Total 33 process development engineer job vacancies in Engineering category in The Philippines

As a Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

Job Description

Micron’s NAND Process Development (PD) Singapore group is looking for process development engineer to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Responsibilities

• Process module ownership involving Chemical Mechanical Planarization (CMP) process characterization and advanced process development for 3D NAND and beyond.

• Work with process development engineers in Singapore and Boise, US TD site and vendors to develop processes that meet integration requirements for next-generation 3-D NAND nodes.

• Transfer CMP processes to high volume manufacturing (Fab10N), and work on continuous improvements to manufacturability.

• Address process issues working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.

• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts.

• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions

• Identify process simplification opportunities and drive multi-functional teams in implementation

• Incorporate best known manufacturing methods into early development phase of upcoming nodes.

• Design and implement advanced process monitoring and control methodologies.

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.

• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.

• This position requires communications and collaboration with partners both locally and globally.  Strict alignment to Micron Intellectual Property protection policy is a must.

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Requirements

• Bachelors’/Masters in Materials Science, Chemical Engineering or Physics with minimum 5 years hands-on experience in groundbreaking CMP polishing equipment such as AMAT or EBARA, or

• PhD in Materials Science, Chemical Engineering or Physics.

• Lead and mentor CMP engineers early in their careers while driving technical excellence.

• Build, lead, grow a capable CMP team for NAND technology development

• Excellent problem-solving skills and critical decision making

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data

• Working knowledge of Design of Experiments (DoE)

• Proven ability to collaborate with local and overseas teams on projects

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously

You are responsible for new equipment introduction, risk assessment, equipment set-up, release, PM, Calibration, lab audits and as well as continuous improvement activities such as equipment reliability improvement, cost reduction, and equipment usage optimization. Through this role, you will enhance your technical skills in equipment management and improvement, project management, and strengthen your engagement and network with vendors and global GEL organizations across Micron sites.

Responsibilities

-Support GEL Equipment and lab operations including Internal and External audits, ESD and PM, Calibration, equipment troubleshooting, Safety and Chemical controls.

- Oversees the installation, modification, upgrade and maintenance of Engineering equipment.

- Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. - -- Establishes programs and solutions for increasing uptime and for equipment problems that affect the engineering process.

-Provides technical support to the engineering equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules.

- Collaborate with cross functional teams on equipment requirements, space planning, facilitation, purchase and installation of equipment.
- Equipment inventory controls and critical spare parts planning.

- Coordinate external vendors on training, repair, and preventive maintenance of equipment.
- Manage external vendors expectation, set and assess goals and achievements.
- Analyze and support stakeholders’ requirements and expectations.
- Foster closer collaboration amongst cross functional teams.
- Focus on customer needs and provide timely solutions.

Requirement

• Bachelor's degree in engineering with experience with ESD checks

• At least 1 year of experience in Semiconductor Equipment or Tools PM, calibration, and troubleshooting.

• Knowledge with Automated Optical Inspection and ANSYS Simulation

As a PDE Central Yield Enhancement (YE) Engineer within Package Development Engineering (PDE), you will own and execute yield learning and improvement activities across advanced package technologies during HBM and NCG New Product Introduction (NPI). Your scope includes yield monitoring, excursion response, and yield stabilization, with an emphasis on rapid learning, early risk identification, and scalable solutions. 

This role plays a key part in driving robust yield performance from first silicon through NPI ramp and early HVM, partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing and Quality teams. You will act as a hands‑on yield owner for NPI builds, translating data into actionable insights, driving fast learning cycles, early risk detection, and leading disciplined yield recovery. 

Job Responsibilities 

Yield Loss Accounted For 

• Account for HBM NPI builds across PWF, Assembly, and test through defect breakdown and PFA submission to understand fail mode 

• Own and execute assigned Central YE responsibilities for HBM NPI program, work closely with PI to identify defects that is coming from their area to brainstorm for CIP 

• Learn NPI processes, phase gates, and yield best practices 

• Assist in maintaining yield dashboards and trackers. Support PI/PE/RDA in identifying and transforming processing data to account/ breakdown a yield loss 

Yield Deviation Control 

• Analyze and report on yield deviation issue and trigger action from PI, PE or RDA 

• Support block run and partial conversion build yield analysis to early detect any impact on yield 

• Work closely with PCS team to identify SPC or FDC charts to put into YLR dashboard for shift left monitoring 

Yield Improvement Opportunities 

• Brainstorm with staff from other departments for improvement opportunities and propose to PI 

• Design and implement new solutions, including hotspot analytics, to improve the effectiveness of the automated defense line system. 

