Total 16,252 Full-time process improvement manager job vacancies

Job Responsibilities:

• Develop, validate, and maintain special process procedures (e.g., heat treatment, surface treatment, coatings, welding, brazing)
• Perform process capability studies and continuous improvement initiatives
• Ensure compliance with aerospace standards and customer requirements
• Assist the Manager in day-to-day process monitoring and production requirement
• Perform other duties and responsibilities, as assigned

Job Requirements:

• Minimum 3 years of relevant experience in an Aerospace or Manufacturing environment

Interestedapplicants can send their detailed resumes to janelui@recruitexpress.com.sgor call JANE @ 6735 1955.

JANE LUI JIE'EN

CEI: R1104482

Company Reg.No. 199601303W || EA Licence No. 99C4599

Role Summary

The DMTS is a recognized expert inside and outside Micron, shaping the technical vision for cell film processes with influence across top-level organizational boundaries, leading programs spanning the engineering group, driving breakthroughs, influencing industry/cross-disciplinary teams, and mentoring senior technical leaders to guide critical roadmap decisions. Owns and updates the cell film process technology roadmap; drives external collaborations and benchmarking; prepares high-impact technical deliverables (presentations/white papers/patent filings); guides investment and prioritization decisions.

Main Responsibilities

• Serve as the CMP technical authority for NAND technology development, defining long‑term technology and equipment strategies

• Architect and drive next‑generation CMP process innovation, including FOAK developments, recipe architecture, and integration alignment

• Lead resolution of the most complex yield, defectivity, and integration challenges through deep CMP process, materials, and layout expertise

• Define and execute CMP hardware and supplier roadmaps, translating industry benchmarking and external insights into internal advantage

• Provide forward‑looking technical leadership, identifying scaling risks early and driving proactive mitigation strategies

• Drive cross‑functional execution across Technology Development, Process Integration, Manufacturing, and Equipment teams

• Mentor senior engineers and strengthen CMP technical capability across the organization

• Represent Micron CMP in cross‑site and external technical forums, and communicate technology roadmaps to senior leadership

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Other Responsibilities

• Prepare high-impact technical presentations, white papers, and patent filings; initiate strategic collaborations with external partners (universities/research institutes).

• Integrates AI assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Qualifications / Experience

• PhD ≥15 yrs, or Master’s ≥17 yrs, of relevant experience in
  Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,

• Experience in CMP process development within an R&D environment (NAND, DRAM, or Logic), including proven transfer to manufacturing

• Publications/patents and strong record of technical contributions.

Must-Have Technical Skills

• Deep expertise in CMP fundamentals, including pad–slurry–wafer interactions, mechanistic slurry chemistry, and pattern density/layout effects

• Broad understanding of multiple CMP process types, including metal, dielectric, barrier/hardmask, and poly‑Si/Si CMP

• Extensive hands‑on experience with advanced 300 mm CMP OEM platforms, including driving hardware roadmap decisions to improve capability, throughput, and cost efficiency

• Strong command of statistical process control (SPC), data analysis, and process qualification methodologies

• Proven ability to lead supplier technical reviews and head‑to‑head evaluations to advance CMP capability

Must-Have Soft Skills

• Demonstrated technical leadership in complex problem solving, including experience leading high‑impact technical programs or projects

• Ability to independently drive execution and influence cross‑functional teams across process, integration, equipment, and manufacturing organizations

• Strong analytical and structured thinking, with disciplined, data‑driven decision making

• Clear and effective technical communication skills, including executive‑level updates and stakeholder engagement

Embody Micron’s core values:

• People – Respect, develop and empower others

• Innovation – Drive continuous improvement and breakthrough thinking

• Tenacity – Show grit and determination

• Collaboration – Build trust and foster teamwork

• Customer Focus – Deliver excellence and value

• Study and evaluate new method and materials to improve current process and manufacturing capability.
• Conduct DOE to determine the key process parameters and product characteristic.
• Assist production in setting up machine operation procedure and safety guidelines.
• Implement new process.
• Explore possibility of reducing material standard usage or cheaper source.
• Determine the root cause for sample rejection for process related issue.

