Total 192 process engineer job vacancies in Education / Training category in The Philippines

About the Role

An exciting opportunity has arisen to join our Cloud Infrastructure Platform and Solutions (CIPS) Research Team. Our CIPS Research team is focussed on developing future technology systems to support growth in the rapidly evolving data center sector. The successful candidate will be directly involved in early-stage research projects, working with academic institutions, suppliers, customers, and partners to deliver proof of concept designs.

Key Responsibilities:

• Fundamental Research – Complete literature reviews and studies to explore existing and future data center cooling system technologies.
• Ideation – Identify problems, future needs or market gaps to establish areas of interest.
• Project Definition – Produce clear target requirements that the solution must meet.
• Concept Proposal – Generate multiple potential design concepts and choose the best solution based on the defined requirements and feasibility analysis.
• Proof of Concept – Create detailed designs, complete simulations and build test setups to demonstrate the technical feasibility of the proposed system.
• Documentation – Write research reports, design guides, patents and performance reports.

Requirements:

• PhD or Master’s degree in Mechanical / Electromechanical Engineering or related field.
• Strong understanding of thermal management, fluid dynamics and electromechanical fundamentals and common technologies.
• Experience with mechanical drawings, prototyping and supplier assessment.
• Knowledge of heat exchangers, fluid dynamics, liquid cooling systems and material science.
• Hands-on prototyping and testing experience with pumps, motors, valves, manifolds, and sensors.
• Familiarity with manufacturing processes and design constraints.
• Expertise in using simulation tools to aid the development and assessment of the proposed solution (ANSYS, COMSOL, OpenFOAM, etc).
• Strong analytical, problem-solving, and communication skills.
• Demonstrated passion for innovation and commitment to continuous learning.
• We welcome applicants at all experience levels, from graduates to seasoned professionals.

Why Join Us

• Work in a world-class R&D environment with well-equipped labs, top-tier industry connections and collaborative teams.
• Shape the future of energy-efficient data storage and AI cloud computing – from renewable energy integration to next generation infrastructure.
• Opportunities to publish, patent and innovate designs for future products.
• Competitive compensation, research autonomy and a continuous learning culture.

About the Role

An exciting opportunity has arisen to join our Cloud Infrastructure Platform and Solutions (CIPS) Research Team. Our CIPS Research team is focussed on developing future technology systems to support growth in the rapidly evolving data center sector. The successful candidate will be directly involved in early-stage research projects, working with academic institutions, suppliers, customers, and partners to deliver proof of concept designs.

Key Responsibilities:

• Fundamental Research – Complete literature reviews and studies to explore existing and future data center cooling system technologies.
• Ideation – Identify problems, future needs or market gaps to establish areas of interest.
• Project Definition – Produce clear target requirements that the solution must meet.
• Concept Proposal – Generate multiple potential design concepts and choose the best solution based on the defined requirements and feasibility analysis.
• Proof of Concept – Create detailed designs, complete simulations and build test setups to demonstrate the technical feasibility of the proposed system.
• Documentation – Write research reports, design guides, patents and performance reports.

Requirements:

• PhD or Master’s degree in Mechanical / Electromechanical Engineering or related field.
• Strong understanding of thermal management, fluid dynamics and electromechanical fundamentals and common technologies.
• Experience with mechanical drawings, prototyping and supplier assessment.
• Knowledge of heat exchangers, fluid dynamics, liquid cooling systems and material science.
• Hands-on prototyping and testing experience with pumps, motors, valves, manifolds, and sensors.
• Familiarity with manufacturing processes and design constraints.
• Expertise in using simulation tools to aid the development and assessment of the proposed solution (ANSYS, COMSOL, OpenFOAM, etc).
• Strong analytical, problem-solving, and communication skills.
• Demonstrated passion for innovation and commitment to continuous learning.
• We welcome applicants at all experience levels, from graduates to seasoned professionals.

Why Join Us

• Work in a world-class R&D environment with well-equipped labs, top-tier industry connections and collaborative teams.
• Shape the future of energy-efficient data storage and AI cloud computing – from renewable energy integration to next generation infrastructure.
• Opportunities to publish, patent and innovate designs for future products.
• Competitive compensation, research autonomy and a continuous learning culture.

