Total 150 test engineer job vacancies

The Senior Engineer supports photolithography process development for advanced memory technologies through hands‑on experimentation, data analysis, and yield improvement activities. This role focuses on execution excellence, disciplined learning, and collaboration, operating under guidance from senior technical leaders. Success in this role requires strong fundamentals in photolithography, analytical rigor, and the ability to translate experimental data into actionable insights. 

Main Responsibilities 

• Execute photolithography process development, optimization, and troubleshooting tasks in support of yield, quality, and performance targets. 

• Perform DOE, SPC, and statistical analysis to characterize process behavior and identify improvement opportunities. 

• Support material evaluations, defect learning, overlay analysis, and process window characterization. 

• Assist with integration learning during development and early manufacturing ramps. 

• Collaborate with cross‑functional teams including integration, etch, metrology, and yield engineering. 

Other Responsibilities 

• Document experimental procedures, results, and learnings in technical reports and presentations. 

• Support technology transfer activities under direction of senior engineers. 

• Integrates AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. 

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work. 

Candidate Profile 

Minimum Qualifications / Experience 

• PhD, or Master’s ≥3 yrs, or Bachelor’s ≥5 yrs of relevant experience in 
  Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, with foundational experience in semiconductor photolithography process development. 

Must‑Have Technical Skills 

• Demonstrated ability to contribute effectively to photolithography process development initiatives and improvement plans. 

• Deep knowledge in optics, immersion lithography, polarized illumination, and low k1 imaging  

• Proficiency in lithography simulation tools, material characterization, DOE, SPC, and basic statistical data analysis 

Must‑Have Soft Skills 

• Analytical thinking and structured problem‑solving 

• Collaboration and openness to learning 

• Clear technical communication 

• Project Management; especially in technical & technology programs  

• Demonstrates ability in applying AI tools to improve workflows, drive efficiency, and support data-informed decisions across teams and projects.

Highly Desirable / Preferred 

• Exposure to advanced lithography (193nm, 248nm, 365nm) and EUV processes 

• Hands-on experience with innovative photolithography equipment and metrology tools 

Embody Micron’s core values: 

• People – Respect, develop and empower others  

• Innovation – Drive continuous improvement and breakthrough thinking  

• Tenacity – Show grit and determination  

• Collaboration – Build trust and foster teamwork  

• Customer Focus – Deliver excellence and value 

You are responsible for new equipment introduction, risk assessment, equipment set-up, release, PM, Calibration, lab audits and as well as continuous improvement activities such as equipment reliability improvement, cost reduction, and equipment usage optimization. Through this role, you will enhance your technical skills in equipment management and improvement, project management, and strengthen your engagement and network with vendors and global GEL organizations across Micron sites.

Responsibilities

-Support GEL Equipment and lab operations including Internal and External audits, ESD and PM, Calibration, equipment troubleshooting, Safety and Chemical controls.

- Oversees the installation, modification, upgrade and maintenance of Engineering equipment.

- Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. - -- Establishes programs and solutions for increasing uptime and for equipment problems that affect the engineering process.

-Provides technical support to the engineering equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules.

- Collaborate with cross functional teams on equipment requirements, space planning, facilitation, purchase and installation of equipment.
- Equipment inventory controls and critical spare parts planning.

- Coordinate external vendors on training, repair, and preventive maintenance of equipment.
- Manage external vendors expectation, set and assess goals and achievements.
- Analyze and support stakeholders’ requirements and expectations.
- Foster closer collaboration amongst cross functional teams.
- Focus on customer needs and provide timely solutions.

Requirement

• Bachelor's degree in engineering with experience with ESD checks

• At least 1 year of experience in Semiconductor Equipment or Tools PM, calibration, and troubleshooting.

• Knowledge with Automated Optical Inspection and ANSYS Simulation

You are responsible for new equipment introduction, risk assessment, equipment set-up, release, PM, Calibration, lab audits and as well as continuous improvement activities such as equipment reliability improvement, cost reduction, and equipment usage optimization. Through this role, you will enhance your technical skills in equipment management and improvement, project management, and strengthen your engagement and network with vendors and global GEL organizations across Micron sites.

Responsibilities

-Support GEL Equipment and lab operations including Internal and External audits, ESD and PM, Calibration, equipment troubleshooting, Safety and Chemical controls.

