Total 590 technical support engineer job vacancies in Manufacturing / Production category

Position Summary

The Engineer, Product Development (Fresh Grad) is responsible for the developmentand establishment of new product and transfer process into production.

Responsibilities

• New product development as requested by customer and internal roadmap, and transfer into production
• New material, process & machine development and qualification, and transfer into production
• Troubleshoot process issues and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Establish, review and update specifications, workflow, quality and safety related documentation for new products and transfer to production line.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• Handle and manage customer audits and 8D reports.
• Any other ad-hoc duties as assigned.

Requirements

• At least a Bachelor’s Degree in Materials Science, Microelectronics, Electrical or Chemical engineering.
• Knowledge in process engineering, process control engineering and yield enhancement preferred
• Knowledge in DOE, FMEA, and 8D reports.
• Prior experience in the semiconductor industry would be an added advantage.

Job Description

• Industry/ Organization Type: Manufacturing - Electronics
• Position Title: Manufacturing Technician/ Manufacturing Engineer
• Working Location: Tai Seng
• Working Hours: Monday to Friday (9am to 6pm)
• Salary Package: Basic + AWS + Variable Bonus
• Duration: Permanent

Key Responsibilities

• Support daily operations of the through‑hole/DIP assembly line to meet output, quality, and safety targets.
• Set up, operate, and perform basic preventive maintenance on DIP equipment and fixtures.
• Conduct in‑process inspections and functional tests on assembled products.
• Troubleshoot process issues, escalate as needed, and recommend improvements.
• Meet production schedules while maintaining first‑pass yield and quality standards.
• Other ad-hoc duties which may be assigned.

APPLY NOW!!!

• Minimum ITE Nitec/Higher Nitec in Electrical/Electronic/Mechatronics/Manufacturing Technology.
• 1–3 years in electronics manufacturing.

Kindly apply through ANY of the following methods:

• Submit your application by clicking the APPLY button;
• Email your resume to Job@anradus.com.sg. Please indicate #80442 on the email subject.

Anradus Application Policy: We value each application and ensure every resume is reviewed. Our process is efficient, typically concluding within 3 working days. If you do not receive communication from us within this timeframe, it's likely that your application has not been shortlisted by our client. In such cases, we recommend continuing your job search to maximize your opportunities.

Anradus Pte Ltd | EA License No. 20C0161 | Rachael Lee | EA Reg No.: R2093131

• Interface with Design Engineering team for the release of new products (NPI) into Manufacturing

• Involve in product development and evaluate the design for manufacturability and reliability by participating in design reviews and the assembly of the prototype units

• Need to understand overall system operation, system integration, system calibrations and need to do preventive and corrective maintenance on Equipment/Machine

• Apply 8D trouble-shooting, including driving learning and standardization where appropriate.

• Drive continuous improvement of system hardware, diagnostics and software, tooling, technical documentation and knowledge management to minimize Cycle time/Quality issues.

• Creating ECO (Engineering Change Orders), Structuring BOMs and  creating test and assembly documentation as needed

• Work with suppliers to resolve component/yield/part problems in a timely manner and assist purchasing teams in driving supplier quality improvements and cost reductions efforts.

• Perform First Article qualifications for parts and EOL components.

• Provide support on field escalations for analysis/resolution on any issue requiring in-depth knowledge on the product.

• Provide strong technical support to production team to resolve issues and ensure on time shipment.

• Generate and Maintain process and equipment work instructions, drawings, and other production document to conform to specifications

Preferred Qualifications:

• Bachelor/Master/Ph.D in Physics, Mechanical, or Mechatronics Engineering with 3 or more years of manufacturing experience.

• Ability to understand the working principles of complex electro‑mechanical and optical assemblies used in high‑precision defect‑inspection equipment, and how these subsystems impact overall system performance.

• Strong troubleshooting and analytical skills, including the ability to set up experiments, analyze data, and support resolution of technical issues.

• Ability to read and interpret technical drawings, and proficiency in using precision testing and measurement instruments for problem‑solving.

• Willing to travel up to 25% of the time.

• Experience in the semiconductor equipment industry or manufacturing is an advantage.

• Basic knowledge of manufacturing processes and quality control is desirable.

• A self-driven individual with keen technical mind, positive attitude and strong team player.