About the Role:

An exciting opportunity has arisen to join our Cloud Infrastructure Platform and Solutions (CIPS) Research Team. Our CIPS Research team is focussed on developing future technology systems to support growth in the rapidly evolving data center industry. The successful candidate will be directly involved in early-stage research projects, working with academic institutions, suppliers, customers, and partners to deliver proof of concept designs.

Key Responsibilities:

• Monitor market trends and research to identify breakthrough opportunities in power architectures and converter topologies for data centers.
• Drive technical excellence across design, modelling, simulation, prototyping and performance testing of new power conversion topologies, control schemes and components.
• Oversee critical design reviews and own technical project direction.
• Represent the company as a subject matter expert when engaging with suppliers, customers, and partners.
• Help to create, review and improve research project processes, from idea creation to project transfer deliverables.
• Identify the skills needed in the team and support recruitment of suitable engineers.
• Work with a commitment to continuous improvement, transparency, and technical expertise.
• Work as a hands-on individual contributor, researching key topics and delivering ideas, designs, and documentation.

Requirements:

• PhD or Master’s degree in Electrical / Electronic Engineering or related field.
• 5+ years’ experience in power electronics research, with increasing mentorship responsibilities.
• Expertise in power electronics, including common topologies, magnetics, control schemes and components.
• Experience with architecture drawings, electronic schematics, component datasheets and PCB layout drawings.
• Knowledge of embedded software (C/C++) and coding practices is preferred.
• Hands-on prototyping and testing experience using oscilloscopes, electronic loads and power analysers.
• Familiarity with SiC/GaN devices, EMI, HVDC, solid state transformers, thermal design and regulatory standards.
• Expertise in using simulation tools (MATLAB, Simulink, LTspice, Python, etc).
• Strong analytical, problem-solving, leadership and communication skills.
• Demonstrated passion for innovation and commitment to continuous learning.

Why Join Us:

• Work in a world-class R&D environment with well-equipped labs, top-tier industry connections and collaborative teams.
• Shape the future of energy-efficient data storage and AI cloud computing – from renewable energy integration to next generation infrastructure.
• Opportunities to publish, patent and innovate designs for future products.
• Competitive compensation, research autonomy and a continuous learning culture.

About the Role

An exciting opportunity has arisen to join our Cloud Infrastructure Platform and Solutions (CIPS) Research Team. Our CIPS Research team is focussed on developing future technology systems to support growth in the rapidly evolving data center sector. The successful candidate will be directly involved in early-stage research projects, working with academic institutions, suppliers, customers, and partners to deliver proof of concept designs.

Key Responsibilities:

• Fundamental Research – Complete literature reviews and studies to explore existing and future data center cooling system technologies.
• Ideation – Identify problems, future needs or market gaps to establish areas of interest.
• Project Definition – Produce clear target requirements that the solution must meet.
• Concept Proposal – Generate multiple potential design concepts and choose the best solution based on the defined requirements and feasibility analysis.
• Proof of Concept – Create detailed designs, complete simulations and build test setups to demonstrate the technical feasibility of the proposed system.
• Documentation – Write research reports, design guides, patents and performance reports.

Requirements:

• PhD or Master’s degree in Mechanical / Electromechanical Engineering or related field.
• Strong understanding of thermal management, fluid dynamics and electromechanical fundamentals and common technologies.
• Experience with mechanical drawings, prototyping and supplier assessment.
• Knowledge of heat exchangers, fluid dynamics, liquid cooling systems and material science.
• Hands-on prototyping and testing experience with pumps, motors, valves, manifolds, and sensors.
• Familiarity with manufacturing processes and design constraints.
• Expertise in using simulation tools to aid the development and assessment of the proposed solution (ANSYS, COMSOL, OpenFOAM, etc).
• Strong analytical, problem-solving, and communication skills.
• Demonstrated passion for innovation and commitment to continuous learning.
• We welcome applicants at all experience levels, from graduates to seasoned professionals.

Why Join Us

• Work in a world-class R&D environment with well-equipped labs, top-tier industry connections and collaborative teams.
• Shape the future of energy-efficient data storage and AI cloud computing – from renewable energy integration to next generation infrastructure.
• Opportunities to publish, patent and innovate designs for future products.
• Competitive compensation, research autonomy and a continuous learning culture.

