Total 54 Senior Executive process development engineer job vacancies in The Philippines

Responsibilities

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type

• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs.

• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements

• Identify disruptive processes early on and work with manufacturing and Boise TD to identify viable path forward

• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions

• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes.

• Design and implement advanced process monitoring and control methodologies.

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.

• This position requires communications and collaboration with partners both locally and globally. 

• Strict adherence to Micron Intellectual Property protection policy is a must.

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Bachelors/Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry and related

• A deep understanding of chemistry, chemical kinetics, thermodynamics and  mass transport

• Opportunity to travel overseas for an extended period of time for collaborative R&D work assignment.

• 2-3 years of experience in Semiconductor Equipment/Process development is preferable

• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data

• Working knowledge of Design of Experiments (DoE)

• Proven ability to collaborate with local and overseas teams on projects

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Ability to be a self-motivated individual and be adaptable

• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously

• Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus

Micron’s Singapore Process Development (PD) group in Technology Development (TD) is looking for Plasma-CVD / Diffusion PD engineer to support Plasma-CVD/DIFF process development of advanced technology nodes. You will design and optimize Plasma-CVD or Diffusion for Micron’s innovative NAND Flash products.

As a PD Engineer, you will take ideas from conception through process development then implementation in our manufacturing facilities. In addition to your technical responsibilities, you will also run the projects of highly technical nature. This role is essential to the success of Micron’s products and may require business-related travel. Primary areas of responsibility include Plasma-CVD or Thermal Diffusion process and film characterization, optimization, design, troubleshooting, process transfer and fundamental research.

Advanced Thin Films PD Engineer will interact with groups such as Process Integration, Metrology, Surface characterization labs, Electrical Failure Analysis, Yield Enhancement, Manufacturing and Equipment vendors/suppliers, to ensure robust thin film processes that meet the precise physical and electrical requirements for Micron Products.

As an Advanced Thin Films PD Engineer at Micron, you will be required to travel for brief business purposes. This position requires that you have an aptitude for a research and development (R&D) environment, good organizational skills and ability to work independently as well as in a team environment. This position may often require weekend support to R&D Pilot Line, for example, in case of pilot/manufacturing line excursions/downs and monitoring program-critical lots thought various modules as deemed necessary.

Your responsibilities will include, but are not limited to:

• Process Development

• Design and develop and deliver process package to meet product specification requirements as per program targets and timelines

• Characterize the processes using appropriate techniques (SEM, TEM, XPS, SIMS, AFM, etc.)

• Design and execute experiments, analyze data and present it in the appropriate forums.

• R&D Pilot Line in the Fab

• Improve process maturity, capability and sustain processes in the fab under your ownership

• Updating the Fab engineers on customer issues and technology needs.

• Supporting root cause defect and unique fail mode analysis.

• Process Integration

• Delivering advanced technology to meet future product nodes.

• Developing recipes to meet structural & electrical requirements.

• Managing wafers though Thin Film levels in support of special requirements.

• Other Process Areas

• Working in cross-functional teams to jointly develop Array and CMOS structures.

• Supporting cross-functional failure analysis and yield improvement.

• Advanced Thin Film peers

• Maintaining or developing expertise in multiple process, hardware, or technology areas.

• Serving as a resource for peers in recipe & process development.

Successful candidates must have:

• Education requirements

• PhD in Physics, Materials Science, Chemical Engineering, Electrical Engineering, Chemistry, or related fields

• BS/MS+5 years equivalent industry or research experience may substitute for a PhD.

• Understanding in one or more of the following topics Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena.

• Solid troubleshooting, experimental design and data analysis skills.

• Strong computer skills, including MS Office.

• Plasma physics background and understanding of plasma sources used in plasma CVD is highly preferred.

• Understanding of CVD and Diffusion deposition processing principles.

• Rudimentary understanding of process control and Statistical Process Control (SPC).

• An understanding of solid state devices.

• An understanding of semiconductor process.