Key Responsibilities

• Sustain and continuously improve Latex Ink manufacturing processes across dispersion, milling, blending, filtration, and ink filling.

• Use strong data analysis to identify trends, root causes, and performance gaps, and translate findings into actionable process improvements.

• Drive initiatives to improve yield, reduce waste, increase throughput, and lower manufacturing cost.

• Monitor and optimize critical process parameters to improve process capability and stability.

• Lead process characterization, margin studies, and statistical analysis using engineering and analytical tools.

• Support process troubleshooting, technical investigations, and corrective action implementation.

• Implement process, equipment, and automation improvements to enhance productivity and asset utilization.

• Enhance process monitoring and control using SCADA/HMI, SPC, JMP, and Power BI dashboards.

• Maintain process documentation and provide training to Operations staff.

Qualifications

• Bachelor’s or Master’s degree in Chemical, Mechanical, or Manufacturing Engineering.

• Minimum 3 years of experience in high-technology manufacturing or R&D. Open to work in Tuas Location.

• Experience owning or improving a manufacturing process is preferred.

• Knowledge of process controls, P&ID, manufacturing quality systems, and data analytics.

• Knowledge of SQL, Excel data analysis, JMP, and Power BI is preferred.

Skills

• Strong data analysis and statistical problem-solving capability.

• Proven experience in data-driven process investigation and improvement.

• Strong technical and analytical skills with cost and efficiency focus.

• Effective cross-functional communication and collaboration.

• Hands-on, continuous-improvement mindset.
   

  Disclaimer
  This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.

THE ROLE:

As a senior staff member of the product characterization team, you will evaluate the performance of AMD AECG products, develop, lead and characterize the next generation Memory Controller IPs.

THE PERSON:

• Strongly motivated individual from post-silicon validation background.
• Excellent communication and presentation skills, demonstrated through technical publications, presentations, training, executive briefings, etc.
• Adept at collaboration and mentorship skills to train and guide fellow engineers and elevate the skills of the team around you.

KEY RESPONSIBILITIES:

• Gain expertise into the AMD SoC architecture to characterize next generation Memory Subsystem (Controller, PHY and IO) for various supported protocols such as DDR4, LPDDR4, DDR5, LPDDR5, DDR6 and LPDDR6.
• Understand Pattern development nuances and guide the team for bench data collection and debug with lab instruments when necessary.
• Work closely with cross functional teams from design and firmware side to identify key new features, firmware stability and ensure proper test coverage for the same.
• Drive continuous improvement initiatives on automated test scripts and test frameworks for efficient data collection, test-time optimization and data analysis.
• Stay updated with the latest developments in Memory specifications and trends to inform product strategy and direction
• Statistical data analysis to post process volume results for data correlation across Process corners and outlier analysis.
• Responsible for isolating the issue to a specific area such as test gaps, SW bug, silicon bug, or process deviation using bench setup and instill good debug practices in the team.
• Drive cross-functional discussions to address the issues uncovered from debugs and collaborate for ensuring screens are in-place for gaps identified.

PREFERRED EXPERIENCE:

• Extensive years of experience into post-silicon validation with strong background on SoC validation and system level testing.
• Technical leadership experience leading a small group of senior engineers.
• Strong understanding of ARM SoC architecture and Memory protocols such as DDR5 and LPDDR5.
• Experienced on bench testing and debug skills with lab instruments usage.
• Proficiency in using test equipment such as oscilloscopes, logic analyzers and protocol analyzers.
• Experienced in Linux environment, data analysis and scripting languages (e.g. Python, Perl) for automation and data processing.
• Strong communication and leadership skills, including data presentation and ability to work well in a group environment that spans across continents.
• Experience with AMD/Xilinx Vivado and FPGA design flow is a plus.

ACADEMIC CREDENTIALS:

• BS in EE, CS, ECE or related field; MS preferred.

Location: Woodlands

Working hours: Shift hours, 2 days work, 2 days off. 720am to 730pm or 720pm to 730am.

The Job:

• Product Maintenance
• Review and analyze wafer test yields
• Determine hold lot disposition
• Communicate with customer for joint disposition.
• Yield Improvement - Identify and resolve issues impacting yield performance
• Perform device / hardware test qualification / Correlation and the issuance of the associated reports
• Support manufacturing operations on technical issues relating to device testing

The Talent:

• Degree in Electrical & Electronics Engineering with min 1 year of relevant working experience.
• Fresh graduates are welcome.
• Strong team player with good communication skills.
• High level of ambition and a strong desire to learn.
• Singaporeans only.

