Total 219 engineering job vacancies in Information Technology category in Singapore

What We Do

At Goldman Sachs, our Engineers don’t just make things – we make things possible.  Change the world by connecting people and capital with ideas.  Solve the most challenging and pressing engineering problems for our clients.  Join our engineering teams that build massively scalable software and systems, architect low latency infrastructure solutions, proactively guard against cyber threats, and leverage machine learning alongside financial engineering to continuously turn data into action.  Create new businesses, transform finance, and explore a world of opportunity at the speed of markets. Goldman Sachs Engineers are innovators and problem-solvers, building solutions in Artificial Intelligence, risk management, big data, mobile and more.

Cloud Platform

As part of Core Engineering at Goldman Sachs, the Cloud Platform team is responsible for enabling the use of public cloud services across the firm. You will be working as part of multi-disciplinary team responsible for researching, architecting and building a cutting-edge platform that enable Goldman Sachs teams to deploy and manage services in public cloud safely and securely. We are at an early stage of modernizing our services around cloud native principles, and you will be directly contributing to platform that programmatically enforces safety, security and compliance of services and enables engineers to innovate faster.

The organization is seeking highly collaborative, creative, and intellectually curious engineers who are passionate about developing and implementing cutting-edge cloud computing solutions. The ideal candidate will thrive in a DevOps culture and contribute to customer-centric product development. They will work closely with cross-functional teams, and will be creative collaborators who evolve, adapt to change and thrive in a fast-paced global environment.

Responsibilities And Qualifications:
As part of our global Cloud Development team you will work on various components as a Software Engineer. Your role includes specification, development, testing and releasing of new features. The team owns the platforms throughout the lifecycle. You are expected to contribute to the vision, understand our customers’ needs, business goals, product roadmap and contribute to building an engineering culture within the team. We expect the successful candidate to deliver high quality software and to be passionate about software engineering. You must have a proficient understanding of software development, security and the mechanisms to design safe, resilient and highly-available cloud native services.

Key Responsibilities:

• Design, develop and manage services in public cloud.
• Develop safe, resilient and highly-available distributed services.
• Write technical specifications, work with several teams and manage technical dependencies and drive design meetings with various stakeholders for consensus.
• Collaborate with business software engineering teams on solving business problems via the architecture and engineering of cloud native applications.
• Engage with the larger Core Engineering organization to create and deliver usable, safe cloud native engineering patterns with associated guardrails and operational practices.
• Create, communicate, and promote best practices for public cloud native development across the firm.
• Partner with cloud providers such as Amazon Web Services (AWS), Google Cloud Platform (GCP), and Microsoft Azure to shape the future of public cloud services for finance industry.

Basic Qualifications:

• Strong technical ability, willingness to learn and evolve your skills with advances in technology.
• Bachelors' or Masters Degree in Computer Science or related field with at least 5 years of relevant professional experience.
• Proficiency in designing, developing, and testing software in one or more of Java, Type Script, Python; open to using and learning multiple languages.
• Expertise with Linux, containers, system security and automation with scripting languages.
• Experience architecting, designing, administering, or developing applications in Amazon Web Services.
• Ability to communicate technical concepts effectively, both written and orally, as well as the interpersonal skills required to collaborate effectively with colleagues across diverse technology teams.
• Ability to reason about performance, security, and process interactions in complex distributed systems.
• Ability to understand and effectively debug both new and existing solutions.
• Ability to independently deliver on Product Roadmap, Operational Stability and Execution Strategy.

Preferred Qualifications:

• Bachelor or Advanced Degree in Computer Science or related field.
• 10+ years of work experience with Typescript, Java, Python and AWS.
• Knowledge and experience of software development lifecycle and infrastructure-as-code tooling, such as Cloud Formation, Terraform,  and AWS CDK.
• Experience with security, isolation and multi-tenant design of distributed cloud services.
• Familiarity with software artifact and container image lifecycle management and governance.
• Understanding of RESTful API design best practices and experience in developing them.
• Familiarity with cloud network architectures and the integration with hybrid cloud networking.
• Experience with Server-less platforms such as AWS Lambda, AWS Batch etc.

