Total 466 procurement engineer job vacancies in Manufacturing / Production category

Responsibilities:

• Full-Stack Development: Design and implement frontend dashboards (e.g., KPI monitoring, real-time equipment status) and backend systems (APIs, microservices) for factory applications.
• System Integration: Connect applications with MES (Manufacturing Execution Systems) and IoT devices for seamless real-time data exchange.
• Automation & Workflow Improvement: Streamline manual processes through automated scripts and services, including report generation and alert notifications.
• Performance & Security: Ensure applications are secure, scalable, and maintain high performance under heavy industrial workloads.
• Deployment & Maintenance: Manage CI/CD pipelines, troubleshoot production issues, and ensure compliance with industrial standards.

Qualifications:

• Frontend: HTML5, CSS, JavaScript/TypeScript with frameworks like React, Angular, or Vue.js.
• Backend: C#/.NET, Java, Python, or Node.js for server-side logic.
• Database: SQL (Oracle, PostgreSQL, MySQL) and possibly NoSQL for production data.
• APIs: RESTful API design and integration.
• DevOps: Familiarity with Docker, Kubernetes, and CI/CD pipelines.

We regret only shortlisted candidates will be contacted. All applications will be handled confidentially. By submitting your application, you agree to the collection, use, retention, and disclosure of your personal information to prospective employers.

Wecruit Pte Ltd
EA License No: 20C0270
EA Personnel: Nyon Hock Sen (Aden)
EA Personnel Reg No: R24124070

As Front End Central Product Integration Engineer-Chip Package Interaction at Micron Technology, Inc., you will be responsible for working with global Micron network to drive each silicon node's Packaging Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

In addition, you will be responsible in integrating solutions by connecting cross-functional expertise, standardizing the business process and regularly benchmarking internal and external intelligence to achieve the highest value bits and productivity. 

Responsibilities and Tasks

• Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.

• Define strategies to ensure that Packaging Technology and interaction with Front End manufacturing process are fully developed and qualified well ahead of any qualification of the product itself.  

• Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.

• Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.

• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.

• Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.

• Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.

• Travel to Micron Fab locations as necessary for face-to-face work.

Requirements

• Bachelor’s  or Master's degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Material Science Engineering or related field

• A minimum of 2 years of experience in Back-End-of-Line (BEOL) semiconductor processing or process integration is required

• Must be willing to travel as needed to support departmental goals, with an expected travel frequency of approximately 20–50%

• Knowledge in Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test and probe yield.

• The experience on DRAM HPM, BEOL integration, advanced packaging and layout will be a plus to this job position.

• Good data analysis, troubleshoot, problem solving, reporting and presentation skills with a strong attention to detail.

• Good multi-tasking, verbal, and written communication skills.

• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.

• Good organizational capabilities and ability to work effectively with minimal supervision.

• Intermediate to advanced PC skills including Microsoft Office.

• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
  

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

Responsibilities

·      Setup and troubleshooting of semiconductorequipment

·      Document engineering improvements for futurereference

·      Create procedures for assembly, inspection andtesting of equipment

·      Collaborating with the engineering team andsoftware team to optimise system design

·      Work with cross-functional engineers to resolvesystem issues

Requirements

·      Degree/Diploma in Mechanical or MechatronicsEngineering

·      More than 3 years of experience in setting upautomation equipment

·      Process good knowledge of electro mechatronicsystems

·      Able to travel overseas for field support whenrequired

To find out more about this opportunity, please contact Lionel Liew at lionel.liew@gmprecruit.com.

Weregret that only shortlisted candidates will be notified.

GMP Technologies(S) Pte Ltd   |   EA Licence: 11C3793 |   EA Personnel: Lionel Liew   |  Registration No: R1330693

Job Description

• Industry/ Organization Type: Manufacturing - Electronics
• Position Title: Manufacturing Technician/ Manufacturing Engineer
• Working Location: Tai Seng
• Working Hours: Monday to Friday (9am to 6pm)
• Salary Package: Basic + AWS + Variable Bonus
• Duration: Permanent

Key Responsibilities

• Support daily operations of the through‑hole/DIP assembly line to meet output, quality, and safety targets.
• Set up, operate, and perform basic preventive maintenance on DIP equipment and fixtures.
• Conduct in‑process inspections and functional tests on assembled products.
• Troubleshoot process issues, escalate as needed, and recommend improvements.
• Meet production schedules while maintaining first‑pass yield and quality standards.
• Other ad-hoc duties which may be assigned.

APPLY NOW!!!