About the Role:

An exciting opportunity has arisen to join our Cloud Infrastructure Platform and Solutions (CIPS) Research Team. Our CIPS Research team is focussed on developing future technology systems to support growth in the rapidly evolving data center industry. The successful candidate will be directly involved in early-stage research projects, working with academic institutions, suppliers, customers, and partners to deliver proof of concept designs.

Key Responsibilities:

• Monitor market trends and research to identify breakthrough opportunities in power architectures and converter topologies for data centers.
• Drive technical excellence across design, modelling, simulation, prototyping and performance testing of new power conversion topologies, control schemes and components.
• Oversee critical design reviews and own technical project direction.
• Represent the company as a subject matter expert when engaging with suppliers, customers, and partners.
• Help to create, review and improve research project processes, from idea creation to project transfer deliverables.
• Identify the skills needed in the team and support recruitment of suitable engineers.
• Work with a commitment to continuous improvement, transparency, and technical expertise.
• Work as a hands-on individual contributor, researching key topics and delivering ideas, designs, and documentation.

Requirements:

• PhD or Master’s degree in Electrical / Electronic Engineering or related field.
• 8+ years’ experience in power electronics research, with increasing mentorship responsibilities.
• Expertise in power electronics, including common topologies, magnetics, control schemes and components.
• Experience with architecture drawings, electronic schematics, component datasheets and PCB layout drawings.
• Knowledge of embedded software (C/C++) and coding practices is preferred.
• Hands-on prototyping and testing experience using oscilloscopes, electronic loads and power analysers.
• Familiarity with SiC/GaN devices, EMI, HVDC, solid state transformers, thermal design and regulatory standards.
• Expertise in using simulation tools (MATLAB, Simulink, LTspice, Python, etc).
• Strong analytical, problem-solving, leadership and communication skills.
• Demonstrated passion for innovation and commitment to continuous learning.

Why Join Us:

• Work in a world-class R&D environment with well-equipped labs, top-tier industry connections and collaborative teams.
• Shape the future of energy-efficient data storage and AI cloud computing – from renewable energy integration to next generation infrastructure.
• Opportunities to publish, patent and innovate designs for future products.
• Competitive compensation, research autonomy and a continuous learning culture.

About the Role:

An exciting opportunity has arisen to join our Cloud Infrastructure Platform and Solutions (CIPS) Research Team. Our CIPS Research team is focussed on developing future technology systems to support growth in the rapidly evolving data center sector. The successful candidate will be directly involved in early-stage research projects, working with academic institutions, suppliers, customers, and partners to deliver proof of concept designs.

Key Responsibilities:

• Fundamental Research – Complete literature reviews and studies to explore existing and future hardware topologies, components and control methods.
• Ideation – Identify problems, future needs or market gaps to establish areas of interest.
• Project Definition – Produce clear target requirements that the solution must meet.
• Concept Proposal – Generate multiple potential design concepts and choose the best solution based on the defined requirements and feasibility analysis.
• Proof of Concept – Create detailed designs, complete simulations and build test setups to demonstrate the technical feasibility of the proposed system.
• Documentation – Write research reports, design guides, patents and performance reports.

Requirements:

• PhD or Master’s degree in Electrical / Electronics Engineering or related field.
• Strong understanding of electronics hardware design and common power electronic architectures (AC/DC, DC/AC, DC/DC, etc).
• Experience with architecture drawings, electronic schematics, component datasheets and PCB layout drawings.
• Knowledge of embedded software (C/C++) and coding practices is preferred.
• Hands-on prototyping and testing experience using oscilloscopes, electronic loads and power analysers.
• Familiarity with SiC/GaN devices, magnetics design, EMI, and thermal management.
• Expertise in using simulation tools to aid the development and assessment of the proposed solution (MATLAB, Python, Simulink, LTspice, etc.)
• Strong analytical, problem-solving, and communication skills.
• Demonstrated passion for innovation and commitment to continuous learning.
• We welcome applicants at all experience levels, from recent graduates to seasoned professionals.

Why Join Us:

• Work in a world-class R&D environment with well-equipped labs, top-tier industry connections and collaborative teams.
• Shape the future of energy-efficient data storage and AI cloud computing – from renewable energy integration to next generation infrastructure.
• Opportunities to publish, patent and innovate designs for future products.
• Competitive compensation, research autonomy and a continuous learning culture.

