Total 12 process engineer job vacancies in Others category in The Philippines

Engineer AMHS is responsible for providing technical support in the field of Automation. Implement actions for stable automation systems including activities related to maintenance, yield improvement, machine troubleshooting. Provide assistance in spare parts management, updating/revising of work-related SOP. Survey new solutions or replacement for existing Automation system.

Key Responsibilities

• Plan and execute maintenance schedules for AMHS equipment (OHT, AGV, AMR, Stocker, Lifter, conveyor and DieBank), ensuring safe operation and compliance
• Provide 24/7 troubleshooting support for automation system issues and conduct root cause analyses for equipment failures.
• Develop and maintain automation SOPs, job/recovery procedures, and spare parts management protocols.
• Coordinate with vendors and team members to address outstanding work, ensure system stability, and manage automation vendors effectively.
• Deliver training and guidance to technicians and AEs on automation systems and safety protocols.
• Coordinate project execution, testing, commissioning, and validation for small to medium-scale projects, including involvement in capital projects related to automation.
• Establish communication with MES to configure process recipes and ensure proper interface with automation systems.
• Oversee commissioning and qualification efforts of production equipment associated with automation, prioritizing safety and efficiency.
• Drive continuous improvement efforts for automation systems and participate in related modification or improvement projects.
• Fulfill any other relevant duties assigned by immediate supervisors, maintaining accountability and adaptability as necessary.

Requirement

• Degree in Mechanical / ElectricalEngineering or its equivalent
• Preferably with 5 years of relevant experience in AMHS
• Experience in Automated Manufacturing Environment will be an added advantage
• Experience in coordination on machine setup and modification work
• Familiar with Program Logic Control(PLC) Software and ACAD.
• Knowledge in some programming language such as Java, Visual Basic, SQL and Tableau will be added advantage

Position Summary

The Electrical Simulation Engineer is responsible for product package electrical simulation. 

Candidates with semiconductor packaging experience are encouraged to apply for this position. 

Responsibilities 

• Conduct simulation on SiPi and High speed digital area in component & system level 

• Conduct simulation on RF, EMI, EMC, in component & system level 

• Provide comments and recommendation to product design and process optimization 

• Provide electrical input to mechanical simulation for thermal and stress analysis. 

• Prepare the simulation reports with data analysis and recommendation. 

• Other ad-hoc activities assigned by the reporting manager. 
  

Requirements

• Minimum Master's Degree in electrical engineering or similar discipline.
• Prior experience in electrical simulation within semiconductor industry is preferable.
• Experience in handling internal and customer projects.

• Hands-on skills on EDA tools:

1. ANSYS: Siwave, Q3D, HFSS, Circuit, etc.
2. Cadense: PowerSi, PowerDC, ExtractIM, Clarity, etc.
3. Keysight: ADS, etc.

Position Summary
The Process Engineer (Thin Film) is responsible for development and establishment of production process.

Responsibilities

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive SPC control towards zero defects. Review and update FMEA, Control plan OCAP with cross-functional teams.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.
• Other ad-hoc duties as assigned

Requirement

• Minimum bachelor’s degree in Materials Science, Microelectronics, Chemical Engineering or relevant disciplines
• Minimum 3 years hands-on working experience in thin film process
• Experience working in Wafer-level Fanout packaging production line or LCD/FPD production line preferred
• Experience in process engineering, process control engineering and yield enhancement
• Experience in SPC, DOE, FEMA, and 8D reports

Position Summary

The Process Engineer (Lithography) is responsible for the development and establishment of production process.

Responsibilities

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line for lithography process
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive SPC control towards zero defects. Review and update FMEA, Control plan OCAP with cross-functional teams.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.
• Any other ad-hoc duties as assigned.

Requirements

• Minimum Bachelor’s Degree in Materials Science, Microelectronics, Chemical Engineering or relevant engineering degrees.
• Minimum 3-years hands-on Lithography process experience in area of in the Wafer-level Fanout packaging production line or LCD/FPD production line.
• Knowledge in process engineering, process control engineering and yield enhancement.
• Experience in SPC, DOE, FMEA, and 8D reports

Position Summary

The Electrical Simulation Engineer is responsible for product package electrical simulation. 

Candidates with semiconductor packaging experience are encouraged to apply for this position. 

Responsibilities 

• Conduct simulation on SiPi and High speed digital area in component & system level 

• Conduct simulation on RF, EMI, EMC, in component & system level 

• Provide comments and recommendation to product design and process optimization 

• Provide electrical input to mechanical simulation for thermal and stress analysis. 

• Prepare the simulation reports with data analysis and recommendation. 

• Other ad-hoc activities assigned by the reporting manager. 

Requirements

• Master Degree in electrical engineering or similar discipline. 

• At least 5 years’ experience in electrical simulation, internal & customer projects. 

• Hands-on skills on EDA tools: Cadense (PowerSi, PowerDC, ExtractIM, Clarity, etc), ANSYS (Siwave, Q3D, HFSS, Circuit, etc.), Keysight (ADS, etc.)