• Utilize software tool like Auto-diagnostics to find yield improvement opportunities 

Integrating Artificial Intelligence 

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgement and complying with organizational standards and legal requirements 

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work 

Job Requirements 

• Bachelor's or Master's degree in Electrical/ Electronics Engineering/ Computer Engineering / Computer Science with 2 to 5 years of experience in semiconductor industry, specifically involving yield analysis, defect/root cause investigation, or data-driven process optimization in advanced memory (HBM, DRAM, NAND) or high-volume semiconductor packaging. 

• Proficiency in Python (e.g., Pandas, NumPy) and SQL for semiconductor manufacturing data analysis, with hands-on experience developing interactive dashboards and visual reports using tools (including Spotfire and Power BI/Tableau) to translate large manufacturing datasets into actionable yield and process improvement insights. 

• Demonstrated experience building automated reporting workflows, data pipelines, or process automation solutions using Python scripting or RPA tools within a semiconductor manufacturing environment, with the ability to drive cross-functional decisions across manufacturing, process integration, and engineering teams in the semiconductor industry. 

• Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes 

Embody Micron’s Core Values 

• People – Respect, develop, and empower others. 

• Innovation – Drive continuous improvement and breakthrough thinking. 

• Tenacity – Show grit and determination. 

• Collaboration – Build trust and foster teamwork. 

• Customer Focus – Deliver excellence and value 

Join Micron as a Senior Process Development Engineer, Dry Etch, NAND, and join a passionate team advancing next-generation NAND process technologies. You will collaborate with proficient professionals, develop inventive process, and assist us in achieving seamless delivery on our demanding projects.

Responsibilities: 

• Rapid deployment of new NAND process technologies.

• Drive development efforts prior to device ramp

• Define and complete effective actions to enable solutions required to hit key achievements and achieve the required performance within timelines

• Complex process development tasks related to ongoing evaluation of Dry Etch tool performance, examination of Dry Etch process windows, and adjustments or refinement of Dry Etch recipes within 3D NAND technology

• Troubleshoot processes as part of cross-functional teams, driving yield and quality improvement.

• Take initiative to identify and own areas for improvement, collaborating with other Fabs and TD teams.

• Proactively identify exciting processes and work with Fabs to find viable solutions

• Drive process simplification initiative across cross-functional teams.

• Integrate best-known manufacturing methods into the early development phase of upcoming nodes

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Successful candidates for this position will have: 

• PhD degree in Material Science, Physics, Chemistry, Electrical/Electronics Engineering, or Bachelors/Masters in Material Science, Physics, Chemistry, Electrical/Electronics Engineering with minimum of 3 years of semiconductor dry etch process development background

• Proven track record of strong publication, patent, or invention disclosure.

• Strong interest in technology development and crafting production-worthy technologies

• Ability to build and maintain relationships with cross-functional teams and vendors

• Excellent communication skills (written, verbal, and presentation).

• Proficiency in statistics, data analysis, Design of Experiments (DOE), and comfort with analysis software tools.

• Ability to work in a fast-paced and dynamic environment

Micron Technology Inc. is a Fortune 500 company & employs about 45,000 workers worldwide, with HQ in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HMCs, and other memory-based systems. Micron is expanding and now starting full-fledged NAND research and development in Singapore co-locating with high volume manufacturing to speed up innovation. Micron has several world class SSD products (NAND) which have revolutionized speed feeding into GPU’s for superior AI performance and achieving blazing fast performance for gaming and pro workloads. Micron is one of the most prolific patent applicants in the world with 60,000 patents granted and still growing.

As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND. You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to:

Main Responsibilities:

• As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts.

• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts

• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications

• Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions

• Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes

• Incorporate best known manufacturing methods into early development phase of upcoming nodes

• Design and implement advanced process monitoring and control methodologies

• Provide strategic roadmap for N+, N++ and future NAND Nodes

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures, and equipment

• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers

• This position requires communication and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property Protection policy is necessary

Other Responsibilities:

• Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems

• Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions

• As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings

Artificial Intelligence

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Education/Job requirements:

• Masters /PhD with 5-10 years or Bachelors degree with 7-12 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication

Must Have Technical Skills

• Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads

• Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology

• Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes

Must Have Soft Skills

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Strong collaboration and communication skills (verbal and written).

• Self-driven, adaptable, and able to manage multiple projects.            

• Proven ability to take calculated risks and execute novel solutions.

• Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.