ABOUT GOLDMAN SACHS

At Goldman Sachs, we commit our people, capital and ideas to help our clients, shareholders and the communities we serve to grow. Founded in1869, we are a leading global investment banking, securities and investment management firm. Headquartered in New York, we maintain offices around the world.

We believe who you are makes you better at what you do. We're committed to fostering and advancing diversity and inclusion in our own workplace and beyond by ensuring every individual within our firm has a number of opportunities to grow professionally and personally, from our training and development opportunities and firmwide networks to benefits, wellness and personal finance offerings and mindfulness programs. Learn more about our culture, benefits, and people at GS.com/careers.

We’re committed to finding reasonable accommodations for candidates with special needs or disabilities during our recruiting process. Learn more: https://www.goldmansachs.com/careers/footer/disability-statement.html

© The Goldman Sachs Group, Inc., 2026. All rights reserved.

Goldman Sachs is an equal opportunity employer and does not discriminate on the basis of race, color, religion, sex, national origin, age, veterans status, disability, or any other characteristic protected by applicable law.

Summary of the Job

• To accurately input, update, and maintain data in company systems and records, while ensuring materials and transactions are correctly matched to the respective production orders, supporting data integrity and operational efficiency.

Job Responsibilities:

1) Data Entry & Record Managemnt

• Enter data into systems (ERP, QC Apps)

• Perform data verification and cross- checking to minimise errors and discrepancies.

• Generate daily, weekly, and monthly QC data reports as required by the QC team.

2) Material & Production Order Verification

• Cross-check:
  - Production Order Number
  - Item/ Part Number
  - Quantity
  - Ensure no mismatch between materials and system records

3) Communicate with production, warehouse, and relevant departments to clarify missing or incorrect data

4) Generate daily handover report for QC to Warehouse and secondary process

5) Assist leader on job order closing, timesheet update using ERP

6) Other duties as and when assigned

Job Requirements:

• Secondary/ NTC in Engineering and above

• At least 1 year experience in Data entry/ documentation control

• Knowledge of MS Office

• Ability to communicate orally in English language and produce written documentation with clearly organized thoughts

• Self-motivated, highly resourceful, and organized

Job's mission

As a Senior Principal Engineer in Software Engineering, you will shape the software that directly powers ASM’s advanced packaging and hybrid bonding equipment. Your work will have immediate, visible impact on highly complex semiconductor systems, combining robotics, motion control, thermal systems, and process intelligence. In this role, you will lead software architecture, roadmap definition, and execution across multiple products while growing strong engineering teams and influencing global software strategy.

What you will be working on

• Define and own software development plans and roadmaps for advanced packaging solutions, delivering software across multiple hybrid bonding products in parallel.
• Lead end‑to‑end software development with a strong focus on first‑time‑right quality and robust release execution.
• Drive software architecture decisions that support long‑term business, scalability, and product evolution.
• Plan, manage, and execute multiple software baselines, ensuring on‑time delivery across complex development cycles.
• Collaborate closely with software quality teams to embed quality throughout the development lifecycle.
• Work cross‑functionally with process engineering, hardware engineering, and system integration teams to deliver tightly integrated equipment software.
• Partner with global software engineering leaders to align on software strategy, best practices, and technology direction.
• Measure, maintain, and continuously improve internal customer satisfaction.
• Build, mentor, and grow a strong team of software engineers, fostering technical excellence, ownership, and collaboration.
• Promote disciplined software baseline management, build management, and version control practices.

What we are looking for

• Bachelor’s or Master’s degree in Computer Science or a related field.
• Minimum 10 years of experience in software development and software baseline management.
• Strong hands‑on software development expertise in C++.
• Experience in the semiconductor process equipment industry.
• Exposure to advanced packaging process flows such as CoWoS, SoIC, or InFO.
• Proven experience with customer‑oriented software baseline management and release planning.
• Solid background in modern software technologies and development practices.
• Demonstrated ability to drive software architecture aligned with long‑term business needs.
• Strong ownership mindset with proactive leadership and a customer‑oriented approach.
• Ability to define clear priorities, set ambitious yet realistic goals, and deliver results.
• Experience managing projects, schedules, activities, and resources effectively.
• Hands‑on experience with Jira, build management tools, and Git version control.

