Total 3,772 process development engineer job vacancies

Youwill be working with a team of dedicated & committed engineers for thedevelopment of healthcare application platform and solutions for thetransformation of Singapore Healthcare IT landscape. Our mantra is to “workhard and have fun”, to deliver the next generation healthcare digitalexperience across whole of Singapore

Role& Responsibilities

• Translate business requirements into detail module or component level design
• Participate in solution design in hybrid cloud environment
• Hands-on coding on the assigned modules or components
• Work closely with DevOps engineer for Release management

Requirements

• Bachelor's Degree, Post Graduate Diploma, Professional Degree in Computer Science, Information Technology.
• 6+ years of relevant work experience in software product development.
• Hands-on development experience for Backend application (C# .Net core)
• Knowledge and experience in frontend development (e.g. Reactjs) will be advantageous
• Design and implementation of  REST API and backend business logic, and ensure the API is compliant to healthcare industry standards HL7 FHIR
• Knowledge and experience in application design patterns
• Knowledge and experience in Azure DevOps or equivalent CI/CD
• Experience developing applications using native cloud service offer by AWS or Azure will be advantageous
• Experience with Containers and Orchestration such as Kubernetes/OpenShift will be advantageous
• Experience in Microservice architecture design and implementation will be advantageous

Weare looking for potential CRM Dynamics specialists who will be working with ateam of dedicated & committed engineers for the development of healthcareapplication platform and solutions for the transformation of SingaporeHealthcare IT landscape. Our mantra is to “work hard and have fun”, to deliverthe next generation healthcare digital experience across whole of Singapore

Role& Responsibilities

• Responsible to do development for MS CRM Dynamics 365 for both On Cloud and On Premises deployments.
• Responsible for the development on Power Platform especially power apps. 
• Responsible for making solution recommendations with pros and cons considering the MS CRM Dynamics and Power Platform.
• Responsible to integrate with other system using KingswaySoft and Web API. 
• Responsible for packaging for deployment team over various Dynamics environments using CI / CD of Azure Cloud. 
• Perform application/technical design documentation.
• Provide on-going application support and be involved in various stages of the SDLC
• Plan and coordinate end-user training for any system implementations or enhancements.
• Work effectively in a tight deadline, high pressure environment.

Requirements

• At least 8-10 year’s working experience in programming using Microsoft and web technologies.
• Detailed knowledge of MS CRM Dynamics and Power Platform having developed at least 2 or 3 Applications using Dynamics best practices and design standards.
• Implementation ofMS CRM Dynamics  
• Develop .Net (C#) Plugins.
• Develop .Net assemblies for Custom Workflow.
• Develop client-side Jscript (JQuery) for entity form events.
• Develop using MS CRM SDK to implement customization.
• Configuration of multi-disciplinary user roles
• Deployment of configurations and customization including solution package for entities (Forms, Views, Charts and Dashboards), Plugins and custom workflows.
• Data Migration 
• Experience in Object Oriented Programming, .Net Web Applications, Web Technology (IIS), .Net framework 4.6.2 and above, C#, SQL and Stored procedure in MS SQL Server 2016 and  Above
• Experience in application integration and / or web services integration required.
• Having a knowledge of various version controls repositories.            
• Bachelor’s degree in software engineering, Computer Science or Management Information Systems

Job Description:

• Responsible for developing, testing, and improving premium connections and OCTG products during the development phase, ensuring they meet rigorous industry standards.
• Coordinating with customers and providing technical advice/training on the range of OCTG products, often involving rig field services.
• Executing validation tests (often in specialized, high-pressure, or high-temperature environments) to verify the integrity and performance of new designs.
• Planning, managing, and documenting test results for internal and client review.

Requirements:

• Min Diploma in Mechanical/ Manufacturing/ Precision Engineering, or equivalent.
• Minimum 3 years of experience in Oil and Gas, specifically with OCTG and downhole tools.
• Knowledge of ISO/API standards related to OCTG and connections. 

To submit your application, please apply online apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd.
EA License No: 17C8900

THE ROLE:

You will be as part of the Product Engineering Organization, where we deliver test and manufacturing solutions for Enterprise New Product Introduction (NPI). You will be at the forefront of developing innovative products that drive next-generation processors for high-performance computing, data centers, and enterprise servers. As a Staff Automatic Test Equipment (ATE) Test Engineer, you will collaborate with design teams to guarantee the timely delivery of high-quality ATE Test solutions. You will assume ownership of specific test modules and/or the overall Test program, which involves ensuring content development and bring-up is in accordance with established validation protocols. You will be developing ATE test programs and designing test hardware for supported products. Additionally, you will evaluate and release robust test programs for production testing, ensuring that all quality, yield, and test time performance indicators are consistently met.