Highly Desirable/Preferred skills or experience

• An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.

• Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.

As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.

Responsibilities and Tasks

Conduct Electrical Characterization

• Understand PFA techniques available for de-processing failures

• Understand assembly and test process

• Perform electrical verification to confirm failures

• Establish best known method for de-processing package

Provide Data Analysis

• Understand backend test flows, qualification methodologies and be able to pull relevant information

Communicate with Internal/External Groups

• Document failure analysis techniques used to isolate failure for other groups

• Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA

• Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs

Provide Technical Expertise

• Conduct TMO training and FA certification

• Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.

• Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.

• Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.

Maintain Equipment

• Coordinate calibrations (external to Micron)

• Procure parts as needed

• Coordinate host vendors to support equipment repair

Manage Laboratory

• Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.

• Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.

• To manage the exhaust and scrubber systems of the FA Lab.

• To maintain records and procedures as per Micron GOPs

Education and Experience

• PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline. 

• 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.

• Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.

• Strong communication skills with the ability to collaborate effectively across internal teams and external partners.

• A mindset that emphasizes customer focus, continuous improvement, and striving for excellence.

Micron Technology Inc. is a Fortune 500 company & employs about 45,000 workers worldwide, with HQ in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HMCs, and other memory-based systems. Micron is expanding and now starting full-fledged NAND research and development in Singapore co-locating with high volume manufacturing to speed up innovation. Micron has several world class SSD products (NAND) which have revolutionized speed feeding into GPU’s for superior AI performance and achieving blazing fast performance for gaming and pro workloads. Micron is one of the most prolific patent applicants in the world with 60,000 patents granted and still growing.

As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND. You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to:

Main Responsibilities:

• As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts.

• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts

• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications

• Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions

• Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes

• Incorporate best known manufacturing methods into early development phase of upcoming nodes

• Design and implement advanced process monitoring and control methodologies

• Provide strategic roadmap for N+, N++ and future NAND Nodes

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures, and equipment

• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers

• This position requires communication and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property Protection policy is necessary

Other Responsibilities:

• Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems

• Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions

• As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings

Artificial Intelligence

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Education/Job requirements:

• Masters /PhD with 5-10 years or Bachelors degree with 7-12 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication

Must Have Technical Skills

• Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads

• Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology

• Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes

Must Have Soft Skills

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Strong collaboration and communication skills (verbal and written).

• Self-driven, adaptable, and able to manage multiple projects.            

• Proven ability to take calculated risks and execute novel solutions.

• Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.

Highly Desirable/Preferred skills or experience

• An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.

• Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.

Responsibilities :

• Support equipment development activities for new or enhanced semiconductor tools and subsystems
• Assist with tool characterization, engineering experiments, and data collection during development or early deployment phases
• Analyze equipment data to support capability assessments, design learning, and risk reduction
• Support documentation of equipment requirements, engineering changes, lessons learned, and development reports
• Participate in tool build, installation, upgrade, and qualification activities from a development perspective
• Collaborate with vendors, manufacturing, process engineering, and facilities teams under engineer supervision
• Prepare technical summaries and presentations for development reviews and project achievements
• Adhere to all safety, environmental, and cleanroom requirements

• Maintain and publish roadmaps to define work/CIP’s required to move toolsets from one EMI level to the next in preparation for transfer to HVM.


Requirements :

• Bachelor’s or Master’s Degree or PhD in Mechanical, Chemical, Electrical/Electronic Engineering

• Understanding of Physical Vapour Deposition (PVD) or Chemical Vapour Deposition (CVD) equipment operation, working principles, fixing, and tool installation procedures

• Exposure to R&D PCVD equipment transfer and the ability to develop/optimize equipment hardware design

• Exposure to PCVD pump/abatement/chiller selection and ability to develop/optimize equipment hardware design is preferred

• Remarkable oral and written communication skills, demonstrating the ability to express messages clearly and effectively on a local and global scale.

• Shown ability to prioritize and handle numerous projects simultaneously, efficiently applying available resources or seeking peers’ and/or management help to drive solutions.
  

  Oversees the installation, modification, upgrade and maintenance of manufacturing equipment. Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. Establishes programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process. Provides technical support to the manufacturing equipment repair and process engineering organizations. Defines and writes preventative maintenan

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.