Next Step:

• Interested applicants, please send your resume to yingchong.koh@adecco.com with your current and expected salary.
• All shortlisted candidates will be contacted.

Koh Ying Chong

EA License No: 91C2918

Personnel Registration Number: R23116418

THE ROLE:

Returns Debug and RMA execution in Quality & Reliability organization, provide supportive functions to the organization to ensure customer quality issue being addressed evoking the required actions via failure analysis to improve product quality.

THE PERSON:

You will also need to possess strong verbal and written communication skills which are essential when working with a global team. A proactive, outstanding teammate who focuses on teamwork, team building, and growing team success.

AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology!

KEY RESPONSIBILITIES:

• Perform analysis & report writing on customer returns electrical FA, include analysis on Automated Test Equipment (ATE) and System Level Test (SLT), duplicate customer reported failure on Platform level and perform board level debug.
• Customer returns debug covering pre & post Mass Production, field return including Excursion/Critical issue, also cover debug for Defect Part Per Million (DPPM) improvement.
• Drive cross-functional collaboration by proactively engaging with Device Analysis and Product Engineering teams to lead fault isolation and root-cause investigations.
• Identify and define test coverage enhancements that strengthen product quality, prevent customer-facing failures, and support long-term reliability improvements.
• Provide technical direction in diagnosing complex issues, influencing validation strategies, and ensuring findings translate into actionable quality improvements across functions.
• Provide conclusive and convincing results and align with Program/PLQ/Customer Interfacing team on final analysis report writing for customer communication.
• Local product ownership roles that include but not limited to understanding, tracking and releases of ATE/SLT/OSV which covers RMA/OSV program, test program contents, and Go-To person on owned product technical queries.
• Role model as a coach for internal team that able to guide junior on technical challenges that arise during work for specific IP or failure category.
• Other duties as assigned by supervisor.

PREFERRED EXPERIENCE:

• Strong in silicon debug or Failure Analysis knowledge either on electronics system level or Integrated Chip.
• Candidate should be analytical and detail oriented, strongly interested in debugging complex system, self-starter, and fast learner
• Experience working in root causes digital or analog failure or SCAN/MBIST/High Speed Loopback failure.
• GPU, CPU or x86 architecture knowledge is much preferred
• Java, Python, Perl coding or Linux Shell scripting skills
• Window and Linux proficiency.
• JTAG knowledge is a plus.
• Knowledge in ATE test class/method experience with Advantest 93k platform is a plus.
• Experience in computing hardware, PC systems or Server platform projects or task is a plus.
• Knowledge or experience in PCB board or Customer Reference Board platform (schematics, layout, hardware configuration/setup, platform validation) is a plus
• Knowledge in industry standards like PCIE, USB, or high bandwidth memory is a strong plus
• Experience in AI or Machine Learning project or task is a plus. 

ACADEMIC CREDENTIALS:

• Bachelor’s or Master’s degree in Electrical/Electronic Engineering or Computer Engineering

• Focus and responsibility for after sales quality related tasks
• Responsible for setting up improvement activities on dedicated products.
• Driving Product Quality Circle within dedicated parties (Sustaining Teams, Platform leaders, HOD’s ..)
• Central part of improvement team in sense of input, coordinator, support on dedicated tasks.
• Supporting escalation in the after sales area (NPI or customer escalation)
• Participating in customer quality calls and task force meeting.
• Close collaboration with the product line & technical support according to the learning's out of onsite trouble shooting and raising preventive knowledge within the organisation.
• Lead all project related documentation and ensure communication (8D-Report, action plans and follow up)
• Initiating and supporting product related analysis
• Interaction with production facility
• Participate customer audits and customer improvement programs.
• Preparation of after sales data and KPI monitoring and reporting.
   