COMPANY DESCRIPTION

Singapore Management University is a place where high-level professionalism blends together with a healthy informality. The 'family-like' atmosphere among the SMU community fosters a culture where employees work, plan, organise and play together - building a strong collegiality and morale within the university.

Our commitment to attract and retain talent is ongoing. We offer attractive benefits and welfare, competitive compensation packages, and generous professional development opportunities - all to meet the work-life needs of our staff. No wonder, then, that SMU continues to be given numerous awards and recognition for its human resource excellence.

RESPONSIBILITIES

The candidate will be responsible for conducting research on robust evaluation of AI=generated code. Successful candidate will be part of an active research team led by Prof WYNTER from School of Computing and Information Systems (SCIS), Singapore Management University (SMU).

• Research into new methods.
• Preparation and carrying out experimental tests.
• Writing research papers of a quality suitable for publication in top venues.
• Other duties as assigned.

• Minimum Master's with preference a PhD degree in Computer Science, Information Technology, Information Systems or closely related disciplines from a reputable institution of higher learning; with particular focus on Gen AI.
• Minimum 2 years of relevant research experience Gen AI including writing and publishing papers.
• Proficiency in programming software/languages such as python will be positively considered/ is required.
• Proven track record and professional experience in publishing research papers.
• Ability to break down complex problems and design effective solutions.
• Innovating new approaches and thinking outside the box.
• Applicants with research publications in Gen AI and classic AI area will be advantageous.
• Ability to work cooperatively as part of a small, agile academic research team is essential.
• Self-motivated individual who can work independently and collaboratively with team members.

#LI-JN2

The Centre for Advanced Technologies in Online Safety (CATOS; https://www.catos.sg) was established in 2023 to host Singapore's Online Trust and Safety (OTS) Programme, a national research programme that leads the advancement of whole-of-nation technology capabilities to monitor and tackle online harms. The Systems Engineering Pillar of CATOS focuses on translational research and development, including evaluating, testing and integrating research output into needle-moving applications. One of the major outcomes will be a technological platform with an integrated suite of deep tech OTS engines, which analyses various internet sites and platforms for fast-trending harmful online content, such as non-factual claims, deepfakes, and hateful and toxic content. Different combinations of OTS engines can then be integrated and adapted to address the specific requirements of various stakeholders.

This role will be responsible for translating research outcomes (e.g., CATOS technologies and OTS engines) into meaningful applications to address the specific needs of various user groups, including public and private agencies, as well as the general public.

The candidate will assume the following roles and responsibilities:

• Explore and apply (Multi-Modal) Large Language Models and emerging AI technologies to solve practical problems.
• Code, develop, and test back-end components that integrate AI capabilities into end-user applications.
• Work with software developers to enhance core platforms and solutions.
• Develop documentation for the implemented solution.
• Follow Agile project management framework.
• Work and communicate well with other team members.
• Stay updated with advancements in AI to evaluate and apply relevant technologies for new challenges.

JOB REQUIREMENT:

• A Bachelor / Master degree in Computer Science / Information Technology / Computer Engineering / Information Systems / Data Engineering / Computational Social Science or equivalent.
• At least 5 years of relevant work experience.
• Demonstrable experience in using machine learning / deep learning frameworks and models.
• Experience in using (Multi-Modal) Large Language Models is valued.
• Demonstrable and relevant commercial and/or enterprise software project management experience and skills.
• Programming skills in Python are essential.
• Experience with the Linux platform is essential.
• Experience with web servers (e.g., Apache), browser-based applications, and databases such as MySQL.
• Able to create complex and interactive UI using HTML5, CSS3, and JavaScript that function across multiple platforms and environments.
• Experience with web libraries and frameworks such as Flutter, ReactJS, Bootstrap, Jquery, and CSS pre-processing frameworks like Sass or Less.
• Solid understanding of HTTP protocols, AJAX, and RESTful services.
• Solid understanding of networking concepts, including TCP/IP and HTTP protocols.
• Hands-on experience with cloud environments, preferably Digital Ocean, AWS, Azure, or GCP.
• Good knowledge on CI/CD pipelines. (e.g. Bitbucket, GitLab)
• Proactive team player with strong communication skills.
• Strong understanding and experience with Agile methodologies and processes.
• Good communication and interpersonal skills for working in a multicultural work environment.
• Strong understanding of algorithms. (i.e., The Art of Programming by Donald Knuth)
• Proficient in clean coding principles. (i.e., Clean Code by Robert Martin)

If you have accomplished any of the following, please include them in your cover letter:

1. You have won a programming competition.
2. You have independently built a software project. (any programming language)
3. You enjoy solving challenging programming problems. Please describe one problem you've solved. (max 1 page)
4. You have been trained under Agile Software Development framework.

