Total 1,355 software engineer job vacancies in Others category

• Prepare, schedule, coordinate and monitor the assigned projects
• Interact daily with manager to interpret their needs and requirements
• Perform overall quality control of the work (budget, schedule, plans, personnel’s performance) and report regularly on project status
• Preparation of shop drawing using AUTOCAD
• Preparation of drawing estimation and submission of quotation to client.
• Cooperate and communicate effectively with project/operation manager and other project participants to provide assistance and technical support
• Design and detailed drafting accordingly to requirements by using AUTOCAD
• Do other Adhoc duties assigned by manager.

1. A Degree in Mechanical Engineering or Electrical Engineering from recognised universities.
2. At least five (5) years of practical working experience in the related field in building construction projects.
3. Report to Technical Manager, and assist in managing, planning and coordinating mechanical engineering or electrical engineering to meet time, cost and quality objectives.
4. Coordinate design and/or detailing with consultants, develop shopdrawings, review of submissions from subcontractors and liaise with other work disciplines.
5. Proficient in REVIT and AUTOCAD software applications.
6. Positive attitude, self-motivated, initiative and responsible.
7. Good communication and interpersonal skills.
8. Able to work independently.
9. Candidates with more than eight (8) years of relevant experience may be considered for senior positions.
10. Remuneration shall commensurate with qualifications and experience. Basic salary: $3,500 to $6,000, plus allowances.

Responsibilities

a) To manage and to run the Data Centre operations team on a 24x7 basis to ensure both facilities, IT infrastructure and business applications are operational

• Monitor Server and application health

• Support level 1 troubleshooting and recovery

• Run batch jobs & monitoring

• Run backup job & monitoring

• Support Production job deployment and Job schedule

b) Accompany & direct Data Centre visitor

c) Support Disaster Recovery activity

d) Ensure all IT related issues are well documented and update management on overall performance status and activities within Data Centre

You will be involved in monitoring the performance and availability of IT services, processing of production jobs, assisting in monitoring and resolution of incidents related to computer hardware, operating system, application systems, data centre facilities and managing the security of the data centre. Supervise service vendors to ensure full compliance to Service Level agreement.

You will also be involved in process improvement initiatives and projects for the data centre.

Requirements

a) Ability to effectively respond to all issues, complex enquiries or complaints from Project Leaders, users and/or higher management

b) Knowledge in Data Centre/Critical Services management

c) Knowledge in security, fire and workplace safety

d) Excellent interpersonal and communicative skills and be a team player

e) Perform other job-related duties or special projects as assigned

f) Preferably certification in ITIL or good understanding of ITIL framework and practices

g) Minimum NITEC IT / Higher NITEC IT qualification

h) Able to work in shift as Data Centre operates 24/7. Each shift is of 12 hours

i) (Day shift 8.45 am to 8.45 pm, Night Shift: 8:45 pm to 8:45am)

h) Deployment of production files and scheduling of Batch Jobs

Responsibilities

• Servicing, Installation, commissioning and troubleshooting of marine control systems on-board vessel and onshore.
• Mainly job duties at anchorage, shipyard and overseas for installation, commissioning, service, troubleshooting and repair.
• Provide progress report and feedback after service.

Requirements

• Required relevant working experience in repair/servicing, troubleshooting and automation
• Min O Level/ ITE in Mechatronics/Mechanical/Electrical/Marine Engineering
• Able to travel overseas especially on short notice / can work at the night-time or Public holiday
• Able to start work immediately is preferable
• Minimum 5 year experiences and above

• Location: Woodlands
• Working Hours: 5.5 days per week (Mon to Fri: 8:00 AM – 5:30 PM, Sat: 8:00 AM – 12:30 PM)
• Willingness to commit to extended hours

Job Responsibilities

• Lead HVAC design development for semiconductor and cleanroom facilities
• Perform cooling load calculations, system sizing, and equipment selection
• Prepare and review HVAC layouts, ducting, and airflow designs
• Coordinate HVAC design with cleanroom, electrical, piping, and process teams
• Review shop drawings, technical submissions, and method statements
• Support installation, testing, and commissioning of HVAC systems
• Troubleshoot design and site-related HVAC issues
• Liaise with clients, consultants, vendors, and contractors
• Ensure compliance with BCA, NEA, WSH, and project specifications
• Mentor junior engineers and provide technical guidance
• Any other ad-hoc duties as assigned

