Total 237 design intern job vacancies in Engineering category in The Philippines

About Lighthouse Canton

Founded in 2014, Lighthouse Canton is a Singapore-headquartered global investment management firm with approximately US$ 5+ billion in Assets Under Management (AUM). Lighthouse Canton is one of the leading and award-winning investment firms in the region, focusing on managing funds with uncorrelated investment strategies, providing investors with the opportunity to achieve consistent returns across market cycles. Lighthouse Canton has offices in Singapore, Dubai, India, and the UK.

Job Purpose

We are offering an AI Engineering Internship designed as a structured, mentored introduction to building production-grade AI systems inside a regulated wealth management firm. You will sit inside our small AI Lab and work alongside experienced engineers on real internal applications across Investment, Relationship Management, Risk, Operations, and Compliance - not toy projects, and not coffee runs.

What You Will Do

Building & Supporting AI Applications

• Pair with senior engineers on AI-powered internal applications using LLMs, RAG pipelines, and agents. Expect to start by reading code and small fixes, and ramp up to owning well-scoped features under guidance.
• Help build and tune retrieval systems: chunking strategies, embeddings, vector search, and basic re-ranking.
• Practise prompt engineering and context engineering—structuring inputs, managing memory, and compacting context - to keep agents coherent across multi-step tasks.
• Help wire internal knowledge bases, market data feeds, and operational systems into agents via Model Context Protocol (MCP) servers and other typed-tool interfaces.

Agent Harness & Evaluation

• Get hands-on with the agent harness - the runtime layer around the LLM that manages execution loops, tool calls, state, memory, and error handling. You will be expected to learn the vocabulary (ReAct, planner/executor, guardrails, permission gates, loop budgets) and apply it in real code.
• Help build evaluation harnesses: writing test cases, regression suites, deterministic checks (schema validation, citation checks),and simple LLM-as-judge graders—so we can tell whether changes actually improve quality.
• Instrument agents with basic observability: tracing tool calls, logging token usage, latency, and outcomes; help triage failure traces and feed lessons back into prompts and tool specs.
• Contribute to internal documentation on harness patterns, evals, and lessons learned - useful both to the team and to your own learning.

Collaboration & Knowledge Sharing

• Partner with stakeholders in Investment, Relationship Management, Risk, Operations, and Compliance to understand requirements—always alongside a senior team member.
• Take part in code reviews, design discussions, and weekly team check-ins. Asking questions is part of the job, not a sign of weakness.
• Present a short end-of-internship readout summarising what you built, what you learned, and what you would do differently.

What We Are Looking For

Technical Foundations

• Programming: Comfortable in Python from coursework, personal projects, or prior internships. Any exposure to JavaScript/TypeScript, Git, and the command line is a plus.
• AI/ML Curiosity: Has built at least one small project involving LLMs (e.g., via OpenAI, Anthropic, or open-source models) - a chatbot, a RAG demo, a hackathon project, a tinkering side project, an agent that does something silly. Quality of curiosity matters more than scale.
• Agentic AI Awareness: Familiar at a conceptual level with agent frameworks (e.g., LangChain, LangGraph, CrewAI, OpenAI Agents SDK, Claude Agent SDK) and modern terms like MCP, RAG, evals, and guardrails. We do not expect mastery - we expect that you have read about them and want to go deeper.
• AI-Assisted Development: Comfortable using coding assistants such as Claude Code, Codex, or GitHub Copilot as part of how you build - and aware that they need supervision, tests, and clear specs to produce reliable code.
• Data & Web Basics: Light exposure to databases (SQL, or any NoSQL store), and to web/API basics (HTTP, JSON, a back-end framework such as FastAPI or Flask) is helpful but not required.

Mindset & Soft Skills

• Genuine curiosity about AI, finance, and the messy intersection of the two. You should be excited to learn how a wealth management firm actually works.
• Comfort with ambiguity: real projects rarely arrive with neat specs. We will help you scope them, but we want someone willing to sit with uncertainty.
• Communication: able to explain technical ideas in plain English (and in writing), and to flag blockers early rather than getting stuck quietly.
• Integrity: this is a regulated environment. We need an intern who treats client data, MNPI, and internal information with the same care a full-time hire would.

