Total 411 qa engineer job vacancies in Manufacturing / Production category

Our vision is to transform how the world uses information to enrich life for all.  
 
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 

As part of the HIG HBM Product Engineering organization, you will help drive the development of next-generation GenAI, machine learning, and advanced data analytics solutions for semiconductor engineering. In this role, you will work on intelligent systems that improve engineering productivity, strengthen technical decision-making, and unlock insights from complex manufacturing, validation, and engineering workflows. 

You will collaborate with cross-functional teams across Product Engineering, Design Engineering, System Engineering, Data Science, IT, and Manufacturing to prototype, build, and scale practical AI-driven solutions that improve quality, cost, cycle time, and engineering efficiency. 

Key Responsibilities 

• GenAI System Development: Design, build, and improve GenAI-powered and agentic systems supporting semiconductor engineering workflows such as code generation, data extraction, analytics, documentation automation, failure triage, and technical knowledge retrieval.  

• Large-Scale Data Pipelines: Develop scalable data pipelines and analytical workflows to ingest, clean, transform, and analyze large, complex, and heterogeneous datasets from multiple manufacturing and engineering systems.  

• Advanced Data Analytics: Apply Python, SQL, and data science libraries (e.g., pandas, matplotlib) to perform deep analysis, generate visualizations, and deliver actionable engineering insights.  

• LLM Workflow Engineering: Build, evaluate, and optimize LLM-based workflows, including prompting, retrieval-augmented generation (RAG), inference orchestration, benchmarking, and quality evaluation.  

• Machine Learning Production: Develop and productionize machine learning and deep learning models for classification, regression, anomaly detection, failure analysis, and engineering decision support.  

• Distributed Data Processing: Implement robust data processing techniques such as data cleansing, outlier detection, and missing-data handling using distributed or large-scale frameworks (e.g., PySpark, BigQuery).  

• Cross-Functional Collaboration: Partner with domain experts and cross-functional teams to translate complex engineering problems into scalable AI/ML and analytics solutions.  

• Production Deployment: Support deployment, monitoring, and operationalization of AI/ML solutions in cloud and enterprise environments.  

• Technical Communication: Communicate technical findings, recommendations, and model outcomes clearly to both technical and non-technical stakeholders.  

• Innovation Leadership: Identify and drive high-impact opportunities where GenAI, machine learning, and analytics can improve engineering productivity and business outcomes. 

Minimum Qualifications 

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Science, Data Science, Statistics, Artificial Intelligence, or a related field. 

• Minimum 2 years of hands-on experience developing and deploying AI applications in semiconductors, electronics, or other engineering industries. 

• Strong programming proficiency in Python and SQL.  

• Strong technical foundation in data analytics and visualization, including tools and libraries such as pandas, scikit-learn, matplotlib, plotly, or similar ecosystems.  

• Familiarity with agentic AI frameworks such as LangGraph, Google ADK, AutoGen and evaluation tools like AgentEval. 

• Familiarity with modern AI coding tools / agentic coding harnesses, such as Claude Code, Roo Code, Cursor, Cline, Windsurf, Gemini CLI, or similar tools.  

• Hands-on experience developing and deploying AI/ML systems involving LLMs, including RAG, agentic workflows, and frameworks such as PyTorch or TensorFlow. 

• Cloud experience with GCP, AWS, or Azure, including deploying ML pipelines in production. 

• Experience with LLM training, inference, and evaluation workflows, including prompt design, benchmarking, validation, or retrieval-augmented systems.  

• Experience analyzing large, complex, and heterogeneous datasets from multiple systems and applying sound techniques for data cleansing, outlier handling, and missing-data treatment.  

• Strong analytical, problem-solving, and software development skills.  

• Strong communication skills with the ability to explain technical concepts and findings effectively.  

• Strong sense of ownership, accountability, and engineering rigor. 

Preferred Qualifications 

• Experience building agentic systems or AI solutions for semiconductor manufacturing, product engineering, validation, yield improvement, reliability, or failure analysis. 

• Deep understanding of semiconductor-specific AI/ML applications 

• Demonstrated understanding of deep learning architectures and computer vision.  

• Experience using enterprise data platforms such as BigQuery, Snowflake, MSSQL, Oracle, or Redshift. 