- Oversees the installation, modification, upgrade and maintenance of Engineering equipment.

- Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. - -- Establishes programs and solutions for increasing uptime and for equipment problems that affect the engineering process.

-Provides technical support to the engineering equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules.

- Collaborate with cross functional teams on equipment requirements, space planning, facilitation, purchase and installation of equipment.
- Equipment inventory controls and critical spare parts planning.

- Coordinate external vendors on training, repair, and preventive maintenance of equipment.
- Manage external vendors expectation, set and assess goals and achievements.
- Analyze and support stakeholders’ requirements and expectations.
- Foster closer collaboration amongst cross functional teams.
- Focus on customer needs and provide timely solutions.

Requirement

• Bachelor's degree in engineering with experience with ESD checks

• At least 1 year of experience in Semiconductor Equipment or Tools PM, calibration, and troubleshooting.

• Knowledge with Automated Optical Inspection and ANSYS Simulation

Responsibilities: 

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type 

• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs. 

• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD Wet Etch peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements 

• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron. 

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions 

• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes. 

• Design and implement advanced process monitoring and control methodologies. 

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment. 

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings 

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers. 

• This position requires communication and collaboration with partners both locally and globally. 

• Strict adherence to Micron Intellectual Property protection policy is a must. 

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions. 

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Requirements: 

• Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry are welcome to apply. 

• 2-3 years of semiconductor industry experience is preferable 

• A deep understanding of chemistry, chemical kinetics, thermodynamics and mass transport 

• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM, FTIR. Understanding of various integration and structural impacts and constraints related to wet etch processes. 

• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular. 

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data 

• Working knowledge of Design of Experiments (DoE) Proven ability to collaborate with local and overseas teams on projects 

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications. 

• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously 

• Ability to travel for extended periods of time and stay at Boise TD for 2-4 months at a stretch to work on technology development. 

Micron’s Singapore Process Development (PD) group in Technology Development (TD) is looking for Plasma-CVD / Diffusion PD engineer to support Plasma-CVD/DIFF process development of advanced technology nodes. You will design and optimize Plasma-CVD or Diffusion for Micron’s innovative NAND Flash products.

As a PD Engineer, you will take ideas from conception through process development then implementation in our manufacturing facilities. In addition to your technical responsibilities, you will also run the projects of highly technical nature. This role is essential to the success of Micron’s products and may require business-related travel. Primary areas of responsibility include Plasma-CVD or Thermal Diffusion process and film characterization, optimization, design, troubleshooting, process transfer and fundamental research.

Advanced Thin Films PD Engineer will interact with groups such as Process Integration, Metrology, Surface characterization labs, Electrical Failure Analysis, Yield Enhancement, Manufacturing and Equipment vendors/suppliers, to ensure robust thin film processes that meet the precise physical and electrical requirements for Micron Products.

As an Advanced Thin Films PD Engineer at Micron, you will be required to travel for brief business purposes. This position requires that you have an aptitude for a research and development (R&D) environment, good organizational skills and ability to work independently as well as in a team environment. This position may often require weekend support to R&D Pilot Line, for example, in case of pilot/manufacturing line excursions/downs and monitoring program-critical lots thought various modules as deemed necessary.

Your responsibilities will include, but are not limited to:

• Process Development

• Design and develop and deliver process package to meet product specification requirements as per program targets and timelines

• Characterize the processes using appropriate techniques (SEM, TEM, XPS, SIMS, AFM, etc.)

• Design and execute experiments, analyze data and present it in the appropriate forums.

• R&D Pilot Line in the Fab

• Improve process maturity, capability and sustain processes in the fab under your ownership

• Updating the Fab engineers on customer issues and technology needs.

• Supporting root cause defect and unique fail mode analysis.

• Process Integration

• Delivering advanced technology to meet future product nodes.

• Developing recipes to meet structural & electrical requirements.

• Managing wafers though Thin Film levels in support of special requirements.

• Other Process Areas

• Working in cross-functional teams to jointly develop Array and CMOS structures.

• Supporting cross-functional failure analysis and yield improvement.

• Advanced Thin Film peers

• Maintaining or developing expertise in multiple process, hardware, or technology areas.

• Serving as a resource for peers in recipe & process development.