Requirements

• Bachelor’s Degree in Mechanical Engineering or related field
• Minimum 5 years of HVAC design experience, preferably in semiconductor or industrial projects
• Strong knowledge of HVAC systems, heat transfer, and airflow control
• Proficient in AutoCAD, Revit, or similar design tools
• Experience in cleanroom HVAC systems is highly preferred
• Good coordination, leadership, and problem-solving skills
• The candidate must be fluent in both Mandarin and English to communicate effectively with internal teams and external stakeholders
• Candidates with good experience will be considered for a higher role, and the salary will be commensurate accordingly

• Location: Woodlands
• Working Hours: 5.5 days per week (Mon to Fri: 8:00 AM – 5:30 PM, Sat: 8:00 AM – 12:30 PM)
• Willingness to commit to extended hours

Job Responsibilities

• Lead electrical design for semiconductor construction projects
• Develop power distribution, lighting, grounding, and earthing systems
• Perform load calculations, cable sizing, and equipment selection
• Prepare and review electrical schematics, layouts, and drawings
• Coordinate electrical design with mechanical, cleanroom, and process teams
• Review shop drawings and technical submissions
• Support installation, testing, and commissioning of electrical systems
• Liaise with clients, consultants, and contractors
• Ensure compliance with BCA, EMA, WSH, and relevant electrical codes
• Guide and mentor junior engineers
• Any other ad-hoc duties as assigned

Requirements

• Bachelor’s Degree in Electrical Engineering or related field
• Minimum 5 years of electrical design experience, preferably in semiconductor or industrial projects
• Strong knowledge of power systems and electrical codes
• Proficient in AutoCAD, Revit, or electrical design software
• Good coordination, leadership, and troubleshooting skills
• The candidate must be fluent in both Mandarin and English to communicate effectively with internal teams and external stakeholders
• Candidates with good experience will be considered for a higher role, and the salary will be commensurate accordingly

• Location: Woodlands
• Working Hours: 5.5 days per week (Mon to Fri: 8:00 AM – 5:30 PM, Sat: 8:00 AM – 12:30 PM)
• Willingness to commit to extended hours
• Fresh graduates are welcome to apply

Job Responsibilities

• Assist in fire protection system design and coordination
• Support design of sprinkler, hose reel, gas suppression, and alarm systems
• Assist in hydraulic calculations and system layouts
• Support installation and testing of fire protection systems
• Coordinate with authorities, consultants, and contractors
• Assist in inspections, testing, and commissioning activities
• Learn and comply with SCDF, BCA, and WSH regulations
• Any other ad-hoc duties as assigned

Requirements

• Bachelor’s Degree in Mechanical, Fire Protection, or related Engineering field
• Exposure to fire protection systems or building services is a plus
• Familiarity with AutoCAD or Revit is preferred
• Basic understanding of fire safety principles and codes
• Strong coordination and documentation skills
• Willingness to learn and work in a multidisciplinary team
• The candidate must be fluent in both Mandarin and English to communicate effectively with internal teams and external stakeholders
• Candidates with good experience will be considered for a higher role, and the salary will be commensurate accordingly

• Location: Woodland
• Working Hours: 5 days per week (Mon to Fri: 8:00 AM – 5:30 PM)
• Willing to commit to extended hours and shift work during peak periods
  

Job Responsibilities:

• Plan and supervise piping system installation, including chilled water, process cooling water, CDA, vacuum, DI water, and chemical piping systems
• Review piping shop drawings, technical submissions, and material samples to ensure compliance with design requirements and client specifications
• Coordinate with M&E consultants, main contractors, and subcontractors to resolve technical and coordination issues on-site
• Ensure that piping works are executed in accordance with project specifications, codes, safety regulations, and quality standards
• Attend site meetings and inspections with clients and relevant authorities
• Monitor work progress and provide regular updates to the Project Manager
• Support testing and commissioning activities including hydro testing, flushing, pressure testing, and cleanroom readiness
• Maintain proper documentation for QA/QC records, inspection checklists, and as-built drawings
• Any ad-hoc duties as assigned

