architecture.
• Ability to read/interpret mechanical drawings and electrical schematics. Proficiency in using multimeters, oscilloscopes, and precision gauges.
• Comfort working in a cleanroom environment and flexibility for shift rotations.

Purpose of the Job:

• To continuously improve Wafer processes and capabilities to attain the highest quality and productivity through work simplifications and standardization, implementation of best-known methods and controlled operating procedures

Key Job Accountabilities:

• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time. 
• To provide interim and long-term corrective actions for any discrepancies.
• Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

Scope of the Job:

• In-charge of photo resist coat, exposure, develop and curing process for PI (e.g. HD4100) and PR (Positive, Negative).  Different photo sensitive material is coated in different machines and different exposure machine types (steppers & aligners).
• Setup recipe for new devices.  Process characterization for every new device: coating thickness, exposure recipe and CD after develop. 
• Working closely with mask designer to continuously update wafer process design rules so to improve process capability and productivity.
• Perform continuous improvement activities for top defects, process simplification and throughput improvement.
• Monitor process capability in terms of input parameter control and SPC monitoring

Required Experience and Qualifications:

• Requires Degree in Engineering, Material Sciences, Chemistry or equivalent
• Minimum 2 years of relevant experience in wafer bumping or wafer fabrication
• Minimum 5 years of experience in relevant area is an added advantage

To attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and implement robust system solutions.

Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time.

Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

Ability to lead cross functional teams to drive improvement.

• Write process specifications and operator instructions
• Sustain and provide continuous process improvement through evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of cost, yield and cycle time.
• Support on new device, new material and new equipment qualification.
• To provide interim and long-term corrective actions for any discrepancies.
• To support photolithography process including yield improvement, SPC control, trouble shooting on stepper and track issues

Required Experience and Qualifications

• Requires Degree in Electrical, Electronics, Mechanical, Materials Engineering, Physics, or Chemistry.

Key Job Accountabilities

• Write process specifications and operator instructions
• Sustain and provide continuous process improvement through evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of cost, yield and cycle time.
• Support on new device, new material and new equipment qualification.
• To provide interim and long-term corrective actions for any discrepancies.

Required Experience and Qualifications

• Requires Degree in Electrical, Electronics, Mechanical, Materials Engineering, Physics, or Chemistry.
• Minimum 5 years of relevant work experience in process as Engineer.

• To attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and implement robust system solutions.
• Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time.
• Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.
• Ability to lead cross functional teams to drive improvement.