Total 63 process development engineer job vacancies in Others category in The Philippines

Responsibilities

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type

• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs.

• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements

• Identify disruptive processes early on and work with manufacturing and Boise TD to identify viable path forward

• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions

• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes.

• Design and implement advanced process monitoring and control methodologies.

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.

• This position requires communications and collaboration with partners both locally and globally. 

• Strict adherence to Micron Intellectual Property protection policy is a must.

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Bachelors/Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry and related

• A deep understanding of chemistry, chemical kinetics, thermodynamics and  mass transport

• Opportunity to travel overseas for an extended period of time for collaborative R&D work assignment.

• 2-3 years of experience in Semiconductor Equipment/Process development is preferable

• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data

• Working knowledge of Design of Experiments (DoE)

• Proven ability to collaborate with local and overseas teams on projects

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Ability to be a self-motivated individual and be adaptable

• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously

• Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus

Micron’s Singapore Process Development (PD) group in Technology Development (TD) is looking for Plasma-CVD / Diffusion PD engineer to support Plasma-CVD/DIFF process development of advanced technology nodes. You will design and optimize Plasma-CVD or Diffusion for Micron’s innovative NAND Flash products.

As a PD Engineer, you will take ideas from conception through process development then implementation in our manufacturing facilities. In addition to your technical responsibilities, you will also run the projects of highly technical nature. This role is essential to the success of Micron’s products and may require business-related travel. Primary areas of responsibility include Plasma-CVD or Thermal Diffusion process and film characterization, optimization, design, troubleshooting, process transfer and fundamental research.

Advanced Thin Films PD Engineer will interact with groups such as Process Integration, Metrology, Surface characterization labs, Electrical Failure Analysis, Yield Enhancement, Manufacturing and Equipment vendors/suppliers, to ensure robust thin film processes that meet the precise physical and electrical requirements for Micron Products.

As an Advanced Thin Films PD Engineer at Micron, you will be required to travel for brief business purposes. This position requires that you have an aptitude for a research and development (R&D) environment, good organizational skills and ability to work independently as well as in a team environment. This position may often require weekend support to R&D Pilot Line, for example, in case of pilot/manufacturing line excursions/downs and monitoring program-critical lots thought various modules as deemed necessary.

Your responsibilities will include, but are not limited to:

• Process Development

• Design and develop and deliver process package to meet product specification requirements as per program targets and timelines

• Characterize the processes using appropriate techniques (SEM, TEM, XPS, SIMS, AFM, etc.)

• Design and execute experiments, analyze data and present it in the appropriate forums.

• R&D Pilot Line in the Fab

• Improve process maturity, capability and sustain processes in the fab under your ownership

• Updating the Fab engineers on customer issues and technology needs.

• Supporting root cause defect and unique fail mode analysis.

• Process Integration

• Delivering advanced technology to meet future product nodes.

• Developing recipes to meet structural & electrical requirements.

• Managing wafers though Thin Film levels in support of special requirements.

• Other Process Areas

• Working in cross-functional teams to jointly develop Array and CMOS structures.

• Supporting cross-functional failure analysis and yield improvement.

• Advanced Thin Film peers

• Maintaining or developing expertise in multiple process, hardware, or technology areas.

• Serving as a resource for peers in recipe & process development.

Successful candidates must have:

• Education requirements

• PhD in Physics, Materials Science, Chemical Engineering, Electrical Engineering, Chemistry, or related fields

• BS/MS+5 years equivalent industry or research experience may substitute for a PhD.

• Understanding in one or more of the following topics Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena.

• Solid troubleshooting, experimental design and data analysis skills.

• Strong computer skills, including MS Office.

• Plasma physics background and understanding of plasma sources used in plasma CVD is highly preferred.

• Understanding of CVD and Diffusion deposition processing principles.

• Rudimentary understanding of process control and Statistical Process Control (SPC).

• An understanding of solid state devices.

• An understanding of semiconductor process.

• Knowledge of advanced data analysis techniques and scripting is highly preferred

• Open to work off shift and weekends if necessary

• Open to domestic and international travel

Micron’s Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology.

