Total 2 Fresh/Entry Level engineering job vacancies in Quality Assurance / Control category in Singapore

As a Test Engineer - Process, you will lead the Project improvement in Burn In area, and support execution and manufacturing issues related to Test Process, and continue improve manufacturing issues with new ideas from time to time through close collaboration across teams and disciplines. In addition, you'll drive Test Process improvements to make our systems more robust and scalable via systematic and proper tools.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Own and sustain burn-in manufacturing processes to ensure stable production performance.
• Monitor burn-in process health, yield trends, uptime, and quality indicators.
• Analyze yield excursions, failures, and process deviations using data-driven methodologies.
• Lead root cause analysis (RCA) and corrective/preventive actions (CAPA).
• Drive continuous improvement initiatives to improve burn-in efficiency, reliability screening effectiveness, and cost reduction.
• Provide timely disposition and technical support for production issues impacting shipment and manufacturing flow.
• Support lot handling, disposition decisions, and recovery actions during abnormal events.
• Support qualification and release of new products into burn-in manufacturing.
• Partner closely with product managers, NPI engineers, Assembly engineers, Manufacturing supervisor and QA to scope, plan, design, and build new features as well as maintain existing functionality.
• Generate and maintain SOPs, OCAPs, FMEA, control plans, and engineering documentation.
• Ensure compliance with manufacturing standards, ESD requirements, and quality management systems
• Participate in audits and customer quality reviews as required.
• Leverage your experience and knowledge to grow your teammates’ technical breadth and depth through direct coaching and mentoring

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• 3D NAND test solution design, assessment, development, and maintenance, including hardware, software, and data analysis.
• R&D and MP program development on multiple platforms including Advantest T5773, T5831 series, & In house designed platforms.
• Test Equipment bring-up and correlation for new packages, including DSA design, pin & channel mapping.
• Product-specific flow creation and integration to meet HVM requirements.
• R&D activities from pre-silicon to post-silicon, including Design Validation, Engineering Evaluation, Qualification Support, and Failure Analysis.
• Engineering investigation and resolution on design/process/packaging issues. 
• RMA failure mode analysis and screen coverage improvements.
• Test data correlation between platforms. Yield enhancement and test time optimization.
• Collaboration internally across multiple departments, such as PE, Device, Packaging, and Design, as well as with external ATE vendors and related parties for debugging and related engineering activities.
• In-house designed platform and new test equipment validation, production environment setup.