• Minimum ITE Nitec/Higher Nitec in Electrical/Electronic/Mechatronics/Manufacturing Technology.
• 1–3 years in electronics manufacturing.

Kindly apply through ANY of the following methods:

• Submit your application by clicking the APPLY button;
• Email your resume to Job@anradus.com.sg. Please indicate #80442 on the email subject.

Anradus Application Policy: We value each application and ensure every resume is reviewed. Our process is efficient, typically concluding within 3 working days. If you do not receive communication from us within this timeframe, it's likely that your application has not been shortlisted by our client. In such cases, we recommend continuing your job search to maximize your opportunities.

Anradus Pte Ltd | EA License No. 20C0161 | Rachael Lee | EA Reg No.: R2093131

Job Description:

• In charge of reviewing customer drawings, specifications, and BOM, understand technical requirements.
• Responsible in providing engineering expertise to resolve and troubleshoot technical issues arise in manufacturing
• Liaise with internal and external customers on requirements and propose solutions.
• In charge of machining process cycle-time estimation and submit to the Sales team
• In charge of providing technical advice to Sale, Quality and Supply Chain team.
• Preparing markup drawings & detailed subcon scopes for the Purchasing team.
• To assess in-house capability, feasibility, and cycle-time for
• Other duties as assigned

Requirements:

• Min Diploma in Mechanical/ Manufacturing/ Precision Engineering, or equivalent.
• Minimum 3 years of working experience in Precision Industry
• Proficient in AutoCAD / SolidWorks application

To submit your application, please apply online apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd.
EA License No: 17C8900

Job Description

• Industry/ Organization Type: Manufacturing - Electronics
• Position Title: Manufacturing Technician/ Manufacturing Engineer
• Working Location: Tai Seng
• Working Hours: Monday to Friday (9am to 6pm)
• Salary Package: Basic + AWS + Variable Bonus
• Duration: Permanent

Key Responsibilities

• Support daily operations of the through‑hole/DIP assembly line to meet output, quality, and safety targets.
• Set up, operate, and perform basic preventive maintenance on DIP equipment and fixtures.
• Conduct in‑process inspections and functional tests on assembled products.
• Troubleshoot process issues, escalate as needed, and recommend improvements.
• Meet production schedules while maintaining first‑pass yield and quality standards.
• Other ad-hoc duties which may be assigned.

APPLY NOW!!!

• Minimum ITE Nitec/Higher Nitec in Electrical/Electronic/Mechatronics/Manufacturing Technology.
• 1–3 years in electronics manufacturing.

Kindly apply through ANY of the following methods:

• Submit your application by clicking the APPLY button;
• Email your resume to Job@anradus.com.sg. Please indicate #80442 on the email subject.

Anradus Application Policy: We value each application and ensure every resume is reviewed. Our process is efficient, typically concluding within 3 working days. If you do not receive communication from us within this timeframe, it's likely that your application has not been shortlisted by our client. In such cases, we recommend continuing your job search to maximize your opportunities.

Anradus Pte Ltd | EA License No. 20C0161 | Rachael Lee | EA Reg No.: R2093131

Job Description

• Industry/ Organization Type: Manufacturing/Semiconductor Technology
• Position Title: Product Engineer (Vision Inspection Systems)
• Working Location: East Area (Nearest MRT: Bendemeer)
• Working Hours: 5 days Monday – Friday, 9 am – 6 pm 
• Salary Package: Up to $5,000 + Variable Bonus
• Duration: Permanent 

Key Responsibilities

• Assist in component selection, engineering evaluations, and testing of parts and sub-modules for vision inspection equipment.
• Design electrical parts and sub-modules for vision inspection systems.
• Maintain product design documents, including drawings and BOM (Bill of Materials).
• Work closely with and manage suppliers to ensure all design requirements are met.
• Provide troubleshooting expertise for design and system issues.
• Plan and coordinate the release of new designs to manufacturing.

APPLY NOW!!! 

• Min. Diploma in Electrical or Electronic Engineering.
• Familiarity with CAD software for electrical layout and schematic design.
• Experience working with PC hardware, Windows OS, and relevant software.
• Knowledge of PCB/PCBA design, fabrication, and testing processes is a plus.

Please apply through ANY of the following methods:

• Submit your application by clicking the APPLY button;
• Email your resume to Job(at)anradus.com.sg. Please indicate #69795 on the email subject.

Anradus Application Policy: We value each application and ensure every resume is reviewed. Our process is efficient, typically concluding within 3 working days. If you do not receive communication from us within this timeframe, it's likely that your application has not been shortlisted by our client. In such cases, we recommend continuing your job search to maximize your opportunities.