THE PERSON:

You will have a deep commitment to technical expertise, who is eager to continuously learn and share knowledge within the team. You should possess a robust background in ATE development, preferably Advantest 93K, focused on test content and program creation. You will be results-driven and demonstrate strong stakeholder management skills, essential for effective collaboration with diverse teams across AMD. Excellent verbal and written communication abilities are required for successful engagement with our global workforce.

KEY RESPONSIBILITIES:

• Partner with IP design, validation, and architecture teams to ensure comprehensive IP content coverage, and to develop, validate, and debug test patterns.
• Build and maintain test program infrastructure, leveraging the latest Best Known Methods.
• Evaluate and validate new product features, test conditions, methodologies, and test content during initial silicon bring-up.
• Conduct silicon characterization across various process, voltage, and temperature conditions.
• Correlate and release test programs for high-volume production environments.
• Lead initiatives to improve Key Performance Indicators, focusing on reducing test time, debugging yield issues, and enhancing product quality.
• Provide support for product qualification processes and assist in debugging customer returns.

PREFERRED EXPERIENCE:

• Hands-on experience developing ATE test programs and patterns, with a preference for Advantest 93K platforms.
• Understanding of JTAG, BIST, and HSIO concepts.
• Experience designing ATE loadboards.
• Strong programming and scripting skills in languages such as C, C++, Java, Ruby, Perl, or Python.
• Familiarity with version control systems
• Competence in statistical analysis techniques.
• Proficiency in Windows, Unix, and Linux operating systems.
• Solid understanding of modern computer architecture.

ACADEMIC CREDENTIALS:

• BS/MS Electrical Engineering, Computer Engineering, or comparable disciplines

LOCATION:

Singapore

JOB DESCRIPTION

• CP test program development.
• Work with designer to develop test programs, debug programs, solve problems.
• Work with commissioned factory to identify, propose, prioritize and implement test automations.
• Design automated test scenarios accordingly to test plan with its acceptance criteria
• The commissioned testing factory product management.
• Test plant test plan management. Ex: prepare test environment, test data, update functional test scripts according to changing requirements
• Contribute towards continuous improvement of testing practices/tools to improve test strategy and efficiency
• Help to ensure every release happens in a timely manner with a high level of quality.

JOB REQUIREMENTS

• Bachelor’s/ Master’s degree in Electronical Engineering ,Computer Science, Software Engineering or other equivalent degree/experience
• Strong VBT scripting skill and C++ programming background
• Good written and verbal communication skills in English and Mandarin is required to liaise with Chinese associates/clients
• Able to work well both independently as well as in a team
• Singaporeans are welcome to apply

JOB DESCRIPTION

· Wireless AP software development and firmware development

· Network communication protocol development

· Embedded system development

· Execution of pre-test for IoT/ Wi-Fi router related certification

JOB REQUIREMENTS

· Bachelor’s Degree or above in Computer Science, Computer Engineering, Electronic, Telecommunication or Networking Engineering

· Familiar with C/C++ and Linux system

· Familiar with networking and embedded system development

· WiFi development experience is an advantage

· Good communication and team working skills

· Good problem solver, ability to think out of the box

· Passion in programming is an advantage

JOB DESCRIPTION

· Understanding of the customer requirements and developing technical solutions for customers.

· Strong collaboration with several stockholders including customer, sales and marketing, RD team.

· Support customers during the all development cycle from design specification until mass production.

· Exposure to schematics and PCB layout design review.

· Direct contact with customers implies excellent communication skills.

JOB REQUIREMENTS

· Bachelor’s degree or above in Electronic Engineering or related majors

· Min 3-5 years of relevant work experience in semiconductor

. Must has outstanding hardware and RF bring-up experience for WLAN + BT combo, as well as best expertise of OFDM/OFDMA, MIMO, RF component knowledge and front-end matching.

. Proficient with multiple tools for board design, such as OrCAD, Allegro, impedance calculation, ADS simulation and other RF/digital simulation on board level.

. Strong communication and interpersonal skills to handle whole board design process, debug critical issue, optimize RF matching, decent documentation technique.

· Familiar with Litepoint IQxel tester, R&S CMW tester, spectrum analyzer, signal generator, network analyzer, power meter, attenuator, and other WLAN/BT test equipment is an advantage.