Key Responsibilities

• Develop and optimize unit processes to meet yield and quality targets for advanced NAND devices

• Evaluate innovative process and equipment solutions for early experimentation and process margin improvement

• Collaborate with Singapore-based Diffusion manufacturing teams to identify and prioritize key technology challenges

• Integrate and troubleshoot processes within cross-functional teams focused on yield and quality enhancement

• Partner with Boise TD Films teams to align future device requirements with process capabilities

• Identify disruptive process technologies early and define viable implementation paths with global TD and manufacturing teams

• Conduct fundamental research, hardware evaluations, and novel process testing to support intellectual property generation

• Design and execute experiments to expand process margins and validate manufacturability of next-node solutions

• Lead cross-functional initiatives to simplify processes and implement improvements

• Embed best-known manufacturing practices into early-stage development of new nodes

• Develop and apply advanced process monitoring and control methodologies.

• Serve as a technical expert, contributing to process, equipment, and procedural improvements

• Lead multidisciplinary projects across teams, sites, and suppliers focused on quality, yield, cost, and productivity

• Advise management on significant technical issues and drive innovation through patents and technical publications

• Maintain strict adherence to Micron’s Intellectual Property protection policies

• Engage continuously with global TD partners and suppliers to push for breakthrough solutions

• Own and manage module-level business processes

Requirements

• Bachelor/Masters in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics with minimum 5 years of relevant experience or PhD in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics

• Strong understanding of:

• - Flow dynamics, thermodynamics, and physical phenomena in deposition

• - Precursor depletion effects in 3D structures and mitigation strategies

• - Interface characterization techniques (e.g., SIMS, XPS, EDX, SEM/TEM)

• - Integration and structural constraints in film deposition processes

• - Memory process flows, especially for planar and vertical NAND

• Proficiency in data analysis tools (e.g., Y3) and Design of Experiments (DoE)

• Excellent communication skills for both in-person and remote interactions

• Self-motivated, adaptable, and capable of managing multiple projects in a dynamic environment

The Senior Engineer supports photolithography process development for advanced memory technologies through hands‑on experimentation, data analysis, and yield improvement activities. This role focuses on execution excellence, disciplined learning, and collaboration, operating under guidance from senior technical leaders. Success in this role requires strong fundamentals in photolithography, analytical rigor, and the ability to translate experimental data into actionable insights. 

Main Responsibilities 

• Execute photolithography process development, optimization, and troubleshooting tasks in support of yield, quality, and performance targets. 

• Perform DOE, SPC, and statistical analysis to characterize process behavior and identify improvement opportunities. 

• Support material evaluations, defect learning, overlay analysis, and process window characterization. 

• Assist with integration learning during development and early manufacturing ramps. 

• Collaborate with cross‑functional teams including integration, etch, metrology, and yield engineering. 

Other Responsibilities 

• Document experimental procedures, results, and learnings in technical reports and presentations. 

• Support technology transfer activities under direction of senior engineers. 

• Integrates AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. 

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work. 

Candidate Profile 

Minimum Qualifications / Experience 

• PhD, or Master’s ≥3 yrs, or Bachelor’s ≥5 yrs of relevant experience in 
  Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, with foundational experience in semiconductor photolithography process development. 

Must‑Have Technical Skills 

• Demonstrated ability to contribute effectively to photolithography process development initiatives and improvement plans. 

• Deep knowledge in optics, immersion lithography, polarized illumination, and low k1 imaging  

• Proficiency in lithography simulation tools, material characterization, DOE, SPC, and basic statistical data analysis 

Must‑Have Soft Skills 

• Analytical thinking and structured problem‑solving 

• Collaboration and openness to learning 

• Clear technical communication 

• Project Management; especially in technical & technology programs  

• Demonstrates ability in applying AI tools to improve workflows, drive efficiency, and support data-informed decisions across teams and projects.

Highly Desirable / Preferred 

• Exposure to advanced lithography (193nm, 248nm, 365nm) and EUV processes 

• Hands-on experience with innovative photolithography equipment and metrology tools 

Embody Micron’s core values: 

• People – Respect, develop and empower others  

• Innovation – Drive continuous improvement and breakthrough thinking  

• Tenacity – Show grit and determination  

• Collaboration – Build trust and foster teamwork  

• Customer Focus – Deliver excellence and value 

You are responsible for new equipment introduction, risk assessment, equipment set-up, release, PM, Calibration, lab audits and as well as continuous improvement activities such as equipment reliability improvement, cost reduction, and equipment usage optimization. Through this role, you will enhance your technical skills in equipment management and improvement, project management, and strengthen your engagement and network with vendors and global GEL organizations across Micron sites.