Education

• Minimum Degree in Mechanical / Electrical / Mechatronics / Machining related with 3 years working experience in similar industry.
• Knowledge in project management and Quality Tools

Work experience

• Good understanding of reliability theories & methods (DFMEA, SPC, 8Ds…) and semiconductor manufacturing processes,
• Experienced in quality methods, data analysis and continuous improvement.
• Being in a driver role and push improvements,
• Fast ability to understand company structure and interact with many interfaces
   

Expertise and methodology

• Knowledge in process management for product related business processes, specifically design, engineering, SCM and production (i. e. operational)
• Familiarity with cleanroom protocols (class 10/100) and semiconductor workflows
• Competency in MS-office for data analysis, reporting & presentation
• Familiarity with the Atlassian JIRA system

Other requirement criteria

• Capabilities in analysis, and creation of measures
• Driving and Setting standards and defining roles and responsibilities in own job, processes, and departments
• Agile in sense to drive improvements, but to accept progress on a pragmatic level.
• Flexibility and practice-oriented proceeding, reacting on rapid moving situations and taking appropriate initiatives.
• Experience in handling Die attach equipment is nice to have

• Build and troubleshoot automated assembly machines, robotic systems, and sub-assemblies from engineering drawings.
• Debug machines, robots, and processes for newly built machines.
• Perform machine and robot alignments, calibration, and final set-ups.
• Assist Engineers in carrying out new machine, robotic system, or equipment start-up.
• Assist Engineers in continuous yield improvement programs through machine mechanization, robotic automation, and process optimization.
• Experience in machine and/or robotic equipment assembly
• Able to read and interpret engineering drawings
• Hands-on experience in machine troubleshooting and assembly is preferred

Interested candidates please send in your resume to:
Reina Patricia Johan
Outsourcing Team
Recruit Express Pte Ltd
Email: reina@recruitexpress.com.sg

EA License No: 99C4599

THE ROLE:

We are the high-end test engineering team providing test solutions for Data Center New Product Introduction (NPI) under the Product Engineering Organization. We do exciting product development for leading-edge technology that will power the next generation processors used for high performance computing, data centers, and enterprise servers.

If you are looking for a fulfilling and challenging career as an engineer leading SLT (System Level Test) Thermal and Board SME (Subject Matter Expert), you are at the right place! As a MTS System Level Technical Lead, you will be responsible for defining, driving and enabling SLT test solution to meet NPI business milestones and KPI (test time, yield, cost, quality .The expectation is to perform leadership to have interaction with Silicon/Board/Power design teams, Product & Test Engineering teams, Customer Quality teams, software & platform teams to ramp GPU coverage with aggressive schedule while debug GPU fallout to ensure high yield. You will experience working with and learning from AMD’s talented engineering teams around the world.

THE PERSON:

We are looking for someone with strong technical, analytical, leadership and problem-solving skills, as well as demonstrating the characteristic of an independent and resourceful individual.

You will be proficient in your understanding about PCB Board and High Power Delivery (above 1kW) design methodology, Thermal dissipation as well as a broad understanding of various industry standards in OCP (Open Compute Project), such as JEDEC HBM3/4, PCIe, I2C/I3C, UEC (Ultra Ethernet Consortium) and UCIe (Unified Chiplet Interconnect Express) etc.

KEY RESPONSIBILITIES:

• Accountable to provide leadership to meet business milestone, cost and quality in GPU system level test area.
• Collaborate with internal teams to drive SLT board and power swim lane from pre-silicon, ASIC initial bring up to HVM (High Volume Manufacturing)
• Conduct engineering evaluations and analysis to drive closure of GPU production issues, qualify cutting-edge high power SLT thermal system for HVM
• Profile or characterize PI (Power Integrity), voltage droop, or power delivery issue observed on SLT platforms in collaboration with board/silicon designers
• Involves collaboration on or assuming the consultative or leadership responsibilities for a specific project or for product development initiatives
• May provide technical supervision or mentoring junior engineers
• Upscale overall team capabilities on low level system debug for AMD data center product families

PREFERRED EXPERIENCE:

• Experience and with good understanding of PCB board and Power Delivery design for high power GPU product (above 1kW), and board lifecycle from Eval to HVM (High Volume Manufacturing)
• Strong expertise with using analyzers and oscilloscopes, and other debug tools
• Knowledge and working experience on GPU and HBM architecture, SoC design and SoC power management features are a strong plus
• Strong and effective presentation, written and verbal communication skills, and the ability to work with geographically distributed product engineering teams
• Proficiency in Windows, and Linux operating systems
• Basic scripting proficiency for automation (Shell script, Perl, Ruby, Python)