Education

• Currently pursuing a Bachelor’s or Master’s degree in Computer Science, Artificial Intelligence, Data Science, Software Engineering, Quantitative Finance, or a related field—or a recent graduate within 12 months.
• No prior professional experience required. Strong coursework, personal projects, open-source contributions, hackathon work, or research projects are all valid signals.
• Penultimate-year and final-year students are encouraged to apply.

Mechanical Design Engineer (Semiconductor Tooling Design)

5 days, 8.30am-6.15pm

Salary: $3500- $6000

Location: Ubi 

Company background:

Specializes in Semiconductor Backend Tooling including Die Attach Tools, Wire Bond Tools & Bond Test Tools

Job Responsibilities:

• Design and development of Semiconductor Tools and mechanical systems.
• Planning, Scheduling and Costing of Tools and Mechanical Modules
• Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.
• Working closely with Electrical, Vision and Software Engineers.
• Willing to work extended hours in critical phases of project execution.

Job Requirements:

• Diploma or Degree in Mechanical Engineering or related Technical disciplines.
• Minimum 3 years of design experiences in semiconductor tooling
• Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus
• Proficiency with CAD Software is a must.
• Experience with vision application, thermal modelling, calculation and measurement techniques would be an advantage.

Cheong Yeat Long | R25145358

The Supreme HR Advisory Pte Ltd | EA 14C7279

• Well Established Industrial Automation Company (MNC)

• $5000 + $6300 + Variable Bonus

• Company located at Woodlands

• Monday – Friday: 8:30am – 5:30pm

• Excellent Welfare & Benefits

Job Scope

• Collaboration with Project Manager and customer to understand design requirements and
• specifications for the product.
• Analyse project requirements and participate in concept generation.
• Design high precision and high-tech automation equipment.
• Selection of standard components such as sensor, pneumatic, motor, servo axis and robotics.
• BOM preparation using SAP.
• Coordinate with fabrication house and component suppliers.
• Report project progress to Project Manager and superior.
• Guide assembly technicians to build and test the equipment.
• Collaborate with cross-functional teams (including design, manufacturing, and quality assurance)to ensure compliance with industry standards and regulatory requirements.

Requirement

• Degree in Mechanical Engineering / Mechatronics or related disciplines
• 5 - 8 years of relevant experiences in automation equipment design
• Proficient in SolidWorks 3D and EPDM software

Candidates are encouraged to apply this position via Apply Now button with the following information in the resume:

• Work experiences and job responsibilities
• Current and Expected salary
• Reason for leaving
• Date of availability
• Education background

We regret that only shortlisted candidates will be contacted.

KHOOSOT MEI (R21102604)

EA Recruitment Pte Ltd

EA License No: 21C0492

Job Description

• Lead cross-functional teams across Design, Systems, Validation, Product/Test Engineering, Firmware, Supply Chain, Procurement, and Quality to ensure seamless program execution in NPI projects.
• Lead COGS reduction programs from impact assessment through qualification, PCN, safelaunch, and production ramp – quantifying savings, evaluating ROI, and assessing the business impact of schedule slips and risk scenarios.
• Drive capacity expansion initiatives across global manufacturing sites, aligning engineering, operations, and supply chain to support production scalability.
• Build and manage detailed schedules for NPI, COGS and capacity programs; track progress, remove roadblocks, and implement data‑driven mitigation plans.
• Manage Engineering Build Request prioritization, conducting bi‑weekly reviews with PMO and Business Operations leadership to ensure alignment with organizational priorities.
• Act as a liaison between the product group, operations/supply chain teams, and key OSAT interface teams to ensure alignment, clarity, and seamless execution across all stages of the program.
• Drive sample readiness and ramp readiness, ensuring cross‑functional teams maintain schedules that support committed customer delivery timelines.
• Coordinate and conduct Project Gate reviews, ensuring cross‑functional readiness, milestone alignment, and clear communication of risks and dependencies.
• Oversee wafer fab, assembly, and test operations to ensure timeline adherence, cost efficiency, and quality standards across programs.
• Provide structured leadership updates on program status, risks, and mitigation plans, maintaining accurate schedules and qualification documentation.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
• The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
• The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.