Requirements:

• Degree in Mechanical/Electrical/Electronics Engineering or equivalent.
• Diploma with 2 to 3 years working experience.
• Good troubleshooting and analytical skills.
• Independent, creative, resourceful and able to take pressure.
• Good communication, report writing and presentation skills.

12 hours shift work week

Loyang Area

Electronics Manufacturing Industry

Interested candidates, please forward a detailed resume and email to audris@alignrecruitment.com.sg

Align Recruitment Pte Ltd

License No: 20C0253

Attention: Pan Hong (Reg No. R2094728)

Join a world-leading US-based data storage technology company in a high-tech manufacturing environment. You will support backend assembly processes, ensuring smooth production performance, quality, and continuous improvement activities.

Position: Test Process Technician

Employment Type: Permanent Role

Location: Woodlands

Working Hours: Shift-Based (Permanent Night Shift)

Role summary:

•Support backend assembly/test processes by monitoring yield, test time, scrap, and key process indicators.

•Perform root cause analysis, failure analysis, and drive process improvement.

•Support test process documentation, work instructions, PFMEA, and control plans.

•Work closely with engineering, equipment, and automation teams on optimization and issue resolution.

Key requirements:

•Diploma in Engineering or related discipline.

•Experience in manufacturing/process environments preferred.

•Fresh graduates are welcome to apply. Candidates with relevant experience will have an added advantage

•Exposure to process setup, process control, or failure analysis is an advantage.

•Knowledge of Python, C/C++, or SQL is a plus.

**Interested candidates, kindly email updated resume to sandra@wancomanpower.com with Subject of "Test Process Technician", thank you.**

Role Summary

As a Senior Member of Technical Staff (SMTS), you are a module‑level CMP technical authority, responsible for defining CMP technical direction, leading FOAK developments, and driving cross‑functional execution across NAND nodes. As a SMTS (Senior Member of Technical Staff), you will be a part of revolutionary Next Generation NAND research & development CMP team driving Advanced NAND and CMP technology forward. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with Next Generation NAND. A SMTS CMP Engineer is a senior individual contributor responsible for defining, developing, and transferring advanced CMP processes for Micron NAND technologies. You will work directly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will work on state of the art and best in class CMP chambers & own the process roadmap to meet program and yield goals.

Main Responsibilities

• Own and lead key NAND CMP process modules, translating technology challenges into executable roadmaps across current and future nodes

• Drive cross‑functional execution across Technology Development, Process Integration, Manufacturing, and Equipment teams

• Lead FOAK CMP process development, including recipe architecture, control strategies, and integration alignment

• Ensure process robustness and manufacturability through run‑to‑run controls, SPC, qualification execution, and risk mitigation

• Resolve complex yield, defectivity, and integration issues using model‑based and data‑driven problem solving

• Define and execute process‑level hardware strategies in collaboration with equipment suppliers

• Act as a CMP technical leader, mentoring engineers, influencing adjacent process roadmaps, and communicating technology status and plans to senior stakeholders

<>·

Other Responsibilities

• Mentor engineers through structured development; build SME pipelines; publish internal papers/BKMs and present to senior leadership; uphold Micron’s technical leadership expectations

• Integrates AI assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Qualifications / Experience

• PhD ≥12 yrs, or Master’s ≥15 yrs, of relevant experience in
  Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,

• Experience in CMP Process Development

• Deep expertise in CMP chemistry, physics, and integration

• Publications/patents and strong record of technical contributions.

Must-Have Technical Skills

• In‑depth expertise in CMP fundamentals, including pad–slurry–wafer interactions, slurry chemistry at a mechanistic level, and pattern density/layout effects

• Strong understanding of multiple CMP process types (e.g., metal, dielectric, barrier/hardmask, poly‑Si/Si CMP)

• Extensive hands‑on experience with advanced 300 mm CMP OEM platforms, including driving hardware capability, throughput, and cost improvements

• Proven expertise in statistical process control (SPC), data analysis, and qualification methodologies

• Ability to independently drive complex technical execution, resolve yield and defectivity issues, and influence cross‑functional teams