What sets you apart

• Experience working in fast‑paced, customer‑driven, and rapidly evolving environments.
• Ability to handle multiple concurrent projects while meeting demanding timelines.
• Strong prioritization skills across complex and competing technical demands.

Job's mission

As a Senior Principal Engineer in Software Engineering, you will shape the software that directly powers ASM’s advanced packaging and hybrid bonding equipment. Your work will have immediate, visible impact on highly complex semiconductor systems, combining robotics, motion control, thermal systems, and process intelligence. In this role, you will lead software architecture, roadmap definition, and execution across multiple products while growing strong engineering teams and influencing global software strategy.

What you will be working on

• Define and own software development plans and roadmaps for advanced packaging solutions, delivering software across multiple hybrid bonding products in parallel.
• Lead end‑to‑end software development with a strong focus on first‑time‑right quality and robust release execution.
• Drive software architecture decisions that support long‑term business, scalability, and product evolution.
• Plan, manage, and execute multiple software baselines, ensuring on‑time delivery across complex development cycles.
• Collaborate closely with software quality teams to embed quality throughout the development lifecycle.
• Work cross‑functionally with process engineering, hardware engineering, and system integration teams to deliver tightly integrated equipment software.
• Partner with global software engineering leaders to align on software strategy, best practices, and technology direction.
• Measure, maintain, and continuously improve internal customer satisfaction.
• Build, mentor, and grow a strong team of software engineers, fostering technical excellence, ownership, and collaboration.
• Promote disciplined software baseline management, build management, and version control practices.

What we are looking for

• Bachelor’s or Master’s degree in Computer Science or a related field.
• Minimum 10 years of experience in software development and software baseline management.
• Experience in the semiconductor process equipment industry.
• Exposure to advanced packaging process flows such as CoWoS, SoIC, or InFO.
• Strong hands‑on software development expertise in C++.
• Proven experience with customer‑oriented software baseline management and release planning.
• Solid background in modern software technologies and development practices.
• Demonstrated ability to drive software architecture aligned with long‑term business needs.
• Strong ownership mindset with proactive leadership and a customer‑oriented approach.
• Ability to define clear priorities, set ambitious yet realistic goals, and deliver results.
• Experience managing projects, schedules, activities, and resources effectively.
• Hands‑on experience with Jira, build management tools, and Git version control.

What sets you apart

• Experience working in fast‑paced, customer‑driven, and rapidly evolving environments.
• Ability to handle multiple concurrent projects while meeting demanding timelines.
• Strong prioritization skills across complex and competing technical demands.

Job Description & Requirements

The Technical Manager is designated as the Design Manager of the LTA MRT project, in charge of design management of the project and managing the consultant and client’s expectation to deliver the project within budget.

A summary of the responsibilities of this position are, and not limited to, as follows:

• Overall responsible for all permanent and temporary works design and design optimization by managing the appointed consultant to ensure that project is delivered within budget.
• Responsible for handling client and consultant, coordinate with consultants, client and authorities for design matters and submission.
• Oversee the shop drawings submission and issuance, planning and control delivery of design schedule, monitoring the progress.
• Coordinate and support the construction and other departments within the project to fulfil design requirement.
• Resolve all technical queries and submit/raise Request for Approval / Information (RFA/I) to concern parties to clarify any ambiguous design details.
• Review technical specifications and proposals submitted by Consultants / Subcontractors / Suppliers and produce procurement specifications.
• Adherence to safety practices in the workplace

Skills & Requirements

• Education: Degree in Civil Engineering from a recognized university endorsed by PE Board or qualification acceptable to the Commissioner of Building Control
• Experience: Minimum 12 years of engineering experience in delivering projects with at least 8 years of experience in design of civil and infrastructure project
• Extensive experience within a construction environment demonstrating accountability and ability to meet commitments through key internal stakeholders, clients, and staff at all levels.
• Technical Competencies: Technical expertise and knowledge in Structural, Architectural Design
• Proven track record of managing teams and delivering projects from start to hand-over

Job Description & Requirements

The Deputy Technical Manager is responsible for all technical operational activities for civil & infrastructure engineering projects, managing the technical department as well as providing engineering & planning services for tender and support services to projects.

