Total 8 job vacancies by Sandisk

ESSENTIAL DUTIES AND RESPONSIBILITIES: 

• You will work as SiP (System In Package ) package integration engineer in packaging engineering group. Leads new SiP product development from concept design and qualification to mass production. Generate innovative product concepts and transform them into tangible, market-ready products.
• Work closely with global functional teams in US, India, China, and Taiwan, review feasibility design drawings and propose design options. Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFx (Design for x) analysis, Product performances , Quality , Cost , Manufacturability and etc, as well as review mechanical and electrical simulations, initiate assembly process flow, and deliver most optimized design for manufacturing with yield and quality.
• Ensuring build readiness, execute package qualification plan, follow up package reliability status, investigate and close failures on time. Monitor assembly and test yield on engineering/customer sample and low volume production builds. Drive yield improvement and manage excursions.
• Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production.
• Lead new technology transition (new wafer tech/process/material) from engineering stage to volume production.

ESSENTIAL DUTIES AND RESPONSIBILITIES 

In this position, you will work in the Material Engineering team within the Packaging R&D organization who owns and deploys best-in-class material engineering solutions to the top-edge product and technology development across advanced semiconductor packaging, flash memory product and host levels. Your essential duties and responsibilities include:

• Drive advancement in packaging materials by addressing material-related design and process challenges. Develop solutions to support next-generation package requirements, including smaller form factors, thinner die, higher interconnect density, increased power, and enhanced reliability.
• Lead the evaluation, development, and qualification of advanced packaging materials for both product development and high-volume manufacturing. Ensure compliance with industry standards and sustain high material quality to enable reliable, high-yield, and cost-efficient manufacturing.
• Responsible for material characterization, lab testing, and design of experiments (DOE) to simulate manufacturing processes and use-condition failure. Analyze thermal, mechanical, and environmental performance to ensure materials meet reliability and performance targets.
• This position will interface with package and product design (in particular, thermal and mechanical), reliability, failure analysis, assembly R&D, and process teams to define material requirements and solutions. Collaborate with suppliers to develop, optimize, and qualify materials for successful production integration.

We are seeking a highly skilled and innovative senior engineer to lead our technical team in bringing new products to market within a dynamic environment. In this role, you will lead and contribute to the development and implementation of advanced test engineering strategies for our cutting-edge storage products. Below are the key responsibilities:

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Optimize Test Strategies: Design and execute efficient test plans, test time, yield, and quality to meet factory financial goals. Identify cost-effective testing methods through troubleshooting, validation, and continuous improvement.
• Lead and Collaborate on Engineering Solutions: Lead and implement innovative engineering solutions while collaborating with cross-functional teams to ensure project success under competitive timeline.
• Champion Innovation and Cost Efficiency: Collaboratively integrate advanced testing technologies, research, and adopt cost-saving solutions like Test Time Reduction (TTR) and new test platforms, driving CAPEX reduction. Continuously improve test programs and test infrastructure to enhance product quality and reliability.
• Technical Expertise and Support: Provide leadership in electrical failure analysis (EFA), exploring new test method/EFA technique to address RMAs, production, reliability, and DPPM improvement. Analyze test results and deliver reports to stakeholders with actionable insights for improvement.
• Technical Communication and Documentation: Develop and deliver clear, concise technical reports and documentation, including EFA, work instructions, test equipment guidelines, test reports, and specifications.
• NPI Support: Lead NPI projects, ensuring smooth transfer of test technology to mass production.
• Knowledge Sharing and Mentorship: Mentor junior engineers, promote best practices, and facilitate knowledge transfer through technical training.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Handle creation of fixed assets and manage asset retirement processes (scrapping, sale etc).
• Manage asset transfers between different legal entities, ensuring accurate recording of intercompany or cross-segment movements.
• Oversee Construction-in-Process (CIP) management: review CIP balances and aging, convert CIP to capitalized fixed assets, and initiate depreciation.
• Perform month-end close activities including preparing journal entries, Fixed Asset subledger close, Roll forward report etc.
• Coordinate biennial physical count of fixed assets to confirm existence, condition, and location against the Fixed Asset Register.
• Prepare and present monthly account reconciliations, close analytics, variance analysis and ad hoc reports.
• Liaise with external professional parties to fulfill local statutory obligations.
• Manage internal and external audit.
• Drive process improvement and automation to streamline end to end processes.
• Support new business initiatives and address risk and concerns
• Handle ad-hoc projects assigned by various business parties

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Responsible for product development and high volume SSD manufacturing is desired.
• Perform manufacturing yield evaluation and data analysis for yield improvement.
• Responsible for prepare, validate and release test package to Agile system.
• Responsible for Failure Analysis of products to meet yield goals and quality targets.
• Interfaces with core team (FW/HW) as well as internal team to solve problems.
• Ability to work with various departments to facilitate the orderly execution of a proposed project plan.
• Participate & contribute in tester/infrastructure and process improvements.
• Ability to read the electrical schematic diagram is an advantage.
• Work closely with departments within the company to ensure product able to meet the delivery timeline.
• Ability to work independently with minimum supervision. 
• Ability to provide guidance to teammate.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Maximize wire bond process capability to handle wide range of product portfolio.
• Drive for Wire Bond process yield improvement and monitoring.
• Drive for Wire Bond related test QDN investigation and improvement plan.
• Drive for wire bond related improvement projects.
• Hand-sake with NPI team on new technology / product / wire bond methodology transfer to mass production.
• Liaise and work with equipment team on equipment related improvement and new machine qualification.
• Project management in project related to wire bond yield improvement, cost saving and process efficiency.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Integrate assembly/test data pipeline, analyze and transform process data.
• Develop new process for NPI, transfer to HVM without major quality issues. 
• Analyze and optimize existing manufacturing processes to enhance efficiency and product quality.
• Develop and implement process improvement initiatives using methodologies such as Six Sigma and Lean.
• Design and conduct experiments to troubleshoot process issues and validate improvements.
• Develop and maintain factory automation applications with modern frontend tools.
• Develop and optimize Oracle SQL and Microsoft SQL Server queries for data access and reporting.
• Integrate factory systems and manufacturing equipment via web services, API calls, or SECS/GEM communication protocols.
• Collaborate closely with process, equipment, factory automation and IT teams to deliver robust and efficient automation, machine learning and AI solutions.

ESSENTIAL DUTIES AND RESPONSIBILITIES: 

• Perform data mining and analytics for Quality Assurance (QA) in semiconductor Assembly & Testing processes
• Understand QA business workflows (e.g., SPC, 8D, defect management) and translate business needs into scalable data solutions
• Design and develop end-to-end data pipelines, including data ingestion, transformation, modeling, and visualization
• Develop analytical methods such as anomaly detection, trend analysis, and predictive modeling to enhance quality control
• Drive the transformation of quality management from manual processes to automated and intelligent systems
• Develop dashboards, reports, and automated QA-related business applications
• Collaborate with IT, data teams, and business stakeholders to integrate data platforms with operational systems
• Explore and implement AI/GenAI use cases in quality engineering, such as intelligent insights and automated reporting