Requirement:

• Degree or Diploma in Mechanical, Electrical, or relevant Engineering discipline
• Minimum 2–5 years of working experience in construction projects, preferably in semiconductor, industrial, or commercial building sectors
• Familiar with project planning tools, construction drawings, and piping standards
• Strong communication, coordination, and problem-solving skills
• Ability to work under pressure and meet tight deadlines
• Good communication, reading, and writing skills in both English and Chinese to liaise with Chinese associate
• Candidates with strong experience will be considered for a higher-level position, with salary adjusted accordingly
• Fresh graduates are welcome to apply

• Location: Woodland
• Working Hours: 5.5 days per week (Mon to Fri: 8:00 AM – 5:30 PM, Sat: 8:00 AM –12:30 PM)
• Willingness to commit to extended hours & night shift

Job Responsibilities

• Lead the development and review of mechanical designs, schematics, and layouts for HVAC, ultra-pure water (UPW), cleanroom ventilation, process piping, and specialty gas distribution systems.
• Perform and validate complex load calculations, equipment sizing, system modelling, and material selection to meet stringent semiconductor facility requirements.
• Provide technical oversight for thermal management, vibration control, and contamination-prevention strategies in cleanroom and sub-fab environments.
• Lead and supervise installation works for pumps, compressors, heat exchangers, cooling towers, and mechanical utility systems, ensuring compliance with design intent and quality standards.
• Coordinate closely with civil, electrical, process, and tool-installation teams to ensure seamless integration of all mechanical systems.
• Ensure strict adherence to cleanroom protocols and contamination-control requirements during construction and installation.
• Troubleshoot complex mechanical system issues and provide engineering solutions during commissioning, start-up, and qualification stages.
• Manage and oversee vendor and contractor performance, ensuring timely delivery, quality workmanship, and alignment with project milestones.
• Ensure compliance with BCA codes, WSH regulations, NEA requirements, and relevant SEMI/ASHRAE/ISO standards.
• Review and approve mechanical method statements, shop drawings, material submissions, testing procedures, and commissioning documentation.
• Any ad-hoc duties as assigned

Requirements:

• Bachelor’s Degree in Mechanical Engineering or equivalent.
• Minimum 5–8 years of relevant experience in semiconductor wafer fabs, cleanrooms, data centres, pharmaceutical plants, or complex industrial facilities.
• Strong expertise in HVAC, process piping, UPW, specialty gas, and mechanical utility systems.
• Proficiency in AutoCAD, SolidWorks, Revit, or similar mechanical design and modelling software.
• Strong knowledge of SEMI standards, ASHRAE cleanroom guidelines, and ISO 14644.
• Solid understanding of thermodynamics, fluid mechanics, system integration, and mechanical safety engineering.
• Proven ability to lead coordination with multidisciplinary teams and manage contractors effectively.
• Strong problem-solving skills with the ability to resolve complex technical issues independently.
• Must be able to communicate in Mandarin to be able to liaise with Mandarin speaking associates

• To resolve all technical and non-technical issues
• Assists Site Manager/Project Manager in verifying monthly progress reports, claims
• Oversees the daily construction activities at the work site to meet the project progress and quality goals
• Supervise direct manpower to complete the project within the given budget and time frame
• Monitor the site progress against the approved construction program and highlight to project manager if progress is behind schedule
• Perform quality inspections
• Other duties as assigned

As a Bonding Process & Equipment Engineer at Micron Technology, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding).

You will drive yield improvement, cost reduction, process capability enhancement, and risk management, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites.