As a Central Team Alignment Engineer at Micron Technology, Inc., you will be responsible for driving improvements to manufacturing capability, delivering industry benchmark methods at the lowest cost, and managing the execution of global standards across process areas. You will execute to this by focusing on Micron’s 4 pillars, and ensure priorities are aligned to Micron business plan and/or Strategic Objective requirements across manufacturing sites.
Your objective is to leverage global internal and external resources to drive network process and equipment alignment to achieve world-class manufacturing performance. Examples include leveraging suppliers to achieve benchmark manufacturing performance, discovery and implementation of equipment and process best known methods (BKM), equipment utilization optimization, cash cost optimization, and continuous improvement project prioritization and execution globally.

You must be willing and capable of effective collaboration with SITES, Procurement, Global Quality and other OCT departments, and external suppliers to accomplish your objectives. You must also be willing and capable of international travel, as needed, to accomplish your objectives.

• Tool Utilization improvement to meet BIC standards

• Execute a process to eliminate low utilization tools in Micron to hit BIC standards.

• This process must enable the cold/warm shutdown of tools, when not in need, to generate OPEX & CAPEX savings calculated through a cost model.

• Generate globally aligned warm shutdown procedures with no impact to safety & subsequent recovery to production.

• To quantify potential spare parts & manhour savings from PM count reduction. 

• Tool POR-MOR gaps on major volume will need to be closed, aligned across the network & PDM updated.

Standardization of practices & BKMs in Process Areas

• Setup global area alignment teams to address chronic issues, drive improvements & eliminate wastes.

• Channel improvements and lessons learnt established from various forums, eg. TPM Forum, Excursion Review, etc.  into global area forums to decide on the standards for deployment, implementation and audit.

• Design suitable matrices for each process area so that improvements impact the 4 pillars.

• Create a library of area level BKMs for Equipment & Process Engineers to search for standards involving the setup of Equipment & associated processes.

• This library must also serve the purpose to feed-forward area level BKMs to TD for process development & HVM for improvement work that will impact the 4 pillars. 

PM SOP Standardization

• Align the PM Procedures across the Micron network for shared workstations.

• Integrate procedures into a system that allows Engineers & Technicians to access procedures, key recordables & measure PM Success from a tablet/notebook.

• Tie matrices to measure the effectiveness of globally aligned PM procedures.

• Put in place change management for changes to existing procedures & new PM procedures.

• Prepare the work force to move up the value chain from performing PM/CM work to achieving tool to tool matching, improving the capabilities of tools & executing tool/lot dispositions in a standardized method.

SEAL System BKM deployment & sustainment  

• Implement system level BKMs in process areas globally.

• Ensure the fan out of SEAL system BKMs of high criticality and value that impact process areas through the site Task Force Teams (TFT) and local MA Engineers.

• Put in place a process to enable the speed and flexibility to transfer area level BKMs when they are ready.

• Perform one-time standardization audit as last step of TFT implementation and monitor, sustain, and control the system BKMs that impact unit process areas for the duration of one year. 

Demonstrate Leadership

• Active coaching and leadership of projects. Ensure activities are well coordinated and productive.

• Provide support and guidance for BKM implementation in your area(s) of responsibility.

• Create strong morale and team spirit, shares wins and successes, foster open dialog, acknowledges team dynamics, builds on positive relationships and addresses negative ones.

• Work with the Fab groups and the Central Team to maintain alignment in your area(s) of responsibility.

Communication 

• Attend area DAM meetings and update on daily plans for alignment activity to ensure coordination with daily operation priorities

• Attend weekly Area Risk Assessment Control Board Meetings to provide input on change points and assess for opportunity for worldwide sharing

• Report monthly to Area on status and progress for all alignment activity

• Regularly maintain alignment on alignment activity direction with MCT Alignment Manager and Site Area manager

• Maintain a strong and open relationship within your functional area and appropriate team members in other functional areas such as Process Integration Engineering, Quality Systems, Production Operations Management, and Purchasing.

• Promote worldwide sharing and transfer of area-specific domain knowledge.

• Communicate and respond to issues in a timely manner, with a cadence appropriate to the priority of the issue.

• Keep stakeholders and team members informed of project status, progress, and roadblocks/opportunities.

Training and Development 

• Keep up to date on current Fab manufacturing processing for both R and D and manufacturing.

• Stay current with business practices at each site in your area(s) of responsibility.

• Hold self and others accountable for meeting goals and action items from projects, meetings and conversations.

• Set personal development and performance goals that are clear, measurable and in line with department and corporate goals.

• Utilize coaches/mentors to develop skills needed to take next steps in your career progression.

• Organize and utilize time and resources effectively.

• Constantly evaluate self, approach and goals.

• Demonstrate a commitment to quality in work.

• Complete assignments in an accurate, thorough and timely manner.