Anradus Pte Ltd | EA License No. 20C0161 | Markus Tan | EA Reg No.: R24124040 

Job Description

• Industry/ Organization Type: Manufacturing/Semiconductor Technology
• Position Title: Product Engineer (Automation/Electromechanical Equipment)
• Working Location: East Area (Nearest MRT: Bendemeer)
• Working Hours: 5 days Monday – Friday, 9 am – 6 pm 
• Salary Package: Up to $5,000 + Variable Bonus
• Duration: Permanent

Key Responsibilities

• Set up and troubleshoot semiconductor equipment.
• Document engineering enhancements for continuous improvement and future reference.
• Develop procedures for the assembly, inspection, and testing of equipment.
• Collaborate with the engineering and software teams to enhance system designs.
• Work alongside cross-functional engineering teams to troubleshoot and resolve system issues.

APPLY NOW!!!

• Min. Diploma in Mechanical or Mechatronics Engineering.
• At least 2 years of experience in setting up and managing automation equipment.
• Possesses a thorough understanding of electromechanical systems.
• Willingness to travel internationally for field support as needed.
• Availability to work overtime when required.

Kindly apply through ANY of the following methods:

• Submit your application by clicking the APPLY button;
• Email your resume to Job(at)anradus.com.sg. Kindly indicate #69727 on the email subject.

Anradus Application Policy: We value each application and ensure every resume is reviewed. Our process is efficient, typically concluding within 3 working days. If you do not receive communication from us within this timeframe, it's likely that your application has not been shortlisted by our client. In such cases, we recommend continuing your job search to maximize your opportunities.

Anradus Pte Ltd | EA License No. 20C0161 | Markus Tan | EA Reg No.: R24124040

Responsibilities and Tasks:

• Drive end‑to‑end front‑end process integration across multiple modules to support yield, functionality, and scalability

• Lead cross‑module root cause analysis for complex yield detractors and integration issues

• Support yield ramp, derivative matching, and node transitions through focused integration execution

• Act as a core cPIE contributor for assigned programs, partnering closely with site PI/PE/Device teams

• Develop and apply Best Known Methods (BKM) within owned integration scope

• Provide technical input to POR/TOR and ECN decisions affecting integration margin

• Apply data‑driven analysis to quantify process sensitivity, margin, and risk

• Participate in SWAT teams and technical deep dives for high‑impact issues

• Mentor junior engineers and contribute to knowledge sharing within CPIE

• Collaborate with PI, PE, Device, Yield, TD, and Quality to accelerate learning cycles

Required Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related discipline

• At least 3 years of strong front‑end semiconductor manufacturing experience, with demonstrated exposure to process integration across multiple modules

• Proven ability to perform complex root‑cause analysis on yield, functionality, or integration issues using data‑driven methods

• Solid understanding of device–process interactions and system‑level integration trade‑offs

• Experience collaborating across PI, PE, Device, Yield, TD, and Quality organisations

• Ability to influence technical decisions through analysis, insight, and technical credibility

• Strong written and verbal communication skills for technical reviews, deep dives, and cross‑team alignment

Good to Have:

• Direct experience supporting advanced DRAM technology nodes and/or technology ramps

• Demonstrated ownership of integration loops, yield ramp activities, or derivative matching efforts

• Experience contributing to or developing Best Known Methods (BKM), standard practices, or reusable integration solutions

• Familiarity with POR/TOR definition, ECN review, and change risk assessment from an integration perspective

• Exposure to statistical analysis, yield modelling, or advanced analytics applied to manufacturing data

• Track record of leading or contributing to SWAT teams or high‑impact technical investigations

• Experience mentoring junior engineers or serving as a technical reference within a team
  

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

Responsibilities and Tasks:

• Drive end‑to‑end front‑end process integration across multiple modules to support yield, functionality, and scalability

• Lead cross‑module root cause analysis for complex yield detractors and integration issues

• Support yield ramp, derivative matching, and node transitions through focused integration execution

• Act as a core cPIE contributor for assigned programs, partnering closely with site PI/PE/Device teams

• Develop and apply Best Known Methods (BKM) within owned integration scope

• Provide technical input to POR/TOR and ECN decisions affecting integration margin

• Apply data‑driven analysis to quantify process sensitivity, margin, and risk

• Participate in SWAT teams and technical deep dives for high‑impact issues

• Mentor junior engineers and contribute to knowledge sharing within CPIE

• Collaborate with PI, PE, Device, Yield, TD, and Quality to accelerate learning cycles

