Role Overview
As a Senior Engineer in NAND Technology Development (TD), Realtime Defect Analysis (RDA), you will provide senior level insight in the development, deployment, and sustainment of advanced defect detection and inspection strategies. This role is critical to accelerating learning cycles, improving yield, and enabling successful technology transfers into manufacturing. You will operate as a subject matter expert with global influence across TD, Process Integration, Yield, Data Science, and Global Manufacturing teams.
Key Responsibilities
• Serve as a key technical contact lead for RDA strategy, methodologies, and execution within NAND TD
• Analyze experimental and production process flows to identify systematic and random defect mechanisms
• Perform root cause analysis using statistical, image-based, and data-driven techniques
• Develop, own, and communicate inspection and defect detection technology roadmaps
• Define program health metrics and drive continuous improvement initiatives (CIP)
• Lead tool anomaly investigations, quarantine decisions, and corrective action planning
• Partner with inspection and metrology equipment suppliers to influence capability and roadmap
• Mentor and develop senior and junior engineers; raise overall organizational capability
• Collaborate globally to align Best Known Methods (BKM) across TD and manufacturing sites
• Champion a strong safety-first and quality-focused engineering culture
Stakeholder Collaboration
• Technology Development (TD) Process and Integration Teams
• Yield Analysis and Data Science organizations
• Global Manufacturing and Operations teams
• Equipment and technology suppliers
• Program and engineering leadership across regions
Required Qualifications
• Equivalent practical experience: with 20+ years of relevant semiconductor experience, or
• Bachelor’s degree with 15+ years of relevant semiconductor experience, or
• Master’s/PhD degree with 5+ years of relevant semiconductor experience
• Minimum 5+ years of hands-on RDA experience in semiconductor manufacturing or equipment engineering
• Demonstrated expertise in defect inspection, process monitoring, and yield learning on multiple memory type flows
Required Technical Competencies
• Proficient in Realtime Defect Analysis (RDA) systems and workflows such as Klarity and SPC
• Proficient in Optical and e-beam inspection technologies
• Proficient in statistical data analysis, correlation development, and large data set interpretation
• Proficient in understanding both semiconductor process integration and technology development environments
• Proficient in understanding and utilizing multiple root cause analysis and systematic problem-solving methodologies
Required Leadership & Behavioral Competencies
• Recognized technical authority with the ability to influence without direct authority
• Strong mentoring and coaching mindset with proven talent development outcomes
• Clear, concise, and effective communication skills across technical and leadership audiences
• Ownership-driven, execution-focused, and comfortable operating in ambiguous environments
Impact & Success Measures
• Reduction in defect-related yield losses and learning cycle times
• Successful deployment and adoption of new inspection capabilities
• Clear alignment of inspection strategy to future technology nodes