•  Process Flow: Learn to analyze and optimize the wafer sort, final test, and backend processes in semiconductor production.
• Factory Layout (AutoCAD): Learn to design and improve factory floor layouts using AutoCAD for efficient space utilization and equipment placement.
• Time Study: Learn to conduct time studies for final test and backend operations, using Excel to analyze data and identify efficiency improvements.
• Exposure to Equipment: Gain hands-on learning experience with semiconductor testing, handling, and backend packaging equipment

Get to Know the Team

You will be joining the Metadata & BI Platforms team within Grab's Data Engineering Platforms department. The team builds and maintains the systems that power Grab's data intelligence: Hubble (data discovery platform), Genchi (data observability platform), Superset and Power BI (business intelligence platforms), and the Data Agent (agentic analytics platform).

We work at the intersection of data engineering and AI, building systems that help thousands of internal users across Grab discover, understand, and act on data. The team is passionate about applying the latest AI advances to make data more accessible, intelligent, and useful at scale.

Get to Know the Role

As an AI Engineer Intern, you will contribute to building and improving AI-powered data platforms that make data discovery, observability, and analytics smarter and more intuitive at Grab. You will get hands-on experience building production-grade systems — from LLM integrations and agentic workflows to vector search pipelines — alongside engineers who ship AI features at scale.

This is a high-impact role where your contributions will be used by real internal users across the company. You will work in a fast-paced, collaborative environment with mentorship from experienced engineers, gaining exposure to the full AI product development lifecycle from design to deployment.

The Critical Tasks You Will Perform

• You will design and implement backend services and APIs that support AI-driven data platform features.
• You will integrate LLM APIs into platform workflows to enable intelligent automation and natural-language capabilities.
• You will contribute to building and orchestrating agentic systems (e.g., using LangGraph) for use cases such as data troubleshooting, SQL/code generation, and data Q&A.
• You will develop and optimize vector search and RAG pipelines to improve data retrieval and semantic understanding.
• You will debug and resolve performance or reliability issues in complex data systems, working toward production readiness.
• You will Collaborate with product managers, data engineers, and data analysts to deliver high-impact features.

About Aurigin

Founded in 2001, Aurigin designs, develops and delivers smart automation equipment and solutions to semiconductor and electrical manufacturing customers. Our systems, such as our flagship BGA ball mount equipment, are installed globally and help produce complex semiconductor devices that power everything from our daily lives to the next frontier of intelligence.

Responsibilities and Duties

• Design & develop high precision & high-speed machines using CAD tools.
• Test and evaluate design.
• Conduct experiments methodically, analyse data and interpret results.
• Identify, formulate and produce effective solutions to emerging problems.
• Evaluate final product’s overall performance, reliability and safety.

Requirements

• Bachelor’s/Master’s Degree in Mechanical/Mechatronics Engineering and preferably with design experience in similar equipment / machine / automation engineering environment.
• Good aptitude and strong interest in machine design.
• Robust understanding of core concepts including mechanics, kinematics, thermodynamics and materials science.
• Creative thinker with strong analytical and problem-solving skills.
• Accurate and strong attention to detail.
• Good communication skills.
• Applicants with demonstrated relevant experience will be consider for senior appointments.

Digital IC Design

• Perform Verilog RTL design to meet product specifications and requirements
• Perform Logic Synthesis, Static Timing Analysis
• Work with Physical designer to achieve timing closure
• Work with Systems and Software engineers on FPGA verification
• Lead DFT related activities - Scan Insertion, ATPG, Pattern Validation
• Work with test team in debugging production test issues
• Help debug & correct any functional issues found in taped-out devices
• Participate in design reviews, support ISO processes and documentation

Additional Responsibilities

1. Any reasonable task assigned by management and deemed to be within the individuals’ capabilities to ensure smooth running of the business.
2. As this is an evolving business, ongoing change is an integral part of the position. Management will liaise with the individual on any fundamental change to work practices. The individual is required to embrace and adopt any change to working practices.

Knowledge and Skill Requirements

• Degree/Master in Electrical/Electronic Engineering
• 5 years or above experience in the area of digital IC design
• Working experience from design to tape-out are essential
• Experience in Verilog HDL and VHDL RTL design, Logic Synthesis, DFT, ATPG, Timing Closure
• Experience in using EDA tools from Cadence, Synopsys
• Knowledge and working experience in one or more of the following:

- Digital and mixed-signal design

- USB interface products

- Knowledge in connectivity technology such as USB, UART, SPI, I2C

- Project Management

The responsibilities of this position include, but are not limited to:

• Design of tunnels in both TBM and SEM (Sequential Excavation Methods), especially TBM tunnel lining design
• Contribute to preparation of contract documents, technical specifications, design report and drawing
• Organize independently work plans and design activities for projects of medium/high complexity
• Plan, manage and implement geotechnical investigation programs for tunnel and underground projects
• Perform geotechnical analyses and design based on geotechnical investigation results
• Use commercial numerical modelling tools including both Finite and Distinct Elements software to design tunnels and underground structures
• Autonomously generate and verify excel sheets for structural and geotechnical verifications
• Provide multidisciplinary teams clear knowledge and expertise of the basic principles of soil and rock mechanics and ground-structure interactions
• Participate in teamwork contributing with specific geotechnical and structural experience on underground components of Transportation and Water Conveyance projects
• Support tunnels proposals with technical inputs, including methodologies and techniques
• Supervise and review the work of less experienced engineers, train interns on numerical modelling
• Liaise with other disciplines, professionals, clients

Qualifications

• Degree in Civil, Geotechnical or Structural Engineering with experience in tunneling and underground engineering
• At least 1 years’ experience in tunnels, trenchless structures
• Design Experience with small (OD 6m~8m) and/or large diameter (OD >10m) TBM tunneling method is preferred
• Knowledge of Geotechnical, Hydrogeology, Geological engineering and Rock mechanics
• Knowledge of analytical and numerical analysis methods for underground works and tunnels
• Ability to work with minimal supervision
• Advanced analytical, problem-solving and decision-making skills applied to design activities
• Advanced oral and written skills as well as interpersonal/teamwork skills

Job Description: 

• Design and development of defence products, including translating design concepts into 3D CAD models and engineering drawings for prototype fabrication. 
• Support prototype fabrication and development testing, carrying out iterative design improvements until products meet requirements, specifications, and qualification standards, followed by the preparation of production drawings. 
• Initiate market research and proposing design improvements to enhance user experience in terms of compactness, durability, cost efficiency, and operational effectiveness. 
• Provide support for product demonstrations, production activities, operations, and support (O&S), as well as marketing and sales functions. 

Job Requirements:

• Degree in Mechanical Engineering or equivalent.
• Strong knowledge of mechanical engineering and mechanical systems.
• Programme management skills, including budgeting and project scoping.
• Agile thinker, able to adapt quickly to change in a high-pace environment
• Proficiency in SolidWorks for 3D CAD modelling and 2D drawings is preferred.
• Good hands-on proficiency in prototyping and system integration to meet project timelines.
• Good interpersonal, people management, and decision-making skills.
• Strong written and verbal communication skills.
• Strong sense of ownership and ability to drive projects from concept through to completion.
• Excellent problem-solving skills with strong creative and analytical capabilities.
• Willingness to travel overseas.

Job Description:

• Drive the design of next-generation semiconductor automation equipment and modules, transforming ideas into functional designs and prototypes.
• Create detailed fabrication, assembly, and layout drawings using 3D CAD tools, such as CREO, SolidWorks, or other acceptable software.
• Perform structural, kinematic, and dynamic analyses, including Finite Element Analysis (FEA) simulations and tolerance stack-ups, to ensure design robustness.
• Work with software, electronics, and vision engineering teams to integrate mechanical designs into complete system solutions.
• Apply Design for Manufacturing (DFM), Design for Assembly (DFA), and concurrent engineering principles to ensure efficient and robust designs.
• Develop and validate pneumatic and hydraulic circuits and ultra-precision, high-speed pick-and-place mechanisms.
• Contribute to design standardization, cost optimization, and project management for research and development initiatives.

Job Requirement:

• Minimum Degree in Mechanical Engineering or related field
• Minimum 5 year working experience in Mechanical Design in Automation/ Semiconductor Industry

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900

about the company

Our client is a premier international consulting firm specializing in maritime engineering. With a reputation for excellence, they partner with a diverse portfolio of clients, ranging from government bodies and port authorities to major industrial companies and private enterprises. Their track record spans the globe, delivering successful engineering solutions for projects of all sizes—from large-scale coastal developments to niche private ventures.