• Experience with Kubernetes or similar production infrastructure and deployment frameworks. 

• Experience with web application technologies such as JavaScript, HTML, and CSS.  

• Experience designing scalable, enterprise-grade AI/ML systems with attention to reliability, traceability, and operational readiness. 

• Familiarity with document-processing pipelines, technical knowledge platforms, or retrieval systems for engineering content. 

• Experience working in cross-functional environments spanning engineering, manufacturing, data science, and IT. 

Job Scope:

• Support medical device product development projects
• Conduct product testing, verification, and validation activities
• Prepare technical reports and analyse data
• Work closely with Quality, Regulatory, and Manufacturing teams
• Support design control and risk management activities

Requirements:

• Degree in Biomedical Science, Life Science, Material Science, or Engineering (Biomedical, Mechanical, Chemical, Manufacturing)
• Experience in medical device product development preferred

All qualified applicants, please click “ APPLY NOW”

Or you may send in your resume to:
Whatsapp: https://wa.me/+6597430026 
Email : kimlow@recruitexpress.com.sg

Kimmy Low Yi Ting (Kim) | CEI Registration Number: R23112122
Recruit Express Pte Ltd Company Reg. No. 199601303W | EA LICENCE Number: 99C4599

As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities:

• Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.

• Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.

• DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time

• Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.

• Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.

• Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.

• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.

• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.

• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.

• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.

• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

• Bachelors/Masters Electrical and Electronics Engineering Degree with 3 years of experience in the semiconductor industry. Product Engineering experience is preferred.

• Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis.

• Good knowledge of statistics and data analysis tools and scripting.

• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).

• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.

• Strong sense of responsibility and accountability towards assigned role with professional work ethic.

• Excellent communication and presentation skills.

• Passionate about people leadership, with a drive toward ongoing learning and development in this area.

• Work on site in Singapore with international travel to US, Taiwan and Japan.

• Provide support for operational and technical activities
• Machine & Equipment maintenance / calibration
• Establish SOP and machine manual to provide comprehensive servicing and maintenance programmes
• Identify areas of process improvement and automation to implement work improvement programmes to achieve desired machine efficiency and reject rate
• Plan, evaluate and improve technical/engineering projects for cost and productivity
• Implementation of industrial safety practice to ensure compliance
• Any other ad-hoc tasks as assigned

JOB REQUIREMENTS:

• Min Degree in Mechanical / Electrical Engineering or related discipline
• No experience needed, training provided

Office hours, Mon to Fi
Medical Device MNC

Interested candidates, please forward your resume to kevynhuang@recruitexpress.com.sg

Consultant: Huang Jingsheng Kevyn (R1333338)
Recruit Express Pte Ltd (99C4599)

Technical Leadership & Strategy

• Set technical direction for CPIE initiatives in UE_ROW, quality indices, Frontend–PTS integration, and high‑value bits (PG2+) yield, aligned to business priorities and technology roadmaps.
• Architect new data solutions, methodologies, and frameworks to:
• Identify and prioritize yield, quality, and reliability improvement opportunities across process, test, and design
• Model, monitor, and benchmark tool performance and process capability at scale

• Enable equipment prognostics and advanced process integration optimization

• Define test and screening optimization strategies that materially improve product grade yield without quality escape

• Drive end‑to‑end problem solving on complex, cross‑module issues that cannot be addressed within a single function or site.

Cross‑Functional & Organizational Influence

• Partner deeply with Process & Equipment Engineering, Manufacturing (MFG), Product Integration Engineering (PIE), and Data Science (DS) teams to:

• Establish feasibility and technical soundness

• Quantify business impact

• Rapidly prototype and mature solutions

• Act as a technical integrator across Global Quality (GQ), Product Engineering (PE), Central PEE (CPEE), Smart Manufacturing AI (SMAI), Technology Development (TD), and suppliers, ensuring solutions are scalable, manufacturable, and production‑ready.

• Influence technical and strategic decisions beyond direct ownership, including across sites, nodes, and organizations.

Execution, Scale, and BKM Deployment

• Lead the development, validation, and global deployment of BKMs, ensuring sustained performance and learning‑rate acceleration.

• Balance long‑term architectural thinking with near‑term execution, driving measurable improvements in yield, quality, and cycle time.

