Total 9 Senior Executive level Engineering job vacancies in BAYAN LEPAS

A. Position Objective

The Girder Launching Engineer is responsible for overseeing the technical planning and on-site execution of segmental box girder (SBG) erection. This role ensures that all launching activities are conducted safely, on schedule, and in strict adherence to engineering specifications and quality standards.

B. Job Responsibilities

• Method Statement & Planning: Compile and refine comprehensive construction schemes and method statements for full framing support and girder launching sequences.
• Technical Drawing: Prepare and review detailed construction drawings, including traffic diversion plans (TDP), launching gantry positions, and temporary works.
• Quality Control: Strictly monitor and control the construction quality related to segmental box girder (SBG) erection, ensuring precise alignment, leveling, and structural integrity.
• Documentation: Compile, maintain, and submit internal engineering documents, site diaries, inspection records (RFI), and progress reports.
• Site Supervision: Supervise the launching crew and subcontractors to ensure compliance with safety protocols and technical requirements.
• Ad-hoc Duties: Undertake other assigned tasks related to bridge/viaduct construction and girder erection as directed by the Project Manager.

C. Job Requirements

• Minimum 3–5 years of site experience specifically in Segmental Box Girder (SBG) erection.
• Candidates with proven experience in LRT, MRT, or major Highway viaduct projects will be given top priority.
• Must be proficient in English, and Malay to facilitate communication between stakeholders, site workers, and management. Proficiency in Chinese is an added advantage.
• Highly skilled in AutoCAD for construction drawings and Microsoft Office for reporting.
• Excellent communication and coordination abilities, with a problem-solving mindset for site-specific challenges.
• Diploma or Bachelor’s Degree in Civil Engineering or a related field.

Perks & Benefits

• Allowance (Mobile, Computer, Transportation, Meals, etc.)
• Medical insurance
• Open culture
• Paid training and development

A. 定位目標

樑架設工程師負責監督節段箱樑（SBG）架設的技術規劃和現場施工。此職位確保所有架設作業安全、按時完成，並嚴格遵守工程規範和品質標準。

B. 工作職責

• 方法說明和規劃：編制和完善全面的施工方案和方法說明，以實現完整的框架支撐和樑架設順序。
• 技術繪圖：準備和審查詳細的施工圖紙，包括交通改道計畫（TDP）、架設龍門架位置和臨時工程。
• 品質控制：嚴格監控和控制節段箱樑（SBG）安裝相關的施工質量，確保精確的對齊、水平和結構完整性。
• 文件編制：編制、維護和提交內部工程文件、現場日誌、檢查記錄（RFI）和進度報告。
• 現場監督：監督發射人員和分包商，確保遵守安全法規和技術要求。
• 臨時性任務：根據專案經理的指示，承擔與橋樑/高架橋施工和樑架設相關的其他分配任務。

C. 工作要求

• 至少 3-5 年現場經驗，尤其是在節段箱樑 (SBG) 架設方面。
• 具有輕軌、地鐵或大型高速公路高架橋專案經驗的候選人將優先考慮。
• 必須精通英語和馬來語，以便與利害關係人、現場工作人員和管理層進行溝通。精通中文者優先考慮。
• 精通 AutoCAD（用於建築繪圖）和 Microsoft Office（用於報告撰寫）。
• 具備優秀的溝通和協調能力，並能針對具體現場挑戰提出問題並解決問題。
• 土木工程或相關領域的文憑或學士學位。