A summary of the responsibilities of this position are, and not limited to, as follows:

• Overall responsible for all permanent and temporary works design and design optimization by managing the appointed consultant to ensure that project is delivered within budget.
• Responsible for handling client and consultant, coordinate with consultants, client and authorities for design matters and submission.
• Oversee the shop drawings submission and issuance, planning and control delivery of design schedule, monitoring the progress.
• Coordinate and support the construction and other departments within the project to fulfil design requirement.
• Resolve all technical queries and submit/raise Request for Approval / Information (RFA/I) to concern parties to clarify any ambiguous design details.
• Review technical specifications and proposals submitted by Consultants / Subcontractors / Suppliers and produce procurement specifications.
• Adherence to safety practices in the workplace

Skills & Requirements

• Education: Degree in Civil Engineering from a recognized university endorsed by PE Board or qualification acceptable to the Commissioner of Building Control
• Experience: Minimum 8 years of engineering experience in delivering projects with at least 8 years of experience in design of civil and infrastructure project
• Extensive experience within a construction environment demonstrating accountability and ability to meet commitments through key internal stakeholders, clients, and staff at all levels.
• Technical Competencies: Technical expertise and knowledge in Structural, Architectural Design
• Proven track record of managing teams and delivering projects from start to hand-over

Our company’s Information Technology division is dedicated to delivering innovative healthcare solutions in collaboration with global colleagues. The Enterprise IT (EIT) team plays a pivotal role in supporting key business areas such as Pharmaceutical Research, Supply Chain, Marketing, and Enabling Functions. Our EIT SAP Platform Team is responsible for our company’s SAP Global Template, ensuring the delivery of enterprise-level capabilities through unified business processes and data management.

Position Overview:

We are seeking a skilled SAP lead, to oversee, drive the design, implementation, and management of SAP business processes for Global clinical supplies (GCS) and ancillary supplies (ASM)within our organization. The ideal candidate will act as the subject matter expert (SME) for the MRL domain, who will provide guidance and design for Clinical and ancillary supplies processes and manage SAP configurations in the SD & MM module. We are looking for someone proactive, determined, and a dept at problem-solving. Building respectful relationships with the business and stakeholders is crucial for success in this role.

Key Responsibilities:

• Lead the design, configuration, testing, and deployment of SAP Clinical and ancillary supplies processes ensuring integration of processes across the organization and different workstreams (OtC, Source to Settle, Supply Chain Management, Finance Business Management).
• Collaborate with business stakeholders to gather and analyze requirements, translating them into SAP functional designs and solutions.
• Provide technical leadership in managing the MRL GCS and ASM processes, ensuring alignment with business goals and SAP best practices.
• Configure and customize SAP to meet the needs of the business.
• Lead and support data migration, system upgrades, and ongoing maintenance in the MRL GCS & ASM area.
• Troubleshoot and resolve MRL related issues, providing root cause analysis and implementing corrective actions.
• Ensure compliance with relevant IT policies, standards, and audit requirements.
• Provide training and support to business users and junior IT team members.
• Lead project teams, manage timelines, and deliver solutions on schedule and within budget.
• Own and be accountable for the global Clinical and ancillary technical process

Required Skills and Experience:

• 6+ years of experience working with SAP, including strong expertise in SAP SD, MM and Clinical and ancillary processes in a pharmaceutical/life sciences company.
• Strong experience in SAP OtC & MM implementation and configuration, including knowledge of order management, STO & delivery processes.
• Proven experience in leading SAP implementations, upgrades, and support in large-scale environments in Clinical supplies and Order to Cash domains.
• Knowledge of STO configuration, tolling processes scenarios
• Experience managing cross-functional teams and working with global teams in complex, matrixed organizations.
• Knowledge of EDI, IDOCs, BTP and APIs for integration.
• Understanding of tax integration (e.g., Thomson Reuters) is a plus.
• Experience with S/4HANA is highly desirable.
• Strong communication and interpersonal skills with the ability to engage effectively with technical and non-technical stakeholders.
• Ability to contribute to multiple projects simultaneously, prioritizing tasks effectively and participating in various project phases, including Solution Design, Testing, Cutover, and Go-Live.

Preferred Qualifications:

• Knowledge of Agile methodologies is a plus.
• Background in Life Sciences or pharmaceutical industry with SAP Intelligent Clinical Supply Management (ICSM) a plus
• Familiarity with project management / testing tools such as JIRA, HP/ALM, X-Ray or ServiceNow.