• Knowledge of advanced data analysis techniques and scripting is highly preferred

• Open to work off shift and weekends if necessary

• Open to domestic and international travel

Role Summary

As a Senior Member of Technical Staff (SMTS), you are a module‑level CMP technical authority, responsible for defining CMP technical direction, leading FOAK developments, and driving cross‑functional execution across NAND nodes. As a SMTS (Senior Member of Technical Staff), you will be a part of revolutionary Next Generation NAND research & development CMP team driving Advanced NAND and CMP technology forward. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with Next Generation NAND. A SMTS CMP Engineer is a senior individual contributor responsible for defining, developing, and transferring advanced CMP processes for Micron NAND technologies. You will work directly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will work on state of the art and best in class CMP chambers & own the process roadmap to meet program and yield goals.

Main Responsibilities

• Own and lead key NAND CMP process modules, translating technology challenges into executable roadmaps across current and future nodes

• Drive cross‑functional execution across Technology Development, Process Integration, Manufacturing, and Equipment teams

• Lead FOAK CMP process development, including recipe architecture, control strategies, and integration alignment

• Ensure process robustness and manufacturability through run‑to‑run controls, SPC, qualification execution, and risk mitigation

• Resolve complex yield, defectivity, and integration issues using model‑based and data‑driven problem solving

• Define and execute process‑level hardware strategies in collaboration with equipment suppliers

• Act as a CMP technical leader, mentoring engineers, influencing adjacent process roadmaps, and communicating technology status and plans to senior stakeholders

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Other Responsibilities

• Mentor engineers through structured development; build SME pipelines; publish internal papers/BKMs and present to senior leadership; uphold Micron’s technical leadership expectations

• Integrates AI assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Qualifications / Experience

• PhD ≥12 yrs, or Master’s ≥15 yrs, of relevant experience in
  Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,

• Experience in CMP Process Development

• Deep expertise in CMP chemistry, physics, and integration

• Publications/patents and strong record of technical contributions.

Must-Have Technical Skills

• In‑depth expertise in CMP fundamentals, including pad–slurry–wafer interactions, slurry chemistry at a mechanistic level, and pattern density/layout effects

• Strong understanding of multiple CMP process types (e.g., metal, dielectric, barrier/hardmask, poly‑Si/Si CMP)

• Extensive hands‑on experience with advanced 300 mm CMP OEM platforms, including driving hardware capability, throughput, and cost improvements

• Proven expertise in statistical process control (SPC), data analysis, and qualification methodologies

• Ability to independently drive complex technical execution, resolve yield and defectivity issues, and influence cross‑functional teams

Must-Have Soft Skills

• Demonstrated technical leadership in problem solving, with experience leading complex or multi‑disciplinary technical projects

• Strong ability to influence without authority across process integration, equipment, and manufacturing teams

• Clear and structured technical communication skills, including written documentation and stakeholder updates

• Strong analytical mindset with disciplined, data‑driven decision making

Embody Micron’s core values:

• People – Respect, develop and empower others

• Innovation – Drive continuous improvement and breakthrough thinking

• Tenacity – Show grit and determination

• Collaboration – Build trust and foster teamwork

• Customer Focus – Deliver excellence and value

Micron’s Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology.

Key Responsibilities

• Develop and optimize unit processes to meet yield and quality targets for advanced NAND devices

• Evaluate innovative process and equipment solutions for early experimentation and process margin improvement

• Collaborate with Singapore-based Diffusion manufacturing teams to identify and prioritize key technology challenges

• Integrate and troubleshoot processes within cross-functional teams focused on yield and quality enhancement

• Partner with Boise TD Films teams to align future device requirements with process capabilities

• Identify disruptive process technologies early and define viable implementation paths with global TD and manufacturing teams

• Conduct fundamental research, hardware evaluations, and novel process testing to support intellectual property generation

• Design and execute experiments to expand process margins and validate manufacturability of next-node solutions

• Lead cross-functional initiatives to simplify processes and implement improvements

• Embed best-known manufacturing practices into early-stage development of new nodes

• Develop and apply advanced process monitoring and control methodologies.