• Display self-motivation/initiative to complete work, training, or projects.

Safety 

• Maintain knowledge of equipment and area materials safety concerns in area of focus

Education:

• Bachelor's Degree- Engineering or related field of study

Experience

• 5 years experience in Fab (desirable)

• In depth knowledge of Process and Equipment perspective. Area content knowledge with experience of area methods, systems, tools. Experience across multiple areas is a plus. 

• Preferred experience with Micron SEAL standardization process and implementation of new systems within the process area

• Good English skills and the ability to lead and coordinate area teams within their site desired  

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.

As a Central Team Alignment Engineer at Micron Technology, Inc., you will be responsible for driving improvements to manufacturing capability, delivering industry benchmark methods at the lowest cost, and managing the execution of global standards across process areas. You will execute to this by focusing on Micron’s 4 pillars, and ensure priorities are aligned to Micron business plan and/or Strategic Objective requirements across manufacturing sites.
Your objective is to leverage global internal and external resources to drive network process and equipment alignment to achieve world-class manufacturing performance. Examples include leveraging suppliers to achieve benchmark manufacturing performance, discovery and implementation of equipment and process best known methods (BKM), equipment utilization optimization, cash cost optimization, and continuous improvement project prioritization and execution globally.

You must be willing and capable of effective collaboration with SITES, Procurement, Global Quality and other OCT departments, and external suppliers to accomplish your objectives. You must also be willing and capable of international travel, as needed, to accomplish your objectives.

• Tool Utilization improvement to meet BIC standards

• Execute a process to eliminate low utilization tools in Micron to hit BIC standards.

• This process must enable the cold/warm shutdown of tools, when not in need, to generate OPEX & CAPEX savings calculated through a cost model.

• Generate globally aligned warm shutdown procedures with no impact to safety & subsequent recovery to production.

• To quantify potential spare parts & manhour savings from PM count reduction. 

• Tool POR-MOR gaps on major volume will need to be closed, aligned across the network & PDM updated.

Standardization of practices & BKMs in Process Areas

• Setup global area alignment teams to address chronic issues, drive improvements & eliminate wastes.

• Channel improvements and lessons learnt established from various forums, eg. TPM Forum, Excursion Review, etc.  into global area forums to decide on the standards for deployment, implementation and audit.

• Design suitable matrices for each process area so that improvements impact the 4 pillars.

• Create a library of area level BKMs for Equipment & Process Engineers to search for standards involving the setup of Equipment & associated processes.

• This library must also serve the purpose to feed-forward area level BKMs to TD for process development & HVM for improvement work that will impact the 4 pillars. 

PM SOP Standardization

• Align the PM Procedures across the Micron network for shared workstations.

• Integrate procedures into a system that allows Engineers & Technicians to access procedures, key recordables & measure PM Success from a tablet/notebook.

• Tie matrices to measure the effectiveness of globally aligned PM procedures.

• Put in place change management for changes to existing procedures & new PM procedures.

• Prepare the work force to move up the value chain from performing PM/CM work to achieving tool to tool matching, improving the capabilities of tools & executing tool/lot dispositions in a standardized method.

SEAL System BKM deployment & sustainment  

• Implement system level BKMs in process areas globally.

• Ensure the fan out of SEAL system BKMs of high criticality and value that impact process areas through the site Task Force Teams (TFT) and local MA Engineers.

• Put in place a process to enable the speed and flexibility to transfer area level BKMs when they are ready.

• Perform one-time standardization audit as last step of TFT implementation and monitor, sustain, and control the system BKMs that impact unit process areas for the duration of one year. 

Demonstrate Leadership

• Active coaching and leadership of projects. Ensure activities are well coordinated and productive.

• Provide support and guidance for BKM implementation in your area(s) of responsibility.

• Create strong morale and team spirit, shares wins and successes, foster open dialog, acknowledges team dynamics, builds on positive relationships and addresses negative ones.

• Work with the Fab groups and the Central Team to maintain alignment in your area(s) of responsibility.

Communication 

• Attend area DAM meetings and update on daily plans for alignment activity to ensure coordination with daily operation priorities

• Attend weekly Area Risk Assessment Control Board Meetings to provide input on change points and assess for opportunity for worldwide sharing

• Report monthly to Area on status and progress for all alignment activity

• Regularly maintain alignment on alignment activity direction with MCT Alignment Manager and Site Area manager

• Maintain a strong and open relationship within your functional area and appropriate team members in other functional areas such as Process Integration Engineering, Quality Systems, Production Operations Management, and Purchasing.

