Overview
Seeking experienced R&D Engineers to develop and optimize processes across Lithography, Coating/Slit-Coating, CMP, Plating, and Simulation for advanced semiconductor or substrate technologies.
Responsibilities
- Develop and optimize processes to improve yield, uniformity, and reliability
- Perform root cause analysis and resolve process defects
- Use DOE/SPC and data analysis to control key parameters
- Support process integration, NPI, and scale-up to manufacturing
- Collaborate with cross-functional teams (process, equipment, materials)
- Apply simulation/modelling (e.g., CFD) where relevant to optimize processes
Requirements
- Master’s or PhD in Engineering or related field
- 5–10+ years in semiconductor / substrate / advanced manufacturing
- Strong expertise in atleast one:LithographyCoating / Slit-CoatingCMPPlatingSimulation
- Experience with OE, SPC, aDnd process troubleshooting
- Familiar with advanced packaging (e.g., ABF, SAP, Damascene)