• Serve as a technical expert, contributing to process, equipment, and procedural improvements

• Lead multidisciplinary projects across teams, sites, and suppliers focused on quality, yield, cost, and productivity

• Advise management on significant technical issues and drive innovation through patents and technical publications

• Maintain strict adherence to Micron’s Intellectual Property protection policies

• Engage continuously with global TD partners and suppliers to push for breakthrough solutions

• Own and manage module-level business processes

Requirements

• Bachelor/Masters in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics with minimum 5 years of relevant experience or PhD in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics

• Strong understanding of:

• - Flow dynamics, thermodynamics, and physical phenomena in deposition

• - Precursor depletion effects in 3D structures and mitigation strategies

• - Interface characterization techniques (e.g., SIMS, XPS, EDX, SEM/TEM)

• - Integration and structural constraints in film deposition processes

• - Memory process flows, especially for planar and vertical NAND

• Proficiency in data analysis tools (e.g., Y3) and Design of Experiments (DoE)

• Excellent communication skills for both in-person and remote interactions

• Self-motivated, adaptable, and capable of managing multiple projects in a dynamic environment

You are responsible for new equipment introduction, risk assessment, equipment set-up, release, PM, Calibration, lab audits and as well as continuous improvement activities such as equipment reliability improvement, cost reduction, and equipment usage optimization. Through this role, you will enhance your technical skills in equipment management and improvement, project management, and strengthen your engagement and network with vendors and global GEL organizations across Micron sites.

Responsibilities

-Support GEL Equipment and lab operations including Internal and External audits, ESD and PM, Calibration, equipment troubleshooting, Safety and Chemical controls.

- Oversees the installation, modification, upgrade and maintenance of Engineering equipment.

- Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. - -- Establishes programs and solutions for increasing uptime and for equipment problems that affect the engineering process.

-Provides technical support to the engineering equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules.

- Collaborate with cross functional teams on equipment requirements, space planning, facilitation, purchase and installation of equipment.
- Equipment inventory controls and critical spare parts planning.

- Coordinate external vendors on training, repair, and preventive maintenance of equipment.
- Manage external vendors expectation, set and assess goals and achievements.
- Analyze and support stakeholders’ requirements and expectations.
- Foster closer collaboration amongst cross functional teams.
- Focus on customer needs and provide timely solutions.

Requirement

• Bachelor's degree in engineering with experience with ESD checks

• At least 1 year of experience in Semiconductor Equipment or Tools PM, calibration, and troubleshooting.

• Knowledge with Automated Optical Inspection and ANSYS Simulation

As a PDE Central Yield Enhancement (YE) Engineer within Package Development Engineering (PDE), you will own and execute yield learning and improvement activities across advanced package technologies during HBM and NCG New Product Introduction (NPI). Your scope includes yield monitoring, excursion response, and yield stabilization, with an emphasis on rapid learning, early risk identification, and scalable solutions. 

This role plays a key part in driving robust yield performance from first silicon through NPI ramp and early HVM, partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing and Quality teams. You will act as a hands‑on yield owner for NPI builds, translating data into actionable insights, driving fast learning cycles, early risk detection, and leading disciplined yield recovery. 

Job Responsibilities 

Yield Loss Accounted For 

• Account for HBM NPI builds across PWF, Assembly, and test through defect breakdown and PFA submission to understand fail mode 

• Own and execute assigned Central YE responsibilities for HBM NPI program, work closely with PI to identify defects that is coming from their area to brainstorm for CIP 

• Learn NPI processes, phase gates, and yield best practices 

• Assist in maintaining yield dashboards and trackers. Support PI/PE/RDA in identifying and transforming processing data to account/ breakdown a yield loss 

Yield Deviation Control 

• Analyze and report on yield deviation issue and trigger action from PI, PE or RDA 

• Support block run and partial conversion build yield analysis to early detect any impact on yield 

• Work closely with PCS team to identify SPC or FDC charts to put into YLR dashboard for shift left monitoring 

Yield Improvement Opportunities 

• Brainstorm with staff from other departments for improvement opportunities and propose to PI 

• Design and implement new solutions, including hotspot analytics, to improve the effectiveness of the automated defense line system. 

• Utilize software tool like Auto-diagnostics to find yield improvement opportunities 

Integrating Artificial Intelligence 

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgement and complying with organizational standards and legal requirements 

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work 

Job Requirements 

• Bachelor's or Master's degree in Electrical/ Electronics Engineering/ Computer Engineering / Computer Science with 2 to 5 years of experience in semiconductor industry, specifically involving yield analysis, defect/root cause investigation, or data-driven process optimization in advanced memory (HBM, DRAM, NAND) or high-volume semiconductor packaging. 

• Proficiency in Python (e.g., Pandas, NumPy) and SQL for semiconductor manufacturing data analysis, with hands-on experience developing interactive dashboards and visual reports using tools (including Spotfire and Power BI/Tableau) to translate large manufacturing datasets into actionable yield and process improvement insights. 

• Demonstrated experience building automated reporting workflows, data pipelines, or process automation solutions using Python scripting or RPA tools within a semiconductor manufacturing environment, with the ability to drive cross-functional decisions across manufacturing, process integration, and engineering teams in the semiconductor industry. 

• Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes 

Embody Micron’s Core Values 

• People – Respect, develop, and empower others. 

• Innovation – Drive continuous improvement and breakthrough thinking. 

• Tenacity – Show grit and determination. 

• Collaboration – Build trust and foster teamwork. 

• Customer Focus – Deliver excellence and value 

You are responsible for new equipment introduction, risk assessment, equipment set-up, release, PM, Calibration, lab audits and as well as continuous improvement activities such as equipment reliability improvement, cost reduction, and equipment usage optimization. Through this role, you will enhance your technical skills in equipment management and improvement, project management, and strengthen your engagement and network with vendors and global GEL organizations across Micron sites.

Responsibilities

-Support GEL Equipment and lab operations including Internal and External audits, ESD and PM, Calibration, equipment troubleshooting, Safety and Chemical controls.

- Oversees the installation, modification, upgrade and maintenance of Engineering equipment.

- Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. - -- Establishes programs and solutions for increasing uptime and for equipment problems that affect the engineering process.

-Provides technical support to the engineering equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules.

- Collaborate with cross functional teams on equipment requirements, space planning, facilitation, purchase and installation of equipment.
- Equipment inventory controls and critical spare parts planning.

- Coordinate external vendors on training, repair, and preventive maintenance of equipment.
- Manage external vendors expectation, set and assess goals and achievements.
- Analyze and support stakeholders’ requirements and expectations.
- Foster closer collaboration amongst cross functional teams.
- Focus on customer needs and provide timely solutions.

Requirement

• Bachelor's degree in engineering with experience with ESD checks

• At least 1 year of experience in Semiconductor Equipment or Tools PM, calibration, and troubleshooting.

• Knowledge with Automated Optical Inspection and ANSYS Simulation

Responsibilities: 

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type 

• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs. 

• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD Wet Etch peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements 

• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron. 

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions 

• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes. 

• Design and implement advanced process monitoring and control methodologies. 

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment. 

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings 

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers. 

• This position requires communication and collaboration with partners both locally and globally. 

• Strict adherence to Micron Intellectual Property protection policy is a must. 

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions. 

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Requirements: 

• Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry are welcome to apply. 

• 2-3 years of semiconductor industry experience is preferable 

• A deep understanding of chemistry, chemical kinetics, thermodynamics and mass transport 

• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM, FTIR. Understanding of various integration and structural impacts and constraints related to wet etch processes. 

• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular. 

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data 

• Working knowledge of Design of Experiments (DoE) Proven ability to collaborate with local and overseas teams on projects 

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications. 

• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously 

• Ability to travel for extended periods of time and stay at Boise TD for 2-4 months at a stretch to work on technology development. 

Join Micron as a Senior Process Development Engineer, Dry Etch, NAND, and join a passionate team advancing next-generation NAND process technologies. You will collaborate with proficient professionals, develop inventive process, and assist us in achieving seamless delivery on our demanding projects.

Responsibilities: 

• Rapid deployment of new NAND process technologies.

• Drive development efforts prior to device ramp

• Define and complete effective actions to enable solutions required to hit key achievements and achieve the required performance within timelines

• Complex process development tasks related to ongoing evaluation of Dry Etch tool performance, examination of Dry Etch process windows, and adjustments or refinement of Dry Etch recipes within 3D NAND technology

• Troubleshoot processes as part of cross-functional teams, driving yield and quality improvement.

• Take initiative to identify and own areas for improvement, collaborating with other Fabs and TD teams.

• Proactively identify exciting processes and work with Fabs to find viable solutions

• Drive process simplification initiative across cross-functional teams.

• Integrate best-known manufacturing methods into the early development phase of upcoming nodes

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Successful candidates for this position will have: 

• PhD degree in Material Science, Physics, Chemistry, Electrical/Electronics Engineering, or Bachelors/Masters in Material Science, Physics, Chemistry, Electrical/Electronics Engineering with minimum of 3 years of semiconductor dry etch process development background

• Proven track record of strong publication, patent, or invention disclosure.

• Strong interest in technology development and crafting production-worthy technologies

• Ability to build and maintain relationships with cross-functional teams and vendors

• Excellent communication skills (written, verbal, and presentation).

• Proficiency in statistics, data analysis, Design of Experiments (DOE), and comfort with analysis software tools.

• Ability to work in a fast-paced and dynamic environment

As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.

Responsibilities and Tasks

Conduct Electrical Characterization

• Understand PFA techniques available for de-processing failures

• Understand assembly and test process

• Perform electrical verification to confirm failures

• Establish best known method for de-processing package

Provide Data Analysis

• Understand backend test flows, qualification methodologies and be able to pull relevant information

Communicate with Internal/External Groups

• Document failure analysis techniques used to isolate failure for other groups

• Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA

• Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs

Provide Technical Expertise

• Conduct TMO training and FA certification

• Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.

• Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.

• Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.

Maintain Equipment

• Coordinate calibrations (external to Micron)

• Procure parts as needed

• Coordinate host vendors to support equipment repair

Manage Laboratory

• Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.

• Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.

• To manage the exhaust and scrubber systems of the FA Lab.

• To maintain records and procedures as per Micron GOPs

Education and Experience

• PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline. 

• 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.

• Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.

• Strong communication skills with the ability to collaborate effectively across internal teams and external partners.

• A mindset that emphasizes customer focus, continuous improvement, and striving for excellence.

As Frontend Central Product Integration Engineering and transformative (CPIE) team at Micron Technology, Inc., you will be leading new initiatives to deliver pioneering process capability, best-in-class bits per wafer (Yield) with the highest quality and fastest speed through innovation and collaboration with multi-functional teams. Your primary focuses include but not limited to:

Initiate new data solutions and methodologies to:

• identify process, test, and design improvement opportunities, specialized in UE_ROW & all quality index, Front End-PTS integration, and high-value-bits (PG2+) yield;

• modeling, monitoring and aiming for tool performance benchmarking;

• Process equipment prognostics and process integration optimization;

• Identity test optimization opportunities for high product grade yield improvement.

• Collaborate with site Process & Equipment Engineering, Manufacturing(MFG), Product Integration Engineering (PIE) and Data Science (DS) team to establish feasibility of new initiatives, demonstrate business values, and prototype solution mock-ups;

• Partner with Global Quality (GQ), Product Engineering (PE), Central PEE(CPEE), Smart Mfg Artificial Intelligent (SMAI), Technology Development (TD), and Suppliers to deliver end to end solutions, implement BKM development and deployment to production.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness,exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabledenhancements within one’s scope of work.