Our research and engineering work is highly interdisciplinary, agile, and pragmatic. The candidate will collaborate closely with a team that embraces agile software development.

• We expect everyone to take ownership of their role, responsibilities, and tasks.
• We encourage everyone to speak up when they have feedback or ideas for improvement.
• We provide honest feedback to one another, which can be tough at times, but it fosters rapid learning.
• We care about each other's professional growth and well-being.

When applying, please share with us one project you have built fully on your own or a challenging technical problem you have solved (max 1 page).

Please note that only shortlisted candidates will be notified.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

Role Description

You will be playing a pivotal role in advancing semiconductor fabrication automation. You will be responsible for deploying and optimizing automation frameworks, integrating IoT hardware/software, and enabling seamless communication between Autonomous Mobile Robots (AMR), SECS/GEM protocols, Manufacturing Execution Systems (MES), and semiconductor tools.

Key Responsibilities

• MES Integration & Vendor Coordination: Collaborate with vendors to evaluate, configure, and deploy robust communication systems between MES, tools, and AMR.
• Software Development & Web UI Creation: Design and develop intuitive web-based user interface for seamless user interaction, system monitoring, and operational control. 
• Automated Data Analytics & Visualization: Generate automated periodic insights, analytics, reports, visualizations, and alerts to support real-time decision-making processes.
• System Maintenance & Optimization: Conduct periodic data integrity checks, implement automated failure alerts, troubleshoot system issues, and enhance automation frameworks with innovative features for existing and new systems.
• Semiconductor Fab Automation: Responsible for proposing/developing/implementing/maintaining IOT automation systems collecting/cleaning/restructuring equipment data and storage in data management system. Create equipment and operator interface enabling the ease of user entry with digital recording 

Job Requirements

• Degree in Microelectronics/Electrical/Mechanical/Chemical Engineering or equivalent
• Technical Proficiency: Strong programming skills in PHP, JavaScript, Python, or other languages commonly used in web technologies and semiconductor automation. 
• Data Analysis & Automation Expertise: Experience in data synthesis, reasoning, and analysis, with a keen ability to develop automation solutions for complex processes. Experience in AMHS (Automated Material Handling System) is a plus. 
• Industry Knowledge: Preferably 1-3 years of MES system administration experience in semiconductor process modules, equipment engineering, or digital transformation/ automation.

Job Overview

We are seeking a motivated and detail-oriented Training Engineer to support the design, development, and delivery of technical training programs for lift and escalator systems. This role is instrumental in enhancing workforce competency, reinforcing safety standards, and driving operational excellence across the organization.

Key Responsibilities

• Design, develop, and deliver structured technical training programs for lift and escalator systems
• Develop high-quality training materials, manuals, and instructional content aligned with training needs
• Conduct engaging classroom and on-site training sessions for technicians and staff
• Evaluate training effectiveness through assessments, feedback, and performance analysis; prepare comprehensive monthly training reports
• Plan, coordinate, and manage training schedules to meet operational and project requirements
• Collaborate with cross-functional teams to identify training needs and align learning initiatives
• Drive continuous improvement through data analysis, feedback collection, and training program enhancements
• Ensure all training activities comply with safety regulations, standards, and company policies
• Manage multiple training programs, projects, and administrative responsibilities concurrently

Requirements

• Bachelor’s Degree in Engineering (Mechanical, Electrical, or related discipline)
• Diploma holders with strong relevant experience will be considered (e.g. 5+ years in lifts/escalators or technical training)
• Strong technical writing and documentation skills
• Excellent presentation, communication, and facilitation skills
• Good analytical thinking and problem-solving capabilities
• Ability to manage multiple priorities in a dynamic environment
• Strong interpersonal skills with the ability to engage stakeholders across departments
• Experience in training, coaching, or knowledge transfer is advantageous
• Prior experience in the lift and escalator industry is preferred but not mandatory
• Only Singaporean and Singapore Permanent Resident need to apply