Required Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related discipline

• At least 3 years of strong front‑end semiconductor manufacturing experience, with demonstrated exposure to process integration across multiple modules

• Proven ability to perform complex root‑cause analysis on yield, functionality, or integration issues using data‑driven methods

• Solid understanding of device–process interactions and system‑level integration trade‑offs

• Experience collaborating across PI, PE, Device, Yield, TD, and Quality organisations

• Ability to influence technical decisions through analysis, insight, and technical credibility

• Strong written and verbal communication skills for technical reviews, deep dives, and cross‑team alignment
  

  Good to Have:

  • Direct experience supporting advanced DRAM technology nodes and/or technology ramps

  • Demonstrated ownership of integration loops, yield ramp activities, or derivative matching efforts

  • Experience contributing to or developing Best Known Methods (BKM), standard practices, or reusable integration solutions

  • Familiarity with POR/TOR definition, ECN review, and change risk assessment from an integration perspective

  • Exposure to statistical analysis, yield modelling, or advanced analytics applied to manufacturing data

  • Track record of leading or contributing to SWAT teams or high‑impact technical investigations

  • Experience mentoring junior engineers or serving as a technical reference within a team
    

    Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

Benefits:

• Basic up to $4000

• Mon to Fri, Office hours

• Location: North

• Great company culture and benefits

• Long-term career progression plan

Job Scope:

• Document and standardize factory and production processes and procedures across the Group.

• Identify opportunities for process improvements and implement automation initiatives to enhance efficiency and productivity.

• Support the deployment and implementation of production processes and procedures across Singapore and overseas operations.

• Manage and support the development of next-generation production systems for switchgear manufacturing and assembly.

• Ensure compliance with internal standards through audits of factory operations and process engineering practices across the Group.

• Collaborate with operations teams to drive continuous improvement initiatives in manufacturing processes.

• Perform other duties related to operations and process engineering as assigned.

Job Requirement:

• Diploma or Degree in Electrical Engineering, Mechanical Engineering, or a related discipline.

• At least 1 year of relevant experience in process engineering within a manufacturing environment will be an added advantage

• Entry levels are welcomed, as training will be provided.

Please submit your updated resume in MS word format by using the APPLY NOW BUTTON.

We regret that only shortlisted candidates will be notified.

Staffking Pte Ltd (20C0358) | Jasmine Wong (R22107578)

• Lead and motivate line leaders and operators to achieve daily production targets and maintain quality standards.
• Conduct shift handovers and address operational or process issues promptly.
• Plan manpower, overtime, and consumable usage for smooth operations.
• Ensure strict adherence to manufacturing procedures and safety guidelines.
• Drive continuous improvement initiatives to enhance efficiency and reduce errors.

Requirements:

• Diploma or Degree in Engineering, Science, or Manufacturing-related disciplines.
• At least 2 years of experience in high-tech/high-volume manufacturing environment.
• Strong leadership abilities with clear communication skills.

If you are keen to apply for the position, kindly email your detailed resume in MS Word to hr@recruit-expert.com

Please note that only shortlisted candidates will be notified.

For more job opportunities, please visit our website at www.recruit-expert.com

EA Licence: 19C9701

Registration: R1326740

Key Responsibilities

• Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products.

• Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure.

• Drive yield breakthroughs by understanding the end‑to‑end test flow, product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements.

• Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs.

• Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification.

• Lead cross‑functional and cross‑site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges in a timely manner.

• Promote network Best‑Known‑Method (BKM) development, standardization, and business process creation or re‑engineering to improve productivity and efficiency.

• Maintain strong working relationships with stakeholders in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams.

• Communicate project status, risks, and proposals effectively through clear written reports and technical presentations.

• Proactively identify obstacles, escalate when needed, and partner with management to drive successful outcomes.

• Travel to Micron fab and development sites as needed to support project execution and alignment.
  

  Minimum Qualifications

  • Bachelor’s, Master’s, or PhD degree in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science Engineering, or a related field.

  • 2+ years of experience in one or more of the following:

  • Product Integration

  • Test Engineering

  • Yield Engineering

  • Design Engineering

  • BEOL semiconductor processing or process integration

  • Strong knowledge of Semiconductor Device Physics and DRAM product operations.

  • Understanding of wafer fabrication process flows, parametric/electrical testing, and probe yield.

  • Strong data analysis, debugging, troubleshooting, and problem‑solving skills with attention to detail.

  • Effective verbal and written communication skills with the ability to present to both small and large technical audiences.