Education:

• Bachelor's degree in computer science, Information Systems, Business, or a related field.

Carry out construction supervision of construction works as required under the BCA regulations and ensure that the design documentation is safely and accurately implemented on site.

Responsible for the co-ordination of work on site and ensure construction safety.

Undertake any other duties related to the project assigned.

Requirements:

Minimum Diploma in Civil Engineering or equivalent from Singapore Polytechnic or other tertiary institutions of equivalent standing

National Certificate on Construction Supervision from BCA or equivalent preferred

Registered as Resident Technical Officer accredited by IES/ACES with minimum 3 years LTA project Resident Technical Officer experience.

Proficient in MS Word, Excel and Project for project update and report

Key Responsibilities:

• Develop and maintain user-facing features using React.js and Next.js while ensuring high performance and responsiveness.
• Write clean, maintainable, and well-documented code using TypeScript and JavaScript.
• Utilize Node.js for server-side logic and MongoDB for data storage and retrieval.
• Implement and maintain Storybook components for efficient UI development and testing.
• Ensure the implementation of responsive designs and cross-browser compatibility.
• Contribute to the development and maintenance of unit tests for frontend components.
• Work closely with backend developers to integrate frontend components with server-side APIs.
• Optimize applications for maximum speed and scalability.
• Stay updated on industry trends and best practices in frontend development.

Requirements:

• Proficiency in React.js, Next.js, TypeScript, JavaScript, HTML, and CSS.
• Strong understanding of design systems and their implementation in frontend development.
• Familiarity with Storybook for component-driven development and testing.
• Solid understanding of unit testing frameworks such as Jest, React Testing Library, or similar.
• Ability to translate design mockups and wireframes into responsive web pages.
• Excellent problem-solving skills and attention to detail.
• Strong communication and collaboration skills.
• Experience with version control systems, preferably Git.

Preferred Qualifications:

• Preferably more than 5 years of experience as a frontend developer;
• Experience working in both Unix and Windows operating environments are preferred.
• Bachelor’s degree in computer science, Engineering, or a related field (preferred).

Job Summary

We would like to invite an independent and self-motivated individual who has keen interest in contributing to the growth of a trusted and innovative environment for Singapore’s data economy and society, and the enhancement of Singapore’s international standing as a trusted data hub to join the Data Innovation & Protection Group (DIPG).

Mandatory Skill-set

• 5+ years in a senior technical role (e.g., Solution Architect, Security Researcher, Privacy Engineer, or Digital Forensic Lead);
• Background in Computer Science, Computer Engineering, or a related field;
• A builder’s mentality - you are driven by technical curiosity and the desire to build a compliant-by-design future for Singapore;
• Keen interest to self-learn and keep up to date with development of data-driven technologies and impact of these technologies on industry and consumers;
• Ability to translate complex engineering, technical concepts and frameworks to a non-technical audience;
• Excellent problem-solving, analytical, and decision-making abilities;
• Certifications: Advanced technical certifications (e.g., CSPO, CHFI, SANS Cybersecurity, CIPT, CDPSE) are highly regarded.

Desired Skill-set

• Strong expertise in data protection, privacy engineering, and cybersecurity frameworks (PDPA, GDPR, ISO 27001);
• Hands-on experience in digital forensics, data breach investigations, and root cause analysis;
• Proficiency in security tools and technologies (SIEM, EDR, vulnerability assessment tools like Qualys, CrowdStrike);
• Knowledge of emerging technologies such as AI, Machine Learning, and Quantum computing with risk assessment perspective;
• Experience in technical research, threat intelligence, and vulnerability analysis;
• Ability to design and develop prototypes / proof of concepts (POCs) for technology evaluation;
• Strong understanding of system architecture, cloud security, and enterprise IT environments;
• Excellent data analysis and problem-solving skills with attention to detail;
• Ability to translate complex technical findings into business and policy recommendations;
• Experience in stakeholder management, technical reporting, and presentations;
• Strong communication skills for advocacy, documentation, and global engagement;
• Familiarity with compliance, regulatory standards, and risk management practices.