Position Summary

The Process Associate Engineer (Backend) is responsible to support the engineering activities as well as the daily production activities reliably and efficiently. 

Candidates with related experience in Semiconductor and LCD processes are encouraged to apply for this position. 

Responsibilities 

• Ensure process integrity for machines related to production 

• Monitor process via SPC chart/real time monitoring system 

• Work on continuous improvement projects 

• Perform lots on hold and disposition 

• Support in recipe setup and qualification for production 

• Troubleshoot process-related issue 

• Collect engineering data 

• Prepare manufacturing documents 

• Maintain good housekeeping in the production area 

• Any other ad-hoc duties as assigned by reporting supervisor 

Requirements 

• Minimum Diploma in Electrical / Electronics / Mechatronics / Mechanical/ Microelectronics Engineering or similar disciplines 

• Prior process experience in Backend Processes: Pick and Place, SMT/SMD, Ball mounting, Reflow, Laser Marking and Package Sawing would be advantageous

• Experience in Packing (TnR, Tray, MBB, etc) is an added advantage 

• Experience working in semiconductor manufacturing environment 

• Experience in manufacturing documentation of SPC, WI, SOP, FMEA, etc. 

• Able to work under various shift patterns. The selected candidate will start with normal office hours, and eventually transition to 12-hour rotating shift between day and night 

Position Summary

The Process Engineer is responsible for development and establishment of production process. 

Responsibilities

• Responsible for Backend process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc.  

• Establish, review and update specifications, workflow, quality and safety related documentation for production line.  

• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.  

• Process sustaining and control through SPC and periodic defect Pareto Analysis.  

• Lead and drive SPC control.  

• Review and maintain FMEA, Control plan, OCAP with cross-functional teams.  

• Handle and manage customer audits and 8D reports.  

• Provide disposition for engineering and production lots.  

• Conduct process characterization and qualification to establish process baseline. 

• Coordinate and liaise with vendor/suppliers on process issue or quality issue.  

• Support customer NPI activities and internal engineering activities.  

• New material, process & machine development and qualification.  

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line 

• Any other ad-hoc duties as assigned by supervisor 
  

Requirement

• Minimum bachelor's degree in material science, microelectronics, mechanical engineering or relevant engineering field  

• At least 3 years of experience in semiconductor manufacturing industry and working in cleanroom environment  

• Hands-on process experience in Backend Process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc within semiconductor IC packaging industry 

• Experience in SPC, DPE, FMEA, OCAP, WI, CPK, PPK, 4D/8D report  

Position Summary

The Process Engineer (Lithography) is responsible for the development and establishment of production process.

Responsibilities

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.  
• Establish, review and update specifications, workflow, quality and safety related documentation for production line. 
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.  
• Process sustaining and control through SPC and periodic defect Pareto Analysis.  
• Lead and drive process control measures such as SPC, FDC/KPC and RCA towards zero defects.  
• Lead and drive continuous improvement activities in area of quality, productivity, cycle time, cost and process control automation. 
• Review and update FMEA, Control plan OCAP with cross-functional teams. 
• Coordinate and liaise with vendor/suppliers on process issue or quality issue. 
• Support customer NPI activities and internal engineering activities. 
• New material, process & machine development and qualification. 
• Handle and manage customer audits and 8D reports.  
• Provide disposition for engineering and production lots. 
• Conduct process characterization and qualification to establish process baseline.
• Any other ad-hoc duties as assigned. 

Requirements

• Minimum Bachelor’s Degree in Materials Science, Microelectronics, Chemical Engineering or relevant engineering degrees.
• Minimum 3-years hands-on Lithography process experience in area of in the Wafer-level Fanout packaging production line or LCD/FPD production line.
• Knowledge in process engineering, process control engineering and yield enhancement.
• Experience in SPC, DOE, FMEA, and 8D reports

Position Summary

The Process Associate Engineer is responsible to support the engineering activities as well as the daily production activities reliably and efficiently. 

Candidates with related experience in semiconductor and/or electronics manufacturing industry are encouraged to apply for this position. 

Responsibilities

• Ensure process integrity for machine is in place for production  

• Process monitoring via SPC / real time monitoring system 

• Work on process improvement projects 

• Handle disposition and on hold lots 

• Maintain good housekeeping in the production area  

• Support in recipe setup and qualification for production 

• Assist to troubleshoot process-related issue 

• Engineering data collection 

• Other ad-hoc duties as assigned 

Requirements 

• Minimum diploma in electrical / mechatronics / mechanical/ microelectronics engineering or similar discipline 

• Minimum 2 years’ experience working in semiconductor manufacturing environment 

• Minimum 2 years of experience working in Die Preparation (Backgrind, Dicing and Laser-grooving), Pick and Place, and Molding/ De-bonding processes.

• Knowledge in basic SPC and Microsoft Office 

• Flexible to work under various shift pattern. The selected candidate will start with office hours first, and eventually work on 12-hour rotating shift (day and night) 

Position Summary

The Equipment Associate Engineer (Backend) is responsible for maintaining and supporting backend equipment operations, including setup, repairs, and preventive maintenance. The job incumbent is expected to work closely with engineering and manufacturing teams on equipment qualification, new product introduction, and continuous improvement initiatives. 