Successful candidates must have:

• Education requirements

• PhD in Physics, Materials Science, Chemical Engineering, Electrical Engineering, Chemistry, or related fields

• BS/MS+5 years equivalent industry or research experience may substitute for a PhD.

• Understanding in one or more of the following topics Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena.

• Solid troubleshooting, experimental design and data analysis skills.

• Strong computer skills, including MS Office.

• Plasma physics background and understanding of plasma sources used in plasma CVD is highly preferred.

• Understanding of CVD and Diffusion deposition processing principles.

• Rudimentary understanding of process control and Statistical Process Control (SPC).

• An understanding of solid state devices.

• An understanding of semiconductor process.

• Knowledge of advanced data analysis techniques and scripting is highly preferred

• Open to work off shift and weekends if necessary

• Open to domestic and international travel

As a Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

Job Description

Micron’s NAND Process Development (PD) Singapore group is looking for process development engineer to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Responsibilities

• Process module ownership involving Chemical Mechanical Planarization (CMP) process characterization and advanced process development for 3D NAND and beyond.

• Work with process development engineers in Singapore and Boise, US TD site and vendors to develop processes that meet integration requirements for next-generation 3-D NAND nodes.

• Transfer CMP processes to high volume manufacturing (Fab10N), and work on continuous improvements to manufacturability.

• Address process issues working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.

• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts.

• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions

• Identify process simplification opportunities and drive multi-functional teams in implementation

• Incorporate best known manufacturing methods into early development phase of upcoming nodes.

• Design and implement advanced process monitoring and control methodologies.

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.

• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.

• This position requires communications and collaboration with partners both locally and globally.  Strict alignment to Micron Intellectual Property protection policy is a must.

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Requirements

• Bachelors’/Masters in Materials Science, Chemical Engineering or Physics with minimum 5 years hands-on experience in groundbreaking CMP polishing equipment such as AMAT or EBARA, or

• PhD in Materials Science, Chemical Engineering or Physics.

• Lead and mentor CMP engineers early in their careers while driving technical excellence.

• Build, lead, grow a capable CMP team for NAND technology development

• Excellent problem-solving skills and critical decision making

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data

• Working knowledge of Design of Experiments (DoE)

• Proven ability to collaborate with local and overseas teams on projects

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously

Join Micron as a Senior Process Development Engineer, Dry Etch, NAND, and join a passionate team advancing next-generation NAND process technologies. You will collaborate with proficient professionals, develop inventive process, and assist us in achieving seamless delivery on our demanding projects.

Responsibilities: 

• Rapid deployment of new NAND process technologies.

• Drive development efforts prior to device ramp

• Define and complete effective actions to enable solutions required to hit key achievements and achieve the required performance within timelines

• Complex process development tasks related to ongoing evaluation of Dry Etch tool performance, examination of Dry Etch process windows, and adjustments or refinement of Dry Etch recipes within 3D NAND technology

• Troubleshoot processes as part of cross-functional teams, driving yield and quality improvement.

• Take initiative to identify and own areas for improvement, collaborating with other Fabs and TD teams.

• Proactively identify exciting processes and work with Fabs to find viable solutions

• Drive process simplification initiative across cross-functional teams.

• Integrate best-known manufacturing methods into the early development phase of upcoming nodes

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Successful candidates for this position will have: 

• PhD degree in Material Science, Physics, Chemistry, Electrical/Electronics Engineering, or Bachelors/Masters in Material Science, Physics, Chemistry, Electrical/Electronics Engineering with minimum of 3 years of semiconductor dry etch process development background

• Proven track record of strong publication, patent, or invention disclosure.

• Strong interest in technology development and crafting production-worthy technologies

• Ability to build and maintain relationships with cross-functional teams and vendors

• Excellent communication skills (written, verbal, and presentation).

• Proficiency in statistics, data analysis, Design of Experiments (DOE), and comfort with analysis software tools.

• Ability to work in a fast-paced and dynamic environment

Responsibilities

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type

• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs.

• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements

• Identify disruptive processes early on and work with manufacturing and Boise TD to identify viable path forward

• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions

• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes.

• Design and implement advanced process monitoring and control methodologies.

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.

• This position requires communications and collaboration with partners both locally and globally. 

• Strict adherence to Micron Intellectual Property protection policy is a must.

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Bachelors/Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry and related

• A deep understanding of chemistry, chemical kinetics, thermodynamics and  mass transport

• Opportunity to travel overseas for an extended period of time for collaborative R&D work assignment.