• Anticipate risks and tradeoffs (technical, schedule, cost, quality) and provide clear decision frameworks for leadership and stakeholders.

• Support global engineering teams, including engagement across time zones and non‑standard hours when required.

Collaboration & Leadership Expectations

• Function as a go‑to expert and mentor within CPIE and the broader FE engineering community.

• Lead by influence rather than authority, enabling alignment across diverse technical disciplines.

• Champion continuous improvement in systems, methods, tools, and skill sets to keep Micron best‑in‑class.

• Demonstrate a strong growth mindset—continuously learning, unlearning, and evolving technical approaches.

Communication

• Communicate complex technical concepts clearly and concisely to both technical and executive audiences.

• Produce high‑quality written artifacts (technical proposals, design reviews, decision memos).

• Represent CPIE effectively in cross‑org reviews and executive forums.

• Willing to travel as needed to support global objectives.
  

  Requirements & Technical Competency

  • PhD, Master’s, or Bachelor’s degree in Engineering or related discipline.

  • 8+ years of semiconductor industry experience, with deep exposure to product integration, process engineering, test solutions, product engineering, or circuit design.

  • Recognized depth in semiconductor manufacturing processes, equipment, and control systems.

  • Strong proficiency in data analysis and modeling tools (e.g., Y3, JMP, Python).

  • Demonstrated application of statistical methods and/or machine learning to real manufacturing problems.

  • Proven track record of technical leadership, decision‑making, multi‑tasking, and root‑cause resolution on ambiguous problems.

Technical Leadership & Strategy

• Set technical direction for CPIE initiatives in UE_ROW, quality indices, Frontend–PTS integration, and high‑value bits (PG2+) yield, aligned to business priorities and technology roadmaps.

• Architect new data solutions, methodologies, and frameworks to:

  Identify and prioritize yield, quality, and reliability improvement opportunities across process, test, and design

  Model, monitor, and benchmark tool performance and process capability at scale

  Enable equipment prognostics and advanced process integration optimization

  Define test and screening optimization strategies that materially improve product grade yield without quality escape

• Drive end‑to‑end problem solving on complex, cross‑module issues that cannot be addressed within a single function or site.

Cross‑Functional & Organizational Influence

• Partner deeply with Process & Equipment Engineering, Manufacturing (MFG), Product Integration Engineering (PIE), and Data Science (DS) teams to:

• Establish feasibility and technical soundness

• Quantify business impact

• Rapidly prototype and mature solutions

• Act as a technical integrator across Global Quality (GQ), Product Engineering (PE), Central PEE (CPEE), Smart Manufacturing AI (SMAI), Technology Development (TD), and suppliers, ensuring solutions are scalable, manufacturable, and production‑ready.

• Influence technical and strategic decisions beyond direct ownership, including across sites, nodes, and organizations.

Execution, Scale, and BKM Deployment

• Lead the development, validation, and global deployment of BKMs, ensuring sustained performance and learning‑rate acceleration.

• Balance long‑term architectural thinking with near‑term execution, driving measurable improvements in yield, quality, and cycle time.

• Anticipate risks and tradeoffs (technical, schedule, cost, quality) and provide clear decision frameworks for leadership and stakeholders.

• Support global engineering teams, including engagement across time zones and non‑standard hours when required.

Collaboration & Leadership Expectations

• Function as a go‑to expert and mentor within CPIE and the broader FE engineering community.

• Lead by influence rather than authority, enabling alignment across diverse technical disciplines.

• Champion continuous improvement in systems, methods, tools, and skill sets to keep Micron best‑in‑class.

• Demonstrate a strong growth mindset—continuously learning, unlearning, and evolving technical approaches.

Communication

• Communicate complex technical concepts clearly and concisely to both technical and executive audiences.
• Produce high‑quality written artifacts (technical proposals, design reviews, decision memos).
• Represent CPIE effectively in cross‑org reviews and executive forums.
• Willing to travel as needed to support global objectives.

Requirements & Technical Competency

• PhD, Master’s, or Bachelor’s degree in Engineering or related discipline.

• 8+ years of semiconductor industry experience, with deep exposure to product integration, process engineering, test solutions, product engineering, or circuit design.