Must-Have Soft Skills

• Demonstrated technical leadership in problem solving, with experience leading complex or multi‑disciplinary technical projects

• Strong ability to influence without authority across process integration, equipment, and manufacturing teams

• Clear and structured technical communication skills, including written documentation and stakeholder updates

• Strong analytical mindset with disciplined, data‑driven decision making

Embody Micron’s core values:

• People – Respect, develop and empower others

• Innovation – Drive continuous improvement and breakthrough thinking

• Tenacity – Show grit and determination

• Collaboration – Build trust and foster teamwork

• Customer Focus – Deliver excellence and value

Job Responsibilities:

• Develop, validate, and maintain special process procedures (e.g., heat treatment, surface treatment, coatings, welding, brazing)
• Perform process capability studies and continuous improvement initiatives
• Ensure compliance with aerospace standards and customer requirements
• Assist the Manager in day-to-day process monitoring and production requirement
• Perform other duties and responsibilities, as assigned

Job Requirements:

• Minimum 3 years of relevant experience in an Aerospace or Manufacturing environment

Interestedapplicants can send their detailed resumes to janelui@recruitexpress.com.sgor call JANE @ 6735 1955.

JANE LUI JIE'EN

CEI: R1104482

Company Reg.No. 199601303W || EA Licence No. 99C4599

About VSMC:

VisionPower Semiconductor Manufacturing Company Pte Ltd(VSMC), a joint venture between Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors (NXP) has started construction on a 300mm wafer manufacturing facility in Singapore, targets automotive, industrial, consumer, and mobile end markets.

Role Summary:

You will be responsible to deliver robust and efficient semiconductor manufacturing process with data driven analytics and systemic problem-solving skills in the specific module (Diffusion, Etch (Dry &WET), Photolithography, Metrology, Physical Vapor Deposition, Thin Film -Chemical Vapor Deposition or Chemical Mechanical Planarization).

Key Responsibilities

• Monitor and sustain production process, assist in running and verifying process recipes on respective module tools.
• Work closely with process engineers to monitor manufacturing processes to scale up capacity swiftly and maintain with quality and urgency.
• Continuously improve process stability and capability, enhance quality, reliability, yield, productivity, and safety standards.
• Assist to conduct experiments, analyse complex data sets, and derive actionable insights to optimize manufacturing processes and precise controls
• Support to analyze production anomalies and maintaining/improving statistical process control (SPC) methods to establish and uphold robust manufacturing processes.
• Operate under rotating shifts (day/night), including weekends and holidays, in a 24/7 fab environment.

Education Qualification & Essential Experiences

• Diploma’s or higher degree in Electrical and Electronics Engineering, Chemical  Engineering or STEM related fields
• Minimum of 2 years of experience as an Process Associate Engineer.
• Experience in a 12’’ (300mm) fab environment is highly preferred.

Key Skills and Attributes

• Good interpersonal and communication skills to work effectively across functions and geographical teams with diverse background.
• Strong analytical and problem-solving skills to achieve positive results and outcome.
• Goal driven and an excellent team player that can work under pressure in a dynamic and fast-paced environment.
• Has a growth mindset, prioritizing adaptability, resilience, innovation, and ongoing learning to support business needs.
• Strong attention to details, hands-on attitude, and willingness to work in shifts if required.

VSMC promotes diversity and inclusivity in our workforce; and hiring will be conducted in phases.

Job Description

• Manage a cost effective manufacturing process procedure in wafer fabrication, through the provision of engineering support to the production line, so as to achieve organization's targeted manufacturing index.
• Take full ownership on all engineering issues of assigned process.
• Maintain and support day to day manufacturing activities through real-time problem analysis and real-time solution implementation.
• Ensure smooth process flow with high quality, high yield, low cost by working with the Maintenance Specialists, Production Supervisors and Shift Engineers to achieve overall committed targets.
• Provide cross functional/cross-dept/cross-fab support & coverage based on need & priority.
• Training of new Engineers & imparting technical knowledge to them.