Collaboration

• Partner closely with multi-functional teams to ensure successful communication and collaboration for project implementation.

• Detail oriented with the ability to work independently

• Dependability and able to work effectively in multi-functional teams.

• Facilitate and lead activities in designing and optimizing current system, methods, tool, skill to be Best In industry.

• Manage priorities and enhancements to improve business processes and existing systems that are global in nature.

• Willing to work during non-standard hours when needed to provide support to engineering teams at any Micron site.

• Strong growth mindset and willing to continue to learn, unlearn, relearn.

Communication

• Effective communication skills in verbal/written.

• Self-motivated. Able to work independently with minimal supervision.

• Able to travel as required to support department and company objectives.

Requirement and Technical Competency:

• Experience in PIE, Test solution team, product engineering and circuit design engineering. Understanding of Process/Product Integration will be advantageous;

• In depth knowledge of processes, equipment and control system;

• Proficiency in data analytical tools such as Y3, JMP, Python to perform numerical experiment. Proficiency in Statistical/Machine Learning will be additional advantageous; 

• Proven track record to make decisions, multi-task, and solve problems and address root causes.

• Exhibit critical thinking to find opportunities.

• PhD/Masters/Bachelors with relevant course of study and experience

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Responsibilities: 

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type 

• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs. 

• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD Wet Etch peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements 

• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron. 

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions 

• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes. 

• Design and implement advanced process monitoring and control methodologies. 

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment. 

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings 

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers. 

• This position requires communication and collaboration with partners both locally and globally. 

• Strict adherence to Micron Intellectual Property protection policy is a must. 

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions. 

Requirements: 

• Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry are welcome to apply. 

• 2-3 years of semiconductor industry experience is preferable 

• A deep understanding of chemistry, chemical kinetics, thermodynamics and mass transport 

• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM, FTIR. Understanding of various integration and structural impacts and constraints related to wet etch processes. 

• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular. 

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data 

• Working knowledge of Design of Experiments (DoE) Proven ability to collaborate with local and overseas teams on projects 

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications. 

• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously 

• Ability to travel for extended periods of time and stay at Boise TD for 2-4 months at a stretch to work on technology development. 

• Demonstrates the ability in applying AI tools to enhance workflows, improve efficiency, and support data-informed decision across team and projects

We are looking for an Senior Engineer in Product Engineering, NAND Validation/Characterization, specializing in functional and design validation. Experienced in simulation‑based validation, failure analysis, and cross‑functional issue closure. Strong focus on automation, data‑driven validation, and applied AI/ML techniques to improve test efficiency, coverage, and debug productivity.

This role focuses on building scalable, reusable, and automated test program frameworks, including AI/ML‑driven initiatives, to support both deterministic validation flows and pseudo‑random validation (RSG – Random Sequence Generator). You will play a key role in architecting the backbone of Verilog test programs—enabling efficient development, execution, debug, and reuse across multiple products and technology nodes. Validation scope includes NAND datasheet commands, features, interfaces, and customer‑mode operations on silicon platforms. When device issues are uncovered, you will perform deep failure analysis, drive root‑cause identification, and collaborate closely with Design, Application Engineering, Product, System, and Validation teams to ensure timely issue closure and infrastructure readiness for product release.

If you are looking for a technically challenging, high‑impact, and collaborative role, STPG Product Engineering (FDV‑Verilog) offers the opportunity to work on leading‑edge NAND technologies with strong ownership and visibility.

Key Responsibilities:

• Designed and executed functional and design validation flows for advanced RG NAND devices using simulation platforms

• Developed  deterministic usage‑case tests and random sequence generators to validate NAND commands and customer‑mode features

• Performed detailed failure analysis of issues seen, root‑cause investigations (including digital and analog circuitry), and drove issue resolution with cross-functional teams

• Implemented  automation frameworks using C‑based programming, Python, and Perl to improve test development and execution efficiency

• Applied  AI/ML‑assisted techniques (data analytics, pattern recognition, anomaly detection) to:

• Accelerate failure triage and root‑cause analysis

• Identify validation coverage gaps

• Improve random sequence effectiveness and debug prioritization

• Utilized data‑driven methods and dashboards to track validation progress, defect trends, and release readiness

• For senior engineer, need to have at least 3–5 years of relevant professional working experience in a similar or related engineering role.