ACADEMIC CREDENTIALS:

• BS/MS Electrical Engineering, Computer Engineering, or comparable disciplines

THE ROLE:

You will be as part of the Product Engineering Organization, where we deliver test and manufacturing solutions for Enterprise New Product Introduction (NPI). You will be at the forefront of developing innovative products that drive next-generation processors for high-performance computing, data centers, and enterprise servers. As a Staff Automatic Test Equipment (ATE) Test Engineer, you will collaborate with design teams to guarantee the timely delivery of high-quality ATE Test solutions. You will assume ownership of specific test modules and/or the overall Test program, which involves ensuring content development and bring-up is in accordance with established validation protocols. You will be developing ATE test programs and designing test hardware for supported products. Additionally, you will evaluate and release robust test programs for production testing, ensuring that all quality, yield, and test time performance indicators are consistently met.

THE PERSON:

You will have a deep commitment to technical expertise, who is eager to continuously learn and share knowledge within the team. You should possess a robust background in ATE development, preferably Advantest 93K, focused on test content and program creation. You will be results-driven and demonstrate strong stakeholder management skills, essential for effective collaboration with diverse teams across AMD. Excellent verbal and written communication abilities are required for successful engagement with our global workforce.

KEY RESPONSIBILITIES:

• Partner with IP design, validation, and architecture teams to ensure comprehensive IP content coverage, and to develop, validate, and debug test patterns.
• Build and maintain test program infrastructure, leveraging the latest Best Known Methods.
• Evaluate and validate new product features, test conditions, methodologies, and test content during initial silicon bring-up.
• Conduct silicon characterization across various process, voltage, and temperature conditions.
• Correlate and release test programs for high-volume production environments.
• Lead initiatives to improve Key Performance Indicators, focusing on reducing test time, debugging yield issues, and enhancing product quality.
• Provide support for product qualification processes and assist in debugging customer returns.

PREFERRED EXPERIENCE:

• Hands-on experience developing ATE test programs and patterns, with a preference for Advantest 93K platforms.
• Understanding of JTAG, BIST, and HSIO concepts.
• Experience designing ATE loadboards.
• Strong programming and scripting skills in languages such as C, C++, Java, Ruby, Perl, or Python.
• Familiarity with version control systems
• Competence in statistical analysis techniques.
• Proficiency in Windows, Unix, and Linux operating systems.
• Solid understanding of modern computer architecture.

ACADEMIC CREDENTIALS:

• BS/MS Electrical Engineering, Computer Engineering, or comparable disciplines

LOCATION:

Singapore

• To analyse user requirements and design, develop, implement and maintain computer applications to support and assist users to meet their business objectives more effectively and efficiently.
• Develop, support and enhance the Data Download Centre (including Engineering Portal) and iSCM websites.
• Develop, support and enhance Excel productivity enhancement tools (VBA macros).
• Support end-users in usage of Plasma and ACCPAC and help to resolve any operational issues, including working together with vendor (Databit) if necessary.
• Develop and enhance data extraction and transformation mechanisms on source systems (e.g. Plasma, YEOS, NYQT, Oracle BI, SAP RFC, PTS etc.) and store the results into Plasma Info Server Monitor the space consumption of Plasma Info so that Server database so that potential problems (e.g. disproportionate consumption of disk space by a particular table, depletion of data tablespace, excessive consumption of temp tablespace) are detected and resolved early to avoid unscheduled database downtime.
• Perform ad-hoc retrieval of order/production/sales data to support incident investigation, reporting or other requests.
• Support Migration Activities of Existing Plasma Info Server to SAP.
• Support & ensure successful implementation of Company-wide Automation (ERP) Projects.

