Total 23 process engineer job vacancies in The Philippines

Position Summary

The Process Engineer is responsible for development and establishment of production process. 

Responsibilities

• Responsible for Backend process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc.  

• Establish, review and update specifications, workflow, quality and safety related documentation for production line.  

• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.  

• Process sustaining and control through SPC and periodic defect Pareto Analysis.  

• Lead and drive SPC control.  

• Review and maintain FMEA, Control plan, OCAP with cross-functional teams.  

• Handle and manage customer audits and 8D reports.  

• Provide disposition for engineering and production lots.  

• Conduct process characterization and qualification to establish process baseline. 

• Coordinate and liaise with vendor/suppliers on process issue or quality issue.  

• Support customer NPI activities and internal engineering activities.  

• New material, process & machine development and qualification.  

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line 

• Any other ad-hoc duties as assigned by supervisor 
  

Requirement

• Minimum bachelor's degree in material science, microelectronics, mechanical engineering or relevant engineering field  

• At least 3 years of experience in semiconductor manufacturing industry and working in cleanroom environment  

• Hands-on process experience in Backend Process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc within semiconductor IC packaging industry 

• Experience in SPC, DPE, FMEA, OCAP, WI, CPK, PPK, 4D/8D report  

Position Summary

The Process Engineer (Lithography) is responsible for the development and establishment of production process.

Responsibilities

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.  
• Establish, review and update specifications, workflow, quality and safety related documentation for production line. 
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.  
• Process sustaining and control through SPC and periodic defect Pareto Analysis.  
• Lead and drive process control measures such as SPC, FDC/KPC and RCA towards zero defects.  
• Lead and drive continuous improvement activities in area of quality, productivity, cycle time, cost and process control automation. 
• Review and update FMEA, Control plan OCAP with cross-functional teams. 
• Coordinate and liaise with vendor/suppliers on process issue or quality issue. 
• Support customer NPI activities and internal engineering activities. 
• New material, process & machine development and qualification. 
• Handle and manage customer audits and 8D reports.  
• Provide disposition for engineering and production lots. 
• Conduct process characterization and qualification to establish process baseline.
• Any other ad-hoc duties as assigned. 

Requirements

• Minimum Bachelor’s Degree in Materials Science, Microelectronics, Chemical Engineering or relevant engineering degrees.
• Minimum 3-years hands-on Lithography process experience in area of in the Wafer-level Fanout packaging production line or LCD/FPD production line.
• Knowledge in process engineering, process control engineering and yield enhancement.
• Experience in SPC, DOE, FMEA, and 8D reports

Position Summary

The Process Associate Engineer is responsible to support the engineering activities as well as the daily production activities reliably and efficiently. 

Candidates with related experience in semiconductor and/or electronics manufacturing industry are encouraged to apply for this position. 

Responsibilities

• Ensure process integrity for machine is in place for production  

• Process monitoring via SPC / real time monitoring system 

• Work on process improvement projects 

• Handle disposition and on hold lots 

• Maintain good housekeeping in the production area  

• Support in recipe setup and qualification for production 

• Assist to troubleshoot process-related issue 

• Engineering data collection 

• Other ad-hoc duties as assigned 

Requirements 

• Minimum diploma in electrical / mechatronics / mechanical/ microelectronics engineering or similar discipline 

• Minimum 2 years’ experience working in semiconductor manufacturing environment 

• Minimum 2 years of experience working in Die Preparation (Backgrind, Dicing and Laser-grooving), Pick and Place, and Molding/ De-bonding processes.

• Knowledge in basic SPC and Microsoft Office 

• Flexible to work under various shift pattern. The selected candidate will start with office hours first, and eventually work on 12-hour rotating shift (day and night) 

Process Engineer (Pick and Place) is responsible for development andestablishment of production process.

Responsibilities

• Establish, review and update specifications, workflow, quality and safety related documentation for Pick and Place process within production line.

• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.

• Process sustaining and control through SPC and periodic defect Pareto Analysis.

• Lead and drive SPC control

• Review and maintain FMEA, Control plan, OCAP with cross-functional teams.

• Handle and manage customer audits and 8D reports.

• Provide disposition for engineering and production lots.

• Conduct process characterization andqualification to establish process baseline.

• Coordinate and liaise with vendor/suppliers on process issue or quality issue.

• Support customer NPI activities and internal engineering activities.

• New material, process & machine development and qualification.

• Review and accept machine buyoff,setup pilot line process and transfer from pilot to production line

Requirement

• Minimum Degree in Electrical & Electronics, Microelectronics, Mechanical engineering or relevant engineering discipline

• Experience in Semiconductor manufacturing industry and working in cleanroom environment

• Minimum 3 years hands-on Pick and Place Process within semiconductor /electronics manufacturing industry

• Experience in SPC, DOE, FEMA, and 8D reports

Position Summary

The Equipment Associate Engineer (Backend) is responsible for maintaining and supporting backend equipment operations, including setup, repairs, and preventive maintenance. The job incumbent is expected to work closely with engineering and manufacturing teams on equipment qualification, new product introduction, and continuous improvement initiatives. 

Responsibilities

• Perform equipment Line Sustaining function (corrective maintenance), preventive maintenance, predictive maintenance, and calibration.  

• Sustain and improve overall equipment performance (OEE).  

• Update consumables/spare parts to ensure no delay in machine recovery due to no spare.  

• Participate in and contribute to continuous improvement activities for yield, maintenance cost, equipment modification and productivity improvement.  