You will gain Technical Skills and Competencies on: -

• Wafer fabrication technology
• Fab general safety and mandatory risk assessments
• Advance semiconductor wafer process 
• Wafer handling system
• Particulate control and prevention
• SPC, FDC application for drift detection and inline prevention
• Process robustness program and improvisation 
• Innovative solutions to manufacturing quality and equipment uptime improvement

Requirements

• A Bachelor’s Degree in, Electronics and Data, Chemical, Electrical Power Engineering, etc.  
• Ability to learn new concept and have good analytical skills
• Ability to work in a fast pace environment and able to multi-task
• Self-driven and independent with an inquisitive mind
• Able to document projects and create workspace for continuity and improvement
• Ability to learn new concept and have good analytical skills.
• Ability to work in a fast pace environment and able to multi-task.
• Able to lead and participate in cross functional problem-solving teams and with good interpersonal skills.
• Self-driven and independent with an inquisitive mind.

Key Responsibilities:

• Lead the architecture design (e.g. memory cells, select transistors, and peripheral devices), process integration, electrical characterization, modeling and simulation, failure analysis for 3D NAND devices.
• Design and execute DoE, analyze the impact of process variations on device performance and reliability (such as durability and data retention), and propose improvement solutions.
• Collaborate with the process development team to assess new device architectures, driving technology iteration.
• Write detailed technical reports and support customers or internal teams in resolving related technical issues.

Required Qualifications:

1. Education: Master's degree or above
2. Major: Microelectronics, physics, material science & engineering, chemistry;
3. Other Requirements:

• 8+ years of semiconductor device work experience, 3+ years of 3D NAND work experience.
• In-depth knowledge of 3D NAND device physics, familiar with its principles, failure modes, and reliability mechanisms.
• Troubleshooting, and problem-solving capabilities, with experience in successfully improving device performance or yield.
• Familiar with advanced semiconductor manufacturing processes and integration flows.
• Strong cross-team communication and collaboration skills.

The Defectivity Line Control Engineer is responsible for controlling defectivity in semiconductor wafer fabrication through daily line monitoring, OOC management, tool excursion response, and cross-functional problem solving. The role supports both routine operations and improvement activities to ensure stable process performance, product quality, and effective industrialization.

Key Responsibilities

• Analyze defect Pareto, defect maps, and characterization data to identify root causes and containment actions.
• Drive tool OOC reduction and lead sporadic defect reduction activities.
• Lead the troubleshooting of defectivity alert and involve in Material Review Board for material assessment and disposition.
• Support troubleshooting of defectivity alerts and escalation of critical issues.
• Work closely with process, equipment, device, quality, and production teams to drive defect reduction and line stability.
• Support technology transfer and industrialization activities to ensure smooth deployment of new products and processes.
• Responsible for setting up, optimizing, maintaining Process Defectivity Systems like Automation system (Auto defect sampling, Auto DOI, DOLI), Defect library.
• Opportunity to involve in deployment of Advanced Defectivity Monitoring system involving AI, Convolution Neural Network (CNN) and deep learning with DIT team and opportunities to learn and apply data analytics.

Skills and Competencies

• Degree in Material Science/Electrical/Electronics/Microelectronics/Mechanical/Physics/Chemistry. 
• Preferred minimum 3 years working experience in semiconductor wafer fabrication industry and good knowledge in Defectivity methodology and knowledge of Defectivity inspection tool. Fresh graduate is welcomed to apply as well.
• Knowledge in Klarity Defects/AceXP/Space/Spotfire and other Defectivity related tool will be an added advantage.
• Strong analytical and problem-solving skills.
• Good understanding of semiconductor wafer fab processes.
• Ability to work across departments and communicate clearly.
• Proactive mindset with strong ownership and teamwork.
• Self-driven and independent with an inquisitive mind.
• Familiar with SPC concept and other problem-solving tools: SPACE, FMEA, 8D, Data mining analysis and AI base on Convolution Neural Network (CNN) will be advantageous.