Key Responsibilities

Process Development & Optimization

• Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)

• Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets

• Drive process capability improvement (Cpk) and defect reduction

Yield & Reliability Improvement

• Lead yield enhancement initiatives by analyzing process, tool, and material interactions

• Perform systematic root cause analysis using methodologies such as DOE, FMEA, 8D, SPC, and fault isolation techniques

• Evaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actions

Equipment & Materials Engineering

• Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g., EVG, TEL, Disco platforms)

• Define equipment specifications, roadmap, process control strategies, and matching/fingerprinting requirements

• Evaluate and introduce new materials/spares/parts for performance improvement

Technology Transfer & Process Integration

• Support technology transfer and ramp-up across global sites

• Align process baseline (POR) and ensure consistency through documentation and control plans

• Work closely with integration, CMP, WET, and Films teams to ensure cross-module compatibility

Manufacturing Support & Problem Solving

• Diagnose and resolve manufacturing line issues impacting bonding yield and performance

• Analyze process excursions and implement containment and recovery actions

• Drive continuous improvement for cycle time, tool availability, and cost efficiency

Qualification & Control

• Lead new process and baseline qualifications

• Develop control plans, SPC strategies, and inline monitoring systems

• Establish risk mitigation frameworks and ensure compliance with manufacturing standards

Supplier & Cross-Functional Collaboration

• Partner with suppliers for technology development, process improvement, and cost optimization

• Audit material and equipment suppliers to ensure quality and reliability targets are met

• Collaborate with global teams and partners to drive alignment and execution

Qualifications

Technical Expertise

• Strong knowledge of semiconductor bonding processes (wafer to wafer hybrid bonding, fusion bonding preferred)

• Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms

• Experience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is highly preferred

Skills & Competencies

• Proficiency in data analysis, SPC, and statistical modeling

• Strong problem-solving skills using structured methodologies (8D, FMEA, DOE)

• Ability to manage complex projects involving multiple functions in a high-volume manufacturing environment

• Excellent communication and collaboration skills across global teams

Education & Experience

• Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field

• 7 years+ Relevant proven experience in semiconductor manufacturing or advanced packaging

As a Bonding Process & Equipment Engineer at Micron Technology, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding).

You will drive yield improvement, cost reduction, process capability enhancement, and risk management, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites.

Key Responsibilities

Process Development & Optimization

• Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)

• Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets

• Drive process capability improvement (Cpk) and defect reduction

Yield & Reliability Improvement

• Lead yield enhancement initiatives by analyzing process, tool, and material interactions

• Perform systematic root cause analysis using methodologies such as DOE, FMEA, 8D, SPC, and fault isolation techniques

• Evaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actions

Equipment & Materials Engineering

• Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g., EVG, TEL, Disco platforms)

• Define equipment specifications, roadmap, process control strategies, and matching/fingerprinting requirements

• Evaluate and introduce new materials/spares/parts for performance improvement

Technology Transfer & Process Integration

• Support technology transfer and ramp-up across global sites

• Align process baseline (POR) and ensure consistency through documentation and control plans

• Work closely with integration, CMP, WET, and Films teams to ensure cross-module compatibility

Manufacturing Support & Problem Solving

• Diagnose and resolve manufacturing line issues impacting bonding yield and performance

• Analyze process excursions and implement containment and recovery actions

• Drive continuous improvement for cycle time, tool availability, and cost efficiency

Qualification & Control

• Lead new process and baseline qualifications

• Develop control plans, SPC strategies, and inline monitoring systems

• Establish risk mitigation frameworks and ensure compliance with manufacturing standards

Supplier & Cross-Functional Collaboration

• Partner with suppliers for technology development, process improvement, and cost optimization

• Audit material and equipment suppliers to ensure quality and reliability targets are met

• Collaborate with global teams and partners to drive alignment and execution

Qualifications

Technical Expertise

• Strong knowledge of semiconductor bonding processes (wafer to wafer hybrid bonding, fusion bonding preferred)

• Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms

• Experience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is highly preferred

Skills & Competencies

• Proficiency in data analysis, SPC, and statistical modeling

• Strong problem-solving skills using structured methodologies (8D, FMEA, DOE)

• Ability to manage complex projects involving multiple functions in a high-volume manufacturing environment

• Excellent communication and collaboration skills across global teams

Education & Experience

• Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field

• 7 years+ Relevant proven experience in semiconductor manufacturing or advanced packaging

You will manage and supervise the construction of road projects, including new roads, expressways, road interchanges, flyovers, underpasses and depressed road structures. You will be responsible for the supervision and completion of projects, ensuring that works are carried out in accordance with the specified quality and safety standards. You will also be involved in the overall project coordination, as well as resolving any technical and contractual issues encountered in the projects.