  • Demonstrated ability to collaborate across functions and cultures, building strong customer and co‑worker relationships.

  • Ability to work independently with minimal supervision, manage multiple priorities, and stay organized.

  • Intermediate to advanced PC skills, including Microsoft Office.

  • Willingness to travel approximately 20–50% to support global project needs.

  • Flexibility to adapt to changing priorities and take on additional responsibilities as needed.

  Preferred Qualifications

  • Experience in DRAM High Bandwidth Memory (HBM) products.

  • Exposure to DRAM HPM, advanced packaging, chip‑package interaction, BEOL integration, or layout‑related topics.

  • Experience working across Test, Product, Yield, Design, Packaging, and Manufacturing organizations.

  • Proven ability to drive alignment and execution in central or network‑level roles.

  • Strong interest in innovation, continuous improvement, and scalable solution development.

Job Responsibilities:

• Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimize integration structures and achieve BIC yield and quality targets.

• Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defense lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity.

• Own and advance product integration programs and loop‑level domain expertise, maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration, including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer (center‑to‑edge) yield and quality ramp.

• Drive worldwide technical alignment and execution excellence by leading global projects, standardizing and leveraging network BKMs, and scaling proven solutions across sites. Identify efficiency and performance gaps, and lead business process creation, optimization, and re‑engineering to improve benchmark performance, cycle time, and development productivity.

Job Requirements:

• With more than 5 years of semiconductor industries' experience / knowledge.

• Bachelors/Masters/PhD. in EE, Materials Engineering, Materials Science, Physics and Chemical but optional if candidates have more than 8 years' experience in process related role in semiconductor industry.

• Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qual data from both front-end and backend assembly process.

• Good logical thinking and knowledge in Semiconductor Fabrication process flows, interaction of different processes and how changes affect yield, device performance and reliability.

• Good model-based problem solving together with data driven decision making, and presentation skills. Proven ability to troubleshoot and solve structure and device related issues, and address root cause.

• Good organizational capabilities and ability to work effectively. Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities. Travel to Micron sites as necessary for face-to-face collaboration.

• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.

• Good multi-tasking, verbal and written communication skills.

Production Engineer

Our client is a leading global manufacturer of polymer. They are currently seeking for Production Engineer.

The role of the Production Engineer includes:

• Lead Operation plans and processes to optimize manufacturing Operations
• Responsible for Plant operations and performance in accordance with production Goals
• Technical Leadership in Production workforce for plant operation, optimization & Troubleshooting
• Coach & Guide for field and console operators reporting to Production Manager
• Cross function collaborations with Maintenance, Project, Reliability Technical- Technology and HSE functions to troubleshoot Petrochemical Manufacturing Site
• Lead the Operating Procedure development and Plant improvement activities
• Lead plant related risk assessment and compliance of Safe operating work practices
• Hire, Train, Develop, Inspire and Coach the Production team
• Lead emergency response, Crisis Management plan
• Provide guidance of shift team during plant troubleshooting, Start-ups/ Shutdowns / Turn arounds
• Responsible for the development, implementation of prestart up planning activities and oversee commissioning & Start- up activities of grassroot facilities
• Capable to identify, develop and implement improvements / changes in the Plant
• Lead Production ideas for improving Profitability, safety, reliability of facilities
• Process Safety Champion for Operations; MOC/PSSR leadership
• To fill in for Production Manager during his/her absence

Requirements:

• Degree in Engineering (Chemical or other equivalent)
• Minimum 5-8 years of working experience in Chemical Manufacturing facilities
• Production Experience in Rubber, Polymer or Petrochemical plants will be preferred
• Experience as Team Lead of Shift Teams
• Excellent Leadership, Planning & Problem-Solving skills
• Advance Coaching & Mentoring Skill to technician and Undergraduates
• Preferred Experience of Green Field Start-up, Operating Procedure development
• Effective written & verbal communication skills
• Knowledge of Singapore Regulations & Industry HSE practices & Process Safety Basics
• Prior experience in Six Sigma, Lean, 5S, and continual improvement programs are preferred

Interested candidates, please send your detailed resume stating Past Employments, including Reasons of Leaving, Last Drawn Salary for the most recent 2 positions (breakdown of basic salary, allowance, bonuses etc), Expected Basic Salary and availability.

WE REGRET TO INFORM THAT ONLY SHORTLISTEDCANDIDATES WILL BE NOTIFIED

Manfield Employment Services Pte Ltd (Lic. No: 95C2823)
Posting Personnel: Win Hui
EA Personnel Reg No.: R23115634

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