• Perform process setup and buyoff for both Drive Backend Assembly, ensuring that yield, cycle time, and quality outcomes meet defined targets
• Support product ID label buyoff to ensure compliance with product specifications and standards• Monitor production yield to detect any excursions, conduct process mapping, and implement immediate containment (stop bleeding)
• Establish hypotheses, design experiments to identify root causes, propose corrective actions, and report findings to engineers
• Escalate process and technical issues appropriately per PMP requirements
• Conduct basic data queries and analysis to provide relevant information and insights for engineering teams
• Ensure process sustainability by monitoring KPIVs/KPOVs and managing Fast Triggering systems to maintain stable and controlled operations
• Lead or participate in continuous improvement projects aimed at enhancing production efficiency in a consistent and sustainable manner
• Perform additional tasks and responsibilities as assigned to support team, department, and company Objectives and Key Results (OKRs)

Requirements:

• Diploma in Engineering and related disciplines
• Strong data querying and analytical capabilities
• Proficient in English with strong verbal and written communication skills
• Able to perform effectively under pressure and meet deadlines
• Demonstrates strong resilience, adaptability, and positive work attitude

To submit your application, please apply online to apply@rn-care.com or call +65 6514 9838 for a private and confidential discussion.

Your interest will be treated with the strictest of confidence. We regret that only shortlisted candidates will be notified or contacted.

RN Care Pte. Ltd

EA License No: 17C8900

Job Description

• Process development and optimization for silk screen printing, die cutting, lamination, assembly and converting processes
• Support new product introduction (NPI), process parameters, validation (IQ, OQ, PQ) and capability studies
• Troubleshoot production and quality issues, conduct root cause analysis, and implement corrective and preventive actions (CAPA)
• Drive Kaizen initiatives for productivity, yield, cycle time, scrap reduction and cost improvement
• Evaluate and qualify new materials, equipment, tooling, and manufacturing methods
• Coordinate tooling fabrication, ECN implementation, and ERP system setup
• Ensure compliance with ISO 9001, ISO 13485, ISO 14001, ISO 45001, safety, environmental, and customer requirements
• Support equipment setup, maintenance coordination, and process capability studies
• Participate in customer audits, supplier audits, and technical discussions when required
• Prepare SOPs, work instructions and engineering documents
• Any other task assigned by the Superior

Requirements

• • Minimum Degree with at least 5 year(s) experience in a Manufacturing environment with mechanical and electronics assembly
  • Independent, self-motivated, team player and able to work under pressure with minimal supervision
  • Proficiency in Microsoft Office, AutoCad, GD&T, PFMEA, QCP and process validation per ISO 13485 is preferred
  • Experience in Kaizen, Lean Manufacturing, Six Sigma, Yield Improvement, Productivity Improvement, Cost Reduction preferably
  • Mechanical system understanding with electrical / electronic knowledge

Interested candidates please send Resume in Ms Word format with full Certificate to diana.soh@boydcorp.com. Regret only shortlisted candidate will be contacted.

Job Description

• Industry/ Organization Type: Precision Manufacturing
• Position Title: Process Engineer
• Working Location: Commonwealth
• Working Hours: 5 days (Mon – Fri, 8.30am – 6.00pm)
• Salary Package: Basic salary up to $5,000 + Performance Bonus
• Duration: Permanent Role

Key Responsibilities

• Plan and oversee the manufacturing process from receiving raw materials to shipping finished parts.
• Create or update work instructions and develop new processes based on engineering drawings and standards.
• Design jigs and fixtures to support the CNC section.
• Develop advanced product quality planning, conduct related training, and manage pre-production trial projects.
• Assist production to meet technical and quality standards.
• Manage technical changes to meet customer requirements.
• Support the RFQ proposal process and development.
• Perform other duties as assigned.

APPLY NOW!!!

• Diploma or degree in Mechanical/Precision Engineering or a related field.
• 3 years of relevant experience in the manufacturing industry.
• Experience with Master-CAM programming is preferred.
• Hands-on experience with CNC milling/turning fabrication.

Kindly apply through ANY of the following methods:

• Submit your application by clicking the APPLY button;
• Email your resume to Job@anradus.com.sg. Please indicate #74458 on the email subject.

