Total 3 job vacancies by Aumovio

1. PLC Programming & Controls

• Advanced programming, troubleshooting, and modification of PLC programs.
• Hands‑on experience with:
  • Omron, Keyence, Mitsubishi, Siemens PLCs
  • Servo actuators, drives, motors, and electrical systems

2. LabVIEW Programming

• Advanced LabVIEW application development including:
  • Graphical Programming (VIs & Sub‑VIs); LabVIEW RT Modules ; DAQ Interfacing (6009/6221/6001), NI‑MAX configuration
  • Field instrument interfacing & hardware configuration; RS232/RS485/Modbus‑TCP communication
  • OPC communication & PLC interfacing; Data logging and application troubleshooting

3. Vision Systems

• Programming and troubleshooting of industrial camera controllers:
  • Keyence & Cognex

4. MES Support,  Digitalization & ABB Robot Operations

• Ensure smooth functioning of MES on the shop floor.
• Perform basic troubleshooting for MES‑machine connectivity issues; Support accurate data capture for production, quality, and machine performance ; Contribute to digital documentation, traceability, and reporting.

• Support basic robot movement, teaching points, and path correction; Safely operate robot programs using FlexPendant. Handle I/O for grippers and sensor signals; Troubleshoot simple robot faults to ensure continuity of automation.

5 Breakdown& Preventive Management

• Attend and troubleshoot machine breakdowns in shifts to ensure minimum downtime.
• Provide immediate containment actions and document breakdowns in MIS; Perform root cause analysis and prepare permanent corrective action reports.

• Plan and execute Preventive Maintenance (PM) schedules; Conduct predictive maintenance and equipment health checks.
• Work towards continuous improvement and zero‑breakdown culture.

6. Spare Parts & Vendor Management

• Maintain and procure spares as part of the Spare Part Management system.
• Coordinate with Purchase and Suppliers for SC/PO/payment follow‑ups and deliveries.
• Track and manage R&M budget and annual maintenance calendar.

7. Additional Technical Knowledge (Preferred)

• Resistance welding
• Crimping
• Molding processes

Job Description

We are seeking a detail-oriented and analytical Semiconductor Yield Engineer to join our team in Singapore, Singapore. In this role, you will be responsible for improving and maintaining semiconductor manufacturing yields through data analysis, process optimization, and defect reduction strategies.

• Responsible for yield analysis, pattern analysis, parametric analysis, and drift analysis in semiconductor processes, e.g. wafers fab and IC package assembly.
• Owner for yield pareto and develop models to predict and enhance yield performance.
• Identify Yield Improvement Programs in collaboration with the Product Engineers to enhance product quality and cost efficiency.
• Define and optimize data management tools and software for efficient data collection and analysis. Utilize statistical analysis tools and techniques to drive data-driven decision-making.
• Collaborate with cross-functional teams to investigate and resolve yield-related issues. Conduct root cause analysis on yield excursions and implement corrective actions.
• Design and execute experiments to optimize process parameters and improve yields.
• Generate comprehensive reports and presentations on yield performance and improvement initiatives.

Qualifications

• Bachelor’s degree in Electronics Engineering, Data Science Engineering or related field; Master’s degree preferred.
• Minimum 7 years of experience in semiconductor yield engineering, product engineering or related field.
• Strong understanding of semiconductor manufacturing processes and yield management systems. Knowledge of process integration and its impact on yield is added advantages,
• Proficiency in statistical analysis software (e.g., JMP, Minitab), data mining tools and automated data analytics scripts.
• Experience with failure analysis techniques and defect reduction strategies
• Excellent problem-solving skills and data analytical competency.
• Familiarity with industry standards and quality control practices in semiconductor manufacturing
• Strong communication skills, both verbal and written (e.g., Business English, Presentations) to interact with internal and external stakeholders.
• Demonstrated ability to work effectively in a fast-paced, team-oriented environment.

Job Description

We are seeking a detail-oriented and analytical NPI - IC Assembly professional to join our team in Singapore, Singapore. In this role, you will be responsible for overseeing the New Product Introduction (NPI) process for Integrated Circuit (IC) assembly, ensuring efficient and high-quality production of new semiconductor products for automotive application.

• Lead the new production introduction (NPI) for Automotive IC assembly process (e.g.: QFP, QFN, BGA) from package development to mass production at OSAT (Outsourced Semiconductor Assembly and Test).
• Coordinating with cross-functional teams to ensure smooth product launches, manufacturability and ramp-up.
• Develop and implement assembly procedures and work instructions for new products.
• Support in data exchange setup with OSAT for part traceability, quality assurance and yield monitoring.
• Monitor and optimize IC assembly processes to improve efficiency and yield. Troubleshoot assembly-related issues and drive improvement projects to meet
• Support in customer complaints events, lead root-cause analysis and corrective actions implementation at OSAT.
• Ensure compliance with quality standards and industry regulations.
• Prepare technical reports on NPI project status, risks and milestones, and presentations for management and stakeholders.
• Mentor and train junior team members on IC assembly techniques and best practices.

Qualifications

• Bachelor’s degree in Electronics Engineering, Electrical Engineering or related field.
• Minimum 5years of working experience in IC package assembly or OSAT management on technical topics.
• Preferable with strong proficiency in IC assembly processes or package development for automotive applications.  
• Proven experience with NPI processes in semiconductors.
• Familiarity with industry automotive standards and regulations (e.g., AEC-Q100, JEDEC. IPC standards)
• Excellent problem-solving skills and data analytical competency.
• Strong communication skills, both verbal and written (e.g., Business English, Presentations) to interact with internal and external stakeholders.
• Demonstrated ability to work effectively in a fast-paced, team-oriented environment.