• 2-3 years of experience in Semiconductor Equipment/Process development is preferable

• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data

• Working knowledge of Design of Experiments (DoE)

• Proven ability to collaborate with local and overseas teams on projects

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Ability to be a self-motivated individual and be adaptable

• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously

• Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus

Micron Technology Inc. is a Fortune 500 company & employs about 45,000 workers worldwide, with HQ in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HMCs, and other memory-based systems. Micron is expanding and now starting full-fledged NAND research and development in Singapore co-locating with high volume manufacturing to speed up innovation. Micron has several world class SSD products (NAND) which have revolutionized speed feeding into GPU’s for superior AI performance and achieving blazing fast performance for gaming and pro workloads. Micron is one of the most prolific patent applicants in the world with 60,000 patents granted and still growing.

As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND. You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to:

Main Responsibilities:

• As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts.

• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts

• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications

• Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions

• Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes

• Incorporate best known manufacturing methods into early development phase of upcoming nodes

• Design and implement advanced process monitoring and control methodologies

• Provide strategic roadmap for N+, N++ and future NAND Nodes

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures, and equipment

• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers

• This position requires communication and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property Protection policy is necessary

Other Responsibilities:

• Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems

• Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions

• As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings

Artificial Intelligence

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Education/Job requirements:

• Masters /PhD with 5-10 years or Bachelors degree with 7-12 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication

Must Have Technical Skills

• Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads

• Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology

• Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes

Must Have Soft Skills

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Strong collaboration and communication skills (verbal and written).

• Self-driven, adaptable, and able to manage multiple projects.            

• Proven ability to take calculated risks and execute novel solutions.

• Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.

Highly Desirable/Preferred skills or experience

• An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.

• Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.

As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.

Responsibilities and Tasks

Conduct Electrical Characterization

• Understand PFA techniques available for de-processing failures

• Understand assembly and test process

• Perform electrical verification to confirm failures

• Establish best known method for de-processing package

Provide Data Analysis

• Understand backend test flows, qualification methodologies and be able to pull relevant information

Communicate with Internal/External Groups

• Document failure analysis techniques used to isolate failure for other groups

• Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA

• Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs

Provide Technical Expertise

• Conduct TMO training and FA certification

• Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.

• Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.

• Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.

Maintain Equipment

• Coordinate calibrations (external to Micron)

• Procure parts as needed

• Coordinate host vendors to support equipment repair

Manage Laboratory

• Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.

• Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.

• To manage the exhaust and scrubber systems of the FA Lab.

• To maintain records and procedures as per Micron GOPs

Education and Experience

• PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline. 

• 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.

• Hands-on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.

• Strong communication skills with the ability to collaborate effectively across internal teams and external partners.

• A mindset that emphasizes customer focus, continuous improvement, and striving for excellence.

As Frontend Central Product Integration Engineering and transformative (CPIE) team at Micron Technology, Inc., you will be leading new initiatives to deliver pioneering process capability, best-in-class bits per wafer (Yield) with the highest quality and fastest speed through innovation and collaboration with multi-functional teams. Your primary focuses include but not limited to:

Initiate new data solutions and methodologies to:

• identify process, test, and design improvement opportunities, specialized in UE_ROW & all quality index, Front End-PTS integration, and high-value-bits (PG2+) yield;

• modeling, monitoring and aiming for tool performance benchmarking;

• Process equipment prognostics and process integration optimization;

• Identity test optimization opportunities for high product grade yield improvement.

• Collaborate with site Process & Equipment Engineering, Manufacturing(MFG), Product Integration Engineering (PIE) and Data Science (DS) team to establish feasibility of new initiatives, demonstrate business values, and prototype solution mock-ups;

• Partner with Global Quality (GQ), Product Engineering (PE), Central PEE(CPEE), Smart Mfg Artificial Intelligent (SMAI), Technology Development (TD), and Suppliers to deliver end to end solutions, implement BKM development and deployment to production.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness,exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabledenhancements within one’s scope of work.

Collaboration

• Partner closely with multi-functional teams to ensure successful communication and collaboration for project implementation.

• Detail oriented with the ability to work independently

• Dependability and able to work effectively in multi-functional teams.

• Facilitate and lead activities in designing and optimizing current system, methods, tool, skill to be Best In industry.