• Recognized depth in semiconductor manufacturing processes, equipment, and control systems.

• Strong proficiency in data analysis and modeling tools (e.g., Y3, JMP, Python).

• Demonstrated application of statistical methods and/or machine learning to real manufacturing problems.

• Proven track record of technical leadership, decision‑making, multi‑tasking, and root‑cause resolution on ambiguous problems.

• Provide support for operational and technical activities
• Machine & Equipment maintenance / calibration
• Establish SOP and machine manual to provide comprehensive servicing and maintenance programmes
• Identify areas of process improvement and automation to implement work improvement programmes to achieve desired machine efficiency and reject rate
• Plan, evaluate and improve technical/engineering projects for cost and productivity
• Implementation of industrial safety practice to ensure compliance
• Any other ad-hoc tasks as assigned

JOB REQUIREMENTS:

• Min Degree in Mechanical / Electrical Engineering or related discipline
• No experience needed, training provided

Office hours, Mon to Fi
Medical Device MNC

Interested candidates, please forward your resume to kevynhuang@recruitexpress.com.sg

Consultant: Huang Jingsheng Kevyn (R1333338)
Recruit Express Pte Ltd (99C4599)

Job Summary

The Production Engineer supports and optimizes daily electroplating operations to ensure consistent product quality, efficient production flow, and compliance with safety and environmental standards. The role requires strong knowledge of plating processes, chemical bath control, equipment maintenance, and continuous improvement.

Key Responsibilities

1. Process Parameter Control

• Perform daily checks on all process parameters (temperature, pH, current, bath levels, flow, pump condition).

• Audit operators to ensure each process step is carried out according to specification and SOP.

• Train operators on proper equipment usage: valve operation, pump priming and air-trap checks, chiller operation, and basic line troubleshooting.

• Ensure timely correction actions when deviations are found.

2. Process Optimization

• Identify opportunities to improve loading efficiency (fixture design, part orientation, racking method).

• Work with Production and Process Engineering to increase throughput and reduce bottlenecks.

• Support improvements on cycle time, workflow, and chemical usage.

3. Quality Troubleshooting

• Participate in root-cause investigations for defects (e.g., poor adhesion, uneven colour, stains, white spots, roughness).

• Work closely with QA to verify findings and implement corrective actions.

• Escalate complex technical issues to senior Process Engineers when deeper subject expertise is required.

4. Equipment & Line Readiness

• Support preventive maintenance activities for pumps, agitators, rectifiers, chillers, filtration systems, and plating/anodizing tanks.

• Assist maintenance team in diagnosing equipment abnormalities that affect production stability.

• Ensure calibration of basic instruments (pH meter, conductivity, thickness gauges) is done on time.

5. Documentation & Reporting

• Complete production forms, bath check sheets, process logs, and operator audit records accurately.

• Update SOPs and work instructions when process changes occur.

• Prepare daily reports on process status, defects, and deviations.

6. Safety & Environmental Compliance

• Ensure safe handling of parts, chemicals, jigs, and equipment.

• Follow SDS and internal EHS requirements for chemical storage and disposal.

• Support EHS team during inspections (wastewater, ventilation, PPE compliance).

• Conduct on-the-job safety briefings for operators.

Qualifications

• Degree or Diploma in Chemical Engineering, Mechanical Engineering, Materials Engineering, or related field.

• 1–5 years’ experience in plating/electroplating, surface finishing, or chemical processing preferred.

• Strong analytical, troubleshooting, and process improvement skills.

• Knowledge of Lean Manufacturing, SPC, and chemical safety standards.

Skills Required

• Understanding of electroplating techniques (e.g., nickel, chrome, zinc, gold, tin).

• Ability to read technical drawings and interpret plating thickness requirements.

• Experience with rectifiers, chemical pumps, dosing systems, and wastewater treatment.

• Good teamwork, communication, and leadership skills.

THE ROLE:

Returns Debug and RMA execution in Quality & Reliability organization, provide supportive functions to the organization to ensure customer quality issue being addressed evoking the required actions via failure analysis to improve product quality.

THE PERSON:

You will also need to possess strong verbal and written communication skills which are essential when working with a global team. A proactive, outstanding teammate who focuses on teamwork, team building, and growing team success.

AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology!