Skills Required:

• Bachelor’s degree in Electronics Engineering, Computer Engineering, or a related discipline

• Strong interest in design validation, characterization, and product engineering

• Proficiency in software development and scripting (e.g., C/C++, Perl, Python)

• Ability to apply AI/ML for test analytics and defect pattern analysis

• Excellent problem solving and analytical skills, with careful attention to root cause analysis

• Effective communication skills in written and spoken English, including documentation and presentation

• Ability to multitask and manage priorities in a fast‑paced development environment

• Proactive mindset toward continuous improvement and self‑development
  

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

As a NAND Reliability Product  Engineer, you will be responsible for defining, evaluating, and safeguarding the Extrinsic/Intrinsic reliability of Micron’s NAND Flash products. You will work hands‑on with large‑scale data analysis, electrical failure analysis, and cross‑functional teams to ensure robust product reliability and prevent escapes to customers.

This role offers deep technical ownership at the intersection of device physics, circuits, process technology, and product engineering, with strong visibility across development and manufacturing organizations.

Key Responsibilities

• Define and implement NAND Flash reliability test flows to assess product reliability performance and prevent extrinsic/intrinsic reliability escapes.

• Perform high‑volume statistical data analysis to evaluate NAND DPM/ intrinsic reliability risks and trends.

• Drive electrical failure analysis, including  advance characterization, to identify root causes and solution spaces.

• Develop short‑term countermeasures such as targeted stresses and screens, applying knowledge of digital/analog circuits, device physics, and process engineering.

• Qualify the product with innovative control measures to provide best in Class DPM and Cell reliability.

• Collaborate closely with Fab, NAND Technology, NAND Design, Product Development, System Development, and Quality/Reliability teams to develop solutions and enable shipment of high‑quality end products.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

• Support customer inquiries and provide technical insights related to product reliability.

• Drive strategic initiatives to enhance the overall reliability program and influence the direction of future product development.

Qualifications And Skills:

• Bachelor’s degree  or Master’s degree  with of relevant experience in Electrical Engineering or related field

• Knowledge in Semiconductor Reliability, NAND Technology, and Electrical Failure Analysis.

• Understanding in Design, Device Physics, Circuits,  Process.

• Strong statistical analysis, communication, and problem‑solving skills.

• Experience with application of AI tools, LLMs ,  data analysis tools (e.g., Python, JMP, Tableau).

• Strong analytical and problem‑solving skills.

• Team player and self driver.

Why Micron

Micron is a global leader in memory and storage technology, delivering HBM,DRAM, NAND,  and NOR solutions that power the world’s data‑driven AI innovation. At Micron, you’ll work on technology that matters—alongside teams that value ownership, learning, and technical excellence.

Manages production support engineering for a specific product or group of products after transfer from design to high volume production. Interfaces with design, process, test and reliability engineering to solve problems. Sustains products with cost reduction and yield improvements.

Our vision is to transform how the world uses information to enrich life for all.  
 
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 

As part of the HIG HBM Product Engineering organization, you will help drive the development of next-generation GenAI, machine learning, and advanced data analytics solutions for semiconductor engineering. In this role, you will work on intelligent systems that improve engineering productivity, strengthen technical decision-making, and unlock insights from complex manufacturing, validation, and engineering workflows. 

You will collaborate with cross-functional teams across Product Engineering, Design Engineering, System Engineering, Data Science, IT, and Manufacturing to prototype, build, and scale practical AI-driven solutions that improve quality, cost, cycle time, and engineering efficiency. 