• Manage priorities and enhancements to improve business processes and existing systems that are global in nature.

• Willing to work during non-standard hours when needed to provide support to engineering teams at any Micron site.

• Strong growth mindset and willing to continue to learn, unlearn, relearn.

Communication

• Effective communication skills in verbal/written.

• Self-motivated. Able to work independently with minimal supervision.

• Able to travel as required to support department and company objectives.

Requirement and Technical Competency:

• Experience in PIE, Test solution team, product engineering and circuit design engineering. Understanding of Process/Product Integration will be advantageous;

• In depth knowledge of processes, equipment and control system;

• Proficiency in data analytical tools such as Y3, JMP, Python to perform numerical experiment. Proficiency in Statistical/Machine Learning will be additional advantageous; 

• Proven track record to make decisions, multi-task, and solve problems and address root causes.

• Exhibit critical thinking to find opportunities.

• PhD/Masters/Bachelors with relevant course of study and experience

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

The Senior Engineer supports photolithography process development for advanced memory technologies through hands‑on experimentation, data analysis, and yield improvement activities. This role focuses on execution excellence, disciplined learning, and collaboration, operating under guidance from senior technical leaders. Success in this role requires strong fundamentals in photolithography, analytical rigor, and the ability to translate experimental data into actionable insights. 

Main Responsibilities 

• Execute photolithography process development, optimization, and troubleshooting tasks in support of yield, quality, and performance targets. 

• Perform DOE, SPC, and statistical analysis to characterize process behavior and identify improvement opportunities. 

• Support material evaluations, defect learning, overlay analysis, and process window characterization. 

• Assist with integration learning during development and early manufacturing ramps. 

• Collaborate with cross‑functional teams including integration, etch, metrology, and yield engineering. 

Other Responsibilities 

• Document experimental procedures, results, and learnings in technical reports and presentations. 

• Support technology transfer activities under direction of senior engineers. 

• Integrates AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. 

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work. 

Candidate Profile 

Minimum Qualifications / Experience 

• PhD, or Master’s ≥3 yrs, or Bachelor’s ≥5 yrs of relevant experience in 
  Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field, with foundational experience in semiconductor photolithography process development. 

Must‑Have Technical Skills 

• Demonstrated ability to contribute effectively to photolithography process development initiatives and improvement plans. 

• Deep knowledge in optics, immersion lithography, polarized illumination, and low k1 imaging  

• Proficiency in lithography simulation tools, material characterization, DOE, SPC, and basic statistical data analysis 

Must‑Have Soft Skills 

• Analytical thinking and structured problem‑solving 

• Collaboration and openness to learning 

• Clear technical communication 

• Project Management; especially in technical & technology programs  

• Demonstrates ability in applying AI tools to improve workflows, drive efficiency, and support data-informed decisions across teams and projects.

Highly Desirable / Preferred 

• Exposure to advanced lithography (193nm, 248nm, 365nm) and EUV processes 

• Hands-on experience with innovative photolithography equipment and metrology tools 

Embody Micron’s core values: 

• People – Respect, develop and empower others  

• Innovation – Drive continuous improvement and breakthrough thinking  

• Tenacity – Show grit and determination  

• Collaboration – Build trust and foster teamwork  

• Customer Focus – Deliver excellence and value 

Responsibilities: 

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type 

• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs. 

• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD Wet Etch peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements 

• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron. 

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions 

• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes. 

• Design and implement advanced process monitoring and control methodologies. 

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment. 

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings 

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers. 

• This position requires communication and collaboration with partners both locally and globally. 

• Strict adherence to Micron Intellectual Property protection policy is a must. 

• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions. 

Requirements: 

• Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry are welcome to apply. 

• 2-3 years of semiconductor industry experience is preferable 

• A deep understanding of chemistry, chemical kinetics, thermodynamics and mass transport 

• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM, FTIR. Understanding of various integration and structural impacts and constraints related to wet etch processes. 

• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular. 

• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data 

• Working knowledge of Design of Experiments (DoE) Proven ability to collaborate with local and overseas teams on projects 

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications. 

• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously 

• Ability to travel for extended periods of time and stay at Boise TD for 2-4 months at a stretch to work on technology development. 