Responsibilities

• Perform equipment Line Sustaining function (corrective maintenance), preventive maintenance, predictive maintenance, and calibration.  

• Sustain and improve overall equipment performance (OEE).  

• Update consumables/spare parts to ensure no delay in machine recovery due to no spare.  

• Participate in and contribute to continuous improvement activities for yield, maintenance cost, equipment modification and productivity improvement.  

• Assist Engineers in setting up new machine and buy-off.  

• Maintain good housekeeping and safety practices in the cleanroom.  

• Communicate with supervisors, fellow shift personnel and vendors to resolve problems.  

• Timely update and ensure data integrity of pass down report, PM Checklist and other similar reports, checklists and documents.  

• Comply safety standards and procedures during shift duty or working in the production line.  

• Responsible for maintenance and repairs on assigned equipment.  

• Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance. 

• Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification.   

• Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction.  

• Any other ad-hoc duties as assigned. 

Requirements

• Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science or equivalent.  

• Minimum 3 years’ relevant experience in semiconductor/ LCD/ electronics/ electrical industry. 

• Minimum 3 years’ experience in maintenance and troubleshooting of equipment, preferably in semiconductor backend operations. 

• Has hands-on experience in handling equipment for any of the following: Carrier Lamination, Pick and Place, Wafer Saw, Wafer Backgrind, Laser grooving, Wafer Mounting, Taping and Detaping, Oven curing/annealing, metrology tools for wafer/panel inspection in semiconductor industry (packaging assembly). 

• Able to work in both day and night rotating shifts, and flexible to work under various shift patterns.  

Position Summary

The Equipment Associate Engineer (Thin Film) is responsible for maintaining and supporting backend equipment operations, including setup, repairs, and preventive maintenance. The job incumbent is expected to work closely with engineering and manufacturing teams on equipment qualification, new product introduction, and continuous improvement initiatives. 

Responsibilities

• Perform equipment Line Sustaining function (corrective maintenance), preventive maintenance, predictive maintenance, and calibration.  

• Sustain and improve overall equipment performance (OEE).  

• Update consumables/spare parts to ensure no delay in machine recovery due to no spare.  

• Participate in and contribute to continuous improvement activities for yield, maintenance cost, equipment modification and productivity improvement.  

• Assist Engineers in setting up new machine and buy-off.  

• Maintain good housekeeping and safety practices in the cleanroom.  

• Communicate with supervisors, fellow shift personnel and vendors to resolve problems.  

• Timely update and ensure data integrity of pass down report, PM Checklist and other similar reports, checklists and documents.  

• Comply safety standards and procedures during shift duty or working in the production line.  

• Responsible for maintenance and repairs on assigned equipment.  

• Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance. 

• Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification.   

• Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction.  

• Any other ad-hoc duties as assigned. 

Requirements

• Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science or equivalent.  

• Minimum 3 years’ relevant experience in semiconductor/ LCD/ electronics/ electrical industry. 

• Minimum 3 years’ experience in maintenance and troubleshooting of equipment, preferably in semiconductor backend operations. 

• Has hands-on experience in handling PVD tools/ equipment (sputtering systems, vacuum pumps, deposition chambers) 

• Able to work in both day and night rotating shifts, and flexible to work under various shift patterns.  

Position Summary

The Equipment Associate Engineer (DP/ Recon) is responsible for performing maintenance and repairs on the assigned equipment. The ideal candidate is a good team player, able to work independently, attentive to details and safety, and willing to embrace new task or responsibilities in a dynamic environment.  

Responsibilities

• Perform equipment Line Sustaining function (corrective maintenance), preventive maintenance, predictive maintenance, and calibration.  

• Sustain and improve overall equipment performance (OEE).  

• Update consumables/spare parts to ensure no delay in machine recovery due to no spare.  

• Participate and contribute to continuous improvement activities for yield, maintenance cost, equipment modification and productivity improvement.  

• Assist Engineers in setting up new machine and buy-off.  

• Maintain good housekeeping and safety practices in the cleanroom.  

• Communicate with supervisors, fellow shift personnel and vendors to resolve problems.  

• Timely update and ensure data integrity of pass down report, PM Checklist and other similar reports, checklists and documents.  

• Comply safety standards and procedures during shift duty or working in the production line.  

• Responsible for maintenance and repairs on the assigned equipment.  

• Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance.  

• Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification.   

• Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction.  

• Any other ad-hoc duties as assigned.  

Requirements

• Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science or equivalent.  

• Minimum 3 years’ relevant experience in semiconductor/ LCD/ electronics/ electrical industry. 

• Minimum 3 years’ experience in maintenance and troubleshooting of equipment, preferably in semiconductor backend operations. 

• Has hands-on experience in handling equipment for any of the following: Carrier Lamination, Pick and Place, Wafer Saw, Wafer Backgrind, Laser grooving, Wafer Mounting, Taping and Detaping, Molding (Compression, Transfer, or Injection).  

• Able to work in both day and night rotating shifts, and flexible to work under various shift patterns.