• Promote worldwide sharing and transfer of area-specific domain knowledge.

• Communicate and respond to issues in a timely manner, with a cadence appropriate to the priority of the issue.

• Keep stakeholders and team members informed of project status, progress, and roadblocks/opportunities.

Training and Development 

• Keep up to date on current Fab manufacturing processing for both R and D and manufacturing.

• Stay current with business practices at each site in your area(s) of responsibility.

• Hold self and others accountable for meeting goals and action items from projects, meetings and conversations.

• Set personal development and performance goals that are clear, measurable and in line with department and corporate goals.

• Utilize coaches/mentors to develop skills needed to take next steps in your career progression.

• Organize and utilize time and resources effectively.

• Constantly evaluate self, approach and goals.

• Demonstrate a commitment to quality in work.

• Complete assignments in an accurate, thorough and timely manner.

• Display self-motivation/initiative to complete work, training, or projects.

Safety 

• Maintain knowledge of equipment and area materials safety concerns in area of focus

Education:

• Bachelor's Degree- Engineering or related field of study

Experience

• 5 years experience in Fab (desirable)

• In depth knowledge of Process and Equipment perspective. Area content knowledge with experience of area methods, systems, tools. Experience across multiple areas is a plus. 

• Preferred experience with Micron SEAL standardization process and implementation of new systems within the process area

• Good English skills and the ability to lead and coordinate area teams within their site desired 

As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) High Bandwidth Memory (HBM) Returned Material Authorization (RMA) Engineer at Micron Technology, Inc., you will be responsible for overseeing and tracking the formal Failure Analysis (FA) of customer-returned product. You will summarize analysis at the electrical and physical level, identify root cause, and establish associated containment plan. In this role, you will work with various engineering and manufacturing groups to evaluate and implement corrective actions (CAs) for the identified issues. You will also be required to regularly communicate FA results to customers as well as other Micron engineering and manufacturing teams. Additionally, you will need to sustain knowledge of device capabilities and characteristics along with a basic understanding of the associated manufacturing processes.

The DEMQRA RMA Engineer must demonstrate the ability to handle multiple customers and deal with multiple issues at one time, while providing detailed and timely follow-up between all applicable internal organizations at Micron.

You will:

Manage FA of Customer Concerns

• Understand the customer complaint as it relates to the DRAM component or module

• When not already provided, initiate contact with customer or customer representative to identify specific failing conditions

• Oversee and direct initial bench level, system level, and ATE level analysis and interpret results

• Coordinate detailed component level analysis (electrical (EFA) and physical (PFA)) and interpret results

Manage Communication of Results with Manufacturing and Engineering Teams

• Review feedback/Corrective Action (CA) from various manufacturing areas

• Ask follow-up questions as necessary to provide an adequate customer response

• Translate results to a customer friendly format

• Analyze data from various sources for trends and variations

• Communicate the needed process improvements

Provide FA Reports to External Customers

• Summarize the RMA background and FA results

• Identify the root cause and potential improvements for use in reports

• Identify and provide containment information and associated risk assessment

• Generate both interim and final FA reports for customer consumption

• Provide customer support for ongoing questions/concerns related to the FA report

Maintain Knowledge of Device Capabilities and Characteristics

•             Understand the latest process technology

•             Recognize differences from previous technology nodes with the associated risks

•             Understand the datasheet specifications for each device

•             Stay up-to-date on common customer DRAM applications

•             Partner with field support teams to understand ongoing customer status

Education:

• Required: Bachelor’s degree in Electrical / Electronics/ Computer Engineering

• Desired: Master’s Degree in Electrical / Electronics/ Computer Engineering

Required Qualifications:

• 5+ years of experience in semiconductor field

• Knowledge of DRAM operation, fabrication process and semiconductor device physics

• Advanced understanding of electronic circuit.

• Basic understanding of DRAM/motherboard/CPU architecture and operation.

• Familiarity with failure analysis, troubleshooting/debugging, advanced packaging, wafer testing, component testing and module testing concept and flow.

• Good written and oral communication skills

• Self-confidence in speaking and chairing a meeting.

• Experienced in computer, laptop or server OEM and focus on system level debug or CPU or DRAM or SYSTEM FAE is a plus.