Preferred Attributes

• Confident and engaging trainer with strong facilitation skills
• Highly organized with strong attention to detail
• Proactive, self-driven, and able to work independently

Benefits

• Training and professional development opportunities (e.g., certifications, courses)
• Clear career progression pathway within engineering and training functions
• Supportive and collaborative working environment
• Opportunity to work on industry-relevant systems and technologies

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Research Engineer or Senior Research Engineer to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• Research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements.
• Interposer and Hybrid Bond pad fabrication for Flip Chip and Hybrid bonding applications
• Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Perform reliability characterization of flip-chip or hybrid-bonded packages to ensure robustness and long-term performance.
• Lead capability development projects with manageable risks and mentor less experienced colleagues.
• Collaborate with senior staff and principal investigators to develop process capability and new.
• Inspire and mentor talent in semiconductor technology, contributing to workforce development in the field.

Qualifications and Skills

Candidates should meet the following criteria:

• Educational Background: Bachelors in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• Experience: 1 to 6 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogenous integration applications.
• Technical Expertise: Hands-on experience in flip chip bonding is preferable
• Knowledge: Knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable, but not mandatory.
• Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
• Excellent written and verbal communication abilities.
• Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
• Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.

What We Offer

• The opportunity to work on cutting-edge research in advanced packaging and heterogeneous integration.
• A collaborative and interdisciplinary work environment.
• Access to state-of-the-art facilities and resources.

Join us in shaping the future of semiconductor technologies and heterogeneous integration. Apply today!

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Research Engineer or Senior Research Engineer to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• Research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements.
• Interposer and Hybrid Bond pad fabrication for Flip Chip and Hybrid bonding applications
• Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Perform reliability characterization of flip-chip or hybrid-bonded packages to ensure robustness and long-term performance.
• Lead capability development projects with manageable risks and mentor less experienced colleagues.
• Collaborate with senior staff and principal investigators to develop process capability and new.
• Inspire and mentor talent in semiconductor technology, contributing to workforce development in the field.

Qualifications and Skills

Candidates should meet the following criteria:

• Educational Background: Bachelors in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• Experience: 1 to 6 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogenous integration applications.
• Technical Expertise: Hands-on experience in flip chip bonding is preferable
• Knowledge: Knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable, but not mandatory.
• Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
• Excellent written and verbal communication abilities.
• Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
• Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.

What We Offer

• The opportunity to work on cutting-edge research in advanced packaging and heterogeneous integration.
• A collaborative and interdisciplinary work environment.
• Access to state-of-the-art facilities and resources.

Join us in shaping the future of semiconductor technologies and heterogeneous integration. Apply today!

We are seeking a highly skilled Machine Learning / AI Engineer to design, develop, and fine-tune AI models for a range of advanced applications, including video analytics, object recognition and detection, fraud detection, and multimodal generative AI leveraging large language models (LLMs).

Key Responsibilities

• Model Selection & Optimization: Identify, experiment with, and fine-tune state-of-the-art machine learning models for tasks such as video analytics, object recognition/detection, fraud detection, and multimodal generative AI.

• Deep Learning & LLMs: Work with transformer architectures, foundation models, and generative AI to develop and enhance multimodal AI solutions.

• Computer Vision: Develop and optimize models for real-time object detection, tracking, and recognition in video streams, ensuring performance in diverse conditions.

• Fraud Detection and other anomaly detection: Design and implement machine learning models for anomaly detection and fraud prevention using advanced statistical and AI techniques.

Technical Skills:

• Strong experience in deep learning frameworks such as TensorFlow, PyTorch, or JAX.

• Proficiency in computer vision techniques, including object detection (YOLO, Faster R-CNN), video analytics, and multimodal learning.

• Hands-on experience with LLMs, transformers (GPT, BERT, T5, CLIP, etc.), and multimodal AI for text, image, and video synthesis.

• Experience in fraud detection and/or anomaly detection using machine learning, pattern recognition, and risk modeling.

• Experience in AWS SageMaker for model training and deployment preferred.

• Familiarity with MLOps and deployment on cloud platforms (AWS and/or GCP preferred) or edge devices.

Preferred Qualifications:

• Degree in Computer Science, AI, Machine Learning, or a related field.