• Demonstrates the ability in applying AI tools to enhance workflows, improve efficiency, and support data-informed decision across team and projects

Micron Technology Inc. is a Fortune 500 company & employs about 45,000 workers worldwide, with HQ in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HMCs, and other memory-based systems. Micron is expanding and now starting full-fledged NAND research and development in Singapore co-locating with high volume manufacturing to speed up innovation. Micron has several world class SSD products (NAND) which have revolutionized speed feeding into GPU’s for superior AI performance and achieving blazing fast performance for gaming and pro workloads. Micron is one of the most prolific patent applicants in the world with 60,000 patents granted and still growing.

As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND. You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to:

Main Responsibilities:

• As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts.

• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts

• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications

• Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions

• Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes

• Incorporate best known manufacturing methods into early development phase of upcoming nodes

• Design and implement advanced process monitoring and control methodologies

• Provide strategic roadmap for N+, N++ and future NAND Nodes

• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures, and equipment

• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction

• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers

• This position requires communication and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property Protection policy is necessary

Other Responsibilities:

• Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems

• Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions

• As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings

Artificial Intelligence

• Using, applying, and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision-making across projects and teams

Education/Job requirements:

• Masters /PhD with 5-10 years or Bachelors degree with 7-12 years of relevant working experience in the semiconductor industry with a background in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication

Must Have Technical Skills

• Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads

• Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology

• Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes

Must Have Soft Skills

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Strong collaboration and communication skills (verbal and written).

• Self-driven, adaptable, and able to manage multiple projects.            

• Proven ability to take calculated risks and execute novel solutions.

• Recognized as a mentor, team player and technical expert with the ability to solicit feedback, accept input, and analyze success/failure.

Highly Desirable/Preferred skills or experience

• An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.

• Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.

We are looking for an Senior Engineer in Product Engineering, NAND Validation/Characterization, specializing in functional and design validation. Experienced in simulation‑based validation, failure analysis, and cross‑functional issue closure. Strong focus on automation, data‑driven validation, and applied AI/ML techniques to improve test efficiency, coverage, and debug productivity.

This role focuses on building scalable, reusable, and automated test program frameworks, including AI/ML‑driven initiatives, to support both deterministic validation flows and pseudo‑random validation (RSG – Random Sequence Generator). You will play a key role in architecting the backbone of Verilog test programs—enabling efficient development, execution, debug, and reuse across multiple products and technology nodes. Validation scope includes NAND datasheet commands, features, interfaces, and customer‑mode operations on silicon platforms. When device issues are uncovered, you will perform deep failure analysis, drive root‑cause identification, and collaborate closely with Design, Application Engineering, Product, System, and Validation teams to ensure timely issue closure and infrastructure readiness for product release.

If you are looking for a technically challenging, high‑impact, and collaborative role, STPG Product Engineering (FDV‑Verilog) offers the opportunity to work on leading‑edge NAND technologies with strong ownership and visibility.

Key Responsibilities:

• Designed and executed functional and design validation flows for advanced RG NAND devices using simulation platforms

• Developed  deterministic usage‑case tests and random sequence generators to validate NAND commands and customer‑mode features

• Performed detailed failure analysis of issues seen, root‑cause investigations (including digital and analog circuitry), and drove issue resolution with cross-functional teams

• Implemented  automation frameworks using C‑based programming, Python, and Perl to improve test development and execution efficiency

• Applied  AI/ML‑assisted techniques (data analytics, pattern recognition, anomaly detection) to:

• Accelerate failure triage and root‑cause analysis

• Identify validation coverage gaps

• Improve random sequence effectiveness and debug prioritization

• Utilized data‑driven methods and dashboards to track validation progress, defect trends, and release readiness

• For senior engineer, need to have at least 3–5 years of relevant professional working experience in a similar or related engineering role.

Skills Required:

• Bachelor’s degree in Electronics Engineering, Computer Engineering, or a related discipline

• Strong interest in design validation, characterization, and product engineering

• Proficiency in software development and scripting (e.g., C/C++, Perl, Python)

• Ability to apply AI/ML for test analytics and defect pattern analysis

• Excellent problem solving and analytical skills, with careful attention to root cause analysis

• Effective communication skills in written and spoken English, including documentation and presentation

• Ability to multitask and manage priorities in a fast‑paced development environment

• Proactive mindset toward continuous improvement and self‑development
  

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.