· Strong customer management and problem-solving skills

· Good communication and team working skills

· Singaporeans are welcome to apply

Job Description:

• Develops and optimizes BCD process technology and devices for power applications, involving TCAD simulations, device layout, characterization, and bench testing
• Develop and integrate new BCD device architectures and process modules for company BCD platforms.
• Conduct TCAD simulations to understand device behavior and calibrate simulation models to match experimental results.
• Design and lay out device test structures and new BCD device platforms.
• Analyze device performance and reliability through bench testing and data collection.
• Work with cross-functional teams, including the modeling team, to satisfy customer needs and develop advanced device models.

Job Requirement:

• Min Degree in Physics or Electrical Engineering.
• Min 3 year of expereince in TCAD (Technology Computer-Aided Design) tools for simulation and calibration.
• Experience with device layout, design rule checks, and test structure generation.
• Knowledge of BCD process development and device characterization techniques.

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900

As a PDE Central Yield Enhancement (YE) Engineer within Package Development Engineering (PDE), you will own and execute yield learning and improvement activities across advanced package technologies during HBM and NCG New Product Introduction (NPI). Your scope includes yield monitoring, excursion response, and yield stabilization, with an emphasis on rapid learning, early risk identification, and scalable solutions. 

This role plays a key part in driving robust yield performance from first silicon through NPI ramp and early HVM, partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing and Quality teams. You will act as a hands‑on yield owner for NPI builds, translating data into actionable insights, driving fast learning cycles, early risk detection, and leading disciplined yield recovery. 

Job Responsibilities 

Yield Loss Accounted For 

• Account for HBM NPI builds across PWF, Assembly, and test through defect breakdown and PFA submission to understand fail mode 

• Own and execute assigned Central YE responsibilities for HBM NPI program, work closely with PI to identify defects that is coming from their area to brainstorm for CIP 

• Learn NPI processes, phase gates, and yield best practices 

• Assist in maintaining yield dashboards and trackers. Support PI/PE/RDA in identifying and transforming processing data to account/ breakdown a yield loss 

Yield Deviation Control 

• Analyze and report on yield deviation issue and trigger action from PI, PE or RDA 

• Support block run and partial conversion build yield analysis to early detect any impact on yield 

• Work closely with PCS team to identify SPC or FDC charts to put into YLR dashboard for shift left monitoring 

Yield Improvement Opportunities 

• Brainstorm with staff from other departments for improvement opportunities and propose to PI 

• Design and implement new solutions, including hotspot analytics, to improve the effectiveness of the automated defense line system. 

• Utilize software tool like Auto-diagnostics to find yield improvement opportunities 

Integrating Artificial Intelligence 

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgement and complying with organizational standards and legal requirements 

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work 

Job Requirements 

• Bachelor's or Master's degree in Electrical/ Electronics Engineering/ Computer Engineering / Computer Science with 2 to 5 years of experience in semiconductor industry, specifically involving yield analysis, defect/root cause investigation, or data-driven process optimization in advanced memory (HBM, DRAM, NAND) or high-volume semiconductor packaging. 

• Proficiency in Python (e.g., Pandas, NumPy) and SQL for semiconductor manufacturing data analysis, with hands-on experience developing interactive dashboards and visual reports using tools (including Spotfire and Power BI/Tableau) to translate large manufacturing datasets into actionable yield and process improvement insights. 

• Demonstrated experience building automated reporting workflows, data pipelines, or process automation solutions using Python scripting or RPA tools within a semiconductor manufacturing environment, with the ability to drive cross-functional decisions across manufacturing, process integration, and engineering teams in the semiconductor industry. 

• Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes 

Embody Micron’s Core Values 

• People – Respect, develop, and empower others. 

• Innovation – Drive continuous improvement and breakthrough thinking. 

• Tenacity – Show grit and determination. 

• Collaboration – Build trust and foster teamwork. 

• Customer Focus – Deliver excellence and value 

About VSMC

VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), a joint venture between Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors (NXP) has started construction on a 300mm wafer manufacturing facility in Singapore, targets automotive, industrial, consumer, and mobile end markets.