• Assist Engineers in setting up new machine and buy-off.  

• Maintain good housekeeping and safety practices in the cleanroom.  

• Communicate with supervisors, fellow shift personnel and vendors to resolve problems.  

• Timely update and ensure data integrity of pass down report, PM Checklist and other similar reports, checklists and documents.  

• Comply safety standards and procedures during shift duty or working in the production line.  

• Responsible for maintenance and repairs on assigned equipment.  

• Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance. 

• Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification.   

• Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction.  

• Any other ad-hoc duties as assigned. 

Requirements

• Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science or equivalent.  

• Minimum 3 years’ relevant experience in semiconductor/ LCD/ electronics/ electrical industry. 

• Minimum 3 years’ experience in maintenance and troubleshooting of equipment, preferably in semiconductor backend operations. 

• Has hands-on experience in handling equipment for any of the following: Carrier Lamination, Pick and Place, Wafer Saw, Wafer Backgrind, Laser grooving, Wafer Mounting, Taping and Detaping, Oven curing/annealing, metrology tools for wafer/panel inspection in semiconductor industry (packaging assembly). 

• Able to work in both day and night rotating shifts, and flexible to work under various shift patterns.  

Position Summary

The Equipment Associate Engineer (Thin Film) is responsible for maintaining and supporting backend equipment operations, including setup, repairs, and preventive maintenance. The job incumbent is expected to work closely with engineering and manufacturing teams on equipment qualification, new product introduction, and continuous improvement initiatives. 

Responsibilities

• Perform equipment Line Sustaining function (corrective maintenance), preventive maintenance, predictive maintenance, and calibration.  

• Sustain and improve overall equipment performance (OEE).  

• Update consumables/spare parts to ensure no delay in machine recovery due to no spare.  

• Participate in and contribute to continuous improvement activities for yield, maintenance cost, equipment modification and productivity improvement.  

• Assist Engineers in setting up new machine and buy-off.  

• Maintain good housekeeping and safety practices in the cleanroom.  

• Communicate with supervisors, fellow shift personnel and vendors to resolve problems.  

• Timely update and ensure data integrity of pass down report, PM Checklist and other similar reports, checklists and documents.  

• Comply safety standards and procedures during shift duty or working in the production line.  

• Responsible for maintenance and repairs on assigned equipment.  

• Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance. 

• Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification.   

• Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction.  

• Any other ad-hoc duties as assigned. 

Requirements

• Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science or equivalent.  

• Minimum 3 years’ relevant experience in semiconductor/ LCD/ electronics/ electrical industry. 

• Minimum 3 years’ experience in maintenance and troubleshooting of equipment, preferably in semiconductor backend operations. 

• Has hands-on experience in handling PVD tools/ equipment (sputtering systems, vacuum pumps, deposition chambers) 

• Able to work in both day and night rotating shifts, and flexible to work under various shift patterns.  

Position Summary

The Equipment Associate Engineer (DP/ Recon) is responsible for performing maintenance and repairs on the assigned equipment. The ideal candidate is a good team player, able to work independently, attentive to details and safety, and willing to embrace new task or responsibilities in a dynamic environment.  

Responsibilities

• Perform equipment Line Sustaining function (corrective maintenance), preventive maintenance, predictive maintenance, and calibration.  

• Sustain and improve overall equipment performance (OEE).  

• Update consumables/spare parts to ensure no delay in machine recovery due to no spare.  

• Participate and contribute to continuous improvement activities for yield, maintenance cost, equipment modification and productivity improvement.  

• Assist Engineers in setting up new machine and buy-off.  

• Maintain good housekeeping and safety practices in the cleanroom.  

• Communicate with supervisors, fellow shift personnel and vendors to resolve problems.  

• Timely update and ensure data integrity of pass down report, PM Checklist and other similar reports, checklists and documents.  

• Comply safety standards and procedures during shift duty or working in the production line.  

• Responsible for maintenance and repairs on the assigned equipment.  

• Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance.  

• Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification.   

• Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction.  

• Any other ad-hoc duties as assigned.  

Requirements

• Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science or equivalent.  

• Minimum 3 years’ relevant experience in semiconductor/ LCD/ electronics/ electrical industry. 

• Minimum 3 years’ experience in maintenance and troubleshooting of equipment, preferably in semiconductor backend operations. 

• Has hands-on experience in handling equipment for any of the following: Carrier Lamination, Pick and Place, Wafer Saw, Wafer Backgrind, Laser grooving, Wafer Mounting, Taping and Detaping, Molding (Compression, Transfer, or Injection).  

• Able to work in both day and night rotating shifts, and flexible to work under various shift patterns.  

Process Engineer (AOI) is responsible for development and establishment of production process.

Responsibilities

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive process control measures such as SPC, FDC/KPC and RCA towards zero defects.
• Lead and drive continuous improvement activities in area of quality, productivity, cycle time, cost and process control automation.
• Review and update FMEA, Control plan OCAP with cross-functional teams.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Handle and manage customer audits and 8D reports.
• - Provide disposition for engineering and production lots.
• - Conduct process characterization and qualification to establish process baseline.
• - Any other ad-hoc duties as assigned.

Requirement

• Minimum bachelor’s degree in Materials Science, Microelectronics, Chemical Engineering or relevant disciplines
• Minimum 3 years of experience working in Wafer-level Fanout packaging production line or LCD/FPD production line
• Knowledge in process engineering, process control engineering and yield enhancement
• Experience in SPC, DOE, FEMA, and 8D reports