KEY RESPONSIBILITIES:

• Perform analysis & report writing on customer returns electrical FA, include analysis on Automated Test Equipment (ATE) and System Level Test (SLT), duplicate customer reported failure on Platform level and perform board level debug.
• Customer returns debug covering pre & post Mass Production, field return including Excursion/Critical issue, also cover debug for Defect Part Per Million (DPPM) improvement.
• Drive cross-functional collaboration by proactively engaging with Device Analysis and Product Engineering teams to lead fault isolation and root-cause investigations.
• Identify and define test coverage enhancements that strengthen product quality, prevent customer-facing failures, and support long-term reliability improvements.
• Provide technical direction in diagnosing complex issues, influencing validation strategies, and ensuring findings translate into actionable quality improvements across functions.
• Provide conclusive and convincing results and align with Program/PLQ/Customer Interfacing team on final analysis report writing for customer communication.
• Local product ownership roles that include but not limited to understanding, tracking and releases of ATE/SLT/OSV which covers RMA/OSV program, test program contents, and Go-To person on owned product technical queries.
• Role model as a coach for internal team that able to guide junior on technical challenges that arise during work for specific IP or failure category.
• Other duties as assigned by supervisor.

PREFERRED EXPERIENCE:

• Strong in silicon debug or Failure Analysis knowledge either on electronics system level or Integrated Chip.
• Candidate should be analytical and detail oriented, strongly interested in debugging complex system, self-starter, and fast learner
• Experience working in root causes digital or analog failure or SCAN/MBIST/High Speed Loopback failure.
• GPU, CPU or x86 architecture knowledge is much preferred
• Java, Python, Perl coding or Linux Shell scripting skills
• Window and Linux proficiency.
• JTAG knowledge is a plus.
• Knowledge in ATE test class/method experience with Advantest 93k platform is a plus.
• Experience in computing hardware, PC systems or Server platform projects or task is a plus.
• Knowledge or experience in PCB board or Customer Reference Board platform (schematics, layout, hardware configuration/setup, platform validation) is a plus
• Knowledge in industry standards like PCIE, USB, or high bandwidth memory is a strong plus
• Experience in AI or Machine Learning project or task is a plus. 

ACADEMIC CREDENTIALS:

• Bachelor’s or Master’s degree in Electrical/Electronic Engineering or Computer Engineering

THE ROLE:

We are the high-end test engineering team providing test solutions for Data Center New Product Introduction (NPI) under the Product Engineering Organization. We do exciting product development for leading-edge technology that will power the next generation processors used for high performance computing, data centers, and enterprise servers.

If you are looking for a fulfilling and challenging career as an engineer leading SLT (System Level Test) Thermal and Board SME (Subject Matter Expert), you are at the right place! As a MTS System Level Technical Lead, you will be responsible for defining, driving and enabling SLT test solution to meet NPI business milestones and KPI (test time, yield, cost, quality .The expectation is to perform leadership to have interaction with Silicon/Board/Power design teams, Product & Test Engineering teams, Customer Quality teams, software & platform teams to ramp GPU coverage with aggressive schedule while debug GPU fallout to ensure high yield. You will experience working with and learning from AMD’s talented engineering teams around the world.

THE PERSON:

We are looking for someone with strong technical, analytical, leadership and problem-solving skills, as well as demonstrating the characteristic of an independent and resourceful individual.

You will be proficient in your understanding about PCB Board and High Power Delivery (above 1kW) design methodology, Thermal dissipation as well as a broad understanding of various industry standards in OCP (Open Compute Project), such as JEDEC HBM3/4, PCIe, I2C/I3C, UEC (Ultra Ethernet Consortium) and UCIe (Unified Chiplet Interconnect Express) etc.

