Chip R&D Vice President (VP)- Based in Shenzhen/Hong Kong (Shanghai/Chengdu also acceptable)
芯片研发- 副总裁（VP）｜深圳 香港（可上海/成都）
Salary- RMB 3.5-4 million/year
I. Job Overview
The company is at a critical stage of high-performance processor chip R&D and industrialization, and is now recruiting a Vice President (VP) for Chip R&D globally. As one of the company's core technology leaders, this position will be responsible for the overall R&D management of large-scale chip products, leading the team to complete the entire process from architecture design to mass production, and driving the company's next-generation processor products to achieve commercial breakthroughs.
Reporting to: CEO Work
Location: Shenzhen (Shanghai/Chengdu also acceptable)
II. Core Responsibilities
1. Chip R&D System Construction Responsible for the company's large-scale chip product R&D strategic planning and technology roadmap formulation;
2. Coordinate the management of chip front-end, back-end, verification, and software R&D teams; Establish and optimize R&D processes, quality systems, and project management mechanisms.
3. Product Lifecycle Management Lead the entire process of high-performance processor chip development, from definition, architecture design, RTL development, verification, physical implementation to tape-out and mass production deployment; Drive chip products to complete tape- out, packaging, testing, and mass production delivery on schedule;
4. Coordinate upstream and downstream partners and fab resources.
5. Technical Team Building Build and cultivate an international chip R&D team; Attract and manage high-end technical talent; Establish a technical talent pipeline and core R&D capabilities.
6. Technical Decision-Making and Risk Control Participate in major technical roadmap and product planning decisions; Lead the tackling of key technologies; Control R&D risks and ensure timely project delivery.
III. Qualifications Education Background
Master's degree or above from a 985 university; Overseas renowned university background preferred; Major in Computer Science, Microelectronics, Integrated Circuits, Communication Engineering, or related fields.
Core Technical Requirements (Hard Requirements)
Required Experience: Leaded large-scale chip (CPU, GPU, AI chip, or high-end communication chip) R&D projects; Have complete chip R&D and successful tape-out experience; Deeply involved in: Chip project initiation Architecture design RTL development Verification Backend implementation Tape-out Fab implementation and mass production Successful case studies of building chip products from scratch.
Preferred Company Background:
Preferred candidates are from the following companies: leading chip companies
Management Experience: Managing a R&D team of over 100 people is preferred;
Experience in cross-departmental collaborative management; Experience in R&D management at startups or fast-growing companies is preferred.
Long-term technical accumulation and strong entrepreneurial spirit; Allowance to adopt innovative corporate development models.
IV. Team and Business Status
R&D Team The R&D team consists of approximately 120-130 people; over 50% of members have overseas experience; a complete R&D system has been established, including: Chip Architecture, Front-End, RTL Design, Verification, Physical Design, and Software. Product Progress The company has successfully released its self-developed processor product; currently in the critical stage of mass production introduction; large-scale mass production is expected to be achieved by the end of 2026 to the first half of 2027.
V. Compensation and Incentives
Components: 12 months fixed salary + 6 months performance bonus
Long-term Incentives: Stock options (with significant growth potential)
VI. Special Notes If a qualified full-stack VP-level talent cannot be found, the company may consider adopting a "Dual Director Model": Front-End Director Back-End Director Both share VP responsibilities, achieving comprehensive technical capabilities