福利待遇

• 津貼（手機、電腦、交通、餐費等）
• 醫療保險
• 開放文化
• 有薪培訓和發展

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• To plan, coordinate and follow-up sputter systems start-up / conversion activities and process documentation.
• To audit sputter parameters and practice periodically, include online SPC and procedure conformance.
• To lead sputter process related issues trouble shooting (common causes), work closely with shift process team in sputter process sustaining, trouble shooting & improvement in order to achieve sputter utilization (down time), yield & quality goal.
• To lead Sputter Process Improvement Projects (SU/STT/Cost/Quality/PPH & others), which include new products/machines/process qualification.
• To lead, supervise and coach/train process tech, include engineering specialist and characterize technicians.
• Responsible for sputter process related issues trouble shooting (common causes), work closely with Shift process team in sputter process sustaining, trouble shooting & improvement in order to achieve sputter utilization (down time) & quality goal.
• Responsible to lead, supervise and coach/train process tech, include engineering specialist and characterize technicians. Responsible to train and share PMR/DS sputter process and yield improvement knowledge with the team.
• Responsible for sputter parameters monitoring, include online SPC monitoring and procedure conformance.
• Responsible for sputter machine start-up include process characterize (new products & process changes).
• Responsible for new products/machines/process qualification.
• Responsible for sputter process improvement projects (SU/STT/Cost/Quality/PPH & others).

Others include FMEA.

• Understand and accept responsibility for performing jobs safely
• Follow safety and health rules
• Responsible to assist in sputter yield related issues trouble shooting (common causes).
• Work closely with Anelva yield team in sputter yield sustaining, trouble shooting & improvement in order
• to achieve sputter yield goal. This includes 0725 Operation Yield Improvement.
• Other supervisor assigned task
• Improve Media magnetic baseline: ACC% and to enable process stability and repeatability via recipe tuning and optimization.
• Responsible for new product qualifications.  

We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes, particularly die bonding and wire bonding. The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance.

The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.

Key Responsibilities

• Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
• Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
• Support new product introduction (NPI), process qualification, and transfer to mass production
• Establish and maintain process parameters, work instructions, and control plans
• Analyze process data using statistical methods (e.g. SPC, CPK, trend analysis)
• Collaborate with cross-functional teams including Production, Quality, Equipment, and R&D
• Drive continuous improvement activities for cost, yield, cycle time, and reliability 

The Senior Packaging Engineer will lead packaging development and qualification activities for WD's HDD and Flash storage products. This is a technically hands-on and cross-functional leadership role — you will mentor junior engineers, drive complex packaging programs, and interface directly with customers, suppliers, and global engineering teams.

You are expected to operate with high autonomy, make independent technical decisions, and represent the Packaging Engineering function in NPI and sustaining programs.

Key Responsibilities : 
Technical Leadership

• Lead end-to-end packaging design, development, and qualification for complex HDD/Flash programs
• Define packaging architecture and material strategy for new and sustaining products
• Make independent technical decisions on packaging design trade-offs (cost vs. protection vs. sustainability)
• Act as Subject Matter Expert (SME) for packaging within cross-functional teams

Design & Qualification

• Own packaging qualification plans and test execution per ISTA/ASTM standards
• Review and approve packaging specifications, BOMs, and qualification reports
• Lead Engineering Change Orders (ECOs) and deviation requests
• Drive DFM (Design for Manufacturability) and DFA (Design for Assembly) reviews

NPI & Program Management

• Lead packaging workstream for NPI programs from concept to mass production
• Manage packaging milestones and deliverables within program timelines
• Interface with global product teams, customers, and contract manufacturers

Vendor & Supply Chain

• Develop and qualify new packaging suppliers in Malaysia/ASEAN
• Lead supplier performance reviews and cost negotiation
• Drive packaging cost reduction (cost down) initiatives

People & Mentorship

• Mentor and coach junior/mid-level packaging engineers
• Conduct technical reviews and provide guidance on complex issues
• Support team capability building and knowledge sharing

Compliance & Sustainability

• Ensure all packaging meets regulatory requirements (RoHS, REACH, ISTA)
• Champion WD sustainability goals through eco-packaging innovation
• Maintain quality documentation per WD QMS standards

Continuous Improvement

• Lead RCCA for field packaging failures and damage incidents
• Drive Lean/Six Sigma improvement projects within packaging function
• Benchmark industry trends and propose technology upgrades

As a Senior Equipment Engineer specializing in sputter media, you will be responsible for overseeing the operation, maintenance, and continuous improvement of sputtering equipment used in the production of hard disk media. You will work closely with cross-functional teams to ensure optimal equipment performance, minimize downtime, cycle time improvement and contribute to the development of new processes and technologies.
 
ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Develop and implement preventive maintenance schedules to ensure equipment reliability.
• Monitor and analyze equipment performance data to identify areas for improvement.
• Oversee machine installation, maintenance, and repair of sputtering equipment.
• Conduct root cause analysis for equipment failures and implement corrective actions.
• Collaborate with process engineers to develop and optimize sputtering processes.
• Develop project (equipment upgrades) plans, timelines, and budgets, ensuring projects are completed on time and within budget.
• Provide technical expertise, training, and mentor junior engineers/technicians on equipment operation and maintenance best practices. 
• Ensure all equipment and support systems comply with safety regulations and industry standards.
• Prepare and present reports on equipment status, performance metrics, and project progress to management.
• Document standard operating procedures (SOPs) and best practices for equipment operation and maintenance.
• Work closely with cross-functional teams, including process engineers, production managers, and quality assurance, to achieve production goals.
• Perform other duties as assigned by management.

• Develop embedded firmware which run on Bosch products.
• The developed embedded firmware shall base on test requirement from customer, internal engineering and manufacturing.
• The embedded firmware shall be able to interact with manufacturing and engineering test system via physical interface such as Serial, Ethernet, and USB
• Work closely with embedded firmware team in Malaysia and Germany in order to achieve common product development goal.
• Assist global engineering team to perform HW-SW integration bring up during development phases.
• Assist global manufacturing sites in troubleshooting manufacturing related problems.
• Provide postproduction and failure analysis support.
• Collaborate as project team member on Software design matters.
• Capture and evaluate customer, internal requirements and vehicle specific interface requirements. Identify suitable concept in terms of functional, technological and effort.
• Adhere to Bosch Software Engineering Process as e.g.:
  • Perform requirement reviews, design reviews and code reviews.
  • Perform unit testing and release of the software according to SW release process.
• Develop the SW design taking into consideration the dependencies to other module and integration into the overall system.
• SW programming using both standard and proprietary software tools and libraries.
• Create SW test specifications and protocols, if necessary, develop test SW. Executes test plans to ensure new software meets specifications, functionalities and performance requirements.
• Analyze failure logs, clarify system problems and resolve design issues.
• Develop and produce technical reports, design analysis and documentation in support of designs.

We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC), and Vertical Power Delivery (VPD) are rapidly increasing their demand for higher density, higher reliability, and high thermal dissipation package technologies.

This role offers the opportunity to work on cutting edge technologies such as power packages for AI/HPC, VPD, Server VR core/peripheral, and Accelerator/GPU markets and contribute to the development of packaging technologies that underpin innovations shaping society, including AI and next generation mobile computing.

Key Responsibilities:

• Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module and power device packaging
• Work with OSAT/CM to develop, run DOEs to optimize processes and establish process specifications.
• Work with Product Groups and Reliability teams to qualify new packages and processes within required time frame.
• Ensure smooth transition into production by resolving all process integration issues, establishing production controls and monitors, and monitoring / resolving process issues.
• Develop and maintain technical expertise on advances and innovations in advanced leadframe, power SiP/modules, and flip chip interconnects.
• Address internal and external customer complaints working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.

Support continuous improvement and automation initiatives, productivity and quality excellence.

Key Responsibilities:

Test Manufacturing (Backend Operation) process improvements:

• Backend Process improvement (Standardization and automation)
• Product Yield improvement
• Product Quality improvement (Poka Yoke)
• Backend equipment and Productivity improvement
• New Equipment qualification and buyoff 
• Specs initiate, revise, and update in Agile system
• Support Internal Audit and Customer Audit
• RMA/ Customer Complain Investigation and Analysis
• New Packages BOM setup in Agile system
• Drive Automated processes to minimize human intervention error