KEY RESPONSIBILITIES:

• Accountable to provide leadership to meet business milestone, cost and quality in GPU system level test area.
• Collaborate with internal teams to drive SLT board and power swim lane from pre-silicon, ASIC initial bring up to HVM (High Volume Manufacturing)
• Conduct engineering evaluations and analysis to drive closure of GPU production issues, qualify cutting-edge high power SLT thermal system for HVM
• Profile or characterize PI (Power Integrity), voltage droop, or power delivery issue observed on SLT platforms in collaboration with board/silicon designers
• Involves collaboration on or assuming the consultative or leadership responsibilities for a specific project or for product development initiatives
• May provide technical supervision or mentoring junior engineers
• Upscale overall team capabilities on low level system debug for AMD data center product families

PREFERRED EXPERIENCE:

• Experience and with good understanding of PCB board and Power Delivery design for high power GPU product (above 1kW), and board lifecycle from Eval to HVM (High Volume Manufacturing)
• Strong expertise with using analyzers and oscilloscopes, and other debug tools
• Knowledge and working experience on GPU and HBM architecture, SoC design and SoC power management features are a strong plus
• Strong and effective presentation, written and verbal communication skills, and the ability to work with geographically distributed product engineering teams
• Proficiency in Windows, and Linux operating systems
• Basic scripting proficiency for automation (Shell script, Perl, Ruby, Python)

ACADEMIC CREDENTIALS:

• BS/MS Electrical Engineering, Computer Engineering, or comparable disciplines

Job Description

• Industry/ Organization Type: Manufacturing
• Position Title: Manufacturing Engineer
• Working Location: Tai Seng
• Working Hours: 5 days (Mon – Fri, 8.00am – 5.30pm)
• Salary Package: Basic salary up to $4,500 + AWS + Performance Bonus
• Duration: Permanent Role

Key Responsibilities

• Assist in New Production Introduction criteria for the following: manufacturing process development, tool design, integrated schedules, design to cost, sourcing technical support, quality qualifications, test support, product cost out and, introduction into the supply chain.
• Provide technical leadership for manufacturing processes of cables, harnesses, electro-mechanical assemblies, inspection, testing, tool and fixture designs.
• Apply knowledge of electrical/ electronic equipment production and test methodologies.
• Help to manage effectively multiple priorities under tight deadlines and bring assigned projects/programs to successful completion and profitability.
• Gather data and develop manufacturing solutions and documentation required for supporting OMS, WI, Schematic, drawings, and specs.
• Perform assembly work and provide guidance to technicians/operators.
• Perform customers’ onsite support for repairs and rework related to assembly process and any other technical issue.
• Manage daily activities of the manufacturing function including BOM, Work Instructions, Engineering Change Order (ECO) and ERP System.
• Perform and support any assembly process during First Article & production stage to meet customer needs.

APPLY NOW!!!

• Diploma or Degree in Electrical / Mechanical Engineering or a related professional certification.
• Able to create/interpret (2D & 3D Cable/Mechanical Drawings, Bill of Material, Operating Procedures, Test Procedures, schematic and Interconnection Diagram, etc)
• General knowledge of Mechanical and Electrical Engineering.
• Good communication and leadership skills; able to train and guide junior technicians.
• Proficient in CAD software.
• Proficient in Microsoft Office with hand-on experience with data and Microsoft Excel reporting.

Kindly apply through ANY of the following methods:

• Submit your application by clicking the APPLY button;
• Email your resume to Job@anradus.com.sg. Please indicate #81261 on the email subject.

Anradus Application Policy: We value each application and ensure every resume is reviewed. Our process is efficient, typically concluding within 3 working days. If you do not receive communication from us within this timeframe, it's likely that your application has not been shortlisted by our client. In such cases, we recommend continuing your job search to maximize your opportunities.

Anradus Pte Ltd | EA License No. 20C0161 | Angel Lim | EA Reg No.: R1769781

Job Description & Requirements

• Involved in design and development of embedded and fiber optics sensing systems, and data communication IC’s hardware and software implementation to prototype functional testing.
• Data compilation and analysis, reporting and documentation.
• Involved in testing of photonics devices and/or optical sensors.
• Participates in the development and implementation of new products or product changes by creating product specifications, quality specifications, quality plans, risk analyses, FMEAs in conjunction with other product development team members.
• Runs complex problem solving efforts and mentors others on best practices. e.g. FMEA, Control Plan, Test plan, quality tools and DOE. e.g. Leads/ coordinates CA of failures using a structured approach.
• Owner of product specification and performance to those specifications.