Responsibilities

-Support GEL Equipment and lab operations including Internal and External audits, ESD and PM, Calibration, equipment troubleshooting, Safety and Chemical controls.

- Oversees the installation, modification, upgrade and maintenance of Engineering equipment.

- Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. - -- Establishes programs and solutions for increasing uptime and for equipment problems that affect the engineering process.

-Provides technical support to the engineering equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules.

- Collaborate with cross functional teams on equipment requirements, space planning, facilitation, purchase and installation of equipment.
- Equipment inventory controls and critical spare parts planning.

- Coordinate external vendors on training, repair, and preventive maintenance of equipment.
- Manage external vendors expectation, set and assess goals and achievements.
- Analyze and support stakeholders’ requirements and expectations.
- Foster closer collaboration amongst cross functional teams.
- Focus on customer needs and provide timely solutions.

Requirement

• Bachelor's degree in engineering with experience with ESD checks

• At least 1 year of experience in Semiconductor Equipment or Tools PM, calibration, and troubleshooting.

• Knowledge with Automated Optical Inspection and ANSYS Simulation

Responsibilities: 

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type 

• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs. 

• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD Wet Etch peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements 

• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron. 

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions 

• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes. 

• Design and implement advanced process monitoring and control methodologies. 

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment. 

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings 

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers. 

• This position requires communication and collaboration with partners both locally and globally. 

• Strict adherence to Micron Intellectual Property protection policy is a must. 

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions. 

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Requirements: 

• Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry are welcome to apply. 

• 2-3 years of semiconductor industry experience is preferable 

• A deep understanding of chemistry, chemical kinetics, thermodynamics and mass transport 

• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM, FTIR. Understanding of various integration and structural impacts and constraints related to wet etch processes. 

• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular. 

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data 

• Working knowledge of Design of Experiments (DoE) Proven ability to collaborate with local and overseas teams on projects 

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications. 

• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously 

• Ability to travel for extended periods of time and stay at Boise TD for 2-4 months at a stretch to work on technology development. 

The Senior Engineer supports photolithography process development for advanced memory technologies through hands‑on experimentation, data analysis, and yield improvement activities. This role focuses on execution excellence, disciplined learning, and collaboration, operating under guidance from senior technical leaders. Success in this role requires strong fundamentals in photolithography, analytical rigor, and the ability to translate experimental data into actionable insights. 

Main Responsibilities 

• Execute photolithography process development, optimization, and troubleshooting tasks in support of yield, quality, and performance targets. 

• Perform DOE, SPC, and statistical analysis to characterize process behavior and identify improvement opportunities. 

• Support material evaluations, defect learning, overlay analysis, and process window characterization. 

• Assist with integration learning during development and early manufacturing ramps. 

• Collaborate with cross‑functional teams including integration, etch, metrology, and yield engineering. 

Other Responsibilities 

• Document experimental procedures, results, and learnings in technical reports and presentations. 

• Support technology transfer activities under direction of senior engineers. 

• Integrates AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. 

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work. 

Candidate Profile 

Minimum Qualifications / Experience 

• PhD, or Master’s ≥3 yrs, or Bachelor’s ≥5 yrs of relevant experience in 
  Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, with foundational experience in semiconductor photolithography process development. 

Must‑Have Technical Skills 

• Demonstrated ability to contribute effectively to photolithography process development initiatives and improvement plans. 

• Deep knowledge in optics, immersion lithography, polarized illumination, and low k1 imaging  

• Proficiency in lithography simulation tools, material characterization, DOE, SPC, and basic statistical data analysis 

Must‑Have Soft Skills 

• Analytical thinking and structured problem‑solving 

• Collaboration and openness to learning 

• Clear technical communication 

• Project Management; especially in technical & technology programs  

• Demonstrates ability in applying AI tools to improve workflows, drive efficiency, and support data-informed decisions across teams and projects.

Highly Desirable / Preferred 

• Exposure to advanced lithography (193nm, 248nm, 365nm) and EUV processes 

• Hands-on experience with innovative photolithography equipment and metrology tools 

Embody Micron’s core values: 

• People – Respect, develop and empower others  

• Innovation – Drive continuous improvement and breakthrough thinking  

• Tenacity – Show grit and determination  

• Collaboration – Build trust and foster teamwork  

• Customer Focus – Deliver excellence and value 

Responsibilities: 

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type 

• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs. 

• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD Wet Etch peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements 

• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron. 

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions 

• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes. 

• Design and implement advanced process monitoring and control methodologies. 

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment. 

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings 

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers. 

• This position requires communication and collaboration with partners both locally and globally. 

• Strict adherence to Micron Intellectual Property protection policy is a must. 

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions. 

Requirements: 

• Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry are welcome to apply. 

• 2-3 years of semiconductor industry experience is preferable 

• A deep understanding of chemistry, chemical kinetics, thermodynamics and mass transport 

• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM, FTIR. Understanding of various integration and structural impacts and constraints related to wet etch processes. 

• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular. 

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data 

• Working knowledge of Design of Experiments (DoE) Proven ability to collaborate with local and overseas teams on projects 

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications. 

• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously 

• Ability to travel for extended periods of time and stay at Boise TD for 2-4 months at a stretch to work on technology development. 

• Demonstrates the ability in applying AI tools to enhance workflows, improve efficiency, and support data-informed decision across team and projects

We are looking for an Senior Engineer in Product Engineering, NAND Validation/Characterization, specializing in functional and design validation. Experienced in simulation‑based validation, failure analysis, and cross‑functional issue closure. Strong focus on automation, data‑driven validation, and applied AI/ML techniques to improve test efficiency, coverage, and debug productivity.

This role focuses on building scalable, reusable, and automated test program frameworks, including AI/ML‑driven initiatives, to support both deterministic validation flows and pseudo‑random validation (RSG – Random Sequence Generator). You will play a key role in architecting the backbone of Verilog test programs—enabling efficient development, execution, debug, and reuse across multiple products and technology nodes. Validation scope includes NAND datasheet commands, features, interfaces, and customer‑mode operations on silicon platforms. When device issues are uncovered, you will perform deep failure analysis, drive root‑cause identification, and collaborate closely with Design, Application Engineering, Product, System, and Validation teams to ensure timely issue closure and infrastructure readiness for product release.

If you are looking for a technically challenging, high‑impact, and collaborative role, STPG Product Engineering (FDV‑Verilog) offers the opportunity to work on leading‑edge NAND technologies with strong ownership and visibility.

Key Responsibilities:

• Designed and executed functional and design validation flows for advanced RG NAND devices using simulation platforms

• Developed  deterministic usage‑case tests and random sequence generators to validate NAND commands and customer‑mode features

• Performed detailed failure analysis of issues seen, root‑cause investigations (including digital and analog circuitry), and drove issue resolution with cross-functional teams

• Implemented  automation frameworks using C‑based programming, Python, and Perl to improve test development and execution efficiency

• Applied  AI/ML‑assisted techniques (data analytics, pattern recognition, anomaly detection) to:

• Accelerate failure triage and root‑cause analysis

• Identify validation coverage gaps

• Improve random sequence effectiveness and debug prioritization

• Utilized data‑driven methods and dashboards to track validation progress, defect trends, and release readiness

• For senior engineer, need to have at least 3–5 years of relevant professional working experience in a similar or related engineering role.

Skills Required:

• Bachelor’s degree in Electronics Engineering, Computer Engineering, or a related discipline

• Strong interest in design validation, characterization, and product engineering

• Proficiency in software development and scripting (e.g., C/C++, Perl, Python)

• Ability to apply AI/ML for test analytics and defect pattern analysis

• Excellent problem solving and analytical skills, with careful attention to root cause analysis

• Effective communication skills in written and spoken English, including documentation and presentation

• Ability to multitask and manage priorities in a fast‑paced development environment

• Proactive mindset toward continuous improvement and self‑development
  

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

As Engineering lead you will be primarily responsible for leading a team to start up, developing and optimizing processes to improve product quality and reliability, working on process yield &cell improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to manage TD business process eg MOR POR gaps, cost targets for respective nodes.  You will focus on optimizing manufacturing performance, ensuring alignment with Micron's business plan and strategic objectives across manufacturing sites. Your goal is to leverage global internal and external resources to define and enable equipment, yield, and output performance to achieve world-class manufacturing results. This includes building a strong team of engineers, collaborating with the Manufacturing Engineering team to hire and train technicians and engineers, and partnering on KPIs to deliver on our commitments. This position requires collaboration with Technology Development, Process & Equipment Engineering, Manufacturing Engineering, and Facilities, as well as our global network of manufacturing sites. You must support effective collaboration across all geographies and departments, and international travel may be required.

• Complete required safety training and ensure all work is conducted in accordance with Micron safety policies while promoting a positive work environment.

• Develop the strategic vision for your team and prioritize resources to accomplish that vision.

• Achieve yield/cell/cost/MOR-POR gaps targets for respective node.

• Set bold performance targets and ensure line-of-sight goals are communicated to your team members.

• Drive fab optimization, maximize output and yield while reducing operation costs and maintaining the highest quality standards.

• Support department business processes for new tool installations, as well as existing tool modifications, relocations, and removals.

• Partner with other 300 mm counterparts and OCT to identify and implement global best-known methods.

• Address large audiences, executives, and technology authorities on complex topics.

• Understand Micron People policies, partner closely with the People organization, and ensure your area of responsibility has succession plans for all key positions.

Job requirements:

• Bachelor's/Masters in Electrical, Materials Science, Physics, Microelectronics, Chemical Engineering with at least 5 years of experience in leading a Process Development team in a semiconductor R&D or high-volumn manufacturing environment or,

• PhD in Electrical, Materials Science, Physics, Microelectronics, Chemical Engineering with at least 3 years of experience in leading a Process Development team in a semiconductor R&D or high-volumn manufacturing environment

• Comprehensive understanding of films deposition, ion implant, NAND cell device physics.

• Knowledge and experience in high aspect ratio deposition and implant process development.

• Demonstration of collaborative ways of problem solving.

• Positive relationship building skills, both with internal and external customers.

• Demonstrated structured problem-solving capabilities.

• Strong communication and interpersonal skills (written, verbal, and presentation).

• Experience in being a mentor to manage the performance of direct reports.

• Ability to seek opportunities for continuous improvement, as a team member, leader, and for the organization.

About Micron 

Micron is a global leader in memory and storage solutions, enabling transformative technology that enriches life for all. With over 40 years of innovation, Micron plays a pivotal role in the data-driven economy, where memory and storage are strategic differentiators. We are committed to sustainability, employee well-being, and community support, and we foster a culture of inclusion, collaboration, and continuous improvement. 

Job Summary 

Main Responsibilities: 
 As a Process Integration Module Engineer in the Process Integration department, you will be responsible for coordinating improvements in Yield, Quality, and Output for the NAND Flash production line. Day-to-day responsibilities include but not limit to crafting and analyzing process experiments, teaming with YE and PQA to investigate yield and quality problems and working with production and process engineering teams to ensure the smooth operation of the fab. 

Responsibilities and Tasks 

• Collaborate with multi-functional teams from PIE, Process & Equipment Engineering, WLR, TD to improve product yields and reliability within your assigned process loop. 

• Communicate module related issues to the Fab engineering and leadership teams. 

• Design, execute, and analyze experiments to improve fab process, yield, and quality. 

• Collect and interpret complex data to optimize Fab processes and increase yields. 

• Engage and/or lead cross-area engineering teams to tackle process issues. 

• Work closely with global partners to stay ahead of on module related topics and process alignment projects. 

• Collaborate with other PI module owners and sister fabs to drive business process alignment 

• Partner with IE, Process and Equipment Engineering and Production to better forecast and balance yield, output and process issues 

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Requirements:

• Bachelor’s or advanced degree in Engineering or Science is required

• Strong analytical, logical, and critical thinking skills 

• Effective communicator, able to collaborate across all levels 

• Growth mindset with a passion for continuous learning 

• Internship or experience in the semiconductor industry is a plus 

• Demonstrated leadership and a track record of impact are highly desirable 

• Interest in and knowledge of the semiconductor industry and Micron is preferred.

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

• Embody Micron’s core values: 

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value 

What to Expect  

Micron is proud to be an equal opportunity employer. All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity, or any other protected factor. 

As Engineering lead you will be primarily responsible for leading a team to start up, developing and optimizing processes to improve product quality and reliability, working on process yield &cell improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to manage TD business process eg MOR POR gaps, cost targets for respective nodes.  You will focus on optimizing manufacturing performance, ensuring alignment with Micron's business plan and strategic objectives across manufacturing sites. Your goal is to leverage global internal and external resources to define and enable equipment, yield, and output performance to achieve world-class manufacturing results. This includes building a strong team of engineers, collaborating with the Manufacturing Engineering team to hire and train technicians and engineers, and partnering on KPIs to deliver on our commitments. This position requires collaboration with Technology Development, Process & Equipment Engineering, Manufacturing Engineering, and Facilities, as well as our global network of manufacturing sites. You must support effective collaboration across all geographies and departments, and international travel may be required.

• Complete required safety training and ensure all work is conducted in accordance with Micron safety policies while promoting a positive work environment.

• Develop the strategic vision for your team and prioritize resources to accomplish that vision.

• Achieve yield/cell/cost/MOR-POR gaps targets for respective node.

• Set bold performance targets and ensure line-of-sight goals are communicated to your team members.

• Drive fab optimization, maximize output and yield while reducing operation costs and maintaining the highest quality standards.

• Support department business processes for new tool installations, as well as existing tool modifications, relocations, and removals.

• Partner with other 300 mm counterparts and OCT to identify and implement global best-known methods.

• Address large audiences, executives, and technology authorities on complex topics.

• Understand Micron People policies, partner closely with the People organization, and ensure your area of responsibility has succession plans for all key positions.

Job requirements:

• Bachelor's/Masters in Electrical, Materials Science, Physics, Microelectronics, Chemical Engineering with at least 5 years of experience in leading a Process Development team in a semiconductor R&D or high-volumn manufacturing environment or,

• PhD in Electrical, Materials Science, Physics, Microelectronics, Chemical Engineering with at least 3 years of experience in leading a Process Development team in a semiconductor R&D or high-volumn manufacturing environment

• Comprehensive understanding of films deposition, ion implant, NAND cell device physics.

• Knowledge and experience in high aspect ratio deposition and implant process development.

• Demonstration of collaborative ways of problem solving.

• Positive relationship building skills, both with internal and external customers.

• Demonstrated structured problem-solving capabilities.

• Strong communication and interpersonal skills (written, verbal, and presentation).

• Experience in being a mentor to manage the performance of direct reports.

• Ability to seek opportunities for continuous improvement, as a team member, leader, and for the organization.

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the steadfast pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
 

As an OCT Modeling Engineer, you serve as the primary contact for the manufacturing network. You assess and report the capital impact of process changes to senior leaders in Manufacturing and R&D. You will be responsible for connecting many parts of the business in order to drive the execution of manufacturing and cost saving processes, including supply change, finance, engineering, procurement, production and planning. Innovation is highly valued at Micron, and you will have the opportunity to develop new tools to expedite, optimize and refine the planning and reporting processed used across the network. The ability to understand and effectively communicate the capita and operational impacts of manufacturing changes is crucial. Careful observation and capacity to operate effectively in circumstances when information is ambiguous will be very valuable.

Your Responsibilities will include but are not limited to :

• Lead network tool utilizations strategies and benchmark performance to optimize the company’s deployed capital

• Lead and communicate improvement and implementation plan to all relevant levels and functions in Manufacturing

• Optimize capacity of install equipment and lead sites and tool level optimization studies for throughput enhancement

• Collaborate with partners to understand future tool and process roadmaps. Able to assess network capacity impacts of process changes

• Improve financial analyses before capital equipment are purchased through automating metrics optimizations, process flexibility, capacity sharing and equipment repurpose

• Attention to detail and ability to work in situations where changes is fluid

• Ability to spot, question and highlight differences to drive resolutions with relevant collaborators

• Crafting reports and benchmarks to ensure department goals are met.

Requirements :

• Bachelors’ Degree or equivalent experience in Engineering, Computer Science, or a Business-related or quantitative field (Finance, Economics or similar subject area). MBA or Master’s degree or equivalent experience is desirable

• Experience turning sophisticated and ambiguous problem statements into structured solution while working in a highly multi-functional environment

• Experience operating independently while maintaining a high degree of organization, control and organizational change

• Experience analyzing and interpreting data, drawing conclusions, defining recommended actions, and reporting results cross diverse technical and non-technical groups

• Experience working in teams, establishing and maintaining multi-functional relationships

• Experience in a combination of capacity analysis, business analysis  or process analysis is advantageous.

As a Bonding Process & Equipment Engineer at Micron Technology, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding).

You will drive yield improvement, cost reduction, process capability enhancement, and risk management, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites.

Key Responsibilities

Process Development & Optimization

• Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)

• Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets

• Drive process capability improvement (Cpk) and defect reduction

Yield & Reliability Improvement

• Lead yield enhancement initiatives by analyzing process, tool, and material interactions

• Perform systematic root cause analysis using methodologies such as DOE, FMEA, 8D, SPC, and fault isolation techniques

• Evaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actions

Equipment & Materials Engineering

• Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g., EVG, TEL, Disco platforms)

• Define equipment specifications, roadmap, process control strategies, and matching/fingerprinting requirements

• Evaluate and introduce new materials/spares/parts for performance improvement

Technology Transfer & Process Integration

• Support technology transfer and ramp-up across global sites

• Align process baseline (POR) and ensure consistency through documentation and control plans

• Work closely with integration, CMP, WET, and Films teams to ensure cross-module compatibility

Manufacturing Support & Problem Solving

• Diagnose and resolve manufacturing line issues impacting bonding yield and performance

• Analyze process excursions and implement containment and recovery actions

• Drive continuous improvement for cycle time, tool availability, and cost efficiency

Qualification & Control

• Lead new process and baseline qualifications

• Develop control plans, SPC strategies, and inline monitoring systems

• Establish risk mitigation frameworks and ensure compliance with manufacturing standards

Supplier & Cross-Functional Collaboration

• Partner with suppliers for technology development, process improvement, and cost optimization

• Audit material and equipment suppliers to ensure quality and reliability targets are met

• Collaborate with global teams and partners to drive alignment and execution

Qualifications

Technical Expertise

• Strong knowledge of semiconductor bonding processes (wafer to wafer hybrid bonding, fusion bonding preferred)

• Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms

• Experience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is highly preferred

Skills & Competencies

• Proficiency in data analysis, SPC, and statistical modeling

• Strong problem-solving skills using structured methodologies (8D, FMEA, DOE)

• Ability to manage complex projects involving multiple functions in a high-volume manufacturing environment

• Excellent communication and collaboration skills across global teams

Education & Experience

• Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field

• 7 years+ Relevant proven experience in semiconductor manufacturing or advanced packaging

As a Bonding Process & Equipment Engineer at Micron Technology, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding).

You will drive yield improvement, cost reduction, process capability enhancement, and risk management, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites.

Key Responsibilities

Process Development & Optimization

• Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)

• Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets

• Drive process capability improvement (Cpk) and defect reduction

Yield & Reliability Improvement

• Lead yield enhancement initiatives by analyzing process, tool, and material interactions

• Perform systematic root cause analysis using methodologies such as DOE, FMEA, 8D, SPC, and fault isolation techniques

• Evaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actions

Equipment & Materials Engineering

• Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g., EVG, TEL, Disco platforms)

• Define equipment specifications, roadmap, process control strategies, and matching/fingerprinting requirements

• Evaluate and introduce new materials/spares/parts for performance improvement

Technology Transfer & Process Integration

• Support technology transfer and ramp-up across global sites

• Align process baseline (POR) and ensure consistency through documentation and control plans

• Work closely with integration, CMP, WET, and Films teams to ensure cross-module compatibility

Manufacturing Support & Problem Solving

• Diagnose and resolve manufacturing line issues impacting bonding yield and performance

• Analyze process excursions and implement containment and recovery actions

• Drive continuous improvement for cycle time, tool availability, and cost efficiency

Qualification & Control

• Lead new process and baseline qualifications

• Develop control plans, SPC strategies, and inline monitoring systems

• Establish risk mitigation frameworks and ensure compliance with manufacturing standards

Supplier & Cross-Functional Collaboration

• Partner with suppliers for technology development, process improvement, and cost optimization

• Audit material and equipment suppliers to ensure quality and reliability targets are met

• Collaborate with global teams and partners to drive alignment and execution

Qualifications

Technical Expertise

• Strong knowledge of semiconductor bonding processes (wafer to wafer hybrid bonding, fusion bonding preferred)

• Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms

• Experience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is highly preferred

Skills & Competencies

• Proficiency in data analysis, SPC, and statistical modeling

• Strong problem-solving skills using structured methodologies (8D, FMEA, DOE)

• Ability to manage complex projects involving multiple functions in a high-volume manufacturing environment

• Excellent communication and collaboration skills across global teams

Education & Experience

• Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field

• 7 years+ Relevant proven experience in semiconductor manufacturing or advanced packaging