about the job

• Coastal Structural Design: Lead the detailed design and engineering of hard coastal solutions (breakwaters, groynes, revetments) and soft interventions (beach stabilization, reclamations).
• Marine & Port Engineering: Determine environmental loading and structural performance for port infrastructure, including quay walls, jetties, and offshore foundations.
• Berthing & Mooring: Oversee the design of ship-shore interfaces, including the specification and layout of fenders, bollards, and Quick Release Hooks (QRH).
• Technical Analysis: Execute high-level technical studies ranging from Metocean data interpretation to Dynamic Mooring Analysis.
• Coastal Dynamics: Conduct specialized studies on wave hydraulics, morphology, and local scour to inform dredging strategies and structural longevity.

skills & experience required

• Msc / Degree in Civil Engineering
• Heavy civil engineering in marine coastal / reclamation / infrastructure engineering project
• Min 8 years of relevant experience in infrastructure / maritime / coastal / dams / ports / underwater projects
• Knowledge of Industry Codes and Standards
• Familiarity and hands-on experience with Singapore authority submissions (e.g., BCA, JTC,MPA, PUB, SCDF, etc.)
• Ground Improvement/Piling Projects experience will be a plus

If you are interested in the position , kindly send your CVs in to yitwei.kwan(@)randstad.com.sg
Please include your availability, expected salary and reason for leaving current job
We regret that only shortlisted candidates will be contacted
EA: 94C3609 / Reg: R1325913

• Exposure to global semiconductor customers
• High technical ownership

About Our Client

Our client is a well‑established hi‑tech engineering company operating in the semiconductor sector, with a focused presence in Singapore. They specialise in precision mechanical solutions for IC testing and interconnect applications, supporting global semiconductor manufacturers. The organisation has an engineering‑driven setup, where technical depth, hands‑on contribution, and close collaboration with customers and manufacturing partners are highly valued. The Singapore team works closely with regional and overseas counterparts and plays a critical role in product design, improvement, and delivery for advanced semiconductor applications.

Job Description

• Stay hands‑on in IC socket and connector design, including:Socket architecture and redesign.Pin and contact structure optimisation

• Review and drive designs from concept to mass production

• Redesign and improve existing socket platforms to meet new customer requirements

• Apply DFM / DFA / DFMEA, GD&T, and tolerance analysis

• Work closely with manufacturing, tooling vendors, and suppliers

• Participate in technical discussions with customers

• Support failure analysis and root‑cause investigations

The Successful Applicant

• At least 6 years of experience in IC socket, test socket, or connector design

• Strong hands‑on background in:Precision mechanical design, Injection molding, machining, stamping

• Experience in mechanical, thermal, and electrical co‑design

• Exposure to high‑speed, high‑current, or high‑power applications

• Proficient in SolidWorks (3D & 2D); simulation experience is a strong plus

What's on Offer

The roles offer hands‑on ownership of real, production‑critical products, exposure to global tier‑one semiconductor customers, and the opportunity to work across the full product lifecycle-from design and redesign through to mass production and customer support. The team operates in a lean setup, meaning engineers have real influence, visibility, and technical impact rather than being siloed. They offer to a competitive base salary, long‑term stability, and the chance to deepen expertise in a specialised domain that remains in strong demand within the semiconductor industry.

Contact

Timothy Huang (Lic No: R1980928/ EA no: 18S9099)

Quote job ref

JN-042026-6999630

Phone number

+65 6416 9863

Michael Page International Pte Ltd | Registration No. 199804751N   

Job Description:

• Drive the design of next-generation semiconductor automation equipment and modules, transforming ideas into functional designs and prototypes.
• Create detailed fabrication, assembly, and layout drawings using 3D CAD tools, such as CREO, SolidWorks, or other acceptable software.
• Perform structural, kinematic, and dynamic analyses, including Finite Element Analysis (FEA) simulations and tolerance stack-ups, to ensure design robustness.
• Work with software, electronics, and vision engineering teams to integrate mechanical designs into complete system solutions.
• Apply Design for Manufacturing (DFM), Design for Assembly (DFA), and concurrent engineering principles to ensure efficient and robust designs.
• Develop and validate pneumatic and hydraulic circuits and ultra-precision, high-speed pick-and-place mechanisms.
• Contribute to design standardization, cost optimization, and project management for research and development initiatives.

Job Requirement:

• Minimum Degree in Mechanical Engineering or related field
• Minimum 5 year working experience in Mechanical Design in Automation/ Semiconductor Industry

To submit your application, please apply online to apply@rn-care.com or call +(65) 6513 5697 for private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd
EA License No: 17C8900