Role Summary

You will be responsible to deliver robust and efficient semiconductor manufacturing process with data driven analytics and systemic problem-solving skills in the respective modules: Etch (Dry Etch and Wet Etch); Photolithography; Diffusion; Chemical Mechanical Planarization (CMP); Chemical Vapor Deposition (CVD) or Physical Vapor Deposition (PVD)

Key Responsibilities

• Maintain smooth daily manufacturing operations and problem solve issues promptly
• Actively collaborate with equipment and material suppliers and partners to identify technology deficiencies; develop, evaluate, and validate corrective and preventive solutions
• Qualify and sustain manufacturing processes to scale up capacity swiftly and maintain with quality and urgency
• Continuously improve process stability and capability, enhance quality, reliability, yield, productivity, and safety standards
• Design and execute experiments, analyze complex data sets, and derive actionable insights to optimize manufacturing processes and precise controls
• Implement statistical process control methods to establish and uphold robust manufacturing processes

Education Qualification & Essential Experiences

• Bachelor’s or higher degree in Electrical and Electronics Engineering, Chemical Engineering, Material Science, Physics or STEM related fields

Key Skills and Attributes

• Good interpersonal and communication skills to work effectively across functions and geographical teams with diverse background
• Strong analytical and problem-solving skills to achieve positive results and outcome
• Goal driven and an excellent team player that can work under pressure in a dynamic and fast-paced environment
• Has a growth mindset, prioritizing adaptability, resilience, innovation, and ongoing learning to support business needs

VSMC promotes diversity and inclusivity in our workforce; and hiring will be conducted in phases.

About VSMC

VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), a joint venture between Vanguard International Semiconductor Corporation (VIS) and  NXP Semiconductors (NXP) has started construction on a 300mm wafer manufacturing facilityin Singapore, targets automotive, industrial, consumer, and mobile end markets.

Role Summary

You will be responsible to deliver robust and efficient semiconductor manufacturing process with data driven analytics and systemic problem-solving skills in the respective modules: Etch (Dry Etch and Wet Etch); Photolithography; Diffusion; Chemical Mechanical Planarization (CMP); Chemical Vapor Deposition (CVD) or Physical Vapor Deposition (PVD)

Key Responsibilities

• Lead and ensure smooth daily manufacturing operations, promptly resolving complex issues to minimize downtime and maintain production efficiency in respective module.
• Drive cross-functional collaboration with equipment and material suppliers and partners to identify technology deficiencies; develop, evaluate, and validate corrective and preventive solutions
• Oversee the qualification and sustaining manufacturing processes, ensuring rapid capacity scale-up while maintaining high standards of quality, consistency, and operational readiness
• Continuously improve process stability and capability, enhance quality, reliability, yield, productivity, and safety standards
• Design, lead and execute experiments, analyze complex data sets, and derive actionable insights to optimize manufacturing processes and precise controls
• Implement statistical process control methods to establish and uphold robust manufacturing processes

Education Qualification & Essential Experiences

• Bachelor’s or higher degree in Electrical and Electronics Engineering, Chemical Engineering, Material Science, Physics or STEM related fields
• Minimum of 5 years of experience as an Process Engineer in respective module; Experience working in a 12'' Fab would be advantageous

Key Skills and Attributes

• Good interpersonal and communication skills to work effectively across functions and geographical teams with diverse background
• Strong analytical and problem-solving skills to achieve positive results and outcome
• Goal driven and an excellent team player that can work under pressure in a dynamic and fast-paced environment
• Has a growth mindset, prioritizing adaptability, resilience, innovation, and ongoing learning to support business needs

VSMC promotes diversity and inclusivity in our workforce; and hiring will be conducted in phases.

Position title : Senior TCB Application & Technical Sales Engineer

Location: Admirax St

Working Days:  5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : SGD 7,000 – SGD 10,000/month (Based on experience and technical capability).

Responsibilities:

• Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.

• Support technical sales activities and customer discussions.

• Benchmark competitor equipment and identify technology gaps.

• Translate customer requirements into internal equipment specifications.

• Develop and optimize TCB process parameters on TCB Equipments.

• Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.

• Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage.

• Conduct DOE and process characterization activities.

• Work closely with Mechanical, Software, Electrical, Motion and Vision teams.

• Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process windows.

• Lead machine qualification, FAT and SAT activities.

• Act as the internal customer during machine development.

• Support customer buyoff and onsite qualification activities.

Requirements:

• Bachelor’s or Master’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Semiconductor Engineering or related fields.

• 5–15 years of semiconductor packaging experience preferred.

• Hands-on experience in TCB, Flip Chip and Advanced Packaging.

• Experience in HBM / CoWoS / 2.5D / 3D packaging.

• Experience in OSAT, IDM or semiconductor equipment environments preferred.

• Experience with fluxless or N2 bonding environment is an advantage.

• Strong understanding of Thermo Compression Bonding (TCB), Flip Chip processes, thermal management, warpage control, alignment systems, vision systems, process qualification, SPC and yield analysis.

• Experience with DOE, statistical analysis tools, failure analysis workflows and semiconductor process characterization.