Total 7 job vacancies by United Test And Assembly Center Ltd

Responsibilities: 

• Responsible for maintaining optimal machine performance through downtime troubleshooting including diagnosis and resolve of machine issues efficiently, implement long-term solutions for recurring problems, collaborate with vendors and assist in updating ISO documentation to minimize downtime.
• Perform preventive maintenance by identifying potential part failures and recommend improvements to extend component life, ensuring smooth and efficient equipment operation.
• Support new machine qualification (PAC/buy-off) and ensure machines meet safety standards and verify parts against specifications.
• Assist engineers in preparing work point instructions (WPI) to facilitate smooth product introductions and business growth.
• Manage machine-related spare parts, including stock checks and order placements.
• Recommend cost-saving measures through localization or vendor changes to reduce cost.

Requirements: 

• Diploma in Engineering, specializing in Electrical / Mechatronics / Mechanical

Responsibilities;

• Line sustaining for dry process (i.e. Sputter, Photolithography and Descum)
• Support lot dispositions and OCAP executions
• Involve in Continuous Improvement Projects
• Working with QM Dept. to response customer inquires and issues
• Execute CIP or project handling that contributes yield & cost efficiency improvement
• Ensure SPC is maintain and in control
• Support new material evaluation and new tool set up

Requirements;

• Diploma in electronics or related disciplines
• Preferably with minimum 2 years' experience in Wafer bumping process running high volume
• Knowledge in: Statistic Process Control (SPC), Out Of Control Procedure (OCAP)

Responsibilities:

• Introduce WLCSP new devices into mass production(concept, design, verification, validation, and manufacturing releases of new products)
• Lead and manage new product, ensure on time delivery as committed with the customer
• Works and communicates with customers to understand qualification requirements and expectations of the new product
• Translate customer's engineering build instructions to Special Work Request
• Review and delegate external specifications from customers pertaining to each device/product to relevant team
• Coordinate with Design and Process Engineering Team on the action items to ensure product is within the site capability and manufacturing flow
• Publishes and reviews engineering reports, including all issues found and resolved during developments, as well as yield reports and analysis.
• Makes smart and sound decisions to support quick turn around on sample and engineering builds
• Maintains lifecycle/document management from Qualification to Production lifecycle phase thru eNPI system.
• Attends daily meeting to check NPI builds movement and issues encountered during processing and coordinate with Support Group for help needed on execution

Requirements:

• Degree/Diploma in Electrical/Electronic Engineering or equivalent
• Minimum 5 years’ experience in WLCSP/Backend Process/Product/Package Engineering in Semiconductor industry or equivalent preferably from OSAT
• Strong project coordination, communication, and problem-solving skills

Responsibilities

• Maintain and ensure stable communication between equipment and host systems - Tools: GPTC UFO-300, AMAT charger, Evatec Hexagon, LAM sabre, Althete BM-1310W
• Troubleshoot and resolve issues when equipment fails to connect or respond to host commands
• Perform sustaining activities to support daily manufacturing operations
• Ensure equipment capability and integration within PPC, RMS, and FDC systems
• Work with Inficon FDC system for fault detection and classification to improve process control
• Conduct Equipment Automation testing, including User Acceptance Testing (UAT)
• Collaborate closely with IT CIM teams to analyze tool output data, identify data linkages, and implement data-driven solutions/innovations
• Monitor system performance and implement corrective actions when necessary

Requirements:

• Degree in Engineering/ Information Technology/ Computer Science or equivalent
• 2-3 years of experience in the semiconductor industry or in a manufacturing plant with automation
• Good understanding of SECS/GEM communication protocol in semiconductor equipment
• Familiarity with factory automation systems such as PPC, RMS, and FDC
• Experience with Inficon FDC system for fault detection and classification
• Basic programming knowledge (e.g., Python, C++, scripting) is an added advantage
• Basic knowledge of TCP/IP networking
• Experience in equipment automation or CIM environment is an advantage
• Strong troubleshooting and problem-solving skills

Responsibilities:

• Provide strategic direction and leadership for the 12" bumping engineering team, aligning with company goals and objectives
• Oversee the development, optimization, and qualification of 12" bumping processes, ensuring high yield, quality, and reliability
• Develop and execute a technology roadmap for 12" bumping, staying ahead of industry trends and requirements
• Collaborate with cross-functional teams, including manufacturing, quality, equipment engineering and RnD, to ensure seamless integration of bumping processes
• Manage resources, including personnel, equipment, and budget, to achieve departmental goals and objectives
• Foster a culture of innovation and continuous improvement, identifying opportunities for process enhancements and implementing changes
• Identify and mitigate risks associated with bumping processes, ensuring minimal impact on production and quality

Requirements:

• Bachelor's or Master's degree in Engineering, Physics, Materials Science, or related field
• Minimum 8-10 years of experience in bumping engineering or a related field, with experience in 12" wafer processing
• Strong technical expertise in bumping processes, including process development, integration, and optimization
• Proven leadership experience, with a track record of managing teams and driving strategic initiatives
• Excellent communication and collaboration skills, with ability to work with cross-functional teams
• Strong analytical and problem-solving skills, with ability to identify and resolve complex technical issues

Responsibilities:

• To support day to day shift duties, facility system operation, and preventive/predictive maintenance programs for facilities system, ensuring good system reliability and optimum efficiency
• Conduct routine monitoring of all the Building Facilities and systems such as cooling towers, vacuum pumps, condenser water pumps, AHU, air compressors, air dryers, electrical system, plumbing and temperature & RH monitoring system
• Respond to feedback/issues and perform troubleshooting to restore/resume the operation back to normal
• Assist the Engineer in system improvement and modification projects
• Maintain proper records of maintenance-related documentation
• Assist the Engineer in the development and implementation of maintenance programs
• Coordinate contractor services for equipment maintenance, housekeeping activities
• Coordinate with Vendors to conduct mandatory servicing of facilities system and equipment
• Carry out all daily work activities complying with the applicable local government regulations, applicable corporate directives and applicable standards
• Inspect, identify and resolve issues of facilities system
• Assist the Engineer for inventories tracking such as appropriate spares, consumables, and other resources necessary for the day-to-day operation
• Provide administrative support to upkeep ISO or auditable documentation (i.e. ISO, IATF, RBA, VDA, EAL6, Customers, etc)
• Keep abreast of changes to the applicable local government regulations and applicable corporate directives

Requirements:

• NITEC / Higher NITEC / Diploma in Electrical or Mechanical Engineering
• At least 2 years of relevant experience in a semiconductor or manufacturing environment
• Able to work 12-hour shifts

Responsibilities:

• Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer
• Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production
• Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification
• Initiates team discussion/ review on customer document gaps/ discrepancies and recommend proposals to customer
• Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders
• Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance
• Develop and grow people project management skills, adopting on dynamic changes and crisis management
• Drive for productivity improvement and cost reduction in process integration
• Work with TPM/ Sales/ customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue

Requirements:

• Degree/Diploma in Electrical/Electronics, Engineering or equivalent
• Minimum 3 years of Engineering experience in Semiconductor manufacturing industry
• Preferably with Project Management Certification
• Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred
• Knowledge on WLCSP bumping process of 2P2M; DOE/SPC/ FMEA /JMP/ APQP standard
• Bumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred