Total 3 Others level Engineering job vacancies in Ipoh

Position Summary

Responsible for the selection, qualification, application, failure analysis and documentation management of components, materials and chemicals together with their supplier evaluation.

Duties & Responsibilities

• Classify, characterize, and manage company-used electronic components, parts, materials, and chemicals as part of an integrated material library.
• Develop component and material selection, qualification, and application guidelines; standardize test methods; and design test plates for common screening and qualification activities.
• Provide technical support on material and component related topics, including datasheet interpretation, alternate part recommendations, application guidance, failure analysis, storage, and handling requirements.
• Support cost reduction initiatives and alternative component sourcing, and address engineering queries (EQ) from suppliers to ensure quality, performance and compliance requirements are met.
• Evaluate emerging technologies, industry developments, and new components, and identify suitable application opportunities for new product development.
• Review product designs to ensure robust and reliable design-in of components and materials both technically and commercially such as lifecycle state, regulation & compliance requirements (e.g. RoHS, REACH, UL, etc.) and supply assurance.
• Lead the root cause analysis of component failures, identify the failure mechanism, and derive countermeasures
• Identify critical and high-risk components within products, develop mitigation plans, and lead reliability and quality validation activities.
• Assess supplier technical capabilities, support supplier selection for key components, and conduct supplier audits or technical visits when required.
• Standardize various technical documents (test plan, reports, guidelines, etc.), craft documentation templates, and optimize the corresponding rules and processes.

Lead the design, build, and optimisation of business‑critical applications and automation solutions that integrate across enterprise systems. Combine architecture leadership with hands‑on engineering to accelerate delivery, reliability, and scale.

Key responsibilities

• Work with relevant stakeholders to understand user requirements, analyse current issues/gaps, identify improvement opportunities, propose digital solution and development roadmap.
• Own end‑to‑end lifecycle: discovery, solution design, implementation, testing, deployment, and transition to operations.
• Create apps and automation: improve user experience and efficiency by digitalize manual business workflow/process.
• Implement automation across CI/CD, infrastructure as code, release management, and test automation.
• Engineer integrations and APIs; design event‑driven workflows and orchestration across SaaS/enterprise platforms.
• Establish and enforce best practices for security, reliability, performance, and cost optimisation.
• Collaborate with product/operations to refine requirements, maintain backlogs, and deliver incremental value.
• Build observability (logging, metrics, tracing); lead incident response and root‑cause analysis.
• Mentor engineers, lead design/code reviews, and maintain technical documentation and standards.
• Contribute to governance: estimation, risk management, change control, and stakeholder communication.
• Track KPIs (deploy frequency, lead time, MTTR, defect rates) and drive continuous improvement

We are actively driving advanced package technology and developing power package with focusing on next generation technologies for AI data center and automotive. To achieve the rapidly growing demand and expedite release to market of power packages, we are developing such as Power QFN, HSON, HSOT and TOLL. This role offers the opportunity to work on, higher density, lower resistance, higher reliability, and high thermal dissipation package design and develop technologies.

Key Responsibilities

• Design and develop power package and interconnect for Renesas’s packaging needs in the areas of power QFN, HSON, HSOT and TOLL for AI data center and Automotive.
• Work with OSAT/Internal manufacturing especially collaboration with Malaysia and Japan PKG team to develop, run DOE to optimize processes and establish process specification.
• Work with Product groups and QA team to define target of package structure/design, develop new package and processes, and qualify packages within required period.
• Ensure smooth transition into production by establishing robust design and process through the DOE results, verification, and resolving issuesduring development period.
• Develop and maintain technical expertise on advances and innovations in advanced power package design, process, and interconnect that linked and execute pkg roadmap.