Key Responsibilities 

• GenAI System Development: Design, build, and improve GenAI-powered and agentic systems supporting semiconductor engineering workflows such as code generation, data extraction, analytics, documentation automation, failure triage, and technical knowledge retrieval.  

• Large-Scale Data Pipelines: Develop scalable data pipelines and analytical workflows to ingest, clean, transform, and analyze large, complex, and heterogeneous datasets from multiple manufacturing and engineering systems.  

• Advanced Data Analytics: Apply Python, SQL, and data science libraries (e.g., pandas, matplotlib) to perform deep analysis, generate visualizations, and deliver actionable engineering insights.  

• LLM Workflow Engineering: Build, evaluate, and optimize LLM-based workflows, including prompting, retrieval-augmented generation (RAG), inference orchestration, benchmarking, and quality evaluation.  

• Machine Learning Production: Develop and productionize machine learning and deep learning models for classification, regression, anomaly detection, failure analysis, and engineering decision support.  

• Distributed Data Processing: Implement robust data processing techniques such as data cleansing, outlier detection, and missing-data handling using distributed or large-scale frameworks (e.g., PySpark, BigQuery).  

• Cross-Functional Collaboration: Partner with domain experts and cross-functional teams to translate complex engineering problems into scalable AI/ML and analytics solutions.  

• Production Deployment: Support deployment, monitoring, and operationalization of AI/ML solutions in cloud and enterprise environments.  

• Technical Communication: Communicate technical findings, recommendations, and model outcomes clearly to both technical and non-technical stakeholders.  

• Innovation Leadership: Identify and drive high-impact opportunities where GenAI, machine learning, and analytics can improve engineering productivity and business outcomes. 

Minimum Qualifications 

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Science, Data Science, Statistics, Artificial Intelligence, or a related field. 

• Minimum 2 years of hands-on experience developing and deploying AI applications in semiconductors, electronics, or other engineering industries. 

• Strong programming proficiency in Python and SQL.  

• Strong technical foundation in data analytics and visualization, including tools and libraries such as pandas, scikit-learn, matplotlib, plotly, or similar ecosystems.  

• Familiarity with agentic AI frameworks such as LangGraph, Google ADK, AutoGen and evaluation tools like AgentEval. 

• Familiarity with modern AI coding tools / agentic coding harnesses, such as Claude Code, Roo Code, Cursor, Cline, Windsurf, Gemini CLI, or similar tools.  

• Hands-on experience developing and deploying AI/ML systems involving LLMs, including RAG, agentic workflows, and frameworks such as PyTorch or TensorFlow. 

• Cloud experience with GCP, AWS, or Azure, including deploying ML pipelines in production. 

• Experience with LLM training, inference, and evaluation workflows, including prompt design, benchmarking, validation, or retrieval-augmented systems.  

• Experience analyzing large, complex, and heterogeneous datasets from multiple systems and applying sound techniques for data cleansing, outlier handling, and missing-data treatment.  

• Strong analytical, problem-solving, and software development skills.  

• Strong communication skills with the ability to explain technical concepts and findings effectively.  

• Strong sense of ownership, accountability, and engineering rigor. 

Preferred Qualifications 

• Experience building agentic systems or AI solutions for semiconductor manufacturing, product engineering, validation, yield improvement, reliability, or failure analysis. 

• Deep understanding of semiconductor-specific AI/ML applications 

• Demonstrated understanding of deep learning architectures and computer vision.  

• Experience using enterprise data platforms such as BigQuery, Snowflake, MSSQL, Oracle, or Redshift. 

• Experience with Kubernetes or similar production infrastructure and deployment frameworks. 

• Experience with web application technologies such as JavaScript, HTML, and CSS.  

• Experience designing scalable, enterprise-grade AI/ML systems with attention to reliability, traceability, and operational readiness. 

• Familiarity with document-processing pipelines, technical knowledge platforms, or retrieval systems for engineering content. 

• Experience working in cross-functional environments spanning engineering, manufacturing, data science, and IT.