Total 3 Manager process development engineer job vacancies in Health / Beauty / Fitness category in Singapore

Develop strong relationships with customers as a trusted advisor to facilitate engineering solutions by visiting customers regularly, providing pre-sales and post sales support.

Work with sales teams to interpret customer requirements, deliver solutions and manage customer expectations with the end-goal of sales in mind

Work as a consultant to the sales teams and clients to problem-solve and make recommendations during the sales process.

Requirements:

The candidate is expected to:

Have a minimum of 1 years engineering experience in the areas of valves, control valves and steam applications.

Good Pay + Good allowance + Good Bonus

Interested candidates please send an updated Resume / CV in Ms Word format to lilian@recruitflash.com or WhatsApp’s your resume to 98332779 ( no Calls)

Consultant in-charge : Quah Li Lian (Lilian) ( Registration No: R1983286 )

Job Summary 

The Package Health Manager/Senior Manager will lead a team of engineers focused on developing and implementing solutions for package health monitoring, simulation, and characterization. This role ensures alignment with product requirements and supports the deployment of scalable engineering and data science solutions. 

Key Responsibilities 

• Manage engineering teams responsible for package health monitoring and diagnostics. 

• Drive implementation of DFT methodologies and test coverage strategies. 

• Lead simulation studies for mechanical stress, thermal behavior, and electrical performance. 

• Coordinate development of engineering solutions for failure detection and prevention. 

• Collaborate with IT and data science teams to deploy analytics dashboards and models. 

• Support qualification and reliability testing for new packaging technologies. 

Qualifications 

• Master’s or Bachelor’s degree in Electrical Engineering, Materials Science or related field. 

• 7+ years of experience in semiconductor packaging, test, or reliability engineering (complex products preferred). 

• Experience defining test architectures, coverage, and managing test/probe yield. 

• Experience in package simulation and characterization (mechanical, thermal, electrical). 

• Strong knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes. 

• Strong knowledge of semiconductor packaging process, material interaction and properties. 

• Experience managing technical teams and cross-functional projects. 

• Knowledge of simulation tools and data analytics platforms. 

Additional/Preferred Qualifications 

• Familiarity with AI/ML applications in manufacturing or reliability. 

• Experience with package characterization techniques and standards. 

• Proven problem-solving and multitasking skills. 

• Strong communication and stakeholder management skills. 

Job Summary 

The Package Health Manager/Senior Manager will lead a team of engineers focused on developing and implementing solutions for package health monitoring, simulation, and characterization. This role ensures alignment with product requirements and supports the deployment of scalable engineering and data science solutions. 

Key Responsibilities 

• Manage engineering teams responsible for package health monitoring and diagnostics. 

• Drive implementation of DFT methodologies and test coverage strategies. 

• Lead simulation studies for mechanical stress, thermal behavior, and electrical performance. 

• Coordinate development of engineering solutions for failure detection and prevention. 

• Collaborate with IT and data science teams to deploy analytics dashboards and models. 

• Support qualification and reliability testing for new packaging technologies. 

Qualifications 

• Master’s or Bachelor’s degree in Electrical Engineering, Materials Science or related field. 

• 7+ years of experience in semiconductor packaging, test, or reliability engineering (complex products preferred). 

• Experience defining test architectures, coverage, and managing test/probe yield. 

• Experience in package simulation and characterization (mechanical, thermal, electrical). 

• Strong knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes. 

• Strong knowledge of semiconductor packaging process, material interaction and properties. 

• Experience managing technical teams and cross-functional projects. 

• Knowledge of simulation tools and data analytics platforms. 

Additional/Preferred Qualifications 

• Familiarity with AI/ML applications in manufacturing or reliability. 

• Experience with package characterization techniques and standards. 

• Proven problem-solving and multitasking skills. 

• Strong communication and stakeholder management skills.