As a Global Quality (GQ) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer on the DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA) at Micron Technology, Inc., you will be responsible for the electrical characterization and electrical failure analysis (EFA) of all HBM products. You will need to distinguish whether it is package or device related failures. Preferably, you are equipped with knowledge of DRAM functionality, process, test program and device necessary for making solid judgment. You will also use a variety of test tools including the uMate tester, Merlin, Mongoose SM3, Prober, CAD layout tool, and a variety of technical drawings and schematics to perform detailed characterization on HBM products. You will record and categorize failures in order to determine failure mechanisms and characteristics. In this role, you will communicate with various engineering groups, assist lab users with equipment setup and interpretation of data, and maintain critical EFA knowledge database. You will also be expected to seek ways to improve the EFA process in order to reduce test time, increase throughput, and increase failure mechanism assignment accuracy and consistency.

You will:

Analyze Failed Components from Reliability Testing

• Interpret historical tests results

• Adjust timing/level/testmode/code/temp to find out the sensitivities of failures for array fails

• Perform visual inspection to identify physical defects

• Utilize schematics/layouts/process to recognize abnormalities

• Document failed conditions and test results

• Categorize electrical failures

• Communicate results

• Coordinate next level analysis to various groups including PYE (Product Yield Enhancement) for CSAM (C-mode scanning acoustic microscope)/functional open (FO)/PFA (Physical Failure Analysis), Product Engineering and Package Reliability.

• Identify and communicate new or unusual results (electrical signals)

Respond to Equipment Issues

• Understand test software and hardware configurations

• Troubleshoot hardware issues

• Identify and report software and hardware issues

• Repair or coordinate repair of equipment

• Configure and upgrade test equipment

• Develop and deploy failure analysis (FA) software

Provide Technical Support and Conduct Training

• Assist lab users with equipment setup

• Teach operation of equipment

• Conduct on-the-job training (OJT) for new hires and transfers

• Provide data interpretation

• Suggest failure root cause

• Provide suggestions for further analysis

• Introduce new users to basic DRAM functionality/process/device

Perform Engineering Requests and Supplemental Tasks

• Submit package level physical failure analysis (PFA)

• Provide FA for other groups as requested (RMA, Module)

• Determine engineering test requirements

• Execute request and experiments

• Summarize test results and provide feedback

• Create repair converters

Manage Failure Analysis (FA) Information

• Create and maintain specific FA database

• Track FA data

• Identify false failures

• Analyze and summarize data

Perform Quality/Reliability request and review

• Perform review on test time reduction requests

• Perform review on Design/Marketing datasheet requests

• Perform review on Modify Qual requests

• Perform review on Material Review Board (MRB)

• Perform review on Process of Record Review Board (PORRB)

• Perform review on customer reports/data

Education:

• Required: Bachelor’s degree in Electrical / Electronics/ Computer Engineering

• Desired: Master’s Degree in Electrical / Electronics/ Computer Engineering

Required Qualifications:

• 5+ years of experience in semiconductor field

• Knowledge of DRAM operation, fabrication process and semiconductor device physics

• Familiarity with failure analysis, troubleshooting/debugging, advanced packaging, wafer testing, component testing and module testing concept and flow.

• Strong troubleshooting skill

• Good organizational skills and sharp attention to detail

• Good written and oral communication skills

• Efficient computer skills

• Knowledge of the DRAM fabrication process/test program/functionality

• Familiarity with Unix, DFII/Cadence, and/or uMate preferred

• Ability to work independently or in a group environment

• Basic understanding of electrical equipment

• Ability to use the analytical tools provided on the various test equipment, such as uMate, Curve Tracer, or Oscilloscope

Job Description:

As a QEM PQE Electrical Failure Analysis (EFA) Engineer, you will be responsible for driving deep technical understanding and resolution of yield, quality, and reliability challenges for advanced NAND memory products manufactured in Fab10.

You will support both new product introduction (NPI) and high-volume manufacturing (HVM) by performing die-level electrical analysis, failure mode construction, and innovative characterization to enable robust product qualification and continuous yield improvement. Leveraging strong knowledge in device physics, probe testing, and wafer fabrication processes, you will identify root causes of electrical failures and translate insights into actionable test, process, and design improvements to enhance product performance and outgoing quality.