• 4 to 5 years of relevant experience

• Experience working with autonomous systems, robotics, or edge AI is a plus.

If the above role is a good fit for you, or if you know anyone who might be good for the role, please get in touch with an updated CV and I'll be in touch!

EA Reg Number: R1660446

EA License Number: 07C3924 

Company Registration No: 200609504D

We are looking for a motivated Research & Technical Support Engineer/Scientist to develop, maintain, and support BEOL furnace processes including BEOL metal anneal, barrier/liner engineering, dielectric curing, hydrogen anneals, and stress‑relief treatments. This role involves both fundamental materials science and hands‑on tool/process ownership in a cleanroom research environment. You will collaborate with R&D teams working on advanced interconnect technologies, photonic integration, 3D integration, and novel dielectric/metallization schemes.

Job Responsibilities:

BEOL Furnace Process Development

• Develop and optimize BEOL thermal processes including Metal anneal, Barrier/liner stabilization, Dielectric curing, Passivation and Stress‑relief anneals
• Perform tool qualification, recipe loading, chamber matching, SPC set up and contamination monitoring.
• Troubleshoot process excursions and ensure stable operations with high repeatability.
• Correlates anneal conditions with film quality, stress, adhesion, and reliability metrics.

Cross‑Functional Collaboration

• Work closely with teams in Photonic IC, Wide-Bandgap Devices, Packaging and reliability for process integration.
• Provide guidance for internal projects on thermal budgets, thermal‑stress implications, and BEOL process compatibility for novel materials and device architectures.

Job Requirements:

• Degree (Bachelor, or Master based on job scope) or above in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry, Physics or related fields.
• 3 years of working experience in Semiconductor Fabrication is advantageous.
• Hands‑on experience with furnace processing, anneals, or BEOL‑related thermal steps is highly wanted.
• Knowledge of metallization physics, anneal passivation, interconnect reliability and dielectric curing.
• Understanding of thermal budget constraints and stress‑management in BEOL stacks.
• Hands-on experience in Design of Experiments (DOE), root cause analysis, and problem-solving methods is desired.
• Experience in Photonic IC, SiC devices, 2.5D/3D packaging and/or Wafer Bonding would be a plus.
• Proficiency with materials characterization tools, such as ellipsometry, XRD, XPS, TEM, SEM, stress measurement

We are looking for a motivated Research & Technical Support Engineer/Scientist to develop, maintain, and support BEOL furnace processes including BEOL metal anneal, barrier/liner engineering, dielectric curing, hydrogen anneals, and stress‑relief treatments. This role involves both fundamental materials science and hands‑on tool/process ownership in a cleanroom research environment. You will collaborate with R&D teams working on advanced interconnect technologies, photonic integration, 3D integration, and novel dielectric/metallization schemes.

Job Responsibilities:

BEOL Furnace Process Development

• Develop and optimize BEOL thermal processes including Metal anneal, Barrier/liner stabilization, Dielectric curing, Passivation and Stress‑relief anneals
• Perform tool qualification, recipe loading, chamber matching, SPC set up and contamination monitoring.
• Troubleshoot process excursions and ensure stable operations with high repeatability.
• Correlates anneal conditions with film quality, stress, adhesion, and reliability metrics.

Cross‑Functional Collaboration

• Work closely with teams in Photonic IC, Wide-Bandgap Devices, Packaging and reliability for process integration.
• Provide guidance for internal projects on thermal budgets, thermal‑stress implications, and BEOL process compatibility for novel materials and device architectures.

Job Requirements:

• Degree (Bachelor, or Master based on job scope) or above in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry, Physics or related fields.
• 3 years of working experience in Semiconductor Fabrication is advantageous.
• Hands‑on experience with furnace processing, anneals, or BEOL‑related thermal steps is highly wanted.
• Knowledge of metallization physics, anneal passivation, interconnect reliability and dielectric curing.
• Understanding of thermal budget constraints and stress‑management in BEOL stacks.
• Hands-on experience in Design of Experiments (DOE), root cause analysis, and problem-solving methods is desired.
• Experience in Photonic IC, SiC devices, 2.5D/3D packaging and/or Wafer Bonding would be a plus.
• Proficiency with materials characterization tools, such as ellipsometry, XRD, XPS, TEM, SEM, stress measurement