Requirement:• Knowledge in Civil / Structural Engineering
• At least 2 years relevant experience in a project / construction environment
• Experience in civil / structural design will be an advantage
• Proficient in relevant software programmes for planning and project works
• Pro-active with strong analytical and communication skills
• Those without experience are also welcome to apply

As part of the shortlisting process for the role, you may be required to complete a medical declaration and / or undergo further assessment.

About the job

An award-winning professional service firm is looking for an AI Manager/ Lead AI Engineer to join their team.

Your new role

As an AI Manager/ Lead AI Engineer, you will be responsible for:

• Define and execute AI strategy, focusing on high-impact legal use cases

• Lead and mentor AI teams to drive innovation and technical excellence

• Establish AI governance, ensuring compliance, security, and ethical usage

• Collaborate with stakeholders and manage vendors to deliver AI solutions

• Oversee AI infrastructure and manage risks for reliable, resilient deployment

What you’ll need to succeed

• Advanced degree in Computer Science, AI, Data Science, or related field preferred

• 5+ years in IT leadership, including 2+ years managing AI/ML teams and projects

• Strong expertise in ML, LLMs, NLP, and Generative AI with production deployment experience

• Proven leadership in managing teams, budgets, and strategic initiatives

• Excellent communication, problem-solving skills, and understanding of legal tech is a plus

What you'll get in return

In return, you'll be part of an organization that values its employees. You’ll be rewarded with:

• Structured career growth and plenty of developmental opportunities

• Stable working environment

What you need to do now

If you're interested in this role, click 'apply now' or for more information and a confidential discussion on this role or to find out about more opportunities in Technology contact Yuki Cheung or email yuki.cheung@hays.com.sg. Referrals are welcome.

At Hays, we value diversity and are passionate about placing people in a role where they can flourish and succeed. We actively encourage people from diverse background to apply.

EA Reg Number: R22110258 | EA License Number: 07C3924 | Company Registration No: 200609504D

You will be responsible for optimizing supply to demand request as well as developing and improving the performance levels of the overall FE probe network, working with various internal and external groups to improve overall FE output performance, and meeting the output commitment on time. You will be facilitating on the rolling out of key indices to Micron executives highlighting issues and mitigation plan. You will be responsible to audit and improve process efficiency and incorporate automation process into metric updates.

• Establish and standardize network probe metrics for Die Mix attainment & operations efficiency. BIC metrics benchmarking and BKM deployment across network to drive standardization.

• Establish probe card and tester BP for capacity optimization, allocation, methodology to drive cross-site & cross-platform fungibility. ​

• Drive probe flex alignment with Global Supply Chain team and Central Probe Planning to meet die mix variability

• Drive die mix optimization, probe card swap process, audit and maximize vendor capacity/allocation to meet network needs

• Collaborate with SMAI on automation to ensure consistency and sustainability​

• Systemization of probe business processes and audit sites on compliance.

• Synchronization of Die Mix processes with Probe Planning process​

• Synchronization of Probe Long Term Planning with Short Term Planning ​

• Synchronization of IE Planning with operations process (POR-MOR gaps), establish Plan-Do-Check-Act (PDCA) process and feedback loop

Requirements :

• Bachelor's degree in Industrial System Engineering, Electrical and Electronics Engineering, Mechanical Engineering or Aerospace Engineering

• 3-5 years of experience in Probe Planning/Probe Manufacturing/Inventory Control/Production Planning/Line Management

• Proficiency in data analytics tools (e.g. Python, SQL or Tableau) to perform detailed analysis and provide metrics visibility

• Able to analyze line performance and provide line direction through concept of Line Management and Inventory Management to meet business plan.

• Proven ability to make decisions, multi-task, and troubleshoot problems and address root causes.

• Proven ability to build consensus in cross-functional groups

• Fluent in the basic concept of weekly wafer starts and wafer outs business process is a good to have.