Requirements:

• Degree in Info Systems/Computer Science or its equivalent
• Prefer 2-3 years relevant experience in Manufacturing Industry.
• Entry level are welcome to appy as training will be provided.
• Entry level candidates with strong programming knowledge are welcome to apply as training will be provided.
• Required travelling to Batam Factory and staying for project is necessary (Min. 2weeks to max 2months stay per visit depending on project requirement)

Knowledge:

SQL; Oracle PL/SQL; MS SQL Server Transact-SQL

Object-oriented analysis and design

ASP.NET 4.5.1; C/C++/C#; XML

JavaScript; JQuery; CSS; HTML

Excel VBA; VBScript; PowerShell

PHP, VS.Net, MS Office

Interested Applicants, kindly email your detailed resume to hr@tempserv.com.sg

Tempserv Pte Ltd

License No: 06C3745

Attention: Audris Teo / EA Personnel No: R1102063

1 year contract under employment agency payroll

Location: Changi Business Park

Salary inclusive of allowance: Up to $4600 (Depend on experience and Company do not provide bonus)

Shift Timing (Need to support weekends and public holidays (off-in-lieu will be provided if support on PH)

• 7AM to 4PM
• 11AM to 8PM
• Transport is claimable - before 7am and after 11pm

Candidate must possess the following skills:

1. Hands on experience with SQL and Linux for L2 support
2. Python (at least basic)
3. Shell scripting to understand existing scripts and modify the scripts.

Responsibilities

• Provide Level 2 production support for business applications and batch jobs
• Monitor applications, troubleshoot incidents, and ensure SLA compliance
• Support and maintain Java/J2EE applications in Linux/Unix environments
• Develop and maintain Python and Shell scripting for automation and operational support
• Execute SQL queries, analyze logs, and perform issue resolution
• Support application deployments, job scheduling, and system monitoring
• Work closely with development and infrastructure teams for issue resolution

Requirements

• Singaporean (Need to clear project clearance and pre-employment check)
• Degree in IT, Computer Science, or related field
• Minimum 2 years of experience in application
• Hands-on experience in Python, Shell scripting, SQL, and Linux/Unix
• Basic knowledge of Java/J2EE applications
• Knowledge of web applications, batch jobs,  JBOSS, MariaDB, SQL,
• Knowledge of Job scheduling, MQ setup, C:D setup experience is a plus
• Banking industry exposure is a plus
• Strong problem-solving skills, ownership mindset, and good team
• Able to commit to a 1 year contract

Please study the link from client before applying:
Unix : https://www.oracle.com/virtualization/technologies/vm/downloads/virtualbox-downloads.html (free download for practising Unix)

Unix : https://upload.wikimedia.org/wikipedia/commons/7/79/Unix_command_cheatsheet.pdf

https://learnsql.com/blog/sql-basics-cheat-sheet/

SQL: Google 100 SQL interview questions for application support in banking.

ES Recruitment Pte Ltd (09C4235)

Hong Chiew Guat (R1219860)

• Develop, set up, transfer, validate, and debug Automated Test Equipment (ATE).
• Provide production line support and perform preventive maintenance.
• Troubleshoot and resolve equipment and test-related issues, including failure analysis.
• Support DCS software and test system operations.
• Conduct First Article Evaluations (FAE) and verify implementation of engineering changes.
• Prepare technical reports and maintain proper documentation.
• Perform other ad-hoc duties as assigned.

Requirements

• Degree in Electrical & Electronics Engineering (EEE), Electrical Engineering, or related field.
• Knowledge of VisualBasic, VS.Net

HOW TO APPLY:

Interested applicants, kindly send your resume in MS WORD format or please click on “Apply Now”.

We regret only shortlisted candidates will be notified.

Important Note: Trust Recruit Pte Ltd is committed to safeguarding your personal data in accordance with the Personal Data Protection Act (PDPA).

Please read our privacy statement on our corporate website.

Trust Recruit Pte Ltd

EA License No: 19C9950

EA Personnel: Tan Sin Yong (Stella)

EA Personnel Reg No: R24124127

As a key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time.

You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities:

• Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.

• Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.

• DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time

• Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.

• Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.

• Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.

• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

• Bachelors/Masters Electrical and Electronics Engineering Degree with 5+ years of experience in the semiconductor industry. Product Engineering experience is preferred.

• Demonstrating Strong Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis.

• Good knowledge of statistics and data analysis tools and scripting tools such as Python or JMP.

• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).

• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.

• Strong sense of responsibility and accountability towards assigned role with professional work ethic.

• Excellent communication and presentation skills.

• Passionate about people leadership, with a drive toward ongoing learning and development in this area.

• Work on site in Singapore with international travel to US, Taiwan and Japan.
  

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mappin