Anradus Application Policy: We value each application and ensure every resume is reviewed. Our process is efficient, typically concluding within 3 working days. If you do not receive communication from us within this timeframe, it's likely that your application has not been shortlisted by our client. In such cases, we recommend continuing your job search to maximize your opportunities.

Anradus Pte Ltd | EA License No. 20C0161 | Angel Lim | EA Reg No.: R1769781

Job's mission

As a Senior Process Engineer in Advanced Packaging, you will bring your PhD research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM’s mission to enable the chips that power today’s most advanced technologies.

What you will be working on

• Contribute to the research, development, and optimization of semiconductor processes for Advanced Packaging, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation technologies.
• Design, execute, and analyze experiments using DOE-based approaches, supported by senior technical experts.
• Perform materials and process characterization to evaluate film quality, reliability, and performance.
• Analyze experimental data and clearly document results in technical reports and internal presentations.
• Collaborate with cross-functional teams across R&D, process engineering, and applications.
• Support troubleshooting of process or equipment issues in laboratory and pilot environments.
• Participate in technology reviews and contribute ideas to process improvement and innovation initiatives.
• Learn industry best practices for transitioning processes from development into customer and manufacturing environments.

What we are looking for

• PhD in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, Electrical Engineering,
• Hands-on research experience with thin-film deposition processes such as ALD, CVD, PECVD, or PVD.
• Strong experimental background, including designing experiments and analyzing complex data sets.
• Solid problem-solving and analytical skills, with a structured approach to research challenges.
• Clear written and verbal communication skills, with the ability to explain technical concepts to diverse audiences.
• Curiosity, initiative, and motivation to apply academic research in an industrial setting.
• Strong understanding of electro/mechanical equipment and software systems

What sets you apart

• Research experience related to advanced packaging, interconnects, or semiconductor manufacturing
• Familiarity with statistical methods, DOE tools, or data modeling techniques.
• Experience with materials characterization methods such as SEM, TEM, XRD, or ellipsometry.
• Exposure to cross-disciplinary or collaborative research environments.
• Interest in long-term growth within semiconductor technology development and process engineering.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

About VSMC:

VisionPower Semiconductor Manufacturing Company Pte Ltd(VSMC), a joint venture between Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors (NXP) has started construction on a 300mm wafer manufacturing facility in Singapore, targets automotive, industrial, consumer, and mobile end markets.

Role Summary:

You will be responsible to deliver robust and efficient semiconductor manufacturing process with data driven analytics and systemic problem-solving skills in the specific module (Diffusion, Etch (Dry &WET), Photolithography, Metrology, Physical Vapor Deposition, Thin Film -Chemical Vapor Deposition or Chemical Mechanical Planarization).

Key Responsibilities

• Monitor and sustain production process, assist in running and verifying process recipes on respective module tools.
• Work closely with process engineers to monitor manufacturing processes to scale up capacity swiftly and maintain with quality and urgency.
• Continuously improve process stability and capability, enhance quality, reliability, yield, productivity, and safety standards.
• Assist to conduct experiments, analyze complex data sets, and derive actionable insights to optimize manufacturing processes and precise controls
• Support to analyze production anomalies and maintaining/improving statistical process control (SPC) methods to establish and uphold robust manufacturing processes.
• Operate under rotating shifts (day/night), including weekends and holidays, in a 24/7 fab environment.

Education Qualification & Essential Experiences

• Diploma’s or higher degree in Electrical and Electronics Engineering, Chemical  Engineering or STEM related fields
• Minimum of 2 years of experience as an Process Associate Engineer.
• Experience in a 12’’ (300mm) fab environment is highly preferred.

Key Skills and Attributes

• Good interpersonal and communication skills to work effectively across functions and geographical teams with diverse background.
• Strong analytical and problem-solving skills to achieve positive results and outcome.
• Goal driven and an excellent team player that can work under pressure in a dynamic and fast-paced environment.
• Has a growth mindset, prioritizing adaptability, resilience, innovation, and ongoing learning to support business needs.
• Strong attention to details, hands-on attitude, and willingness to work in shifts if required.

VSMC promotes diversity and inclusivity in our workforce; and hiring will be conducted in phases.