Responsibilities

• Manage data breach investigations to identify system failures, technical negligence behind complex data failures;
• Distill and present findings and recommendations from complex digital forensic methods and systems to internal stakeholdersTech Intelligence and Innovation;
• Conduct research on vulnerabilities of existing systems and solutions;
• Assess and evaluate emerging technologies and frameworks (such as quantum and AI) to ensure high standards of safety and utility;
• Design and build functional prototypes for new utilities or technology assessmentsAdvocacy and Engagement:;
• Develop technical materials and guides to help organisations ensure new products and services remain compliant and up-to-date;
• Represent the organization in international and domestic technical forums;
• Translate deep engineering findings into strategic recommendations for senior leadership and global standards bodies.
  
  Should you be interested in this career opportunity, please send in your updated resume to sandhya.p@sciente.com at the earliest.
  
  When you apply, you voluntarily consent to the disclosure, collection and use of your personal data for employment/recruitment and related purposes in accordance with the SCIENTE Group Privacy Policy, a copy of which is published at SCIENTE’s website(https://www.sciente.com/privacy-policy).Confidentiality is assured, and only shortlisted candidates will be notified for interviews.EA Licence No. 07C5639

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:  

Process Development:  

• Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)  

• Upgrade process capabilities and reduce production costs  

• Establish and improve process management projects to deliver technology node requirements and scaling for next node.  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred. 

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement.  

Key responsibilities and duties include:  

Process Development:  

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Establish and improve process management projects to deliver technology node requirements 
   

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Job Requirements: 

• Bachelor’s or advanced degree in Engineering or Science is required 

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred.

• Experience with Visual Basic for automation and tool integration is preferred. 

Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value  

What to Expect 
Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  
 

Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.  

Key responsibilities and duties include:  

Process Development:  

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.  

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity  

• Establish and improve process management projects to deliver technology node requirements  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities 

Requirements 

• B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields  

• 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field  

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes  

Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.  

Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.  

Key responsibilities and duties include:  

Process Development:  

• Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)  

• Upgrade process capabilities and reduce production costs  

• Establish and improve process management projects to deliver technology node requirements and scaling for next node.  

Equipment and Materials:  

• Evaluate and promote new equipment and materials to enhance process capabilities  

• Set up process parameters for a variety of semiconductor equipment  

• Evaluate, promote, and plan for new equipment and materials  

Quality Improvement:  

• Ensure defense coverage through process, measurement, inspection, and testing  

• Establish correlations between defense mechanisms to identify improvement opportunities  

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities  

Collaboration and Coordination:  

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives  

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control  

• Ensure smooth transition from new product development, qualification, small volume production to high volume production  

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

Requirements: 

• B.S/M.S./Ph.D. (or equivalent education) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields  

• 2 or more years of semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging field  

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. 

• Experience with Visual Basic for automation and tool integration. 

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. 

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. 

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability  

• Tenacity to work effectively under timelines and limited resources  

• Consistent track record to solve problems and address root causes 

Overall Purpose of Job:

Explore and evaluate new and adjacent technologies and assist CTO in development of technology road map for Marine.

Responsibilities:

1. Scan the technology landscape for future disruptors and new product/solutions for management evaluation. Special attention to the adoption of AI on products and the exploration of alternative energies for marine platforms.
2. Facilitate internal efforts for R&D and seek collaboration with external parties including IHL to supplement internal R&D resources. Assist to prepare R&D budget and  all aspects of R&D efforts for corporate reporting.
3. Perform feasibility studies with potential customer/early adopters of new solution/technologies. Project manage POC projects.
4. Assist in application of R&D funding and grants from external agencies to support R&D efforts.  Assist in the project cycle from the initiation of ideas, search for the relevant agencies, the submission of the proposal to the claims.
5. Work closely with Group CTO working level to align the development of relevant technologies for growing the future business of Marine.  Collaborate with other Business Areas working level for new technology applications that can be shared across industries.

Requirements:

1. Bachelor Degree in Engineering  (Marine and Offshore, Naval Architecture, Structural) 
2. 5-10 years of industry experience in Marine or Offshore
3. Software skills preferred: Rhino, Solidworks, AutoCAD  

Other Information:
 

• Location: 16 Benoi Road (Island-wide transport provided)
• 5-day work week
• Working Hours: 7.25am-5pm