Requirements

Qualifications:

• Candidate must possess at least a Bachelor or Master in Engineering (Electrical/Electronics/Computer/Optics)

Experience:

• 8 – 10 years working experience preferably in the semiconductor/component manufacturing industry background (with or without experience are welcome to apply)
• Software knowledge of MS Office, JMP, PDF/Spot-fire is a plus
• Excellent inter-personal and communication skills, both written and oral.
• Possess the ability to work independently, self-motivated, initiative and deliver tasks on time.
• Must be team oriented, positive working attitude, able to multi-tasks in a fast pace environment and work with personnel at all level.

Job Description

• Product owner for photonics devices and optical sensors, responsible for product specification and performance.
• Design and development of embedded and fiber optics modules for sensing and data communication optics hardware and software.
• Collaboration with cross-functional team to develop and prototyping of new products or product derivatives, implementation to prototype functional testing and ramp to production.
• Develop qualification strategy and schedule, drive execution to meet project goals
• Complete project documentation including product specifications, quality specifications, quality plans, risk analysis, FMEAs and other product related documentation.
• Big data processing and analysis to provide management reporting and drive improvement activities.
• Lead complex problem solving efforts and mentor others on best practices. e.g. FMEA, Control Plan, Test plan, quality tools and DOE. e.g. Leads/ coordinates CA of failures using a structured approach.

Requirements

Minimum Qualification:

• Candidate must possess at least a Bachelor or Master in Engineering (Electrical/Electronics/Computer/Photonics)

Experience:

• 5 – 7 years working experience preferably in the semiconductor/component/photonics industry background

Specific Skills / Knowledge:

• Knowledge of photonics technology
• Software knowledge of MS Office, JMP, PDF/Spot-fire/Tibco is a plus
• Excellent inter-personal and communication skills, both written and oral
• Possess the ability to work independently, self-motivated, initiative and deliver tasks on time
• Must be team oriented, positive working attitude, able to multi-tasks in a fast pace environment and work with personnel at all level

Technical Product Management

• Collects process / production / competitor data at customer site Provide Level 2 support
• Scouts and reports new product ideas and innovation with the goal to enhance the product and service portfolio
• Provides support  for AFC model introduction (launching, demo, Semi shows)
• Conducts feasibility studies and sample bonding
• Engages in R&D projects during product definition / requirement engineering, In-house and customer testing
• Collaborate with R&D in defining new features and CIP requirements; both software and hardware
• Participation in the development of new or the extension of existing hardware and software modules according to current or future customer requirements (analysis, modelling, calculation, measurement, qualification)
• Carry out internal acceptance test of new features and CIP developed by R&D
• Builds-up technical know-how on product / problem solving via structured knowledge transfer between the Product Line, the R&D team and the different regional support centers
• Defines SW requirements (JIRA) for new modules and features (Requirement Engineering)

Pre- & After Sales Support

• Conducts evaluations, benchmarks and demos
• Support Sales and CPMs during Pre-Sales activities
• Establishes good customer relationship on technical level with all key accounts assigned
• Provides Technical Info and Updates to CPMs and Sales

Technical Support, 2nd Level support

• Coordinates and provides technical solutions / problems solving on customer issues in collaboration with Field Service Engineer in Asia (2nd level support)
• Investigates issues at customer site and supports Engineering team (Software & Hardware) for fast and short time to solution

Know How Transfer

• Troubleshoots and maintains demo equipment if necessary
• Conducts training on existing and future FC platforms to FSE’s and customers
• Supports Documentation and Manual writing activities
• Travel requirement

Position Summary

The Engineer, Product Development is responsible for the development and establishment of new product and transfer process into production.

Responsibilities

• New product development as requested by customer and internal roadmap, and transfer into production
• New material, process & machine development and qualification, and transfer into production
• Troubleshoot process issues and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Establish, review and update specifications, workflow, quality and safety related documentation for new products and transfer to production line.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• Handle and manage customer audits and 8D reports.
• Any other ad-hoc duties as assigned.

Requirements

• Bachelor’s Degree in Materials Science, Microelectronics, Electrical, Chemical engineering or similar disciplines
• At least 3 years of experience in product development or NPI work in area of Wafer-level Fanout packaging production line or LCD/FPD production line, focusing on processes such as:

1. Die Preparation/ Recon
2. Lithography

• Knowledge in process engineering, process control engineering and yield enhancement
• Experience in DOE, FMEA, and 8D reports