Job Responsibility:

• Perform electrical failure analysis (EFA) using bench characterization to identify failure mechanisms at die, circuit, and transistor levels

• Construct failure models and root cause understanding for yield excursion, reliability issues, and customer return cases

• Design and execute bench DOE and probe engineering experiments to validate hypotheses and drive yield/quality improvement

• Translate characterization results into test, process, or device optimization solutions to improve yield, reliability, and product quality

• Conduct circuit and layout tracing analysis to correlate electrical failure signatures to physical/process limitations

• Support NPI qualification and HVM issue resolution, ensuring timely product release and manufacturing stability

• Drive data-driven yield improvement programs through close collaboration with cross-functional teams (PI, TD, PE, TSE, YE)

• Troubleshoot complex issues across test conditions, probe limitations, and device design interactions

• Develop custom test conditions, scripts, and methodologies for advanced failure validation and experiment execution

• Contribute to process capability improvement and cost reduction initiatives by resolving abnormal manufacturing behaviors

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.​

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

  Requirements:

• Bachelor’s / Master’s Degree in Electronics/Microelectronics/Material Science/Physics/Applied Science

• Excellent problem-solving and analytical skills.

• Proven ability to communicate effectively both written and verbal to all level.

• Proven ability in multi-tasking complex projects and driving them to completion.

• Strong teamwork skills and the ability to build strong peer relationships

• Knowledge of Circuit analysis and layout tracing, Yield analysis and failure mechanisms

• Strong understanding of NAND memory operation and architecture, CMOS device physics and wafer fabrication processes

• Hands-on experience in Electrical failure analysis, bench characterization, Probe testing and test flow understanding, Data analysis and DOE methodology

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

• Embody Micron’s core values:
  People – Respect, develop, and empower others
  Innovation – Drive continuous improvement and breakthrough thinking
  Tenacity – Show grit and determination
  Collaboration – Build trust and foster teamwork
  Customer Focus – Deliver excellence and value

Key Responsibilities

• Define and implement NAND Flash reliability test flows to assess product reliability performance and prevent extrinsic/intrinsic reliability escapes.

• Perform high‑volume statistical data analysis to evaluate NAND DPM/ intrinsic reliability risks and trends.

• Drive electrical failure analysis, including  advance characterization, to identify root causes and solution spaces.

• Develop short‑term countermeasures such as targeted stresses and screens, applying knowledge of digital/analog circuits, device physics, and process engineering.

• Qualify the product with innovative control measures to provide best in Class DPM and Cell reliability.

• Collaborate closely with Fab, NAND Technology, NAND Design, Product Development, System Development, and Quality/Reliability teams to develop solutions and enable shipment of high‑quality end products.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and aligning with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

• Support customer inquiries and provide technical insights related to product reliability.

• Drive critical initiatives to enhance the overall reliability program and influence the direction of future product development.
  

  Qualifications And Skills:

  • Bachelor’s degree  or Master’s degree  with of relevant experience in Electrical Engineering or related field

  • Knowledge in Semiconductor Reliability, NAND Technology, and Electrical Failure Analysis.

  • Understanding in Design, Device Physics, Circuits,  Process.

  • Strong statistical analysis, communication, and problem‑solving skills.

  • Experience with application of AI tools, LLMs ,  data analysis tools (e.g., Python, JMP, Tableau).

  • Strong analytical and problem‑solving skills.

  • Team player and self driver.

Technical Expertise: Experience with defect monitoring equipment and recipe management.

Analytical Skills: Strong data analysis and problem-solving abilities.

Equipment Management: Set up equipment, monitor stability, improve capability, and interact with vendor representatives for advanced functionality and application work.

Recipe Management: Write or modify equipment recipes to support the needs of the RDA area.

Tool Recovery: Perform basic and advanced recoveries of down tools for assigned workstations.

Software Upgrades: Drive software upgrades and improvements, working with internal and external vendors for implementation.

Tool Monitoring: Monitor tool qualification SPC charts for deviations, initiate tool repairs, and adjust limits as necessary.

Data Science skills: Apply scripting, coding, or programming for monitoring performance and capabilities of the inspection data

Data Analysis: Collect and analyze tool/process data to suggest ways to improve performance and efficiency.

Collaboration: Collaborate with vendors for escalation results on application issues and with Equipment Owners to identify long-term solutions to tool issues.

Communication: Excellent verbal and written communication skills for effective vendor and team interactions.

Project Management: Ability to manage multiple projects and priorities effectively.

Job Requirements:

Application Expertise: EBEAM Inspection for BSE, eScan, Hot Spot inspection technologies preferred; or RDA Optical inspection such as Brightfield or Grayfield or Darkfield .

Training and Mentoring: Proven experience in training and mentoring engineers and technicians.

Vendor Relations: Experience working with vendors for equipment setup, troubleshooting, and upgrades >3years.

Experience: 6+ years of semiconductor experience working with Ebeam inspection

Education: Master’s or PHD Degree in Electrical Engineering, Materials Science & Engineering, Chemical Engineering, Micro Electronics or Physics field are preferred